Laminated optical relay packaging device

Abstract

A stacked optical relay packaging device comprises a first guide pin; the second guide pin is adjacent to the first guide pin; the photoelectric unit is in direct or indirect contact with the first guide pin and is electrically connected with the first guide pin and the second guide pin; the first light-transmitting insulating block is arranged on the photoelectric unit; the third guide pin is adjacent to the first guide pin; the fourth guide pin is arranged adjacent to the third guide pin; the first light-emitting unit is arranged on the first light-transmitting insulating block and is electrically connected with the third guide pin and the fourth guide pin; the creepage distance between the photoelectric unit and the first light-emitting unit along the first light-transmitting insulating block is larger than the height of the first light-transmitting insulating block.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to a light relay packaging device, in particular, a stacked light relay packaging device. BACKGROUND

[0002] A light relay can also be called a photo coupler, an optical coupler, an optical isolator, and an opto-isolator. The light relay is a device that transmits electrical signals through visible light or infrared light as a medium. The light relay has the characteristic of electrical isolation between the input circuit and the output circuit.

[0003] The existing light relay adopts two conductive pins arranged in an up-down manner. A light-emitting unit is arranged on one of the conductive pins, and a photoelectric unit is arranged on the other conductive pin. The packaging steps are to first package with white glue with a light transmittance of about 20%, and then to coat the outside with black glue that is not transparent. That is, the packaging needs to be performed by twice molding, which has high process complexity. In addition, the light transmittance of the white glue is poor, which requires a higher driving current of the light-emitting unit and sufficient brightness to drive the photoelectric unit.

[0004] Therefore, how to simplify the packaging process and improve the electrical isolation effect between the light-emitting unit and the photoelectric unit is one of the problems to be solved at present. SUMMARY

[0005] The present disclosure provides a stacked light relay packaging device, which can complete the packaging by one-time molding, effectively simplifying the process complexity. The stacked light relay packaging device can first be made by injection molding or compression molding to make a light-transmitting insulating plate, and then the light-transmitting insulating plate is cut to form a light-transmitting insulating block with a guide angle (chamfer). The injection molding or compression molding can make the thickness of the light-transmitting insulating plate uniform, and the side wall size of the light-transmitting insulating block with a guide angle is longer, the creepage distance is longer, and the electrical isolation effect is better.

[0006] The present disclosure provides a stacked light relay packaging device, which includes a first lead, a second lead adjacent to the first lead, a photoelectric unit directly or indirectly contacting the first lead and electrically connected to the first lead and the second lead, a first light-transmitting insulating block disposed on the photoelectric unit, a third lead adjacent to the first lead, a fourth lead adjacent to the third lead, and a first light-emitting unit disposed on the first light-transmitting insulating block and electrically connected to the third lead and the fourth lead. The creepage distance of the photoelectric unit and the first light-emitting unit along the first light-transmitting insulating block is greater than the height of the first light-transmitting insulating block.

[0007] In some embodiments, the first light-transmitting insulating block further includes a guide angle located at the periphery of the first light-transmitting insulating block.

[0008] In some embodiments, the corner includes a straight corner, a round corner, a stepped corner, a C-shaped corner, a V-shaped corner, or a U-shaped corner.

[0009] In some embodiments, the stacked photorelay package further comprises a second light-transmissive insulating block disposed on the second light-sensitive region of the photoelectric unit; and a second light-emitting unit disposed on the second light-transmissive insulating block; the first light-transmissive insulating block is disposed on the first light-sensitive region of the photoelectric unit.

[0010] In some embodiments, the first light-transmissive insulating block further comprises a corner disposed on a periphery of the first light-transmissive insulating block; and the second light-transmissive insulating block further comprises a corner disposed on a periphery of the second light-transmissive insulating block.

[0011] In some embodiments, the first light-transmissive insulating block and the second light-transmissive insulating block are integrally formed.

[0012] In some embodiments, the second light-emitting unit is electrically connected to the third lead and the fourth lead.

[0013] In some embodiments, the photoelectric unit includes a photosensitive integrated circuit, a photosensitive resistor, a phototransistor, a photodiode, or a photo triac.

[0014] In some embodiments, the stacked photorelay package further comprises a first lead electrically connected to the photoelectric unit and the first lead; a second lead electrically connected to the photoelectric unit and the first lead; a third lead electrically connected to the photoelectric unit and the second lead; a fourth lead electrically connected to the photoelectric unit and the second lead; a fifth lead electrically connected to the photoelectric unit and the third lead; and a sixth lead electrically connected to the photoelectric unit and the third lead.

[0015] In some embodiments, the stacked photorelay package further comprises a seventh lead electrically connected to the first light-emitting unit and the third lead; and an eighth lead electrically connected to the first light-emitting unit and the fourth lead.

[0016] As described above, the stacked photorelay package of the present disclosure converts an input electrical signal source into an optical signal and then into an electrical signal, while maintaining electrical isolation. That is, the current and voltage of the input end do not directly act on the output end, and the current and voltage of the output end do not directly act on the input end, thus having good electrical insulation and anti-interference capabilities. Adding the stacked photorelay package of the present disclosure to a circuit can prevent the circuit components at the back end from being damaged by imperfect input electrical signal sources, lightning, electrostatic discharge, electromagnetic interference, and switching pulses. Furthermore, the stacked photorelay package of the present disclosure is different from existing photorelay structures, as it can be packaged by a single molding process, effectively simplifying the process complexity. The first lead can support the photoelectric unit through the insulating block, so the photoelectric unit does not need to be disposed on other support structures.

[0017] Furthermore, the creepage distance of the first light-transmissive insulating block of the epitaxial optical relay packaging device is greater than the height. The epitaxial optical relay packaging device can achieve better insulation effect than the epitaxial optical relay packaging device.

[0018] In addition, the first light-emitting unit and the second light-emitting unit of the epitaxial optical relay packaging device can respectively emit light, and the first light-transmissive insulating block and the second light-transmissive insulating block can respectively receive the light and respectively form electrical signals, which facilitates subsequent differential operation. BRIEF DESCRIPTION OF DRAWINGS

[0019] The details of one or more embodiments of the subject matter described in this specification are set forth in the accompanying drawings and the description below. Other features, aspects, and advantages of the subject matter of this specification will become apparent from the description, the drawings, and the claims, where:

[0020] Figure 1A A cross-sectional view of the epitaxial optical relay packaging device of the first embodiment of the present disclosure.

[0021] Figure 1B A schematic view of the light-transmissive insulating plate of the epitaxial optical relay packaging device of the first embodiment of the present disclosure.

[0022] Figure 2 A top view of the epitaxial optical relay packaging device of the first embodiment and the second embodiment of the present disclosure.

[0023] Figure 3A A cross-sectional view of the epitaxial optical relay packaging device of the second embodiment of the present disclosure.

[0024] Figure 3B A schematic view of the light-transmissive insulating plate of the epitaxial optical relay packaging device of the second embodiment of the present disclosure.

[0025] Figure 4 A schematic view of a variation of the light-transmissive insulating block of the epitaxial optical relay packaging device of the second embodiment of the present disclosure.

[0026] Figure 5A A cross-sectional view of the epitaxial optical relay packaging device of the third embodiment of the present disclosure.

[0027] Figure 5B A schematic view of the light-transmissive insulating plate of the epitaxial optical relay packaging device of the third embodiment of the present disclosure. DETAILED DESCRIPTION

[0028] The detailed description and technical content of the present disclosure are described below in conjunction with the drawings, however, the accompanying drawings are provided for reference and illustration only, and are not intended to limit the present disclosure.

[0029] As used herein, terms such as "first", "second", "third", "fourth", "fifth", "sixth", "seventh", and "eighth" describe various components, elements, regions, layers and / or sections but do not connote an ordering, unless specifically stated otherwise. The terms "first", "second", "third", "fourth", "fifth", "sixth", "seventh", and "eighth" are used herein, merely to identify elements, components, regions, layers and / or sections. Unless the context clearly indicates otherwise, the use of terms such as "first", "second", "third", "fourth", "fifth", "sixth", "seventh", and "eighth" herein does not connote an ordering.

[0030] Figure 1A A cross-sectional view of a stacked crystal type optical relay package device of a first embodiment of the present disclosure, Figure 1B A schematic view of a light-transmissive insulating plate of a stacked crystal type optical relay package device of the first embodiment of the present disclosure, Figure 2 A top view of a stacked crystal type optical relay package device of the first embodiment and the second embodiment of the present disclosure. Please refer to Figure 1A 、 Figure 1B and Figure 2 The stacked crystal type optical relay package device 1 of the first embodiment includes a first lead 21, a second lead 22, a photoelectric unit 32, a first light-transmissive insulating block 331, a third lead 23, a fourth lead 24, and a first light-emitting unit 341.

[0031] The material of the first lead 21 can be, for example, a conductive material such as silver copper gold aluminum, etc. The first lead 21 can support other components and enable the stacked crystal type optical relay package device 1 to be electrically connected to an external circuit.

[0032] The second lead 22 is adjacent to the first lead 21. The second lead 22 can be located on the same side or the opposite side of the first lead 21. The material of the second lead 22 can be, for example, a conductive material such as silver copper gold aluminum, etc. The second lead 22 enables the stacked crystal type optical relay package device 1 to be electrically connected to an external circuit.

[0033] The photoelectric unit 32 directly or indirectly contacts the first lead 21 and is electrically connected to the first lead 21 and the second lead 22. The photoelectric unit 32 can directly contact the first lead 21, enabling the photoelectric unit 32 to be electrically connected to the first lead 21. The photoelectric unit 32 can not contact the first lead 21, but be electrically connected to the first lead 21 through a wire. The first lead 21 can support the photoelectric unit 32. The first lead 21 and the second lead 22 can lead out an electrical signal of the photoelectric unit 32.

[0034] In some embodiments, the photoelectric unit 32 includes a photonic integrated circuit, a photoresistor, a phototransistor, a photodiode, or a photo TRIAC. A photonic integrated circuit is an integrated circuit that integrates photonic components on a single chip. A photonic integrated circuit is an integrated circuit that uses photons to perform signal processing and transmission functions. A photoresistor, for example, can include cadmium sulfide or lead sulfide. A photoresistor can change its resistance value with the intensity of light. A photodiode, for example, can include silicon or germanium. A photodiode can generate a photo current under light irradiation and provide a corresponding current signal according to the intensity of light. A photo TRIAC, also known as a photo thyristor, is a semiconductor component that combines the functions of a triode AC semiconductor switch and the properties of a photosensitive component. A phototransistor, for example, can include a bipolar junction transistor (BJT), a field effect transistor (FET), or a metal oxide semiconductor field effect transistor (MOSFET).

[0035] The first light-transmissive insulating block 331 is disposed on the photoelectric unit 32. In some embodiments, the first light-transmissive insulating block 331 can be sandwiched between the photoelectric unit 32 and the first light-emitting unit 341, serving as a medium for light conduction and electrically isolating the photoelectric unit 32 from the first light-emitting unit 341. In other words, the current voltage of the input end does not directly act on the output end, and the current voltage of the output end does not directly act on the input end. The material of the first light-transmissive insulating block 331, for example, can be a light-transmissive and insulating material such as acrylic, glass, polycarbonate, resin, or plastic. The first light-transmissive insulating block 331, for example, can be made by coating molding, injection molding, or compression molding and plastic encapsulation molding, and then cut to a specified size.

[0036] The third lead 23 is adjacent to the first lead 21, and the fourth lead 24 is adjacent to the third lead 23. The third lead 23 can be located on the same side or the opposite side of the first lead 21. The fourth lead 24 can be located on the same side or the opposite side of the third lead 23. The material of the third lead 23 and the fourth lead 24, for example, can be a conductive material such as silver, copper, gold, or aluminum. The third lead 23 and the fourth lead 24 enable the stacked crystal light relay package device 1 to be electrically connected to an external circuit.

[0037] The first light emitting unit 341 is disposed on the first light-transmissive insulating block 331 and is electrically connected with the third lead 23 and the fourth lead 24. The first light-transmissive insulating block 331 can transmit the light emitted by the first light emitting unit 341. When the third lead 23 and the fourth lead 24 are connected with a proper input electrical signal source, the input electrical signal source changes the light emitted by the first light emitting unit 341. The first light emitting unit 341 can be a light emitting diode, a light bulb or a fluorescent tube. The first light emitting unit 341 can include, for example, a light emitting diode. The light emitting diode can include, for example, a red light emitting diode, a yellow light emitting diode, a green light emitting diode, a blue light emitting diode, a violet light emitting diode, an infrared light emitting diode or an ultraviolet light emitting diode, but is not limited thereto. The light emitting diode can be an inorganic light emitting diode or an organic light emitting diode (OLED), but is not limited thereto.

[0038] Therefore, when the third lead 23 and the fourth lead 24 of the stacked photorelay package device 1 are connected with an input electrical signal source, the first light emitting unit 341 can emit light, the light can pass through the first light-transmissive insulating block 331, and the photoelectric unit 32 can receive the light and generate an electrical signal. In other words, the input electrical signal source changes the light emitted by the first light emitting unit 341, the change of the light causes the photoelectric unit 32 to generate an electrical signal such as a voltage signal or a current signal, and the electrical signal is output from the first lead 21 and the second lead 22, thereby achieving the function of a relay.

[0039] As described above, the stacked photorelay package device 1 of the present disclosure converts an input electrical signal source into an optical signal and then into an electrical signal, and maintains electrical isolation. That is, the current and voltage at the input end do not directly act on the output end, and the current and voltage at the output end do not directly act on the input end, thereby having good electrical insulation and anti-interference capabilities. Adding the stacked photorelay package device 1 of the present disclosure to a circuit can avoid damage to the components of the back-end circuit caused by imperfect input electrical signal sources, lightning, electrostatic discharge, electromagnetic interference and switching pulses. Furthermore, the stacked photorelay package device 1 of the present disclosure is different from existing photorelay devices, and can complete packaging through one-time plastic packaging, effectively simplifying the process complexity. The first lead 21 can support the photoelectric unit 32 through the insulating block, so the photoelectric unit 32 does not need to be disposed on other support structures.

[0040] Figure 3A a cross-sectional view of a stacked photorelay package device according to a second embodiment of the present disclosure, Figure 3B a schematic view of a light-transmissive insulating plate of a stacked photorelay package device according to the second embodiment of the present disclosure, Figure 4 a schematic view of a light-transmissive insulating block of a stacked photorelay package device according to the second embodiment of the present disclosure. Please refer to Figure 2 ,Figure 3A 、 Figure 3B and Figure 4 As shown in FIG. 1A, the stacked photorelay packaging device 1A of the second embodiment differs from the stacked photorelay packaging device 1 (as shown in FIG. 1) of the first embodiment in that the first light-transmissive insulating block 331A of the second embodiment has a different structure from the first light-transmissive insulating block 331 (as shown in FIG. 1) of the first embodiment. The first lead 21, the second lead 22, the photoelectric unit 32, the third lead 23, the fourth lead 24, and the first light-emitting unit 341 of the second embodiment are similar to those of the first embodiment, and thus are not described again. Figure 1A Figure 1A As shown in FIG. 1A, the stacked photorelay packaging device 1A of the second embodiment differs from the stacked photorelay packaging device 1 (as shown in FIG. 1) of the first embodiment in that the first light-transmissive insulating block 331A of the second embodiment has a different structure from the first light-transmissive insulating block 331 (as shown in FIG. 1) of the first embodiment. The first lead 21, the second lead 22, the photoelectric unit 32, the third lead 23, the fourth lead 24, and the first light-emitting unit 341 of the second embodiment are similar to those of the first embodiment, and thus are not described again.

[0041] The creepage distance CD of the photoelectric unit 32 and the first light-emitting unit 341 along the first light-transmissive insulating block 331A is greater than the height D of the first light-transmissive insulating block 331A. The creepage distance CD is the shortest distance from the photoelectric unit 32 to the first light-emitting unit 341 along the surface of the first light-transmissive insulating block 331A. The height D is the shortest vertical distance between the surface of the photoelectric unit 32 and the surface of the first light-emitting unit 341. Because there can be moisture and dust pollution in the environment in which the first light-transmissive insulating block 331A is used, the surface resistance of the first light-transmissive insulating block 331A is reduced. Furthermore, the first light-transmissive insulating block 331A can have tiny cracks, holes, or unevenness, so that the electric field is concentrated to break down the first light-transmissive insulating block 331A, causing current to pass through the first light-transmissive insulating block 331A. Therefore, the creepage distance CD is greater than the height D, so that the first light-transmissive insulating block 331A can achieve better insulation effect.

[0042] The first light-transmissive insulating block 331A further includes a lead angle R1 at the periphery or the outer edge of the first light-transmissive insulating block 331A. The lead angle R1 can include, for example, a straight lead angle, a round lead angle, a stepped lead angle, a C-shaped lead angle, a V-shaped lead angle, or a U-shaped lead angle. The light-transmissive insulating plate 33A can be made by injection molding or compression molding, and the mold can have a demolding angle. The light-transmissive insulating plate 33A is then cut to a specified size to form the first light-transmissive insulating block 331A with the lead angle R1 (the chamfered angle).

[0043] As shown in FIG. 1A, the first light-transmissive insulating block 331A can include the lead angle R1 and the lead angle R2, increasing the creepage distance CD and achieving a better insulation effect. Figure 4

[0044] ​​In some embodiments, the epitaxial opto-relay package 1A further comprises a first wire 51 electrically connected to the photoelectric unit 32 and the first pin 21; a second wire 52 electrically connected to the photoelectric unit 32 and the first pin 21; a third wire 53 electrically connected to the photoelectric unit 32 and the second pin 22; a fourth wire 54 electrically connected to the photoelectric unit 32 and the second pin 22; a fifth wire 55 electrically connected to the photoelectric unit 32 and the third pin 23; and a sixth wire 56 electrically connected to the photoelectric unit 32 and the third pin 23. The materials of the first wire 51, the second wire 52, the third wire 53, the fourth wire 54, the fifth wire 55, and the sixth wire 56 can be, for example, silver, copper, gold, aluminum, or other conductive materials to transmit electrical signals.

[0045] In some embodiments, the epitaxial opto-relay package 1A further comprises a seventh wire 57 electrically connected to the first light-emitting unit 341 and the third pin 23; and an eighth wire 58 electrically connected to the first light-emitting unit 341 and the fourth pin 24. The materials of the seventh wire 57 and the eighth wire 58 can be, for example, silver, copper, gold, aluminum, or other conductive materials to transmit electrical signals.

[0046] In other embodiments, the epitaxial opto-relay package 1A can further comprise a fifth pin 25 and a sixth pin 26. The fifth pin 25 can be, for example, adjacent to the second pin 22; and the sixth pin 26 can be, for example, adjacent to the third pin 23. The materials of the fifth pin 25 and the sixth pin 26 can be, for example, silver, copper, gold, aluminum, or other conductive materials. The fifth pin 25 and the sixth pin 26 can serve as backup pins of the epitaxial opto-relay package 1A.

[0047] In some embodiments, the epitaxial opto-relay package 1A further comprises a package adhesive (not shown). The package adhesive can be, for example, epoxy or hot melt adhesive. The package adhesive can protect the internal electronic components from mechanical force, corrosive substances, oxygen, moisture, or electricity. The package adhesive can only cover a portion of the first pin 21, a portion of the second pin 22, a portion of the third pin 23, and a portion of the fourth pin 24, so that the other portions of the first pin 21, the other portion of the second pin 22, the other portion of the third pin 23, and the other portion of the fourth pin 24 can serve as pins for connecting to external circuits.

[0048] Therefore, when the third pin 23 and the fourth pin 24 of the epitaxial opto-relay package 1A of the second embodiment are connected to an input electrical signal source, they can have similar operating modes as the epitaxial opto-relay package 1A, thereby achieving the function of a relay.

[0049] As described above, the stacked photorelay package device 1A of the second embodiment of the present disclosure has the same functions as the first embodiment, and in addition, because the creepage distance CD of the first light-transmissive insulating block 331A of the stacked photorelay package device 1A is greater than the height D, the stacked photorelay package device 1A can achieve a better insulation effect than the stacked photorelay package device 1.

[0050] Figure 5A A cross-sectional view of a stacked photorelay package device of a third embodiment of the present disclosure, Figure 5B A schematic view of a light-transmissive insulating plate of a stacked photorelay package device of a third embodiment of the present disclosure. Please refer to Figure 5A and Figure 5B As shown in FIG. 1C, the stacked photorelay package device 1B of the third embodiment of the present disclosure is different from the stacked photorelay package device 1A of the second embodiment (as shown in FIG. 1B) in that the stacked photorelay package device 1B of the third embodiment further includes a second light-transmissive insulating block 332B and a second light-emitting unit 342. The first lead pin 21, the second lead pin (similar to that shown in FIG. 1B), the photoelectric unit 32, the first light-transmissive insulating block 331B, the third lead pin 23, the fourth lead pin (similar to that shown in FIG. 1B), and the first light-emitting unit 341 are similar to those of the stacked photorelay package device 1A of the second embodiment, and thus will not be described again. Figure 3A Figure 2 Figure 2

[0051] The first light-transmissive insulating block 331B is arranged on the first photosensitive area 321 of the photoelectric unit 32, and the second light-transmissive insulating block 332B is arranged on the second photosensitive area 322 of the photoelectric unit 32. The first light-transmissive insulating block 331B can be arranged between the photoelectric unit 32 and the first light-emitting unit 341, and the second light-transmissive insulating block 332B can be arranged between the photoelectric unit 32 and the second light-emitting unit 342. The first photosensitive area 321 and the second photosensitive area 322 can respectively receive light and respectively form electrical signals, which are beneficial for subsequent differential operation.

[0052] The first light-transmissive insulating block 331B further includes a lead angle R1 and a lead angle R2 located at the periphery or outer edge of the first light-transmissive insulating block 331B, and the second light-transmissive insulating block 332B further includes a lead angle R1 and a lead angle R2 located at the periphery or outer edge of the second light-transmissive insulating block 332B. The lead angle R1 and the lead angle R2 may, for example, include a straight lead angle, a round lead angle, a stepped lead angle, a C-shaped lead angle, a V-shaped lead angle, or a U-shaped lead angle. The light-transmissive insulating plate 33B can be made by injection molding or compression molding, and the mold can have a demolding angle. The light-transmissive insulating plate 33B is then cut to a specified size to form the first light-transmissive insulating block 331B and the second light-transmissive insulating block 332B with the lead angles R1 and R2.

[0053] ​​​In some embodiments, the first light-transmitting insulating block 331B and the second light-transmitting insulating block 332B are integrally formed. The light-transmitting insulating block 33B can be manufactured by injection molding or compression molding. The mold can have a draft angle. The light-transmitting insulating block 33B is then cut to a specified size, forming the first light-transmitting insulating block 331B and the second light-transmitting insulating block 332B as an integrally formed structure. The first light-transmitting insulating block 331B and the second light-transmitting insulating block 332B can be made of the same material and have no connection points.

[0054] The second light emitting unit 342 is disposed on the second light-transmitting insulating block 332B. The second light emitting unit 342 is connected to the third lead 23 and the fourth lead (similar to Figure 2 The structure and configuration of the second light emitting unit 342 are similar to those of the first light emitting unit 341, and will not be described in detail herein.

[0055] Therefore, when the third lead 23 and the fourth lead (similar to Figure 2 When the input electrical signal source is connected to the stacked-chip optical relay package device 1A (as shown in FIG. Figure 3A ) has a similar actuation mode, thereby achieving the function of a relay.

[0056] As described above, the stacked-chip photorelay package device 1B of the third embodiment of the present disclosure not only has the same functions as the second embodiment, but also has the following advantages: the first light-emitting unit 341 and the second light-emitting unit 342 of the stacked-chip photorelay package device 1B can respectively emit light, while the first light-transmitting insulating block 331B and the second light-transmitting insulating block 332B can respectively receive the light and generate electrical signals, thereby facilitating subsequent differential operations.

[0057] In summary, the stacked crystal photorelay packaging device disclosed in the present invention converts the input electrical signal source into an optical signal and then into an electrical signal, while maintaining electrical isolation. In other words, the current and voltage at the input end will not directly act on the output end, and the current and voltage at the output end will not directly act on the input end, so it has good electrical insulation and anti-interference capabilities. Adding the stacked crystal photorelay packaging device disclosed in the present invention to the circuit can prevent the back-end circuit components from being damaged by imperfect input electrical signal sources, lightning, electrostatic discharge, electromagnetic interference and switching pulses. Furthermore, the stacked crystal photorelay packaging device disclosed in the present invention is different from the existing photorelay device. It can be packaged through a one-time plastic encapsulation, effectively simplifying the complexity of the process. The first lead can support the photoelectric unit through the insulating block, so the photoelectric unit does not need to be set on other supporting structures.

[0058] Furthermore, the creepage distance of the first light-transmitting insulating block of the stacked-chip optical relay packaging device is greater than the height. The stacked-chip optical relay packaging device can achieve a better insulation effect than the stacked-chip optical relay packaging device.

[0059] In addition, the first light-emitting unit and the second light-emitting unit of the epitaxial light relay packaging device can respectively emit light, and the first light-transmitting insulating block and the second light-transmitting insulating block can respectively receive the light and respectively form electrical signals, thereby facilitating subsequent differential operation.

[0060] As used herein and unless otherwise indicated, the terms "substantially," "approximately," and the like are used to describe and account for small variations. When used in connection with a description of a structure, these terms can encompass the structure as precisely as possible, as well as to structures that are within a close approximation of the structure. When used in connection with a description of a value, these terms can encompass a range of variation less than or equal to ±10% of the value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%.

[0061] The above summarizes the components of several embodiments so that those having ordinary knowledge in the art to which this disclosure pertains can more readily understand the concepts of the embodiments of the present disclosure. Those having ordinary knowledge in the art to which this disclosure pertains should understand that other processes and structures can be designed or modified using the embodiments of the present disclosure as a basis to achieve the same objectives and / or achieve the same benefits as the embodiments described herein. Those having ordinary knowledge in the art to which this disclosure pertains should also understand that such equivalent structures do not depart from the spirit and scope of the present disclosure, and that various changes, substitutions, and other alternatives can be made in the embodiments described herein without departing from the spirit and scope of the present disclosure. Therefore, the scope of protection of the present disclosure is defined by the appended claims.

[0062]

Symbol Description

[0063] 1, 1A, 1B: epitaxial light relay packaging device

[0064] 21: first lead

[0065] 22: second lead

[0066] 23: third lead

[0067] 24: fourth lead

[0068] 25: fifth lead

[0069] 26: sixth lead

[0070] 32: photoelectric unit

[0071] 321: first light-sensing region

[0072] 322: second light-sensing region

[0073] 33, 33A, 33B: light-transmissive insulating plate

[0074] 331, 331A, 331B: first light-transmissive insulating block

[0075] 332B: second light-transmissive insulating block

[0076] R1, R2: corner

[0077] CD: creepage distance

[0078] D: height

[0079] 341: first light-emitting unit

[0080] 342: second light-emitting unit

[0081] 51: first lead wire

[0082] 52: second lead wire

[0083] 53: third lead wire

[0084] 54: fourth lead wire

[0085] 55: fifth lead wire

[0086] 56: sixth lead wire

[0087] 57: seventh lead wire

[0088] 58: eighth lead wire

Claims

1. A stacked photorelay package device, characterized by comprising: The application comprises: a first lead; a second lead adjacent to the first lead; a photoelectric unit directly or indirectly contacting the first lead and electrically connected to the first lead and the second lead; a first light-transmissive insulating block disposed on the photoelectric unit; a third lead adjacent to the first lead; a fourth lead adjacent to the third lead; and a first light-emitting unit disposed on the first light-transmissive insulating block and electrically connected to the third lead and the fourth lead; wherein a creepage distance of the photoelectric unit and the first light-emitting unit along the first light-transmissive insulating block is greater than a height of the first light-transmissive insulating block.

2. The twin photorelay package device according to claim 1, wherein The first light-transmissive insulating block further comprises: a lead corner located at a periphery of the first light-transmissive insulating block.

3. The twin photorelay package device according to claim 2, wherein The lead corner comprises a straight lead corner, a round lead corner, a stepped lead corner, a C-shaped lead corner, a V-shaped lead corner, or a U-shaped lead corner.

4. The twin photorelay package device according to claim 1, wherein The application further comprises: a second light-transmissive insulating block disposed on a second photosensitive area of the photoelectric unit; and a second light-emitting unit disposed on the second light-transmissive insulating block; wherein the first light-transmissive insulating block is disposed on a first photosensitive area of the photoelectric unit.

5. The twin photorelay package device according to claim 4, wherein The first light-transmissive insulating block further comprises a lead corner located at a periphery of the first light-transmissive insulating block. The second light-transmissive insulating block further comprises a lead corner located at a periphery of the second light-transmissive insulating block.

6. The twin photorelay package device according to claim 5, wherein The first light-transmissive insulating block and the second light-transmissive insulating block are a one-piece structure.

7. The twin photorelay package device according to claim 4, wherein The second light-emitting unit is electrically connected to the third lead and the fourth lead.

8. The van der waals epitaxy photorelay package device of claim 1, wherein, The photoelectric unit comprises a photosensitive integrated circuit, a photosensitive resistor, a phototransistor, a photodiode, or a photo triac.

9. The van der waals epitaxy photorelay package device according to claim 1, wherein, The application further comprises: a first lead wire electrically connected to the photoelectric unit and the first lead; a second lead wire electrically connected to the photoelectric unit and the first lead; a third lead wire electrically connected to the photoelectric unit and the second lead; a fourth lead wire electrically connected to the photoelectric unit and the second lead; a fifth lead wire electrically connected to the photoelectric unit and the third lead; and a sixth lead wire electrically connected to the photoelectric unit and the third lead.

10. The twin photorelay package device according to claim 1, wherein The application further comprises: a seventh lead wire electrically connected to the first light-emitting unit and the third lead; and an eighth lead wire electrically connected to the first light-emitting unit and the fourth lead. ​

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