Wafer carrier box

Abstract

The utility model relates to the field of wafer storage devices, in particular to a wafer carrier box. The wafer carrier box comprises a box body and a drying box, ventilation holes are formed in the side wall of the drying box, a containing part used for containing the drying box is arranged in the box body, the containing part can be an installation groove or a hanging point, and the drying box can be arranged in the installation groove or hung on the hanging point. The drying box can comprise a box body and a box cover, a plurality of abutting plates are arranged on the peripheral side of the box body, and the abutting plates abut against the side walls of the mounting grooves to achieve clamping fit. The drying box can also comprise two panels and baffles, the baffles are annular and fixedly connected with one panel, a space used for containing drying agents is formed between the two panels and the baffles, and the two baffles are detachably connected. The drying agent is contained in the drying box, so that the sealing performance and the drying performance of the wafer carrier box are effectively improved, and safe storage and transportation of wafers are ensured.

Description

Technical Field

[0001] This application relates to the field of wafer memory devices, and more particularly to a wafer carrier cassette. Background Technology

[0002] Semiconductor manufacturing is a core component of the modern electronics industry. With the rapid development of technology, the applications of semiconductor devices are becoming increasingly widespread, placing ever higher demands on manufacturing processes. In the semiconductor manufacturing process, the storage environment of the wafer has a crucial impact on the quality of the final product. Especially regarding moisture resistance, improving the moisture resistance of wafer carriers has become a critical issue that urgently needs to be addressed in the current semiconductor manufacturing field.

[0003] Currently, various methods and technologies are widely used in the industry to address potential moisture issues during wafer storage. Common methods include the use of desiccants. Adding desiccants is a relatively simple method, but since the desiccant is placed directly inside the wafer carrier, it can collide with the wafer during handling or transportation, easily causing damage. This cannot fully meet the high standards of moisture protection required in modern semiconductor manufacturing.

[0004] Therefore, there is an urgent need for a new technology that can rapidly deploy moisture protection capabilities on existing carriers to ensure the stability and security of wafers during storage. Utility Model Content

[0005] This application provides a wafer carrier box with good moisture-proof performance to ensure the stability of wafer quality.

[0006] The wafer carrier box provided in this application adopts the following technical solution:

[0007] A wafer carrier box includes a housing and a drying box, wherein ventilation holes are provided on the side wall of the drying box; the housing is provided with a placement part for placing the drying box, the placement part being located on the bottom wall or side wall of the housing; the placement part is configured as a mounting groove or a hanging point, and the drying box is placed in the mounting groove or hung on the hanging point.

[0008] By adopting the above technical solution, this wafer carrier box can effectively prevent wafers from absorbing moisture during storage, improving their moisture resistance. Specifically, the ventilation holes on the side wall of the drying box ensure the desiccant's permeability, allowing it to effectively absorb moisture inside the box and maintain a dry internal environment. Simultaneously, the placement section (mounting slot or hanging point) inside the box provides a stable placement position for the drying box, preventing movement during transportation and storage. This design improves wafer storage safety, reduces product quality issues caused by moisture, and increases production efficiency.

[0009] Preferably, the drying box includes a box body and a box lid, the box lid cooperating with the box body; the box body is provided with a plurality of abutment plates on its periphery, and the abutment plates abut against the side wall of the mounting groove to achieve a snap-fit ​​engagement between the box body and the mounting groove.

[0010] By adopting the above technical solution, the snap-fit ​​between the box and the mounting slot is achieved, which enhances the stability of the box in the mounting slot and prevents displacement during transportation or handling, thereby improving the overall stability and safety of the wafer carrier box.

[0011] Preferably, the lid is provided with an operating handle for controlling the opening and closing of the lid, the mounting groove is provided on the bottom wall of the box, and the operating handle is provided on the side of the box facing the side wall of the box.

[0012] By adopting the above technical solution, the operating handle on the lid allows operators to easily control the opening and closing of the lid, improving ease of use. Simultaneously, the operating handle is located on the side of the box facing the cabinet sidewall, avoiding interference with other components during operation and further enhancing operational safety and reliability. Furthermore, the mounting slot located on the bottom wall of the cabinet ensures stable placement of the desiccant box, reducing the risk of desiccant spillage due to shaking.

[0013] Preferably, one side of the lid is hinged to the box body, and the other side is snapped into the box body. The side of the box body facing the lid is also provided with a locking tooth, and the locking tooth is located on the side where the box body and the lid snap into each other. The lid is provided with a slot corresponding to the locking tooth.

[0014] By adopting the above technical solution, the hinge and snap-fit ​​structure between the lid and the box body ensures the stability and sealing of the lid. Specifically, the hinge allows the lid to be opened and closed easily, while the snap-fit ​​ensures that the lid fits tightly against the box body when closed. The locking teeth on the box body cooperate with the locking grooves on the lid, further enhancing the connection between the lid and the box body and improving the overall protective capability.

[0015] Preferably, the box body includes two oppositely arranged panels and a baffle disposed between the two panels. The baffle is fixedly connected to one of the panels and is arranged in a ring shape. A space for placing desiccant is formed between the two panels and the baffle. The two baffles are detachably connected.

[0016] One of the panels is mounted on the side wall of the enclosure.

[0017] By adopting the above technical solution, the structure of the drying box not only facilitates the replacement of the desiccant and improves the moisture-proof effect, but also makes the entire wafer carrier box structure more compact, facilitating installation and maintenance. Meanwhile, the panel design mounted on the side wall of the box further enhances the stability and reliability of the box, effectively preventing the wafers from shaking and being damaged during transportation and storage.

[0018] Preferably, a groove is provided on the panel not connected to the baffle, and the baffle extends into the groove.

[0019] By adopting the above technical solution, a groove is provided on the panel that is not connected to the baffle, and the baffle extends into the groove, which can effectively improve the structural stability and sealing of the box, prevent the desiccant from leaking during transportation and use, and further enhance the moisture-proof performance of the wafer carrier box.

[0020] Preferably, one side of the groove is open, one of the baffles is provided with a guide groove, and the other panel is provided with a guide part that cooperates with the guide groove to realize the sliding connection of the two panels; the baffle can enter or exit the groove from the opening.

[0021] By adopting the above technical solution, a sliding connection is used between the two panels, which can effectively improve the convenience of opening and closing the drying box, so as to facilitate the replacement of the desiccant inside.

[0022] Preferably, the guide portion has a tenon, and the guide groove is provided with a locking part that mates with the tenon; the tenon is also provided with a dial.

[0023] By adopting the above technical solution, the guide section of the wafer carrier box is equipped with a latch, and the guide groove has a locking part that mates with the latch, ensuring the stability and reliability of the box. The dial design on the latch facilitates user operation, making the assembly and disassembly of the box more convenient and improving usability.

[0024] In summary, this application includes at least one of the following beneficial technical effects:

[0025] 1. The drying box exchanges gas with the internal environment through ventilation holes. At the same time, the design of the placement part ensures that the drying box is placed stably, thereby effectively absorbing and removing moisture inside the box, significantly improving the moisture-proof performance of the wafer carrier box, avoiding wafer damage due to moisture, and improving product quality and production efficiency.

[0026] 2. Multiple abutment plates are set around the box body to abut against the side wall of the mounting groove, so as to realize the snap-fit ​​between the box body and the mounting groove, ensuring that the drying box will not loosen or fall off during transportation and storage, and enhancing the stability and reliability of the overall structure;

[0027] 3. The drying box of this application has two structural forms, and the appropriate drying box can be selected according to actual needs, thereby effectively expanding the application range and saving usage costs. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of the structure of the wafer carrier box in the embodiments of this application;

[0029] Figure 2 This is a cross-sectional view of the wafer carrier box in the embodiments of this application, and is used to show the mating relationship between the mounting slot and the drying box;

[0030] Figure 3 This is a schematic diagram of the drying box in Scheme 1 of the embodiments of this application;

[0031] Figure 4 This is a schematic diagram of the drying box in Scheme 2 of the embodiments of this application;

[0032] Figure 5 This is a schematic diagram of the drying box from another perspective in Scheme 2 of this application.

[0033] The following labels are used in the attached diagram: 1. Box body; 11. Mounting slot; 2. Drying box; 21. Box body; 211. Abutment plate; 212. Clamping tooth; 22. Box cover; 221. Operating handle; 23. Panel; 231. Groove; 24. Baffle; 25. Guide groove; 251. Snap-fit ​​part; 26. Guide part; 261. Snap tenon; 262. Dial head. Detailed Implementation

[0034] The following is in conjunction with the appendix Figure 1-5 This application will be described in further detail.

[0035] This application provides a wafer carrier box, which is described in an embodiment. Figure 1 The device includes a housing 1 and a drying box 2, with ventilation holes on the side wall of the drying box 2. The housing 1 has a placement section for the drying box 2, located on the bottom or side wall of the housing 1. The placement section is configured as a mounting groove 11 or a hanging point, with the drying box 2 placed in the mounting groove 11 or hung on the hanging point. This design, by providing a dedicated placement section within the housing 1 to accommodate the drying box 2, ensures effective placement and ventilation of the drying box 2, thereby improving the moisture-proof performance of the wafer carrier.

[0036] The desiccant in box 2 can be placed inside. The desiccant can be silica gel, molecular sieve, or other highly efficient adsorbent materials; the specific choice depends on the required moisture resistance level and cost considerations. The ventilation holes can be circular, square, or polygonal, and their diameter and spacing can be adjusted according to actual needs.

[0037] The mounting slot 11 or hanging point can be used as a placement part, and different design schemes are possible.

[0038] Reference Figure 2 and Figure 3 As one option, the placement part is configured as a mounting groove 11, which is located on the bottom wall of the housing 1. Preferably, the mounting groove 11 can also be located on the side wall of the housing 1. Two mounting grooves 11 are provided, located on both sides of the bottom wall of the housing 1 respectively. Two drying boxes 2 are also provided accordingly. The drying box 2 includes a box body 21 and a box cover 22, and the box body 21 can be placed in the mounting groove 11.

[0039] Reference Figure 4 and Figure 5 As a second option, the placement section uses hanging points and is located on the side wall of the box 1. The drying box 2 includes two opposing panels 23 and a baffle 24 disposed between the panels 23.

[0040] The above two options can be flexibly selected according to actual usage needs, or the two can be combined and used simultaneously.

[0041] Reference Figure 2 and Figure 3 As one possible solution, when the drying box 2 consists of a box body 21 and a lid 22, one side of the lid 22 is hinged to the box body 21, and the other side is snapped into place. A locking tooth 212 is also provided on the side of the box body 21 facing the lid 22, and the locking tooth 212 is located on the side where the box body 21 and the lid 22 snap together. A corresponding slot is provided on the lid 22. This design, by combining hinges and snap-fit, ensures a tight seal on the lid 22.

[0042] Furthermore, the lid 22 is provided with an operating handle 221 for controlling the opening and closing of the lid 22. The mounting groove 11 is located on the bottom wall of the box body 1, and the operating handle 221 is located on the side of the lid 22 facing the side wall of the box body 1. This design, by adding the operating handle 221, makes it convenient for users to quickly open and close the lid 22, improving the convenience and safety of operation.

[0043] Specifically, the operating handle 221 can take the form of a pull handle, knob, or lever, the specific choice of which should be determined based on the actual usage scenario and user habits. The material of the operating handle 221 can be plastic, metal, or composite material, and the surface should be smooth and burr-free to reduce injury to the hands. The size and shape of the operating handle 221 should be easy to grip, ensuring that the user can operate it easily even while wearing gloves.

[0044] Furthermore, multiple abutment plates 211 are provided around the periphery of the box body 21, and the abutment plates 211 abut against the side wall of the mounting groove 11 to achieve a snap-fit ​​engagement between the box body 21 and the mounting groove 11. This design, by adding abutment plates 211, further improves the connection stability between the box body 21 and the mounting groove 11, and reduces the risk of loosening and falling off during transportation.

[0045] The abutment plate 211 can be rectangular, circular, or other geometric shapes, and its specific design should match the shape of the mounting groove 11. The number and position of the abutment plates 211 should be adjusted according to actual needs. Generally, one abutment plate 211 can be set at each of the four corners of the box 21 to ensure all-round support and fixation.

[0046] The internal structure of the mounting slot 11 also needs to be optimized accordingly. The side wall of the mounting slot 11 can be set at a slightly inclined angle to facilitate the smooth insertion of the abutment plate 211.

[0047] Reference Figure 4 and Figure 5 As a second option, when the box body 21 consists of a panel 23 and a baffle 24, the baffle 24 is specifically fixedly connected to one of the panels 23, while the other baffle 24 has a groove 231. The baffle 24 is arranged in a ring shape and extends into the groove 231, thereby forming a space for placing desiccant between the two panels 23 and the baffle 24. The two baffles 24 are detachably connected. One of the panels 23 is hung on the side wall of the box body 1, and the panel 23 can be fixedly connected to the side wall of the box body 1 by means of hooks, adhesives, or welding.

[0048] To facilitate the assembly and disassembly of the two panels 23, they can be slidably connected. Specifically, one baffle 24 is provided with a guide groove 25, and the other panel 23 is provided with a guide part 26 that cooperates with the guide groove 25 to achieve a slidable connection between the two panels 23. In addition, the baffle 24 with the groove 231 is also provided with a through groove, which is located on one side of the groove 231 and communicates with the groove 231, so that one side of the groove 231 is open, and the baffle 24 can enter or exit the groove 231 through the opening.

[0049] Furthermore, the guide section 26 has a latch 261, and the guide groove 25 is provided with a locking part 251 that mates with the latch 261; the latch 261 is also provided with a dial 262. This design, through the cooperation of the latch 261 and the locking part 251, ensures a stable connection between the baffle 24 and the panel 23, and the dial 262 also facilitates the disassembly and replacement of the desiccant.

[0050] The above are all preferred embodiments of the present application, and are not intended to limit the scope of protection of the present application. Therefore, any equivalent changes made based on the structure, shape, and principle of the present application should be included in the scope of protection of the present application.

Claims

1. A wafer carrier box, characterized in that: The device includes a housing (1) and a drying box (2), with ventilation holes on the side wall of the drying box (2); the housing (1) is provided with a placement part for placing the drying box (2), which is located on the bottom wall or side wall of the housing (1); the placement part is configured as an installation groove (11) or a hanging point, and the drying box (2) is placed in the installation groove (11) or hung on the hanging point.

2. The wafer carrier box according to claim 1, characterized in that: The drying box (2) includes a box body (21) and a box cover (22), the box cover (22) and the box body (21) are fitted together; a plurality of abutment plates (211) are provided on the periphery of the box body (21), and the abutment plates (211) abut against the side wall of the mounting groove (11) to realize the snap-fit ​​fit between the box body (21) and the mounting groove (11).

3. The wafer carrier cassette according to claim 2, characterized in that: The lid (22) is provided with an operating handle (221) for controlling the opening and closing of the lid (22). The mounting groove (11) is located on the bottom wall of the box body (1). The operating handle (221) is located on the side of the box body (21) facing the side wall of the box body (1).

4. The wafer carrier cassette according to claim 2, characterized in that: The lid (22) is hinged to the box body (21) on one side and snapped into the box body (21) on the other side. The box body (21) facing the lid (22) is also provided with a locking tooth (212), and the locking tooth (212) is located on the side where the box body (21) and the lid (22) snap into each other. The lid (22) is provided with a slot corresponding to the locking tooth (212).

5. The wafer carrier cassette according to claim 2, characterized in that: The box body (21) includes two oppositely arranged panels (23) and a baffle (24) disposed between the two panels (23). The baffle (24) is fixedly connected to one of the panels (23) and is arranged in a ring shape. A space for placing desiccant is formed between the two panels (23) and the baffle (24). The two baffles (24) are detachably connected. One of the panels (23) is hung on the side wall of the box (1).

6. The wafer carrier cassette according to claim 5, characterized in that: A groove (231) is provided on the panel (23) that is not connected to the baffle (24), and the baffle (24) extends into the groove (231).

7. The wafer carrier cassette according to claim 6, characterized in that: The groove (231) has an opening on one side. One of the baffles (24) has a guide groove (25), and the other panel (23) has a guide part (26) that cooperates with the guide groove (25) to achieve a sliding connection between the two panels (23). The baffle (24) can enter or exit the groove (231) from the opening.

8. The wafer carrier cassette according to claim 7, characterized in that: The guide part (26) has a tenon (261), and the guide groove (25) is provided with a snap-fit ​​part (251) that cooperates with the tenon (261); the tenon (261) is also provided with a dial (262).

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