Resin plate for improving residual glue on edge of wafer after wire cutting

Abstract

According to the resin plate for improving the residual glue on the edge of the wafer after wire cutting, the two ends of the resin plate are provided with the arc surfaces with the curvature radius of 1-2.5 mm, and compared with a plane area in which the two ends of the resin plate are arranged to be right angles in the prior art, the resin plate has a larger contact area with a glue body for bonding a crystal bar; therefore, the bonding force between the resin plate and the colloid for bonding the crystal bar is increased, the space between the crystal bar and the edge of the resin plate can be further released, residual glue is easier to wipe and remove, the two ends of the resin plate are arranged to be arc surfaces, stress concentration can be eliminated, and the abnormal problems of edge breakage, corner breakage and the like of the resin plate are avoided. And due to the resin plate with the arc surface, the risk that fingers are scratched when a worker operates the resin plate is avoided.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor manufacturing technology, and in particular relates to a resin board for improving residual adhesive at the edge of a wafer after wire cutting. Background Technology

[0002] In semiconductor wafer manufacturing, wire cutting technology is typically used to cut crystal ingots into silicon wafers. This process usually involves bonding the crystal ingot to a resin substrate, which is then attached to the wire cutting machine's fixtures before cutting. After wire cutting, the wafers undergo a cleaning and heating process on a debinding machine to separate them from the resin substrate. In current cutting processes, a flat area is typically ground at both ends of the resin substrate, such as... Figure 1 As shown.

[0003] However, in actual use, it was found that when the crystal ingot is bonded to the resin board, the residual adhesive in the gaps at both ends of the bonding surface of the crystal ingot and the resin board cannot be completely wiped clean. Furthermore, because the surface tension of the adhesive bonding the crystal ingot to the wafer is smaller than that of the adhesive bonding the resin board to the crystal ingot, the residual adhesive that cannot be wiped clean is more likely to adhere to the edge of the silicon wafer in a triangular shape during heating and debonding, and be carried out with the silicon wafer. This results in the residual adhesive remaining at the edge of the silicon wafer being squeezed against the wafer during subsequent processes, leading to risks such as edge chipping, fragmentation, abnormal processing data, and damage to the wafer edge grinding wheel. On the other hand, because the flat area of ​​the resin board is a right angle, the surface stress is more easily concentrated at the right angle, making the resin board more prone to edge chipping, corner missing, and other abnormalities. The right angle formed at the flat area of ​​the resin board also makes it relatively sharp, making it easy for workers to cut their fingers during operation, causing injury. Utility Model Content

[0004] The purpose of this invention is to provide a resin board that improves the residual adhesive on the edge of the wafer after wire cutting. This solves the problem in the prior art where residual adhesive cannot be completely wiped clean due to the planar areas at both ends of the edge of the resin board, thus affecting subsequent wafer processing. It also addresses the issue that the right angles at the planar areas of the resin board cause stress concentration, making the resin board more prone to edge chipping, corner breakage, and other abnormalities, and easily causing workers to cut their fingers during operation.

[0005] To achieve the above and other related objectives, this utility model provides a resin board for improving residual adhesive at the edge of a wafer after wire dicing. The resin board includes a groove on its surface, the inner wall of which is a curved surface with positive curvature. The groove connects both ends of the resin board, and both ends are formed as arc surfaces with negative curvature. The wire-diced wafer is bonded to the groove, and the bonding area between the wire-diced wafer and the groove is at least 1 / 3 of the surface area of ​​the wire-diced wafer.

[0006] Optionally, the thickness D1 of the resin board is 25.5 to 33.5 mm, and the width W of the resin board is 90 to 150 mm.

[0007] Optionally, the distance D2 between the lowest point of the groove and the bottom of the resin plate is 12-20 mm.

[0008] Optionally, the radius of curvature of the groove is 100-153 mm.

[0009] Optionally, the radius of curvature of the arc surface is 1 to 2.5 mm.

[0010] Optionally, the resin board is further provided with circular micropores on both sides of the resin board, and the circular micropores penetrate through both sides of the resin board.

[0011] Optionally, the circular micropore is located below the bottom of the groove.

[0012] As described above, the resin plate of the present invention for improving residual adhesive at the edge of wafers after wire cutting has the following beneficial effects: By setting both ends of the resin plate as arc surfaces with a radius of curvature of 1 to 2.5 mm, compared with the right-angled planar areas at both ends of the resin plate in the prior art, the resin plate and the adhesive for bonding the crystal rod have a larger contact area, thereby increasing the adhesion between the resin plate and the adhesive for bonding the crystal rod. It can also further release the space at the edge of the crystal rod and the resin plate, making the residual adhesive easier to wipe away. Setting both ends of the resin plate as arc surfaces can eliminate stress concentration, so that the resin plate will not have abnormal problems such as edge chipping or corner missing. In addition, the resin plate with arc surfaces eliminates the risk of workers cutting their fingers when handling the resin plate. Attached Figure Description

[0013] Figure 1 The diagram shows a structural schematic of a resin plate for a wire-cut wafer, as provided in the prior art.

[0014] Figure 2 The diagram shows a structural schematic of a resin plate for improving residual adhesive at the edge of a wafer after wire cutting, as provided by the utility model.

[0015] Figure 3Showing a front view of the resin plate provided by the utility model for improving residual adhesive at the edge of a wafer after wire cutting.

[0016] Figure 4 The image shown is a partial schematic diagram of a resin board for improving residual adhesive at the edge of a wafer after wire cutting, as provided by the utility model.

[0017] Figure 5 The image shown is a left view of a resin plate for improving residual adhesive at the edge of a wafer after wire cutting, as provided by the utility model.

[0018] Component designation explanation

[0019] 10. Resin board; 11. Groove; 12. Arc surface; 13. Circular micropores. Detailed Implementation

[0020] The following specific examples illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. This utility model can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this utility model.

[0021] In the detailed description of the embodiments of this utility model, for ease of explanation, the schematic diagrams illustrating the device structure may be partially enlarged without adhering to the general scale, and the schematic diagrams are merely examples and should not limit the scope of protection of this utility model. Furthermore, in actual manufacturing, the three-dimensional spatial dimensions of length, width, and depth should be included.

[0022] For ease of description, spatial relation terms such as “below,” “under,” “lower than,” “below,” “above,” and “upper” may be used herein to describe the relationship between one element or feature shown in the accompanying drawings and other elements or features. It will be understood that these spatial relation terms are intended to include directions other than those depicted in the accompanying drawings for devices in use or operation.

[0023] Please see Figures 2 to 4 It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of the present invention. Therefore, the illustrations only show the components related to the present invention and are not drawn according to the actual number, shape and size of the components in the actual implementation. In the actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0024] like Figure 2As shown, this utility model provides a resin board for improving residual adhesive at the edge of a wafer after wire cutting. The resin board includes a resin board 10, on the surface of which a groove 11 is provided. The inner wall of the groove 11 is a curved surface with positive curvature. The groove 11 connects both ends of the resin board 10. Both ends of the resin board 10 are formed as arc surfaces 12 with negative curvature. The wire-cut wafer is bonded to the groove 11, and the bonding area between the wire-cut wafer and the groove 11 is at least 1 / 3 of the surface area of ​​the wire-cut wafer. Specifically, the crystal rod is bonded to the resin plate 10 with grooves 11 by the adhesive used to bond the crystal rod. This enhances the bonding strength between the crystal rod and the resin plate 10. The two ends of the resin plate 10 are set as arc surfaces 12 with negative curvature, which increases the contact area between the resin plate 10 and the adhesive used to bond the crystal rod. This also eliminates stress concentration, preventing the resin plate 10 from chipping or missing corners. Furthermore, it releases space at the edges of the crystal rod and the resin plate 10, making it easier to wipe away residual adhesive, thereby improving the yield rate of wire-cut wafers.

[0025] In some embodiments, the thickness D1 of the resin board 10 is 25.5 to 33.5 mm, and the width W of the resin board 10 is 90 to 150 mm.

[0026] Specifically, the thickness D1 of the resin board 10 is 25.5–33.5 mm, for example, D1 can be 22.5 mm, 27.5 mm, or 33.5 mm; the width W of the resin board 10 is 90–150 mm, for example, W can be 90 mm, 120 mm, or 150 mm; preferably, in this embodiment, as... Figure 3 As shown, the thickness D1 of the resin board 10 is set to 29.5 mm, and the width W of the resin board 10 is set to 130 mm, which makes the resin board 10 more conducive to processing and molding, and at the same time improves the strength of the resin board 10.

[0027] In some embodiments, the distance D2 between the lowest point of the groove 11 and the bottom of the resin plate 10 is 12 to 20 mm.

[0028] Specifically, the distance D2 between the lowest point of the groove 11 and the bottom of the resin plate 10 is 12-20 mm. For example, the distance D2 between the lowest point of the groove 11 and the bottom of the resin plate 10 is 12 mm, 16 mm, or 20 mm. Preferably, in this embodiment, such as... Figure 3 As shown, the distance D2 between the lowest point of the groove 11 and the bottom of the resin plate 10 is 16mm, which is conducive to the subsequent formation of circular micropores 13. This facilitates the entry of hot water during the cleaning and heating degumming process on the degumming separator, allowing for rapid heat exchange, separating the crystal rod from the resin plate 10, and improving the efficiency of residual glue wiping and removal.

[0029] In some embodiments, the radius of curvature of the groove 11 is 100–153 mm.

[0030] Specifically, in the production of 8-inch or 12-inch wafers, a resin board 10 is first bonded to the crystal ingot, and then wire cutting technology is used to cut the crystal ingot. Therefore, in this embodiment, as... Figure 3 As shown, the radius of curvature of the groove 11 is set to 100-153mm. For example, the radius of curvature of the groove 11 is 100mm, 125mm or 153mm, so that the resin board for improving the residual adhesive at the edge of the wafer after wire cutting in this embodiment can be adapted to the size of 8-inch wafers or 12-inch wafers.

[0031] In some embodiments, the radius of curvature of the arc surface 12 is 1 to 2.5 mm.

[0032] Specifically, in this embodiment, such as Figure 4 As shown, the radius of curvature of the arc surface 12 is set to 1 to 2.5 mm. For example, the radius of curvature of the arc surface 12 is 1 mm, 2 mm or 2.5 mm. Compared with the flat surface in the prior art, the arc surface 12 has more contact area with the adhesive for bonding the crystal rod, thereby increasing the adhesion between the resin plate 10 and the residual adhesive after cutting. At the same time, the setting of the arc surface 12 can also release the relative space between the crystal rod and the edge of the resin plate 10, making it easier to wipe away the residual adhesive on the wafer after cutting. In addition, the resin plate 10 with the arc surface 12 makes it less likely for the operator to cut their fingers when handling the resin plate 10.

[0033] In some embodiments, circular microholes 13 are also provided on the two side walls of the resin board 10, and the circular microholes 13 penetrate the two side walls of the resin board 10.

[0034] Specifically, in this embodiment, such as Figure 5 As shown, circular microholes 13 are also formed on both side walls of the resin plate 10; the circular microholes 13 penetrate both side walls of the resin plate 10; after the cutting process is completed, the resin plate 10 and the crystal rod bonded in the groove 11 of the resin plate 10 need to be immersed in hot water together to separate the crystal rod from the resin plate 10. The circular microholes 13 formed on both side walls of the resin plate 10 facilitate the entry of hot water, realize rapid heat exchange, and thus separate the crystal rod from the resin plate 10, improving processing efficiency. In other embodiments, the circular microholes 13 are located below the bottom of the groove 11, thereby enhancing the entry of hot water into the resin plate 10 while avoiding affecting the structural strength of the resin plate 10.

[0035] In summary, the resin plate of this invention, which improves the removal of residual adhesive at the edge of wafers after wire cutting, features rounded ends with a radius of curvature of 1–2.5 mm at both ends. Compared to the right-angled planar areas at both ends of resin plates in the prior art, this provides a larger contact area between the resin plate and the adhesive used to bond the crystal rod, thereby increasing the adhesion between the resin plate and the adhesive. It also further frees up space at the edge of the crystal rod and the resin plate, making residual adhesive easier to wipe away. The rounded ends of the resin plate eliminate stress concentration, preventing edge chipping, corner breakage, and other abnormalities. Furthermore, the rounded surfaces eliminate the risk of finger injuries for workers handling the resin plate. Therefore, this invention effectively overcomes the various shortcomings of the prior art and has high industrial applicability.

[0036] The above embodiments are merely illustrative of the principles and effects of this utility model and are not intended to limit the scope of this utility model. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this utility model. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this utility model should still be covered by the claims of this utility model.

Claims

1. A resin board for improving residual adhesive at the edge of a wafer after wire cutting, characterized in that: A groove is provided on the surface of the resin plate. The inner wall of the groove is a curved surface with positive curvature. The groove connects the two ends of the resin plate. The two ends of the resin plate are set as arc surfaces with negative curvature. The wire-cut wafer is bonded to the groove and the bonding area between the wire-cut wafer and the groove is at least 1 / 3 of the surface area of ​​the wire-cut wafer.

2. The resin board for improving residual adhesive at the edge of a wafer after wire cutting according to claim 1, characterized in that, The thickness D1 of the resin board is 25.5-33.5 mm, and the width W of the resin board is 90-150 mm.

3. The resin board for improving residual adhesive at the edge of a wafer after wire cutting according to claim 1, characterized in that, The distance D2 between the lowest point of the groove and the bottom of the resin plate is 12-20 mm.

4. The resin board for improving residual adhesive at the edge of a wafer after wire cutting according to claim 1, characterized in that, The radius of curvature of the groove is 100–153 mm.

5. The resin board for improving residual adhesive at the edge of a wafer after wire cutting according to claim 1, characterized in that, The radius of curvature of the arc surface is 1 to 2.5 mm.

6. The resin board for improving residual adhesive at the edge of a wafer after wire cutting according to claim 1, characterized in that, The resin board is also provided with circular micropores on both sides of the resin board, and the circular micropores penetrate through both sides of the resin board.

7. The resin board for improving residual adhesive at the edge of a wafer after wire cutting according to claim 6, characterized in that, The circular micropore is located below the bottom of the groove.

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