Chip mounter binding head device and correction mounting system

Abstract

The utility model relates to the technical field of semiconductors, in particular to a chip mounter binding head device and a correction mounting system, and the chip mounter binding head device comprises a driving assembly and a suction nozzle assembly. The driving assembly comprises a driving part and a connecting assembly connected with the driving part, the suction nozzle assembly comprises an adsorption assembly and a suction nozzle detachably connected with one end of the adsorption assembly, and the other end of the adsorption assembly is connected with the driving part through the connecting assembly; a hollow cavity with two through ends is formed in the driving part, the suction nozzle is at least partially transparent, an adsorption hole with two through ends is formed in the suction nozzle, the driving part is communicated with the adsorption hole in the suction nozzle through the hollow cavity, and the adsorption assembly and the suction nozzle are located at an opening in one end of the hollow cavity; a first air path is arranged in the connecting assembly, a ventilation module is externally connected to the first air path, a second air path is arranged in the adsorption assembly, and when the suction nozzle is connected with the adsorption assembly, the ventilation module is in air path conduction with the suction nozzle through the first air path and the second air path in sequence.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor, especially relate to a binding head device of chip mounter and correction mount system. BACKGROUND

[0002] Chip mount binding head device is the indispensable equipment in integrated circuit packaging process, and is mainly used in the chip pick and mount in the automatic mount process of semiconductor industry, and the mount of chip is that chip is taken down from wafer by the suction nozzle of chip mount device, and then is mounted to lead frame.

[0003] Chip mount binding head device is the indispensable equipment in integrated circuit packaging process, and is mainly used in the chip pick and mount in the automatic mount process of semiconductor industry, and the mount of chip is that chip is taken down from wafer by the suction nozzle of chip mount device, and then is mounted to lead frame.

[0004] However, the effect of the existing chip mount binding head device is poor when aligning the chip to the corresponding position of the lead frame for mounting, and it is difficult to meet the high precision requirement of chip mounting, therefore, the utility model provides a chip mount binding head device with high mounting precision, which can align the upper surface of the chip and the mounting position recognition point in real time during mounting to solve the above technical problems. UTILITY MODEL CONTENTS

[0005] To solve the technical problem that the effect of the existing chip mount binding head device is poor when aligning the chip to the corresponding position of the lead frame for mounting, and it is difficult to meet the high precision requirement of chip mounting, the utility model provides a chip mount binding head device and correction mount system.

[0006] The technical scheme for solving the technical problem of the utility model is to provide a chip mount binding head device, which comprises a driving assembly and a suction nozzle assembly.

[0007] The driving assembly comprises a driving member and a connecting assembly connected with the driving member, and the suction nozzle assembly comprises a suction assembly and a suction nozzle detachably connected with one end of the suction assembly, and the other end of the suction assembly is connected with the driving member through the connecting assembly.

[0008] The driving member is provided with a hollow cavity penetrating through both ends, the suction nozzle is at least partially transparent and is provided with a suction hole penetrating through both ends, the driving member is in communication with the suction hole on the suction nozzle through the hollow cavity, and the suction assembly and the suction nozzle are located at the opening of one end of the hollow cavity.

[0009] The connecting assembly is internally provided with a first air path, and the first air path is externally connected with a ventilation module; the suction assembly is internally provided with a second air path; when the suction nozzle is connected with the suction assembly, the ventilation module is sequentially connected with the suction nozzle through the first air path and the second air path to realize air path conduction.

[0010] Preferably, the connecting assembly comprises a hollow mounting plate, an air slip ring plate and a connecting plate; one side of the mounting plate is connected with the driving member, and the other side is connected with the air slip ring plate; the outer diameter of the connecting plate is less than or equal to the inner diameter of the mounting plate; one end of the connecting plate is connected with the driving member, and the other end is connected with the suction assembly.

[0011] Preferably, the suction assembly comprises a suction plate and at least partially transparent glass; one end of the suction plate is detachably connected with the suction nozzle, and the other end is connected with the connecting plate; the glass is located in the connecting plate and is sealingly fixed to the suction plate.

[0012] Preferably, the inner diameter of the air slip ring plate is greater than or equal to the outer diameter of the connecting plate; the inner wall surface of the air slip ring plate and the outer wall surface of the connecting plate are arranged in a spaced manner; the connecting plate can rotate relative to the air slip ring plate; the inner wall surface of the air slip ring plate and the outer wall surface of the connecting plate are sealed by opening a sealing assembly; a closed space is formed between the inner wall surface of the air slip ring plate, the outer wall surface of the connecting plate and the sealing assembly.

[0013] Preferably, the air slip ring plate is provided with a material suction and ventilation pipe connected with the ventilation module; the connecting plate is provided with a first material suction and ventilation hole and a material suction and ventilation hole; the first material suction and ventilation hole is in communication with the inside of the air slip ring plate; the material suction and ventilation pipe and the first material suction and ventilation hole are in air path conduction in the closed space; the material suction and ventilation hole is in communication with the first material suction and ventilation hole through the inside of the connecting plate; the first air path is formed by air path conduction among the air slip ring plate, the closed space and the connecting plate; the second air path comprises a second material suction and ventilation hole opened on the suction plate, and the second material suction and ventilation hole is in communication with the material suction and ventilation hole.

[0014] Preferably, the side of the suction plate facing the suction nozzle is provided with a ventilation hole; the second material suction and ventilation hole is in communication with the suction hole through the ventilation hole; when the suction nozzle is connected with the suction plate, the ventilation module is sequentially connected with the suction hole through the material suction and ventilation pipe on the air slip ring plate, the first material suction and ventilation hole and the material suction and ventilation hole on the connecting plate, the second material suction and ventilation hole and the ventilation hole on the suction plate to realize air path conduction to adsorb the chip.

[0015] Preferably, one end of the adsorption plate facing the suction nozzle is provided with an adsorption groove, and the other end is provided with a first suction nozzle adsorption air inlet hole, and the adsorption groove is communicated with the first suction nozzle adsorption air inlet hole; the air slide ring plate is provided with a suction nozzle adsorption air pipe connected with the air supply module, the connecting plate is provided with a second suction nozzle adsorption air inlet hole and a suction nozzle adsorption air outlet hole, the second suction nozzle adsorption air inlet hole is communicated with the inside of the air slide ring plate, and the suction nozzle adsorption air pipe and the second suction nozzle adsorption air inlet hole are in air connection in the closed space; one end of the suction nozzle adsorption air outlet hole is communicated with the second suction nozzle adsorption air inlet hole through the inside of the connecting plate, and the other end is communicated with the adsorption groove through the first suction nozzle adsorption air inlet hole, so as to adsorb the suction nozzle.

[0016] Preferably, one end of the adsorption plate facing the suction nozzle is provided with an adsorption groove, and the other end is provided with a first suction nozzle adsorption air inlet hole, and the adsorption groove is communicated with the first suction nozzle adsorption air inlet hole; the air slide ring plate is provided with a suction nozzle adsorption air pipe connected with the air supply module, the connecting plate is provided with a second suction nozzle adsorption air inlet hole and a suction nozzle adsorption air outlet hole, the second suction nozzle adsorption air inlet hole is communicated with the inside of the air slide ring plate, and the suction nozzle adsorption air pipe and the second suction nozzle adsorption air inlet hole are in air connection in the closed space; one end of the suction nozzle adsorption air outlet hole is communicated with the second suction nozzle adsorption air inlet hole through the inside of the connecting plate, and the other end is communicated with the adsorption groove through the first suction nozzle adsorption air inlet hole, so as to adsorb the suction nozzle.

[0017] Another technical solution for solving the above technical problems of the utility model is to provide a correction and mounting system, which can realize the pickup, correction and mounting of chips, and the correction and mounting system comprises a visual correction component and the above-mentioned bonding head device of the chip mounter.

[0018] Preferably, the correction and mounting system further comprises a force sensor component and a control component; the force sensor component comprises an adapter plate, a force sensor mounted on the adapter plate and a fixed plate stacked on the force sensor; the driving component is mounted on the adapter plate, and one side of the fixed plate is connected with the control component.

[0019] Compared with the prior art, the bonding head device of the chip mounter and the correction and mounting system have the following advantages:

[0020] 1. The bonding head device of the chip mounter can be used for the pickup, correction and mounting of chips in the automatic mounting process of the semiconductor industry, and the bonding head device of the chip mounter is applied to occasions with high-precision mounting requirements, and when the chip is picked up and adsorbed, the feature that needs to be identified can be exposed, and when the chip is mounted, the mounting process of real-time alignment and mounting of the upper surface of the chip and the mounting position identification point can be realized.

[0021] Understandably, the bonding head device of the chip mounter can realize the real-time alignment and mounting function by setting the hollow cavity penetrating through both ends on the driving member, setting the adsorption hole penetrating through both ends on the at least partially transparent suction nozzle, and communicating the hollow cavity with the adsorption hole, and after picking up and adsorbing the chip, the chip and the corresponding mounting position identification point can be identified from the top of the suction nozzle, so that the mounting precision of the bonding head device of the chip mounter is improved, and the high-precision requirement of chip mounting is met.

[0022] It should be noted that the first gas path and the second gas path arranged inside the connecting assembly and the adsorbing assembly can ensure good vacuum tightness of the chip bonding head device of the chip mounter and high vacuum degree during the chip picking and mounting, thereby ensuring that the position of the chip does not deviate during the high-speed movement of picking and mounting the chip.

[0023] The utility model discloses a technical problem that the effect of the chip bonding head device of the prior art is poor when aligning and mounting the chip, and it is difficult to meet the high-precision requirement of chip mounting.

[0024] 2, the mounting plate, the air slip ring plate and the connecting plate are hollow in the chip bonding head device provided by the utility model embodiment, so as to facilitate the perspective identification of the chip and the mounting position identification point above the suction nozzle when the chip is picked up and prepared for mounting by using the chip bonding head device, wherein the mounting plate is used to fix the driving part and the air slip ring plate, the connecting plate is used to connect the driving part and the adsorbing assembly respectively, and the mounting plate, the air slip ring plate and the connecting plate are matched to ensure good vacuum tightness inside the driving assembly.

[0025] It should be noted that the driving part of the utility model embodiment is a hollow rotary motor, which can realize 360° arbitrary angle mounting correction when mounting the chip, and improve the angle precision of chip mounting by using the chip bonding head device.

[0026] 3, the suction plate of the chip bonding head device provided by the utility model embodiment is detachably connected with the suction nozzle, and the suction plate is responsible for adsorbing the suction nozzle and adsorbing the chip by the suction nozzle when picking and mounting the chip by using the chip bonding head device, and the glass placed at the end of the suction plate away from the suction nozzle can prevent air leakage in vacuum, and by arranging at least partially transparent glass on the suction plate, feature identification including the identification point of the chip and the mounting position can be performed through the glass by the correction device before the chip is mounted, thereby improving the mounting precision of the equipment.

[0027] 4, the inner wall surface of the air slip ring plate corresponds to the outer wall surface of the connecting plate in the chip bonding head device provided by the utility model embodiment, the air slip ring plate and the connecting plate can rotate relative to each other, the hollow rotary motor drives the connecting plate to rotate relative to the air slip ring plate to realize 360° arbitrary angle rotation, and the inner wall surface of the air slip ring plate and the outer wall surface of the connecting plate are sealed by opening the sealing assembly to ensure good vacuum tightness between the air slip ring plate and the connecting plate.

[0028] 5. The head binding device of the patching machine provided by the embodiment of the utility model, first gas path is formed by the gas slip ring plate, the gas path between the closed space and the connecting plate, and is specific as follows: the material adsorption air pipe is equipped on the gas slip ring plate, one end is connected with the air module, the other end is in gas path conduction with the first material adsorption air inlet hole on the connecting plate in the closed space, and the material adsorption air outlet hole is communicated with the first material adsorption air inlet hole through the inside of the connecting plate; the second gas path includes the second material adsorption air inlet hole opened on the adsorption plate, and the second material adsorption air inlet hole is communicated with the material adsorption air outlet hole.

[0029] Need to be explained, through this design, the air module is in gas path conduction with the suction nozzle through the first gas path and the second gas path in turn, on the basis of realizing 360 ° arbitrary angle correction when mounting the chip, guaranteeing the good pickup effect of the head binding device of the patching machine to the chip, and further satisfying the pickup and mounting demand to the chip.

[0030] 6. The head binding device of the patching machine provided by the embodiment of the utility model, a side of the adsorption plate facing the suction nozzle is provided with an air hole, the air module is communicated with the adsorption hole provided on the suction nozzle through the first gas path, the second gas path and the air hole in turn, by setting the first gas path and the second gas path through which the vacuum passes, further setting the air hole and the adsorption hole on the adsorption plate and the suction nozzle respectively, the vacuum adsorption chip can be realized, and the mounting angle can be better adjusted when mounting the chip.

[0031] 7. The head binding device of the patching machine provided by the embodiment of the utility model, the detachable connection between the suction nozzle and the adsorption plate is realized through the vacuum adsorption or magnetic suction mode, through this design, the head binding device of the patching machine can automatically replace the suction nozzle of different sizes in the working process, the flexibility of the equipment is improved, and the mounting demand of the complex process of multiple chip mounting is satisfied.

[0032] 8. The embodiment of the utility model further provides a correction mounting system, the pickup, correction and mounting of the chip can be realized, the correction mounting system comprises a visual correction assembly and the above-mentioned head binding device of the patching machine; the visual correction assembly is arranged at one end of the hollow cavity far from the suction nozzle.

[0033] Need to be explained, the correction mounting system has the same beneficial effects as the above-mentioned head binding device of the patching machine, and will not be repeated here. [BRIEF DESCRIPTION OF DRAWINGS]

[0034] In order to more clearly illustrate the technical scheme in the embodiment of the utility model, the drawings needed to be used in the embodiment description will be briefly introduced below, and obviously, the drawings in the following description are only some embodiments of the utility model, and other drawings can be obtained according to these drawings without the creative labor of the ordinary skilled in the art.

[0035] Figure 1 is the overall structure explosion of the head binding device of the patching machine in the embodiment of the utility model Figure One .

[0036] Figure 2 is the overall structure explosion of the head binding device of the patching machine in the embodiment of the utility model Figure Two .

[0037] Figure 3 is the overall structure explosion of the head binding device of the patching machine in the embodiment of the utility model Figure Three .

[0038] Figure 4 is the first gas path and the second gas path schematic diagram of the head binding device of the patching machine in the embodiment of the utility model.

[0039] Figure 5 is the overall structure explosion of the head binding device of the patching machine in the embodiment of the utility model Figure Four .

[0040] Figure 6 is the overall structure schematic diagram of the correction and mounting system in the embodiment of the utility model Figure One .

[0041] Figure 7 is the overall structure schematic diagram of the correction and mounting system in the embodiment of the utility model Figure Two .

[0042] The drawing mark explanation is as follows:

[0043] 10, the head binding device of the patching machine, 20, the correction and mounting system,

[0044] 1, the driving assembly, 11, the driving piece, 111, the hollow cavity, 12, the connecting assembly, 121, the mounting plate, 122, the air slip ring plate, 1221, the material adsorption air pipe, 1222, the suction nozzle adsorption air pipe, 123, the connecting plate, 1231, the first material adsorption air inlet hole, 1232, the material adsorption air outlet hole, 1233, the second suction nozzle adsorption air inlet hole, 1234, the suction nozzle adsorption air outlet hole,

[0045] 2, the suction nozzle assembly, 21, the adsorption assembly, 211, the adsorption plate, 2111, the air hole, 2112, the adsorption groove, 212, the glass, 22, the suction nozzle, 221, the adsorption hole,

[0046] 3, the visual correction assembly,

[0047] 4, the force sensor assembly, 41, the adapter plate, 42, the force sensor, 43, the fixed plate,

[0048] 5, the magnetic force spring assembly,

[0049] 6. Cable assembly. [Specific implementation method]

[0050] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and implementation examples. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0051] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly attached to the other element or there may be an intermediate element. When an element is referred to as being "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only.

[0052] It should be noted that the terms "first" and "second" in the description and claims of the present utility model are used to distinguish different objects rather than to describe a specific order.

[0053] In this utility model, terms such as "upper," "lower," "left," "right," "front," "back," "top," "bottom," "inner," "outer," "center," "vertical," "horizontal," "transverse," and "longitudinal" indicate positions or locations based on the positions or locations shown in the accompanying drawings. These terms are primarily intended to better describe the utility model and its embodiments and are not intended to limit the devices, elements, or components indicated to having a specific orientation, or to being constructed or operated in a specific orientation.

[0054] Furthermore, some of the above terms may be used to express other meanings besides indicating a position or location. For example, the term "on" may also be used to indicate a dependency or connection in certain circumstances. Those skilled in the art will understand the specific meanings of these terms in this utility model based on the specific circumstances.

[0055] Furthermore, the terms "installed," "disposed," "provided with," "connected," and "connected" should be interpreted broadly. For example, they can refer to fixed connections, removable connections, or integral structures; mechanical connections or electrical connections; direct connections, indirect connections through an intermediary, or internal communication between two devices, elements, or components. Those skilled in the art will understand the specific meanings of these terms in this utility model based on the specific circumstances.

[0056] See also Figure 1The utility model embodiment provides a kind of binding head device 10 of chip mounter, binding head device 10 of chip mounter 10 includes drive assembly 1 and suction nozzle component 2;

[0057] Drive assembly 1 includes driving part 11 and the connecting assembly 12 connected with driving part 11, suction nozzle component 2 includes adsorption component 21 and the suction nozzle 22 detachably connected with one end of adsorption component 21, the other end of adsorption component 21 is connected with driving part 11 by connecting assembly 12;

[0058] Driving part 11 is equipped with hollow cavity 111 that two ends are penetrated, suction nozzle 22 is at least partly transparent and is equipped with adsorption hole 221 that two ends are penetrated on suction nozzle 22, driving part 11 is communicated with adsorption hole 221 on suction nozzle 22 by hollow cavity 111, and adsorption component 21 and suction nozzle 22 are located at the opening of one end of hollow cavity 111;

[0059] Connecting assembly 12 is equipped with first gas path inside, and air passage module (not marked in drawing) is connected on first gas path, adsorption component 21 is equipped with second gas path inside, when suction nozzle 22 is connected with adsorption component 21, air passage module is sequentially communicated with suction nozzle 22 by first gas path and second gas path.

[0060] The binding head device 10 of chip mounter provided in the embodiment of the utility model can be used for picking up, correcting and accurately mounting chips in the automatic mounting process of the semiconductor industry. The binding head device 10 of chip mounter can be applied to occasions requiring high-precision mounting. When picking up and adsorbing the chip, the feature to be identified can be exposed. When mounting the chip, the mounting process of real-time alignment and mounting of the upper surface of the chip and the identification point of the mounting position can be realized.

[0061] Specifically, in the drive assembly 1, the driving part 11 is used to control the rotation of the connecting assembly 12. The end of the connecting assembly 12 away from the driving part 11 is responsible for being connected with the suction nozzle component 2. When the driving part 11 controls the rotation of the connecting assembly 12, the suction nozzle component 2 is driven to rotate synchronously by the connecting assembly 12. In the suction nozzle component 2, one end of the adsorption component 21 is detachably connected with the suction nozzle 22, and the other end is connected with the driving part 11 through the connecting assembly 12. When the suction nozzle 22 is connected with the adsorption component 21, the working end of the driving part 11 controls the rotation of the suction nozzle 22 through the connecting assembly 12 and the adsorption component 21 in sequence.

[0062] The utility model solves the technical problem that the existing binding head device of chip mounter has poor effect when aligning and mounting the chip, and is difficult to meet the high-precision requirement of chip mounting.

[0063] It can be understood that the patch machine binding head device 10 of the embodiment of the utility model can realize perspective identification of the chip and the corresponding mounting position identification point from the top of the suction nozzle 22 after picking up and adsorbing the chip, so as to realize real-time alignment mounting function, improve the mounting precision of the patch machine binding head device 10, and further meet the high-precision requirement of chip mounting.

[0064] Through the above design, after picking up and adsorbing the chip, the chip and the corresponding mounting position identification point can be identified from the top of the suction nozzle 22, so as to realize real-time alignment mounting function, improve the mounting precision of the patch machine binding head device 10, and further meet the high-precision requirement of chip mounting.

[0065] It should be noted that after the ventilation module is sequentially communicated with the first gas path and the second gas path on the patch machine binding head device 10 and is in gas path conduction with the suction nozzle 22, the good vacuum sealing property of the patch machine binding head device 10 and the high vacuum degree during chip picking and mounting can be ensured, and further the position of the chip does not deviate during the high-speed movement of picking and mounting the chip.

[0066] The embodiment of the utility model realizes the requirement of chip manufacturing during chip mounting, avoids the influence of the quality of the chip due to the insufficient vacuum sealing property of the patch machine binding head device 10 by setting the first gas path and the second gas path in the inside of the connecting assembly 12 and the adsorption assembly 21 respectively and externally connecting the ventilation module.

[0067] In the patch machine binding head device 10, the ventilation module is sequentially communicated with the inside of the suction nozzle 22 through the first gas path in the inside of the connecting assembly 12 and the second gas path in the inside of the adsorption assembly 21; one end of the ventilation module is defined as an air inlet end, and the other end is defined as an air outlet end; the air inlet end of the ventilation module is communicated with the air extraction equipment, and the air outlet end is communicated with the first gas path.

[0068] The process of adsorbing the chip by the patch machine binding head device 10 of the embodiment of the utility model is as follows: when the patch machine binding head device 10 moves to the suction nozzle 22 to be attached to the chip or just contacts the chip, the air extraction equipment is opened to keep the ventilation module being extracted, so that the gas in the inside of the ventilation module, the first gas path, the second gas path and the inside of the suction nozzle 22 is extracted, so that there is a gas pressure difference between the inside of the suction nozzle 22 and the outside atmosphere, and finally the chip is stably attached to the working end of the suction nozzle 22; at this time, the chip can be picked up and mounted by adsorption of the working end of the suction nozzle 22.

[0069] In the ideal state, the inside of the patch machine binding head device 10 is in a completely vacuum state, but in fact, the completely vacuum state is not easy to realize, the cost is relatively high, and the requirement of the air extraction equipment is relatively high.

[0070] Optionally, the patch machine binding head device 10 further comprises a device capable of replacing the suction nozzle 22, the working end of the suction assembly 21 can be detachably connected with suction nozzles 22 of different sizes, and the replacement of the suction nozzle 22 can be automatic replacement or manual replacement, which can be set according to actual conditions.

[0071] Please continue to refer to Figure 1 The connecting assembly 12 comprises a hollow mounting plate 121, a gas slip ring plate 122 and a connecting plate 123.

[0072] It can be understood that in the patch machine binding head device 10 provided by the embodiment of the utility model, the mounting plate 121, the gas slip ring plate 122 and the connecting plate 123 are all hollow, so that when the chip is picked up and prepared for mounting by using the patch machine binding head device 10, the chip and the mounting position identification point can be identified in the upper of the suction nozzle 22.

[0073] It should be noted that one side of the mounting plate 121 is connected with the driving part 11, and the other side is connected with the gas slip ring plate 122, the outer diameter of the connecting plate 123 is less than or equal to the inner diameter of the mounting plate 121, one end of the connecting plate 123 is connected with the driving part 11, and the other end is connected with the suction assembly 21.

[0074] The mounting plate 121 is used to fix the driving part 11 and the gas slip ring plate 122 respectively, and the driving part 11 and the gas slip ring plate 122 are fixedly installed on the two sides of the mounting plate 121 respectively; the connecting plate 123 is used to connect the working end of the driving part 11 and the suction assembly 21 respectively, and the mounting plate 121, the gas slip ring plate 122 and the connecting plate 123 are cooperated to ensure the good vacuum tightness of the driving assembly 1.

[0075] Through the above design, when the patch machine binding head device 10 is pressed to pick up and mount the chip, the working end of the driving part 11, the connecting plate 123 and the suction nozzle assembly 2 do not generate lateral force on the chip, so as to ensure the rigidity of the internal elements of the patch machine binding head device 10.

[0076] The driving part 11 provided by the embodiment of the utility model is a hollow rotary motor, which can realize 360° arbitrary angle mounting correction when mounting the chip, and improves the angle precision of the chip mounting by using the patch machine binding head device 10.

[0077] Specifically, the working end of the driving part 11 is responsible for controlling the rotation of the connecting plate 123, and then drives the suction assembly 21 and the suction nozzle 22 to rotate together, so as to adjust the angle of picking up the chip and mounting the chip by the suction nozzle 22.

[0078] Further, the adsorption assembly 21 comprises an adsorption plate 211 and a glass 212 which is at least partially transparent, wherein one end of the adsorption plate 211 is detachably connected with the suction nozzle 22, and the other end is connected with the connecting plate 123, and the glass 212 is located in the connecting plate 123 and is sealingly fixed to the adsorption plate 211.

[0079] It can be understood that one end of the adsorption plate 211 is detachably connected with the suction nozzle 22, and in the process of picking up and mounting the chip by using the chip mounter head binding device 10, the adsorption plate 211 is responsible for adsorbing the suction nozzle 22, and the suction nozzle 22 is responsible for adsorbing the chip to realize the picking up and mounting of the chip.

[0080] It should be noted that placing the glass 212 on the end of the adsorption plate 211 away from the suction nozzle 22 can prevent air leakage, and the glass 212 is sealingly fixed to the end of the adsorption plate 211 away from the suction nozzle 22; by setting the glass 212 which is at least partially transparent, feature recognition can be performed through the transparent part of the glass 212 by the correction device before picking up the chip and before preparing to mount the chip, the feature recognition includes the identification points of the chip and the mounting position, thereby improving the mounting accuracy of the chip mounter head binding device 10.

[0081] In some embodiments, the glass 212 used in the chip mounter head binding device 10 is a high-transmittance glass, and the general light transmittance reaches more than 90%, which meets the feature recognition of the chip and the identification points of the mounting position by the correction device, and further ensures the accuracy of the chip mounting.

[0082] In the embodiments of the present application, the glass 212 provided in the chip mounter head binding device 10 is located in the hollow part of the connecting plate 123 and is sealingly fixed to the end of the adsorption plate 211 away from the suction nozzle 22; when the suction nozzle 22 is connected with the adsorption plate 211, at least part of the glass 212 covers and seals one end of the adsorption hole 221 through the adsorption plate 211.

[0083] In some embodiments, the suction nozzle 22 can be designed according to the characteristics of different chip identification, and the suction hole 221 which is penetrated through both ends of the suction nozzle 22 or the perspective position is added, thereby leaking out the features which need to be identified during chip mounting.

[0084] Please refer to Figure 2 , the inner diameter of the air slide ring plate 122 is greater than or equal to the outer diameter of the connecting plate 123, the inner wall surface of the air slide ring plate 122 is spaced apart from the outer wall surface of the connecting plate 123, and the connecting plate 123 can rotate relative to the air slide ring plate 122.

[0085] In the binding head device 10 provided by the embodiment of the utility model, the inner wall surface of the air slide ring plate 122 and the outer wall surface of the connecting plate 123 are correspondingly arranged, the air slide ring plate 122 and the connecting plate 123 can rotate relatively, and the hollow rotary motor drives the connecting plate 123 to rotate at 360 degrees at any angle relative to the air slide ring plate 122.

[0086] Further, the inner wall surface of the air slide ring plate 122 and the outer wall surface of the connecting plate 123 are sealed by the sealing assembly (not marked in the figure), and a closed space is formed between the inner wall surface of the air slide ring plate 122, the outer wall surface of the connecting plate 123 and the sealing assembly.

[0087] It can be understood that the sealing space is formed between the inner wall surface of the air slide ring plate 122 and the outer wall surface of the connecting plate 123 by the sealing assembly, which can ensure that the air passage module and the first air passage formed in the connecting assembly 12 are in sealed communication.

[0088] In the embodiment of the utility model, the sealing assembly specifically comprises a plurality of sealing rings, which seals the inner wall surface of the air slide ring plate 122 and the outer wall surface of the connecting plate 123 to ensure that the first air passage in the connecting assembly 12 has good vacuum sealing property.

[0089] In some embodiments, the sealing ring on the sealing assembly can be a nano sealing ring, which is an important sealing element, and its main functions include preventing fluid (liquid or gas) leakage or seepage to maintain the internal and external pressure difference (even complete vacuum state), and preventing the entry of pollutants and dust.

[0090] The embodiment of the utility model prevents the first air passage formed in the connecting assembly 12 from being directly connected with the outside atmosphere by the good sealing effect of the sealing assembly, so as to ensure the high sealing property of the binding head device 10 of the chip mounter, and the device is wear-resistant and durable, further protects the sealing surface in contact with it from being damaged, and improves the service life of the binding head device 10 of the chip mounter.

[0091] It should be noted that the number and position of the sealing ring in the utility model can be set according to actual needs, and can be set according to the shape of the air slide ring plate 122 and the connecting plate 123, the interval distance between the inner wall surface of the air slide ring plate 122 and the outer wall surface of the connecting plate 123 and other parameters, which are not particularly limited here.

[0092] Please refer to Figure 3The air slide ring plate 122 is provided with a material adsorption air pipe 1221 connected with the air module, the connecting plate 123 is provided with a first material adsorption air inlet hole 1231 and a material adsorption air outlet hole 1232, the first material adsorption air inlet hole 1231 is in communication with the inside of the air slide ring plate 122, and the material adsorption air pipe 1221 is in air path conduction with the first material adsorption air inlet hole 1231 in the sealed space.

[0093] The first air path is formed by air path conduction among the air slide ring plate 122, the sealed space and the connecting plate 123, wherein one end of the material adsorption air pipe 1221 is in communication with the air module, and the other end is in air path conduction with the first material adsorption air inlet hole 1231 on the connecting plate 123 in the sealed space.

[0094] Further, the second air path includes a second material adsorption air inlet hole (not labeled in the figure) formed in the adsorption plate 211, and the second material adsorption air inlet hole is in communication with the material adsorption air outlet hole 1232.

[0095] It should be noted that through the above design, the air module is in air path conduction with the suction nozzle 22 through the first air path and the second air path in sequence, and on the basis of realizing 360° arbitrary angle mounting correction during mounting of the chip, the head binding device 10 of the chip mounter guarantees good pickup effect of the chip, and further meets the pickup and mounting requirements of the chip.

[0096] In some embodiments, the material adsorption air pipe 1221 is in communication with the inside of the air slide ring plate 122 through the outer wall surface of the air slide ring plate 122, the air module is connected with one end of the material adsorption air pipe 1221 away from the outer wall surface of the air slide ring plate 122, the first material adsorption air inlet hole 1231 is formed in the outer wall surface of the connecting plate 123 and is in communication with the material adsorption air pipe 1221, and a sealing ring is arranged between the inner wall surface of the air slide ring plate 122 and the outer wall surface of the connecting plate 123 to seal the material adsorption air pipe 1221 and the first material adsorption air inlet hole 1231 to realize air path conduction therebetween.

[0097] In some embodiments, the material adsorption air outlet hole 1232 is formed in the bottom surface of the connecting plate 123, that is, the side facing the second material adsorption air inlet hole of the adsorption plate 211, the material adsorption air outlet hole 1232 corresponds to the second material adsorption air inlet hole to realize air path conduction between the first air path and the second air path.

[0098] Please continue to refer to Figure 3 The side of the adsorption plate 211 facing the suction nozzle 22 is provided with an air hole 2111, and the second material adsorption air inlet hole is in communication with the suction hole 221 through the air hole 2111.

[0099] When the suction nozzle 22 is connected with the adsorption plate 211, the air passage module is in turn connected with the material adsorption air passage pipe 1221 on the air slide ring plate 122, the first material adsorption air inlet hole 1231 and the material adsorption air outlet hole 1232 on the connecting plate 123, the second material adsorption air inlet hole and the air passage hole 2111 on the adsorption plate 211, and the adsorption hole 221 in gas path conduction to adsorb the chip.

[0100] It can be understood that the air passage hole 2111 and the second material adsorption air inlet hole are connected through the inside of the adsorption plate 211 to realize the gas path conduction between the first air passage on the connecting assembly 12 and the second air passage on the adsorption plate 211.

[0101] The air passage hole 2111 is arranged on the side facing the suction nozzle 22, and the second material adsorption air inlet hole is arranged on the side facing the connecting plate 123, so that both ends of the adsorption plate 211 are penetrated, and the second air passage is connected with the adsorption hole 221 on the suction nozzle 22, at this time, the air passage module is in turn connected with the first air passage, the second air passage and the air passage hole 2111, and finally connected with the outside through the adsorption hole 221 on the suction nozzle 22.

[0102] Through the above design, the chip can be vacuum adsorbed, and the mounting angle can be better adjusted when the chip is mounted.

[0103] When the suction nozzle 22 is connected with the adsorption plate 211, the suction device is opened, so that the inside of the bonding head device 10 of the chip mounter is continuously sucked through the air passage module, the gas in the first air passage, the second air passage and the inside of the suction nozzle 22 is sucked away, so that there is a pressure difference between the inside of the suction nozzle 22 and the outside atmosphere, and finally the working end of the suction nozzle 22 is realized. The chip is stably attached, and then the chip is picked up and mounted. Through the design, the rigidity of the bonding head device 10 of the chip mounter for deep cavity mounting of the chip can be ensured, and the high precision requirement of the chip mounting position can be met.

[0104] Please refer to Figure 3 and Figure 4 , wherein, Figure 4 is a schematic diagram of the first air passage and the second air passage in the embodiment of the utility model. The yellow line part is the first air passage, and the first air passage is in turn connected with the material adsorption air passage pipe 1221 on the air slide ring plate 122, the first material adsorption air inlet hole 1231 and the material adsorption air outlet hole 1232 provided on the connecting plate 123. The material adsorption air passage pipe 1221 and the first material adsorption air inlet hole 1231 are sealed and connected through the sealing assembly arranged between the air slide ring plate 122 and the connecting plate 123, and the first material adsorption air inlet hole 1231 and the material adsorption air outlet hole 1232 are in gas path conduction in the inside of the connecting plate 123.

[0105] The second gas path is formed in the red line part, the second gas path is communicated with the second material adsorption air inlet hole and the air hole 2111 formed in the adsorption plate 211, and the second gas path is conducted in the inside of the adsorption plate 211; the communication between the first gas path and the second gas path is realized by the corresponding arrangement of the second material adsorption air inlet hole and the material adsorption air outlet hole 1232.

[0106] As an optional embodiment, refer to Figure 5 The one end of the adsorption plate 211 facing the suction nozzle 22 is provided with an adsorption groove 2112, and the other end is provided with a first suction nozzle adsorption air inlet hole (not marked in the figure), and the adsorption groove 2112 is communicated with the first suction nozzle adsorption air inlet hole.

[0107] Specifically, the gas slide ring plate 122 is provided with a suction nozzle adsorption air pipe 1222 connected with the air module, the connecting plate 123 is provided with a second suction nozzle adsorption air inlet hole 1233 and a suction nozzle adsorption air outlet hole 1234, the second suction nozzle adsorption air inlet hole 1233 is communicated with the inside of the gas slide ring plate 122, and the suction nozzle adsorption air pipe 1222 and the second suction nozzle adsorption air inlet hole 1233 are in gas path conduction in the closed space; one end of the suction nozzle adsorption air outlet hole 1234 is communicated with the second suction nozzle adsorption air inlet hole 1233 through the inside of the connecting plate 123, and the other end is communicated with the adsorption groove 2112 through the first suction nozzle adsorption air inlet hole, so as to adsorb the suction nozzle 22.

[0108] It can be understood that the adsorption groove 2112 on the adsorption plate 211 is arranged on the same side as the air hole 2111, and the first suction nozzle adsorption air inlet hole and the second material adsorption air inlet hole are arranged on the same side, wherein the gas path communicated between the adsorption groove 2112 on the adsorption plate 211 and the first suction nozzle adsorption air inlet hole and the gas path communicated between the air hole 2111 and the second material adsorption air inlet hole are independent of each other, so as to respectively realize the adsorption of the suction nozzle 22 and the adsorption of the chip through the suction nozzle 22.

[0109] In the embodiment of the utility model, by opening the air extraction equipment, it keeps the inside of the binding head device 10 of the chip mounter to continuously extract air through the air module, in turn through the suction nozzle adsorption air pipe 1222 on the gas slide ring plate 122, the second suction nozzle adsorption air inlet hole 1233 and the suction nozzle adsorption air outlet hole 1234 communicated in the inside of the connecting plate 123 and the adsorption groove 2112 on the adsorption plate 211, and then realize that the suction nozzle 22 is stably attached to the adsorption groove 2112 on the adsorption plate 211.

[0110] As another optional implementation, the one end of the adsorption plate 211 facing the suction nozzle 22 is magnetically connected with the suction nozzle 22.

[0111] In some embodiments, the magnetic attraction connection between the adsorption plate 211 and the suction nozzle 22 can be achieved by respectively arranging magnetic attraction elements on the connected contact surfaces, or by arranging a magnetic attraction element on one surface and a magnetic element on the other surface; the magnetic attraction element can be a magnet, and the magnetic element can be an iron sheet or other element with magnetism.

[0112] In the head binding device 10 provided by the embodiment of the utility model, the detachable connection between the suction nozzle 22 and the adsorption plate 211 is achieved by the vacuum adsorption or magnetic attraction mode, the suction nozzle 22 of different sizes can be automatically replaced in the working process of the head binding device 10, the flexibility of the equipment is improved, and the mounting demand of the complex process of multi-chip mounting is met.

[0113] Please refer to Figure 6 and Figure 7 The embodiment of the utility model further provides a correction mounting system 20, which can realize the pickup, correction and mounting of chips, and the correction mounting system 20 comprises a visual correction assembly 3 and the above-mentioned head binding device 10 of the chip mounter.

[0114] Understandably, the visual correction assembly 3 is arranged at the end of the hollow cavity 111 away from the suction nozzle 22, and is responsible for the real-time alignment and correction of the upper surface of the chip and the mounting position identification point during the chip mounting.

[0115] Further, the correction mounting system 20 further comprises a force sensor assembly 4 and a control assembly (not marked in the figure); the force sensor assembly 4 comprises an adapter plate 41, a force sensor 42 mounted on the adapter plate 41 and a fixed plate 43 stacked on the force sensor 42; the driving assembly 1 is mounted on the adapter plate 41, and one side of the fixed plate 43 is connected with the control assembly.

[0116] Understandably, in the force sensor assembly 4 provided by the embodiment of the utility model, the adapter plate 41 is connected with a plurality of force sensors 42, and at the same time, the driving assembly 1 is also mounted on the adapter plate 41; when the mounting or adsorption of the chip needs to be controlled, the force sensor 42 is used as a force sensing feedback matched with the control assembly to control the mounting force or adsorption force of the head binding device 10, and through this design, the chip can be prevented from being damaged during mounting or adsorption.

[0117] It should be noted that the working process of the correction mounting system 20 is as follows: the main body of the correction mounting system 20 controls the head binding device 10 of the chip mounter to descend, the force is controlled by the cooperation of the force sensor assembly 4 and the control assembly, the material vacuum is opened after the suction nozzle 22 contacts the chip, the chip is adsorbed by the suction nozzle 22, and the main body of the correction mounting system 20 controls the head binding device 10 of the chip mounter to rise.

[0118] Further, when the patch machine binding head device 10 and the visual correction assembly 3 move above the mounting position, continue to descend to approach the mounting position, first by the visual correction assembly 3 to carry out real-time alignment, according to the identification of the visual correction assembly 3 to carry out the correction of the mounting position, after the correction is completed, the patch machine binding head device 10 is lowered to complete the chip mounting, after closing the material vacuum, the patch machine binding head device 10 is raised, and a mounting action is completed.

[0119] In some embodiments, by using the force sensor 42 to match the closed-loop control of the linear motor or voice coil motor module, the high-precision mounting force control of the patch machine binding head device 10 during chip mounting can be realized, so as to meet the process requirements of different pressure mounting of chips, effectively prevent the damage of chips caused by overshoot in the mounting process, and further improve the yield of finished products.

[0120] It should be noted that the correction mounting system 20 of the embodiment of the utility model further comprises a magnetic spring assembly 5 connected with the force sensor assembly 4, the magnetic spring assembly 5 is used for reducing the load of the driving assembly 1 of the patch machine binding head device 10 and the visual correction assembly 3 when vertically used, and can be automatically lifted when the driving assembly 1 is powered off, so as to prevent collision caused by falling.

[0121] Optionally, the main body of the correction mounting system 20 and the patch machine binding head device 10 can be connected by using a wire arrangement assembly 6, the wire arrangement assembly 6 uses a high-soft cable, ensures the stability of the cable output when the patch machine binding head device 10 is raised and lowered, and further improves the force control precision.

[0122] The above only describes the preferred embodiment of the utility model, and does not limit the utility model, and any modification, equivalent replacement and improvement within the principle of the utility model should be included in the protection range of the utility model.

Claims

1. A patch bonding head device, characterized in that: the patch bonding head device comprises a driving assembly and a suction nozzle assembly; the driving assembly comprises a driving member and a connecting assembly connected to the driving member, and the suction nozzle assembly comprises a suction assembly and a suction nozzle detachably connected to one end of the suction assembly, and the other end of the suction assembly is connected to the driving member through the connecting assembly; the driving member is provided with a hollow cavity penetrating through both ends, the suction nozzle is at least partially transparent and is provided with a suction hole penetrating through both ends, the driving member is in communication with the suction hole on the suction nozzle through the hollow cavity, and the suction assembly and the suction nozzle are located at the opening of one end of the hollow cavity; the connecting assembly is internally provided with a first air path, the first air path is externally connected with a ventilation module, the suction assembly is internally provided with a second air path, and when the suction nozzle is connected to the suction assembly, the ventilation module is in air path conduction with the suction nozzle through the first air path and the second air path in sequence. 2.The patch bonding head device according to claim 1, characterized in that: the connecting assembly comprises a hollow mounting plate, a gas slip ring plate and a connecting plate; one side of the mounting plate is connected to the driving member, and the other side is connected to the gas slip ring plate; the outer diameter of the connecting plate is less than or equal to the inner diameter of the mounting plate, one end of the connecting plate is connected to the driving member, and the other end is connected to the suction assembly. 3.The patch bonding head device according to claim 2, characterized in that: the suction assembly comprises a suction plate and a glass that is at least partially transparent; one end of the suction plate is detachably connected to the suction nozzle, and the other end is connected to the connecting plate, and the glass is located in the connecting plate and is fixedly sealed to the suction plate. 4.The patch bonding head device according to claim 3, characterized in that: the inner diameter of the gas slip ring plate is greater than or equal to the outer diameter of the connecting plate, the inner wall surface of the gas slip ring plate and the outer wall surface of the connecting plate are arranged in a spaced manner, and the connecting plate can rotate relative to the gas slip ring plate; the inner wall surface of the gas slip ring plate and the outer wall surface of the connecting plate are sealed by opening a sealing assembly, and a sealed space is formed between the inner wall surface of the gas slip ring plate, the outer wall surface of the connecting plate and the sealing assembly. 5.The patch bonding head device according to claim 4, characterized in that: the gas slip ring plate is provided with a material suction ventilation pipe connected to the ventilation module, the connecting plate is provided with a first material suction air inlet hole and a material suction air outlet hole, the first material suction air inlet hole is in communication with the inside of the gas slip ring plate, and the material suction ventilation pipe and the first material suction air inlet hole are in air path conduction in the sealed space; the material suction air outlet hole is in communication with the first material suction air inlet hole through the inside of the connecting plate, and the first air path is formed by the air path conduction among the gas slip ring plate, the sealed space and the connecting plate; the second air path comprises a second material suction air inlet hole opened on the suction plate, and the second material suction air inlet hole is in communication with the material suction air outlet hole. 6.The patch bonding head device according to claim 5, characterized in that: The side of the adsorption plate facing the suction nozzle is provided with a ventilation hole, and the second material adsorption inlet hole is communicated with the adsorption hole through the ventilation hole. When the suction nozzle is connected to the adsorption plate, the ventilation module is sequentially communicated with the adsorption hole through the material adsorption ventilation pipe on the air slide ring plate, the first material adsorption inlet hole and the material adsorption outlet hole on the connecting plate, the second material adsorption inlet hole and the ventilation hole on the adsorption plate, so as to adsorb the chip.

7. The patch machine binding head device of claim 6, wherein: The end of the adsorption plate facing the suction nozzle is provided with an adsorption groove, and the other end is provided with a first suction nozzle adsorption inlet hole, and the adsorption groove is communicated with the first suction nozzle adsorption inlet hole; The air slide ring plate is provided with a suction nozzle adsorption ventilation pipe connected with the ventilation module, and the connecting plate is provided with a second suction nozzle adsorption inlet hole and a suction nozzle adsorption outlet hole, the second suction nozzle adsorption inlet hole is communicated with the inside of the air slide ring plate, and the suction nozzle adsorption ventilation pipe is communicated with the second suction nozzle adsorption inlet hole in the closed space; One end of the suction nozzle adsorption outlet hole is communicated with the second suction nozzle adsorption inlet hole through the inside of the connecting plate, and the other end is communicated with the adsorption groove through the first suction nozzle adsorption inlet hole, so as to adsorb the suction nozzle.

8. The patch machine binding head device of claim 6, wherein: The end of the adsorption plate facing the suction nozzle is magnetically connected with the suction nozzle.

9. A correction mounting system capable of pickup, correction and mounting of a chip, characterized by comprising: a pickup device for picking up the chip; a correction device for correcting the picked-up chip; and a mounting device for mounting the corrected chip. The correction mounting system comprises a visual correction assembly and the patch machine binding head device of any one of claims 1-8; the visual correction assembly is arranged at the end of the hollow cavity away from the suction nozzle.

10. The correction mounting system of claim 9, wherein: The correction mounting system further comprises a force sensor assembly and a control assembly; The force sensor assembly comprises an adapter plate, a force sensor mounted on the adapter plate, and a fixed plate stacked on the force sensor; The driving assembly is mounted on the adapter plate, and one side of the fixed plate is connected with the control assembly.

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