Mini LED screening system

Abstract

The utility model provides a Mini LED screening system, comprising a plurality of visual identification devices, a plurality of die bonders and a photoelectric test device, the visual identification devices are internally provided with accommodating cavities, the visual identification devices are connected with a first identification reader, the visual identification devices are all connected with a computing terminal, the computing terminal comprises a coordinate mapping unit and a storage unit, and the coordinate mapping unit is connected with the storage unit. The computing terminal is connected with the plurality of die bonders through the local area network, the die bonders are connected with the second identification reader, the plurality of die bonders are all connected with the photoelectric test equipment, and the photoelectric test equipment is connected with the statistical equipment. The visual identification equipment and the die bonder are connected through the computing terminal, the coordinate mapping unit in the computing terminal maps the solder paste defect coordinates in the visual identification equipment into the coordinates which can be read by the die bonder, and non-die bonding processing is carried out at the die bonding coordinates corresponding to the solder paste defect coordinates, so that the solder paste defect coordinates are more easily detected as defective products; and the phenomena of missing detection and false detection are avoided.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing technology, and in particular to a Mini LED screening system. Background Technology

[0002] Mini LEDs have the advantages of smaller LED chip size and higher density compared to traditional LEDs, which helps to present better clarity and contrast, and are widely used in the field of high-definition displays.

[0003] Existing Mini LEDs typically employ flip-chip packaging technology to increase integration. The process of fabricating display products using flip-chip Mini LEDs mainly includes printing, SPI, die bonding, AOI, molding, dicing, beam splitting, and tape-and-reel bonding. The printing process involves printing solder paste onto the substrate; however, issues such as insufficient solder or solder bridging are prone to occur at the printed points. If defective printed points appear during the printing stage, it will directly affect the product quality, leading to defects such as dead LEDs and failures. Therefore, it is crucial to screen out defective solder paste printed points after the printing stage.

[0004] In existing technologies, the screening of defective printed circuits such as insufficient solder and solder bridging occurs during the AOI and spectral separation stages, with the spectral separation stage incorporating the detection of electrical and optical parameters. However, after die bonding, a chip already exists on the substrate. At this point, the electrical parameters of insufficient solder and solder bridging defects overlap to some extent with those of normal solder points, leading to missed or false detections. This makes it impossible to completely prevent defective printed circuits from entering the market in large quantities during Mini LED production, negatively impacting the reliability of Mini LED products. Utility Model Content

[0005] To address the shortcomings of existing technologies, the purpose of this utility model is to provide a Mini LED screening system, which aims to solve the problem that traditional spectrophotometry in existing technologies leads to missed detections and false detections due to the overlapping range of electrical parameters between defective and good products, thus failing to prevent defective printed products from entering the market.

[0006] To achieve the above objectives, this utility model is implemented through the following technical solution:

[0007] A Mini LED screening system includes several visual recognition devices, several die bonders, and photoelectric testing equipment. The visual recognition devices include a color difference inspection module or an image recognition module to detect the coordinates of solder paste defects on the Mini LED substrate. Each visual recognition device has an internal receiving cavity for holding the Mini LED substrate. A camera is mounted on the top of the receiving cavity. The visual recognition devices are connected to a first identification reader for reading the Mini LED substrate's information. The markings on the LED substrate are provided. Several visual recognition devices are connected to a computing terminal. The computing terminal includes a coordinate mapping unit and a storage unit communicatively connected to the coordinate mapping unit. The coordinate mapping unit is communicatively connected to the visual recognition devices to map the solder paste defect coordinates to die-bonding coordinates. The storage unit stores the die-bonding coordinates and the markings. The computing terminal is connected to several die-bonding machines via a local area network. Each die-bonding machine is connected to a second marking reader and communicatively connected to the storage unit to read the markings and retrieve the corresponding die-bonding coordinates. Both the first and second marking readers have handles. Several die-bonding machines are connected to an optoelectronic testing device. The optoelectronic testing device is connected to a statistical device. The optoelectronic testing device includes a control console with a display area and several buttons for setting electrical and optical parameter ranges. The statistical device is used to count the number of defective products.

[0008] Compared with the prior art, the beneficial effects of this utility model are as follows: By connecting the visual recognition device and the die bonder through the computing terminal, the visual recognition device performs visual inspection on the solder paste printing points and identifies defects such as insufficient solder and poor solder bonding in the printing points through color difference principle or image recognition comparison methods. The first identification reader reads the identification corresponding to the Mini LED substrate. The visual recognition device uploads the coordinates of the defective printing points and the identification to the computing terminal. The coordinate mapping unit in the computing terminal maps the solder paste defect coordinates in the visual recognition device to coordinates that can be read by the die bonder. The die bond coordinates correspond one-to-one with the identification. When the Mini LED substrate is sent to the die bonder for die bonding, only the identification needs to be read to retrieve the relevant die bond coordinates from the computing terminal. By performing non-die bonding processing at the die bond coordinates corresponding to the solder paste defect coordinates, the Mini LED substrate with defective printing points can be made to achieve the desired results. LED substrates lacking chips have electrical parameters that exceed standard ranges and cannot be lit at corresponding locations, creating optical blind spots. These defects are more easily detected by the optoelectronic testing equipment, preventing missed or false detections and thus preventing defective products from entering the market.

[0009] Furthermore, a cutting device is provided between the optoelectronic testing equipment and the die bonder. The cutting device has several cutting wheels inside to cut the Mini LED substrate into several sub-Mini LED substrates by pixels.

[0010] Furthermore, the optoelectronic testing equipment also includes an electrical testing unit and an optical testing unit. The electrical testing unit is used to test the electrical parameters of the sub-Mini LED substrate, and the optical testing unit is used to test the optical parameters of the sub-Mini LED substrate.

[0011] Furthermore, the computing terminal is connected to a display, and the computing terminal also includes a device number control unit. The device number control unit is communicatively connected to the coordinate mapping unit, and the device number control unit is used to assign device numbers to a plurality of the visual recognition devices and a plurality of the die bonders.

[0012] Furthermore, the optoelectronic testing equipment is connected to a first warehouse and a second warehouse via a transfer module. The transfer module includes a conveyor belt and a transfer vehicle connected to the optoelectronic testing equipment. The transfer vehicle is used to transfer the sub-Mini LED substrate on the conveyor belt to the first warehouse or the second warehouse. The first warehouse is used to store good products, and the second warehouse is used to store defective products.

[0013] Furthermore, the second warehouse is connected to waste treatment equipment and recycling equipment.

[0014] Furthermore, the statistical device is communicatively connected to the warehouse management equipment in the second warehouse, so as to determine, based on the statistical results, whether the defective products in the second warehouse should be sent to the waste disposal equipment or the recycling equipment.

[0015] Furthermore, the recycling and processing equipment includes a chemical reaction device and a smelting device. Attached Figure Description

[0016] Figure 1 This is a partial structural schematic diagram of the Mini LED screening system in an embodiment of this utility model;

[0017] Figure 2 This is a schematic diagram of the Mini LED screening system in an embodiment of this utility model;

[0018] Explanation of key component symbols:

[0019] Visual recognition equipment 100 Receiving cavity 101 First Identifier Reader 110 Computing terminal 200 monitor 210 Die bonder 300 Second identifier reader 310 Cutting equipment 400 Optoelectronic testing equipment 500 Statistical equipment 510 First Warehouse 610 Second Warehouse 620 Waste treatment equipment 621 Recycling and processing equipment 622

[0020] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this utility model. Detailed Implementation

[0021] To facilitate understanding of this utility model, a more complete description will be given below with reference to the accompanying drawings. Several embodiments of this utility model are shown in the drawings. However, this utility model can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of this utility model will be more thorough and complete.

[0022] It should be noted that when a component is said to be "fixed to" another component, it can be directly on the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0023] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0024] See also Figure 1The Mini LED screening system in this embodiment includes several visual recognition devices 100, several die bonders 300, and photoelectric testing equipment 500. Each visual recognition device 100 includes a color difference inspection module or an image recognition module to detect the solder paste defect coordinates of the Mini LED substrate. Each visual recognition device 100 has an internal receiving cavity 101 for placing the Mini LED substrate. A camera is mounted on the top of the receiving cavity 101. The visual recognition device 100 is connected to a first identifier reader 110, which reads the Mini LED substrate's information. The markings on the LED substrate are provided. Several visual recognition devices 100 are connected to a computing terminal 200. The computing terminal 200 includes a coordinate mapping unit and a storage unit communicatively connected to the coordinate mapping unit. The coordinate mapping unit is communicatively connected to the visual recognition devices 100 to map the solder paste defect coordinates to die-bonding coordinates. The storage unit stores the die-bonding coordinates and the markings. The computing terminal 200 is connected to a display 210. The computing terminal 200 also includes a device number control unit, which is communicatively connected to the coordinate mapping unit. The device number control unit is used to assign device numbers to several visual recognition devices 100 and several die-bonding machines 300. The computing terminal 200 is connected to several die-bonding machines 300 via a local area network. Each die-bonding machine 300 is connected to a second marking reader 310 and communicatively connected to the storage unit to read the markings through the second marking reader 310 and retrieve the die-bonding coordinates corresponding to the markings. Both the first marking reader 110 and the second marking reader 310 are equipped with handles.Preferably, solder paste defects can be identified by inspecting the color difference or by comparing the image of the Mini LED substrate with the image of the substrate to be inspected. In this embodiment, the visual recognition device 100 is an SPI (Solder Paste Inspection) device. The SPI has a visual inspection function and can scan each printed point in the Mini LED substrate. It uses color difference detection to identify printed points with solder paste defects such as insufficient solder or poor solder bonding, and filters and records the coordinates of the defects. The coordinates of the filtered solder paste defects are uploaded to the computing terminal 200. A light-absorbing layer is provided in the receiving cavity 101 to avoid the influence of light on color difference recognition, making the color difference detection more accurate. The computing terminal 200 integrates an SPI detection module corresponding to the SPI and is networked with the die bonder 300. The SPI detection module includes a coordinate mapping unit, and the identifier is a QR code. Each Mini LED substrate... A unique QR code is set on the LED substrate. The die bonder 300 reads the identifier and searches the storage unit for the die bond coordinates corresponding to the solder paste defect coordinates. If they exist, the printed point corresponding to the die bond coordinates is skipped and the chip is not bonded. The device number is recorded in the computing terminal 200. This is beneficial for managing large-scale Mini LED production lines. Understandably, any Mini LED substrate with solder paste defects will be missing chips under the processing of the die bonder 300, which helps to increase the difference between defective and good products and greatly reduces the difficulty of identifying defective products in subsequent production and inspection processes.

[0025] Several die bonders 300 are connected to the optoelectronic testing equipment 500. A cutting device 400 is provided between the optoelectronic testing equipment 500 and the die bonders 300. The cutting device has several cutting wheels inside to cut the MiniLED substrate into several sub-Mini LED substrates by pixels. The optoelectronic testing equipment 500 includes an electrical testing unit and an optical testing unit. The electrical testing unit is used to test the electrical parameters of the sub-Mini LED substrates, and the optical testing unit is used to test the optical parameters of the sub-Mini LED substrates. The optoelectronic testing equipment 500 is connected to a statistical device 510. The optoelectronic testing equipment 500 includes a control console with a display area and several buttons to set the range of electrical parameters and the range of optical parameters. The statistical device 510 is used to count the number of defective products. Preferably, the photoelectric testing equipment 500 is a spectrometer. The electrical parameters are voltage values, and the optical parameters are the brightness and wavelength of the chip's emission. Specifically, the operator inputs a standard voltage range of 1V to 4.2V through the control console, sets the standard brightness range to 0.3mcd to 999.99mcd, and sets the standard wavelength range to 0nm to 999.99nm. The calibration voltage of the Mini LED substrate is 5V. Both the electrical testing unit and the optical testing unit are connected to a support platform. The support platform is used to support the sub-Mini LED substrate. The sub-Mini LED substrate is connected to the electrical interface of the support platform to connect the electrical testing unit and the optical testing unit. Understandably, regarding the electrical parameters of defective products, if the solder paste defect is insufficient solder, a short circuit will occur at the defective printing point, and the test voltage will directly be the rated voltage of 5V, exceeding the standard range. If the solder paste defect is poor solder bridging, a short circuit will occur at the defective printing point, and the test voltage will be close to 0V, exceeding the standard range. The electrical parameters of defective and good products no longer overlap. Furthermore, regarding the optical parameters of defective products, since no chip is fixed at the defective printing point and no chip emits light, the test brightness is close to 0mcd, and no data is displayed for the test wavelength, all of which do not meet the standard range. Judging by multiple indicators can effectively prevent the phenomenon of missed or false detection of defective products, intercept defective products in time, prevent defective substrates from entering the market, and effectively improve the reliability of Mini LED products.

[0026] The optoelectronic testing equipment 500 is connected to a first warehouse 610 and a second warehouse 620 via a transfer module. The transfer module includes a conveyor belt and a transfer vehicle connected to the optoelectronic testing equipment. The transfer vehicle is used to transfer the sub-Mini LED substrates on the conveyor belt to the first warehouse or the second warehouse. The first warehouse 610 is used to store good products, and the second warehouse 620 is used to store defective products. The second warehouse 620 is connected to waste treatment equipment and recycling equipment. The statistical equipment 510 is communicatively connected to the warehouse management equipment in the second warehouse 620 to determine, based on statistical results, whether the defective products in the second warehouse 620 should be sent to the waste treatment equipment 621 or the recycling equipment 622. The recycling equipment 622 includes a chemical reaction device and a smelting device. Preferably, if the defect rate is high, to reduce production line losses, the defective products stored in the second warehouse 620 are recycled. The metal components in the substrates of the defective products are recovered and extracted through chemical and smelting methods. Understandably, this can compensate for the economic losses caused by a large number of defective substrates and is beneficial to resource conservation and recycling.

[0027] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0028] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of this utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A Mini LED screening system, characterized in that, The system includes several visual recognition devices, several die bonders, and optoelectronic testing equipment. The visual recognition devices include a color difference inspection module or an image recognition module to detect the coordinates of solder paste defects on the Mini LED substrate. Each visual recognition device has an internal cavity for holding the Mini LED substrate. A camera is mounted on the top of the cavity. The visual recognition device is connected to a first identifier reader, which reads the Mini LED substrate's information. The markings on the LED substrate are provided. Several visual recognition devices are connected to a computing terminal. The computing terminal includes a coordinate mapping unit and a storage unit communicatively connected to the coordinate mapping unit. The coordinate mapping unit is communicatively connected to the visual recognition devices to map the solder paste defect coordinates to die-bonding coordinates. The storage unit stores the die-bonding coordinates and the markings. The computing terminal is connected to several die-bonding machines via a local area network. Each die-bonding machine is connected to a second marking reader and communicatively connected to the storage unit to read the markings and retrieve the corresponding die-bonding coordinates. Both the first and second marking readers have handles. Several die-bonding machines are connected to an optoelectronic testing device. The optoelectronic testing device is connected to a statistical device. The optoelectronic testing device includes a control console with a display area and several buttons for setting electrical and optical parameter ranges. The statistical device is used to count the number of defective products.

2. The Mini LED screening system according to claim 1, characterized in that, A cutting device is provided between the optoelectronic testing equipment and the die bonder. The cutting device has several cutting wheels inside to cut the Mini LED substrate into several sub-Mini LED substrates by pixels.

3. The Mini LED screening system according to claim 2, characterized in that, The optoelectronic testing equipment also includes an electrical testing unit and an optical testing unit. The electrical testing unit is used to test the electrical parameters of the sub-Mini LED substrate, and the optical testing unit is used to test the optical parameters of the sub-Mini LED substrate.

4. The Mini LED screening system according to claim 1, characterized in that, The computing terminal is connected to the display, and the computing terminal also includes a device number control unit. The device number control unit is communicatively connected to the coordinate mapping unit and is used to assign device numbers to a plurality of the visual recognition devices and a plurality of the die bonders.

5. The Mini LED screening system according to claim 3, characterized in that, The optoelectronic testing equipment is connected to a first warehouse and a second warehouse via a transfer module. The transfer module includes a conveyor belt and a transfer vehicle connected to the optoelectronic testing equipment. The transfer vehicle is used to transfer the sub-Mini LED substrate on the conveyor belt to the first warehouse or the second warehouse. The first warehouse is used to store good products, and the second warehouse is used to store defective products.

6. The Mini LED screening system according to claim 5, characterized in that, The second warehouse is connected to waste treatment equipment and recycling equipment.

7. The Mini LED screening system according to claim 6, characterized in that, The statistical equipment is communicatively connected to the warehouse management equipment in the second warehouse, so as to determine, based on the statistical results, whether the defective products in the second warehouse should be sent to the waste disposal equipment or the recycling equipment.

8. The Mini LED screening system according to claim 6, characterized in that, The recycling and processing equipment includes a chemical reaction device and a smelting device.

Images