Carrier plate baking jig

Abstract

The utility model discloses a carrier plate baking jig, which belongs to the technical field of packaging carrier plates and solves the problem of high manufacturing cost of a baking jig in the prior art. The device mainly comprises an upper-layer plate and a lower-layer plate, the upper-layer plate and the lower-layer plate are fixed up and down; a plurality of empty grooves are formed in the upper-layer plate and the lower-layer plate; and the size of the empty slot of the upper-layer plate is smaller than that of the empty slot of the lower-layer plate. The mode that the upper layer plate and the lower layer plate are spliced is adopted, the upper layer plate is used for fixing the base plate, and the lower layer plate is used for bearing the base plate; the limiting grooves in the bottom of the upper-layer plate are matched with the limiting blocks on the lower-layer plate, it is guaranteed that the upper-layer plate and the lower-layer plate are accurately aligned, and unstable placement or uneven stress of the carrier plate caused by dislocation is prevented.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of packaging board processing technology, and concretely relates to a board baking fixture. BACKGROUND

[0002] In the standard BGA board production process, the whole large-size board needs to be first precision machined and then cut and separated into single independent units. The cut substrate usually needs to be treated by high-temperature baking. The purpose of baking is mainly to remove the moisture absorbed by the substrate during processing and storage, eliminate internal stress to improve flatness, and stabilize material performance. The baked substrate is considered as a qualified product, ready to be shipped to the downstream packaging factory for chip mounting and ball planting processes.

[0003] At present, in the baking link of the substrate, a dedicated placement fixture is generally used. The core function of these fixtures is to carry the substrate during high-temperature baking to ensure that it remains flat and prevents warping deformation caused by self-weight or thermal stress. The application with the publication number CN222838834U discloses a chip baking fixture in the prior art; wherein the wafer storage plate is provided with a containing groove suitable for placing a wafer; the storage plate must be specially designed and manufactured according to each specific size of the substrate. This not only has the mold opening cost, but also needs to pay the design cost, significantly increasing the manufacturing cost. At present, there is a lack of a low-cost, simple-to-make, and flatly placed board baking fixture. SUMMARY

[0004] The purpose of the utility model is to provide a board baking fixture to solve the problem of high manufacturing cost of the baking fixture in the prior art.

[0005] The utility model is implemented through the following technical solutions:

[0006] A board baking fixture, comprising an upper layer plate and a lower layer plate; the upper layer plate and the lower layer plate are fixed one above the other; the upper layer plate and the lower layer plate are each provided with a plurality of hollow grooves; the size of the hollow grooves of the upper layer plate is smaller than that of the lower layer plate.

[0007] Further, the positions of the hollow grooves of the lower layer plate correspond to those of the upper layer plate.

[0008] Further, the hollow grooves are provided with a taking groove on both sides.

[0009] Further, the taking groove is semicircular in shape.

[0010] Further, the upper layer plate is provided with a limiting groove at the bottom; the lower layer plate is provided with a limiting block at the bottom; the limiting block cooperates with the limiting groove.

[0011] Further, the size of the hollow slot of the upper layer plate is 1mm-3mm smaller than that of the lower layer plate.

[0012] Further, the material of the upper layer plate and the lower layer plate is high-temperature-resistant resin plate.

[0013] Compared with the prior art, the present application has the following beneficial effects:

[0014] The upper layer plate and the lower layer plate are spliced, the upper layer plate fixes the substrate, the lower layer plate bears the substrate, the hollow slot of the lower layer plate is smaller than that of the upper layer plate, the extra part is used for bearing the substrate, the hollow slot of the upper layer plate is slightly larger than the substrate size, and the semi-circular taking slot can conveniently take the substrate and avoid scratching the substrate; the limiting slot at the bottom of the upper layer plate cooperates with the limiting block on the lower layer plate to ensure accurate alignment of the upper and lower layer plates and prevent misalignment from causing unstable placement or uneven stress of the substrate. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 is a schematic view of the upper layer plate structure of the present application;

[0016] Figure 2 is a schematic view of the lower layer plate structure of the present application;

[0017] Figure 3 is a schematic view of the combination of the upper layer plate and the lower layer plate of the present application;

[0018] Figure 4 is a sectional view of the present application.

[0019] In the figure: 1, lower layer plate; 2, hollow slot; 3, taking slot; 4, limiting block; 5, upper layer plate; 6, limiting slot. DETAILED DESCRIPTION

[0020] In order to make the personnel in the art better understand the technical scheme of the present application, the technical scheme of the present application will be described clearly and completely below in combination with the drawings of the present application, and other similar embodiments obtained by the personnel in the art without creative labor on the basis of the embodiments in the present application shall all belong to the protection scope of the present application. In addition, the direction words mentioned in the following embodiments, such as "up", "down", "left", "right", etc. are only the directions of the drawings, therefore, the direction words used are used for explanation and not for limiting the creation of the present application.

[0021] The present application will be further described and explained below in combination with the drawings.

[0022] Example 1, a carrier plate baking jig, as shown in Figures 1-3 The upper layer plate 5 and the lower layer plate 1 are fixed in a top-bottom relationship, and the upper layer plate 5 and the lower layer plate 1 are each provided with 25 matrix-shaped cavities 2; the size of the cavities 2 of the upper layer plate 5 is smaller than that of the cavities 2 of the lower layer plate 1; the size of the cavities 2 of the upper layer plate 5 is 72.1*72.1mm; and the size of the cavities 2 of the lower layer plate 1 is 69*69mm.

[0023] Example 2, the cavities 2 of the lower layer plate 1 correspond to the cavities 2 of the upper layer plate 5 in position; each cavity 2 is provided with a half-circular-shaped taking groove 3 on both sides; and the radius of the half-circular-shaped taking groove 3 is 10mm.

[0024] The bottom of the upper layer plate 5 is provided with a limiting groove 6, and the bottom of the lower layer plate 1 is provided with a limiting block 4; the limiting block 4 cooperates with the limiting groove 6.

[0025] The size of the cavities 2 of the upper layer plate 5 is 1mm-3mm smaller than that of the cavities 2 of the lower layer plate 1.

[0026] The material of the upper layer plate 5 and the lower layer plate 1 is high-temperature-resistant resin plate.

[0027] In the manufacturing process, the upper layer plate 5 is stacked above the lower layer plate 1 after the cavities 2 are cut, the limiting block 4 is embedded in the limiting groove 6, and the two plates are bonded with adhesive. Figure 4 As shown in the figure, the cavities 2 of the lower layer plate 1 are smaller than the cavities 2 of the upper layer plate 5, and the extra part is used to carry the substrate; the cavities 2 of the upper layer plate 5 are slightly larger than the substrate size, used to fix the substrate; the extra half-circular-shaped taking groove 3 can facilitate the taking of the substrate and avoid scratching the substrate; and in use, the substrate is only needed to be placed in the cavity 2 and then sent into the baking oven for baking.

[0028] The utility model has made the detailed description, the above-mentioned, only for the preferable embodiment of the utility model, when cannot limit the utility model implementation range, namely all equal changes and modification that make in the application scope, should still belong to the utility model cover range.

Claims

1. A carrier board baking fixture, characterized by: The invention comprises an upper plate (5) and a lower plate (1); the upper plate (5) and the lower plate (1) are fixed up and down; the upper plate (5) and the lower plate (1) are both provided with a plurality of slots (2); the size of the slots (2) of the upper plate (5) is smaller than the size of the slots (2) of the lower plate (1).

2. The carrier baking fixture of claim 1, wherein: The position of the empty slot (2) of the lower plate (1) corresponds to the position of the empty slot (2) of the upper plate (5).

3. The carrier baking fixture of claim 2, wherein: Receiving slots (3) are provided on both sides of the empty slot (2).

4. The carrier baking fixture of claim 3, wherein: The taking groove (3) is semicircular in shape.

5. The carrier baking fixture of claim 1, wherein: The upper plate (5) is provided with a limiting groove (6) at the bottom; the lower plate (1) is provided with a limiting block (4) at the bottom; the limiting block (4) cooperates with the limiting groove (6).

6. The panel baking fixture of claim 1, wherein: The size of the empty slot (2) of the upper plate (5) is 1 mm to 3 mm smaller than the size of the empty slot (2) of the lower plate (1).

7. The panel baking fixture of claim 1, wherein: The upper plate (5) and the lower plate (1) are made of resin plates.

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