Resin hole plugging structure of multilayer circuit board
By designing an inclined resin plug and electroplated copper hole structure on the PCB board, combined with upper and lower copper pads, the problem of resin plug detachment during vibration or drop is solved, improving the stability and conductivity of the circuit board.
Patent Information
- Application Number
- CN202422646518.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-31
- Publication Date
- 2025-10-24
- Estimated Expiration
- 2034-10-31
AI Technical Summary
The vertical placement of resin-filled through-holes on existing PCBs makes the copper layer prone to detachment when the equipment vibrates or is dropped, resulting in insufficient friction and affecting the stability and lifespan of the circuit board.
The structure employs inclined plugging resin and electroplated copper holes, combined with upper and lower copper disks, to ensure that the plugging resin is not easily detached during vibration. The inclined angle design enhances stability, and the copper disks enable conductivity.
It improves the stability of PCB boards under vibration or drop, reduces the risk of via-filling resin detaching from through-holes, and ensures the reliability and continuity of circuits.
Smart Images
Figure CN223472393U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to PCB board technical field, concretely is resin hole structure of multilayer circuit board. BACKGROUND
[0002] In the production process of circuit board, more and more customers choose to use resin hole when making HDI board to adapt to the development trend of dense circuit, and the process of PCB resin hole includes drilling, plating, hole plugging, baking and grinding, after drilling, the hole is plated, then the resin is baked, and then it is ground flat, the resin after grinding is not copper, so it needs to be plated with a layer of copper to become a pad, these processes are done before the original PCB drilling process, that is, the hole to be plugged is processed first, and then the hole is drilled, and the normal process is carried out.
[0003] At present, the through hole of the resin hole used in the PCB is vertically arranged, which plays an insulating role in use, but in the long-term use process, the equipment falls, the PCB vibrates, the copper layer used for plugging the through hole is separated, and the through hole is vertically arranged, the friction is insufficient, and the through hole is separated, which affects the use of the circuit board, therefore, aiming at the above problems, a resin hole structure of multilayer circuit board is provided. UTILITY MODEL CONTENTS
[0004] The utility model aims at providing a resin hole structure of multilayer circuit board to solve the problems in the above background technology.
[0005] To achieve the above object, the utility model provides the following technical scheme: a resin hole structure of multilayer circuit board, including PCB substrate, copper layer and upper unit aluminum layer;
[0006] The copper layer is mounted in the inside of the PCB substrate;
[0007] The upper and lower sides of the PCB substrate are plated with an upper unit aluminum layer and a lower unit aluminum layer respectively, and the surfaces of the upper unit aluminum layer and the lower unit aluminum layer are coated with an insulating resin layer;
[0008] The PCB substrate is provided with a through hole in the inside, and the through hole is plated with a layer of electroplated copper hole in the inside, the inside of the electroplated copper hole is provided with compact hole resin, and the upper and lower sides of the hole resin are respectively plated with an upper unit copper disc and a lower unit copper disc distributed in an up-down manner.
[0009] Further, the hole resin is arranged in an inclined manner.
[0010] Further, the lower unit copper disc and the upper unit copper disc are arranged in a disc shape.
[0011] Compared with the prior art, the utility model has the advantages of
[0012] The utility model discloses in using, its setting through -hole is inclined to a certain angle, and the hole resin and the copper hole of electroplating are set to a certain angle of inclination in through -hole inside, when the equipment vibration, PCB vibration, because the hole resin is inclined setting, hole resin is not easy to separate from PCB through -hole at this moment, and the upper unit copper disc and the lower unit copper disc on the upper side and the lower side of hole resin play the purpose of conduction. BRIEF DESCRIPTION OF DRAWINGS
[0013] Figure 1 It is the whole structure schematic diagram of the utility model.
[0014] In the drawing: 1, base plate, 2, copper layer, 3, upper unit aluminum layer, 4, lower unit aluminum layer, 5, copper hole of electroplating, 6, hole resin, 7, lower unit copper disc, 8, insulating resin, 9, upper unit copper disc. DETAILED DESCRIPTION
[0015] The technical scheme in the embodiments of the utility model will be apparently and completely described below in conjunction with the drawings of the embodiments of the utility model, and obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by the ordinary skill in the art without making creative labor belong to the range of protection of the utility model.
[0016] Embodiment 1: please refer to Figure 1 The utility model provides a kind of technical scheme:
[0017] A resin hole structure of multilayer circuit board, including PCB base plate 1, copper layer 2 and upper unit aluminum layer 3;
[0018] The inside of the above-mentioned PCB base plate 1 is installed with copper layer 2;
[0019] The upper and lower sides of the above-mentioned PCB base plate 1 are respectively plated with a layer of upper unit aluminum layer 3 and lower unit aluminum layer 4, and the surface of upper unit aluminum layer 3 and lower unit aluminum layer 4 is coated with a layer of insulating resin 8;
[0020] The inside of the above-mentioned PCB base plate 1 is provided with through -hole, and the inside of through -hole is electroplated with a layer of copper hole 5 of electroplating, the inside of the above-mentioned copper hole 5 of electroplating is provided with compact hole resin 6, and the upper and lower sides of the above-mentioned hole resin 6 are respectively electroplated with upper unit copper disc 9 and lower unit copper disc 7 that are distributed in upper and lower.
[0021] The above-mentioned hole resin 6 is inclined setting.
[0022] The above-mentioned lower unit copper disc 7 and upper unit copper disc 9 are discoid setting.
[0023] Work flow: The resin plug hole of the PCB board is currently vertically arranged, which plays an insulating role in use, but in the long-term use process, the device falls, the PCB board vibrates, the copper layer used for plugging the through hole is separated, and the through hole is vertically arranged, the friction is insufficient, and the through hole is separated, which affects the use of the circuit board. The PCB substrate 1 is processed to open a hole, and the through hole is arranged at an inclination angle of 5°. Therefore, when electroplating, the electroplated copper hole 5 will plate the copper layer inside the through hole, and when plugging the hole, the resin will be filled inside the electroplated copper hole 5. Therefore, the plug hole resin 6 and the electroplated copper hole 5 are arranged at a certain inclination angle inside the through hole. When the external vibration is set, the PCB substrate 1 follows the vibration, and since the plug hole resin 6 is arranged at an inclination, the plug hole resin 6 is not easy to separate from the PCB through hole at this time, which plays a stable installation purpose, and the upper and lower sides of the plug hole resin 6, the upper unit copper disc 9 and the lower unit copper disc 7 play a conduction purpose.
[0024] It should be noted that in this document, the terms such as first and second are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply that there is any such actual relationship or order between these entities or operations. Moreover, the terms "include", "contain" or any other variants thereof are intended to cover non-exclusive inclusion, so that the process, method, article or equipment including a series of elements not only includes those elements, but also includes other elements not explicitly listed or inherent to such process, method, article or equipment.
[0025] Although the embodiments of the present application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to the embodiments without departing from the principles and spirit of the present application, and the scope of the present application is defined by the appended claims and their equivalents.
Claims
1. A resin plug structure of a multilayer circuit board, characterized in that: it comprises a PCB substrate (1), a copper layer (2) and an upper unit aluminum layer (3); the inside of the PCB substrate (1) is provided with the copper layer (2); the upper and lower sides of the PCB substrate (1) are respectively plated with an upper unit aluminum layer (3) and a lower unit aluminum layer (4), and the surfaces of the upper unit aluminum layer (3) and the lower unit aluminum layer (4) are respectively coated with an insulating resin (8); the inside of the PCB substrate (1) is provided with a through hole, and the inside of the through hole is electroplated with an electroplated copper hole (5), the inside of the electroplated copper hole (5) is provided with a compact plug resin (6), and the upper and lower sides of the plug resin (6) are respectively electroplated with an upper unit copper disc (9) and a lower unit copper disc (7) distributed in an up-down manner. The plug resin (6) is arranged in an inclined manner. The lower unit copper disc (7) and the upper unit copper disc (9) are arranged in a disc shape. 2. The resin plug structure of a multilayer wiring board according to claim 1, wherein: 3. The resin plug structure of a multilayer wiring board according to claim 1, wherein: