Silicon wafer degumming device
By designing an automated silicon wafer degumming device, combined with a robot and a detection device, the problem of low efficiency of manual degumming is solved, efficient and automatic separation of silicon wafers and material holders is achieved, and the safety and integrity of the degumming process is ensured.
Patent Information
- Application Number
- CN202422337036.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-25
- Publication Date
- 2025-10-28
- Estimated Expiration
- 2034-09-25
AI Technical Summary
In the existing technology, the silicon wafer degumming process relies on manual operation, resulting in low efficiency and high cost.
A silicon wafer degumming device including a degumming tank, a separation device and a detection device is designed. The silicon wafer and the material holder are separated automatically by a robot, and the separation pressure plate and the detection device are used to ensure the separation effect and safety.
It realizes the automatic degumming of silicon wafers, saves labor, improves work efficiency, and ensures the degumming effect and equipment safety through multiple tests.
Smart Images
Figure CN223475763U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of silicon wafer production technology, and in particular relates to a silicon wafer debonding device. Background Technology
[0002] To ensure the cleanliness of the silicon wafers, after the ingots are cut into wafers by the cutting equipment, a debinding process is required to separate the wafers from the substrate. Manual debinding, which involves manually separating the wafers from the substrate, is labor-intensive and inefficient. Utility Model Content
[0003] To solve the above-mentioned technical problems, this utility model provides a silicon wafer debonding device, which effectively solves the problem of low efficiency of manual debonding and overcomes the shortcomings of the prior art.
[0004] The technical solution adopted in this utility model is: a silicon wafer debonding device, comprising:
[0005] The degumming tank has an internal material frame support that can move up and down.
[0006] A separation device is installed on the degumming tank and rotatably connected to the degumming tank, used to separate the material seat from the silicon wafers bonded to the material seat;
[0007] The first detection device is located outside the degumming tank and at one end opposite the separation device, and is used to detect the position of the separation device.
[0008] Furthermore, the material frame support is provided with adjusting bolts at both ends, which are set on the degumming tank and can drive the material frame support to move up and down.
[0009] Furthermore, the separation device includes,
[0010] A rotating shaft is rotatably connected to the degumming tank and is arranged along the length of the material frame support. A motor is provided on the rotating shaft.
[0011] A separation plate is disposed on the rotating shaft and arranged along the rotating shaft. The rotating shaft can drive the separation plate to move closer to or away from the material frame support.
[0012] Furthermore, a detection rod is provided at one end of the rotating shaft relative to the first detection device. The detection rod is positioned above the degumming tank, and the rotating shaft can drive the detection rod to move.
[0013] Furthermore, the rotating shaft has a connecting rod at one end where the detection rod is located, and the detection rod is mounted on the connecting rod.
[0014] Furthermore, the first detection device includes,
[0015] A fixed bracket is disposed on the top outer side of the degumming tank, relative to the detection rod;
[0016] The first sensor is mounted on the fixed bracket.
[0017] Furthermore, the fixed bracket has mounting holes along the movement trajectory of the detection rod, and the first sensor is detachably connected to the mounting holes.
[0018] Furthermore, a second detection device is provided at the top of the degumming tank to detect whether silicon wafers are adhered to the separated material seat.
[0019] Furthermore, the bottom of the degumming tank is provided with a slag removal drawer for filtering slag, and the slag removal drawer is detachably connected to the degumming tank.
[0020] Furthermore, an overflow tank is provided on one side of the degumming tank.
[0021] The advantages and positive effects of this utility model are as follows: by adopting the above technical solution, automatic debonding of silicon wafers is achieved, saving labor and improving work efficiency. The first detection device ensures the normal progress of debonding, and the second detection device further ensures the debonding effect. The structure is simple and the operation is convenient. Attached Figure Description
[0022] Figure 1 This is a schematic diagram of the overall structure of a silicon wafer debonding device according to an embodiment of this utility model.
[0023] Figure 2 This is a schematic diagram of the overall structure of a silicon wafer debonding device according to an embodiment of this utility model.
[0024] Figure 3 This is a schematic diagram of the material frame support structure of a silicon wafer debonding device according to an embodiment of this utility model.
[0025] Figure 4 This is a schematic diagram of the bottom structure of the degumming tank of a silicon wafer degumming device according to an embodiment of this utility model.
[0026] In the picture:
[0027] 10. Degumming tank body; 11. Drain outlet; 12. Slag removal outlet
[0028] 13. Overflow trough body; 20. Material frame support; 21. Adjusting bolts
[0029] 22. Fastening bolts; 23. Positioning plate; 30. Separation device
[0030] 31. Rotating shaft; 32. Separating pressure plate; 33. Motor
[0031] 34. Driving gear; 35. Driven gear; 36. Connecting plate
[0032] 37. Detection rod; 38. Connecting rod; 40. First detection device
[0033] 41. Fixed bracket; 42. First sensor; 43. Mounting hole
[0034] 50. Second detection device; 51. Mounting bracket; 60. Slag removal drawer
[0035] 70. Heater; 80. Temperature sensor Detailed Implementation
[0036] This utility model provides a silicon wafer debonding device. The embodiments of this utility model are described below with reference to the accompanying drawings.
[0037] In the description of the embodiments of this utility model, it should be understood that the terms "top," "bottom," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. In the description of this utility model, it should be noted that unless otherwise expressly specified and limited, the terms "set" and "connected" should be interpreted broadly. For example, it can refer to a fixed connection, a detachable connection, or an integral connection; it can refer to a direct connection or an indirect connection through an intermediate medium; it can refer to the internal communication of two elements. Those skilled in the art can understand the specific meaning of the above terms in this utility model through specific circumstances.
[0038] like Figure 1 and Figure 2As shown in the figure, an embodiment of the present invention provides a silicon wafer debonding device, including a debonding tank 10, a separation device 30, and a first detection device 40. After the crystal rod is cut into silicon wafers, the silicon wafers are bonded to the substrate. A robotic arm places the silicon wafers with the substrate attached into a material frame, and then places the material frame into the debonding tank 10. The debonding tank 10 contains a debonding solution to debond the silicon wafers, separating them from the substrate. To facilitate the placement of the material frame, a material frame support 20 is provided inside the debonding tank 10. Due to the different sizes of silicon wafers, the material frame support 20 can be moved up and down to adjust its height so that the silicon wafers can be completely immersed in the debonding solution. A separation device 30 is provided on the debonding tank 10, and the separation device 30 is rotatably connected to the debonding tank 10. It can move closer to or further away from the material frame support 20, pressing down on the silicon wafers in the material frame while the robotic arm grabs the substrate above the silicon wafers, separating the silicon wafers from the substrate. To prevent damage to the separator 30 and silicon wafers caused by excessive or insufficient rotation, a first detection device 40 is installed outside the degumming tank 10. The first detection device 40 is positioned opposite one end of the separator 30 and can detect the rotational position of the separator 30. Placing the first detection device 40 outside the degumming tank 10 eliminates the influence of the degumming solution on the first detection device 40, ensuring its normal operation.
[0039] Specifically, such as Figure 3 As shown, the material frame support 20 has adjusting bolts 21 at both ends. These adjusting bolts 21 are mounted on the degumming tank 10 and can move the material frame support 20 up and down. In this embodiment, the material frame support 20 is a rectangular frame. Four adjusting bolts 21 are threadedly connected to the ends of the material frame support 20. Fastening bolts 22 are fitted inside the adjusting bolts 21, vertically fixing the adjusting bolts 21 to the inner wall of the degumming tank 10. Loosening the fastening bolts 22 and rotating the adjusting bolts 21 adjusts the height of the material frame support 20. The structure and connection relationship of the adjusting bolts 21 and fastening bolts 22 are existing technology and will not be described in detail here. To facilitate the positioning of the material frame, positioning plates 23 are fixed around the perimeter of the material frame on the material frame support 20.
[0040] Specifically, such as Figure 2As shown, the separation device 30 includes a rotating shaft 31 and a separation pressure plate 32. The rotating shaft 31 is rotatably connected to the degumming tank 10 and is arranged along the length of the material frame support 20. A motor 33 is mounted on the rotating shaft 31, and the separation pressure plate 32 is mounted on the rotating shaft 31 and arranged along the rotating shaft 31. The rotating shaft 31 can drive the separation pressure plate 32 to move closer to or away from the material frame support 20. In this embodiment, to facilitate the separation of silicon wafers from the material holder, separation devices 30 are symmetrically arranged on both sides of the material frame support 20. The rotating shaft 31 is arranged along the length of the material frame support 20 and is rotatably connected to the inner wall of the degumming tank 10 by bearings. A motor 33 is mounted at one end of the rotating shaft 31 and is fixed to the top of the side wall of the degumming tank 10. A drive gear 34 is mounted at the output end of the motor 33, and a driven gear 35 meshes with the bottom of the drive gear 34. The driven gear 35 is fixedly connected to the rotating shaft 31. The motor 33 drives the drive gear 34 to rotate, and the drive gear 34 drives the rotating shaft 31 to rotate through the driven gear 35. The separating pressure plate 32 is arranged along the length of the rotating shaft 31, and a connecting plate 36 is fixed on the separating pressure plate 32. The connecting plate 36 is fixed on the rotating shaft 31. Since the separating pressure plate 32 needs to contact the silicon wafer to press it down, in order to avoid damage to the silicon wafer, the separating pressure plate 32 is set as an elastic element, which can be made of rubber or silicone or other materials.
[0041] Specifically, a detection rod 37 is provided at one end of the rotating shaft 31 relative to the first detection device 40. The detection rod 37 is positioned above the degumming tank 10, and the rotating shaft 31 can drive the detection rod 37 to move. In this embodiment, the detection rod 37 is provided at the end of the rotating shaft 31 where the motor 33 is not located. To avoid the degumming solution affecting the detection rod 37, the detection rod 37 is horizontally positioned above the degumming tank 10. The rotation of the rotating shaft 31 can drive the detection rod 37 to move, and the first detection device 40 can detect the rotational position of the rotating shaft 31 by detecting the position of the detection rod 37.
[0042] Specifically, the rotating shaft 31 has a connecting rod 38 at one end where the detection rod 37 is located, and the detection rod 37 is mounted on the connecting rod 38. In this embodiment, the connecting rod 38 is an L-shaped rod, with one end fixed to the rotating shaft 31 and the other end fixed with a horizontal detection rod 37. The detection rod 37 is perpendicular to the connecting rod 38. By setting the connecting rod 38, the detection rod 37 is always positioned above the degumming tank 10 during movement and will not come into contact with the degumming solution.
[0043] Specifically, the first detection device 40 includes a fixed bracket 41 and a first sensor 42. The fixed bracket 41 is located on the top outer side of the degumming tank 10, opposite to the detection rod 37, and the first sensor 42 is mounted on the fixed bracket 41. To avoid the first sensor 42 coming into contact with the degumming liquid and affecting the detection accuracy, the fixed bracket 41 is installed on the top outer side of the degumming tank 10, and the shape of the fixed bracket 41 is not limited. In this embodiment, the fixed bracket 41 is arc-shaped. When the rotating shaft 31 drives the separating pressure plate 32 to move, there are two extreme positions: downward and upward. Correspondingly, there are also two extreme positions on the fixed bracket 41 relative to the detection rod 37. The first sensor 42 is installed at the two extreme positions on the fixed bracket 41 to detect the position of the separating pressure plate 32 and prevent the separating pressure plate 32 from exceeding the extreme positions or not moving into place. When the first sensor 42 detects the detection rod 37, the separation plate 32 is at its limit position of pressing down or lifting up. When the separation plate 32 is at its limit position of pressing down, it contacts the top of the silicon wafer. At this time, the robot arm grabs the material holder and moves it upward to separate the material holder from the silicon wafer. When the separation plate 32 is at its limit position of lifting up, it moves away from the upper part of the material frame support. At this time, the robot arm takes the entire material frame out of the degumming tank.
[0044] Preferably, the fixed bracket 41 has a mounting hole 43 along the moving trajectory of the detection rod 37, and the first sensor 42 is detachably connected to the mounting hole 43. In this embodiment, the moving trajectory of the detection rod 37 is arc-shaped, and the mounting hole 43 is set as an arc-shaped through hole, allowing the first sensor 42 to be detachably connected to the mounting hole 43. By moving the mounting position of the first sensor 42 on the arc-shaped mounting hole 43, the extreme positions of the pressing down and lifting of the separating pressure plate 32 can be adjusted.
[0045] Preferably, a second detection device 50 is provided at the top of the debonding tank 10 to detect whether silicon wafers are adhered to the separated substrate. In this embodiment, the second detection device 50 is a through-beam sensor, which is mounted on the top of the debonding tank 10 using a mounting bracket 51. After the robotic arm grasps the substrate and separates it from the silicon wafer, it lifts the substrate to a set height, pauses for a set time, and drains the substrate while the second detection device 50 detects whether silicon wafers are adhered to it. The set height must exceed the installation height of the second detection device 50, and the height difference between the set height and the second detection device 50 must be less than the diameter of the silicon wafer to ensure that the second detection device 50 can detect when silicon wafers are adhered to the substrate. When the second detection device 50 detects a silicon wafer, it will issue an alarm to ensure that all silicon wafers are separated from the substrate, that is, the silicon wafers are completely debonded, ensuring the debonding effect.
[0046] Preferably, Figure 4As shown, the bottom of the degumming tank 10 is equipped with a slag-cleaning drawer 60 for filtering slag. The slag-cleaning drawer 60 is detachably connected to the degumming tank 10, making it easy to remove and clean. In this embodiment, the bottom of the degumming tank 10 is an inclined surface, with a groove at the lower end of the inclined surface for placing the slag-cleaning drawer 60. The slag-cleaning drawer 60 has filter holes, and a drain port 11 is located at the bottom of the groove. The cleaning liquid flows to the slag-cleaning drawer 60 through the inclined surface, is filtered by the slag-cleaning drawer 60, and is discharged through the drain port 11. At one end of the slag-cleaning drawer 60, a slag-cleaning port 12 is provided on the side wall of the degumming tank 10, through which the slag-cleaning drawer 60 can be removed from the degumming tank 10 for cleaning. A slag-cleaning port cover is installed on the slag-cleaning port 12 by a clamp, making the slag-cleaning port cover easy to remove and facilitating the removal and placement of the slag-cleaning drawer 60.
[0047] Preferably, an overflow tank 13 is provided on one side of the degumming tank 10. By providing the overflow tank 13, the degumming liquid can be prevented from overflowing to the outside of the degumming tank 10 and causing pollution to the external environment.
[0048] Preferably, a heater 70 and a temperature sensor 80 are installed at the bottom of the degumming tank 10. The heater 70 is used to heat the degumming solution, which is more conducive to degumming. The temperature sensor 80 is used to detect the temperature of the degumming solution. Both the heater 70 and the temperature sensor 80 are existing technologies and will not be described in detail here.
[0049] The advantages and positive effects of this utility model are:
[0050] 1. By setting up a separation device in conjunction with a robotic arm, the silicon wafers can be automatically debonded, saving manpower and improving work efficiency.
[0051] 2. By setting up a first detection device, the position of the separation plate is detected to prevent damage to the separation plate and silicon wafer, ensuring the normal progress of degumming. Moreover, the first detection device is set outside the degumming tank, so it will not be contaminated by the degumming solution, ensuring the detection accuracy.
[0052] 3. By setting up a second detection device, the degumming effect can be further guaranteed, and silicon wafers can be prevented from sticking to the separated material base.
[0053] The embodiments of this utility model have been described in detail above, but the content described is only a preferred embodiment of this utility model and should not be considered as limiting the scope of implementation of this utility model. All equivalent changes and improvements made in accordance with the claims of this utility model should still fall within the patent coverage of this utility model.
Claims
1. A silicon wafer debonding device, characterized in that, include: The degumming tank has an internal material frame support that can move up and down. A separation device is installed on the degumming tank and rotatably connected to the degumming tank, used to separate the material seat from the silicon wafers bonded to the material seat; A first detection device is disposed outside the degumming tank and opposite one end of the separation device, and is used to detect the position of the separation device. The separation device includes, A rotating shaft is rotatably connected to the degumming tank and is arranged along the length of the material frame support; a motor is provided on the rotating shaft. A separation pressure plate is disposed on the rotating shaft and arranged along the rotating shaft. The rotating shaft can drive the separation pressure plate to move closer to or away from the material frame support. The rotating shaft has a detection rod at one end relative to the first detection device. The detection rod is positioned above the degumming tank. The rotating shaft can drive the detection rod to move. The rotating shaft has a connecting rod at one end with the detection rod, and the detection rod is mounted on the connecting rod.
2. The silicon wafer debonding device according to claim 1, characterized in that: The material frame support is provided with adjusting bolts at both ends. The adjusting bolts are set on the degumming tank and can drive the material frame support to move up and down.
3. The silicon wafer debonding device according to claim 1, characterized in that: The first detection device includes, A fixed bracket is disposed on the top outer side of the degumming tank, relative to the detection rod; The first sensor is mounted on the fixed bracket.
4. The silicon wafer debonding device according to claim 3, characterized in that: The fixed bracket has mounting holes along the movement trajectory of the detection rod, and the first sensor is detachably connected to the mounting holes.
5. A silicon wafer debonding device according to any one of claims 1-4, characterized in that: The top of the degumming tank is equipped with a second detection device for detecting whether silicon wafers are adhered to the separated material seat.
6. The silicon wafer debonding device according to claim 5, characterized in that: The bottom of the degumming tank is equipped with a slag removal drawer for filtering slag, and the slag removal drawer is detachably connected to the degumming tank.
7. A silicon wafer debonding device according to any one of claims 1-4 and 6, characterized in that: An overflow tank is provided on one side of the degumming tank.