Wave soldering equipment tin immersion parameter measuring device and wave soldering equipment

Abstract

The utility model provides a wave soldering equipment tin immersion parameter measuring device and wave soldering equipment, and relates to the technical field of soldering, the wave soldering equipment tin immersion parameter measuring device comprises a movable plate, a width adjusting assembly, a measuring module and a measuring hole; the two movable plates are arranged in parallel at an interval; the two ends of the width adjusting assembly are connected with the two movable plates correspondingly so as to adjust the distance between the two movable plates. The measuring hole is formed in the movable plate; the measuring module is installed in the measuring hole. According to the utility model, the width is adjusted through the width adjusting assembly to simulate the conditions of P plates with different widths, parameter influences caused by actual wave soldering of the P plates are simulated, a worker adjusts the tin immersion time of wave soldering equipment and the width of a tin liquid temperature testing device to the required width, and then the testing device is connected with a testing instrument through the measuring hole, so that the testing efficiency is improved. The tin immersion time and the tin liquid temperature of different point positions can be tested, the quality is improved, and the efficiency is improved.

Description

Technical Field

[0001] This utility model relates to the field of welding equipment technology, and in particular to a wave soldering equipment immersion tin parameter measuring device and wave soldering equipment. Background Technology

[0002] Wave soldering equipment is an indispensable production process in the manufacturing of electronic control motherboards. It plays a role in improving efficiency and ensuring quality in the electronics industry. Large-scale production cannot be separated from wave soldering equipment, but it is necessary to meet the process parameter requirements of the user.

[0003] During the debugging of wave soldering equipment process parameters, due to the limitations of the wave soldering equipment itself, the required process parameters are not necessarily exactly the same for different products. Currently, the immersion time of wave soldering equipment is tested frequently. It needs to be tested every time the line is started or any value of line speed, chain speed, solder pot height, or wave height changes. Each time the employee tests, they need to find the motherboard to be produced for testing, and the test requires measurement at multiple points. The motherboard cannot be wave soldered multiple times, so it is necessary to repeatedly make immersion time test boards. Moreover, it cannot be guaranteed that the test board will not be damaged 100% during the test. In addition, there is no test procedure for solder temperature in the existing production process.

[0004] The existing wave soldering immersion time and solder temperature testing devices in the industry have the following drawbacks:

[0005] 1. There is no device for testing immersion time and solder temperature with adjustable width. Existing immersion time and solder temperature testing devices all use the motherboard to be produced or a single test fixture for testing. Using the motherboard requires multiple testing processes, which is cumbersome and wastes efficiency. When using a single fixture for testing, the width of the wave soldering track must be adjusted to match the fixture. However, in reality, different track widths set on the wave soldering equipment may cause differences in measurement parameters, which do not meet the actual production requirements.

[0006] 2. The test boards have quality issues and low testing efficiency. The test boards used on-site are all intact motherboards ready for production. During the testing process, they need to be heated by wave soldering equipment to obtain test results. Repeated exposure to high-temperature equipment may affect the motherboard's functionality. The test boards need to be made multiple times according to the test point requirements, so the test boards need to be made repeatedly for testing, resulting in low testing efficiency.

[0007] Therefore, how to ensure that there are no quality problems after testing the immersion time and molten solder temperature, strengthen the monitoring of test results, and design a convenient testing fixture are important technical problems that need to be solved by those skilled in the art. Utility Model Content

[0008] The purpose of this utility model is to provide a wave soldering equipment immersion tin parameter measuring device and wave soldering equipment to solve the above-mentioned technical problems existing in the prior art.

[0009] To achieve the above objectives, the present invention provides the following technical solution:

[0010] This utility model provides a wave soldering equipment immersion parameter measuring device, comprising a movable plate, a width adjustment component, a measuring module, and measuring holes; wherein:

[0011] The number of movable plates is two, arranged in parallel and spaced apart;

[0012] The width adjustment component is connected to the two movable plates at both ends to adjust the distance between the two movable plates;

[0013] The measuring hole is disposed on the movable plate;

[0014] The measurement module is installed inside the measurement hole.

[0015] This utility model discloses a tin-immersion parameter measuring device, which is applicable to testing the tin-immersion time and solder temperature when the width of the wave soldering track is different. To achieve adjustable width of the tin-immersion time and solder temperature testing device for wave soldering equipment, a wave soldering test movable plate and a width adjustment component were developed and designed. By adjusting the width through the width adjustment component, the situation of P-boards with different widths can be simulated, simulating the parameter effects caused by the actual wave soldering of P-boards. By adjusting the width of the tin-immersion time and solder temperature testing device of the wave soldering equipment to the required width, and then connecting it to the testing instrument through the measuring hole, the tin-immersion time and solder temperature at different points can be tested, thereby improving quality and efficiency.

[0016] As a further improvement of this utility model, the number of measuring holes is several, which are respectively arranged on the two movable plates.

[0017] As a further improvement of this utility model, all the measuring holes located on the same movable plate are in different positions, and are set at the first end, the middle and / or the second end of the movable plate.

[0018] As a further improvement of this utility model, the width adjustment component includes two connecting rails, which are arranged in parallel and spaced apart, and both ends of all the connecting rails are respectively connected to the two movable plates.

[0019] As a further improvement of this utility model, the connecting guide rail includes a first connecting block, a second connecting block, and a sliding guide rail; wherein:

[0020] The first connecting block and the second connecting block are respectively fixed on the two movable plates;

[0021] The two ends of the sliding guide rail are respectively slidably disposed within the first connecting block and the second connecting block.

[0022] As a further improvement of this utility model, the measuring module includes a solder immersion time measuring module and a solder melt temperature measuring module. The measuring hole includes a first measuring hole and a second measuring hole of different specifications. The first measuring hole is used to fix the solder immersion time measuring module, and the second measuring hole is used to fix the solder melt temperature measuring module.

[0023] As a further improvement of this utility model, the height of the measuring module is the same as the height of the movable plate, and when the measuring module is installed in the measuring hole, the bottom of the measuring module is flush with the bottom surface of the movable plate.

[0024] As a further improvement of this utility model, the movable plate is made of a high-temperature resistant material.

[0025] As a further improvement of this utility model, the cross-section of the sliding guide rail is square.

[0026] This utility model provides a wave soldering equipment, including the immersion tin parameter measuring device.

[0027] This invention relates to a wave soldering equipment that integrates immersion time and solder temperature testing by setting up an adjustable-width wave soldering immersion parameter measuring device. The width of the measuring fixture is adjustable, making it suitable for different types of products. This improves the stability of test results, reduces product quality anomalies, increases testing efficiency, reduces labor costs, improves the consistency of test results, and avoids differences in the selection of different test products. Attached Figure Description

[0028] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0029] Figure 1 This is a top view of the immersion tin parameter measuring device for wave soldering equipment of this utility model;

[0030] Figure 2 This is a front view of the immersion tin parameter measuring device for wave soldering equipment of this utility model;

[0031] Figure 3 This is a top view of the movable plate in the immersion tin parameter measuring device of the wave soldering equipment of this utility model;

[0032] Figure 4This is a top view of the width adjustment component in the immersion tin parameter measuring device of the wave soldering equipment of this utility model;

[0033] Figure 5 This is a front view of the width adjustment component in the immersion tin parameter measuring device of the wave soldering equipment of this utility model;

[0034] Figure 6 This is a top view of one embodiment of the measuring module in the wave soldering equipment immersion tin parameter measuring device of this utility model;

[0035] Figure 7 This is a front view of an embodiment of the measuring module in the wave soldering equipment immersion tin parameter measuring device of this utility model;

[0036] Figure 8 This is a top view of another embodiment of the measuring module in the wave soldering equipment immersion tin parameter measuring device of this utility model;

[0037] Figure 9 This is a front view of another embodiment of the measuring module in the wave soldering equipment immersion tin parameter measuring device of this utility model.

[0038] In the figure: 1. Movable plate; 2. Width adjustment component; 21. First connecting block; 22. Second connecting block; 23. Sliding guide rail; 3. Measuring hole; 4. Measuring module; 41. Solder temperature measuring module; 42. Solder immersion time measuring module. Detailed Implementation

[0039] To make the objectives, technical solutions, and advantages of this utility model clearer, the technical solutions of this utility model will be described in detail below. Obviously, the described embodiments are only a part of the embodiments of this utility model, and not all of them. Based on the embodiments of this utility model, all other implementation methods obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0040] like Figures 1-9 As shown, this utility model provides a wave soldering equipment immersion parameter measuring device with adjustable width, including a movable plate 1, a width adjustment component 2, a measuring module 4, and a measuring hole 3; wherein:

[0041] There are two movable boards 1, set in parallel and spaced apart. The two movable boards 1 are used to simulate the test motherboard in order to measure the tinning parameters.

[0042] The width adjustment component 2 is connected to two movable plates 1 at both ends to adjust the distance between the two movable plates 1; the width adjustment component 2 can realize the distance between the two movable plates 1, thereby simulating test motherboards of different widths;

[0043] Measuring hole 3 is provided on movable plate 1. In this embodiment, measuring hole 3 is a through-hole that extends from the top to the bottom of movable plate 1.

[0044] The measurement module 4 is installed inside the measurement hole 3. When performing parameter measurement, the measurement module 4 is inserted into the measurement hole 3 and then the parameter measurement is performed.

[0045] This utility model's immersion soldering parameter measuring device is applicable to testing immersion soldering time and solder temperature when wave soldering track widths vary. To achieve adjustable width of the wave soldering immersion soldering time and solder temperature testing device, a wave soldering test movable plate 1 and a width adjustment component 2 were developed and designed. By adjusting the width of the width adjustment component 2, the situation of P-boards with different widths can be simulated, simulating the parameter effects caused by the actual wave soldering of P-boards. By adjusting the width of the wave soldering equipment's immersion soldering time and solder temperature testing device to the required width, and then connecting it to the testing instrument through the measuring hole 3, the immersion soldering time and solder temperature at different points can be tested, improving quality and efficiency.

[0046] As a further improvement of this utility model, there are several measuring holes 3, which are respectively set on two movable plates 1.

[0047] As a further improvement of this utility model, all the measuring holes 3 located on the same movable plate 1 are in different positions, and are set at the first end, the middle and / or the second end of the movable plate 1.

[0048] This invention employs an adjustable-width wave soldering immersion time and solder temperature measuring device. The adjustable width of this testing fixture allows for the application of different wave soldering lines during production, ensuring consistency with the width of the motherboard to be produced and minimizing the impact of varying track widths. The fixture features different test points, enabling the measurement of data at multiple points and reducing the influence of specific locations. Made of high-temperature resistant materials, the fixture can pass through the wave soldering equipment multiple times in a short period, meeting the requirements of different test points. It measures solder temperature simultaneously with immersion time. Different test points, due to their varying sizes, avoid misuse. By observing the readings of the immersion time tester and thermocouple, it is possible to determine whether the wave soldering meets production requirements. This effectively solves the current industry problem of requiring test boards of varying widths for wave soldering immersion time testing. The adjustable width of the testing fixture effectively overcomes the shortcomings of existing testing fixtures.

[0049] As a further improvement of this utility model, the width adjustment component 2 includes two connecting guide rails, which are arranged in parallel and spaced apart, and both ends of all the connecting guide rails are connected to two movable plates 1 respectively.

[0050] As a further improvement of this utility model, the connecting guide rail includes a first connecting block 21, a second connecting block 22, and a sliding guide rail 23; wherein:

[0051] The first connecting block 21 and the second connecting block 22 are respectively fixed on the two movable plates 1;

[0052] The two ends of the sliding guide rail 23 are respectively slidably set in the first connecting block 21 and the second connecting block 22.

[0053] As a further improvement of this utility model, the measuring module 4 includes a solder immersion time measuring module 42 and a solder melt temperature measuring module 41. The measuring holes 3 include a first measuring hole 3 and a second measuring hole 3 with different specifications. The first measuring hole 3 is used to fix the solder immersion time measuring module 42, and the second measuring hole 3 is used to fix the solder melt temperature measuring module 41. The two measuring holes 3 have different specifications and can be distinguished visually, which facilitates the quick and convenient installation of different measuring modules.

[0054] This utility model allows for the adjustment of the width of the movable plate, and is equipped with a solder immersion time measurement module 42 and a solder bath temperature measurement module 41 to test the solder immersion time and solder bath temperature of wave soldering equipment for producing different products. Firstly, it solves the problem that there is currently no universal test fixture for wave soldering equipment for producing different products in the industry. The width of this test fixture is adjustable to meet the needs of rapid switching tests. Secondly, it solves the problem of low efficiency caused by the need to repeatedly manufacture test boards for solder immersion time and solder bath temperature in the current industry.

[0055] As a further improvement of this utility model, the height of the measuring module 4 is the same as the height of the movable plate 1. When the measuring module 4 is installed in the measuring hole 3, the bottom of the measuring module 4 is flush with the bottom surface of the movable plate 1.

[0056] As a further improvement of this utility model, the movable plate 1 is made of high temperature resistant material.

[0057] As a further improvement of this utility model, the sliding guide rail 23 has a square cross-section.

[0058] This utility model discloses a width-adjustable wave soldering equipment immersion time and solder bath temperature measuring device, which consists of two movable plates connected by a movable sliding guide rail. The adjustable width meets the requirement of strong applicability, allowing for adjustment of the required width for different motherboards. Furthermore, the plates are equipped with multiple different types of openings, enabling simultaneous testing of immersion time and solder bath temperature. This increases the ability to test the solder bath temperature and also prevents motherboard damage and scrapping due to testing, improving testing efficiency and reducing potential quality risks. The specific operating procedure is as follows:

[0059] 1. Employees adjust the width of the design device for the motherboard to be tested online as needed;

[0060] 2. Employees use wave soldering immersion time and solder temperature measuring devices to test immersion time and solder temperature;

[0061] 3. The immersion time and molten tin temperature test results meet the equipment process parameter requirements, and normal production resumed after the test was completed;

[0062] 4. If the immersion time and molten solder temperature test results do not meet the process parameter requirements, the wave soldering equipment operator needs to adjust the equipment parameters and retest according to step 2 until the requirements are met before normal production can resume.

[0063] This utility model provides a wave soldering equipment, including a tin immersion parameter measuring device.

[0064] Specifically, during assembly, after connecting the first connecting block 21 and the second connecting block 22 to the two movable plates 1 respectively, the sliding guide rail 23 is inserted into the first connecting block 21 and the second connecting block 22, thus assembling a part of the wave soldering equipment measuring device with adjustable width. Then, the measuring module 4 is installed into the pre-reserved measuring hole 3 in the movable plate 1 to form a complete measuring device. The measuring module 4 is at the same height as the measuring hole 3, and after assembly, the bottom of the measuring module 4 is flush with the liquid surface. During production, this device is adjusted to be the same width as the board to be produced. At this time, the measuring device can flow into the wave soldering equipment for production in the normal test board production method. Specifically, before measuring the immersion time and molten solder temperature of the wave soldering equipment, the sliding guide rail of the device is adjusted according to the size of the product to be produced. When the total width of the edges of the two movable plates of this device is adjusted to be consistent with the width of the product to be produced, the device is used to measure the data of the wave soldering equipment. When passing through the molten solder, the immersion time and molten solder temperature can be measured.

[0065] After the employee places the wave soldering equipment on the track, before it reaches the contact point with the molten solder, the immersion time tester and thermocouple can be used to measure the immersion time and the temperature of the molten solder. The immersion time and the temperature of the molten solder are measured at the measurement module 4 installed at the measurement hole 3. The wave soldering is judged to meet the production requirements based on the instrument readings.

[0066] When replacing different motherboards or production lines, the previous steps can be repeated to test different wave soldering equipment data, thereby enabling the measurement of immersion time and solder temperature for motherboards of different widths.

[0067] By adjusting and testing the above devices, and inspecting the wave soldering equipment after line change and line opening, it is possible to effectively determine whether the parameters of the wave soldering equipment meet the production requirements.

[0068] This invention relates to a wave soldering equipment that integrates immersion time and solder temperature testing by setting up an adjustable-width wave soldering immersion parameter measuring device. The width of the measuring fixture is adjustable, making it suitable for different types of products. This improves the stability of test results, reduces product quality anomalies, increases testing efficiency, reduces labor costs, improves the consistency of test results, and avoids differences in the selection of different test products.

[0069] First, it should be noted that "inward" refers to the direction towards the center of the storage space, while "outward" refers to the direction away from the center of the storage space.

[0070] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the appendix. Figure 1 The orientations or positional relationships shown are for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0071] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0072] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0073] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0074] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0075] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the protection scope of the claims.

Claims

1. A device for measuring tin immersion parameters in wave soldering equipment, characterized in that, Includes a movable plate, width adjustment assembly, measurement module, and measurement holes; among which: The number of movable plates is two, arranged in parallel and spaced apart; The width adjustment component is connected to the two movable plates at both ends to adjust the distance between the two movable plates; The measuring hole is disposed on the movable plate; The measurement module is installed inside the measurement hole.

2. The wave soldering equipment immersion tin parameter measuring device according to claim 1, characterized in that, The number of measuring holes is several, and they are respectively set on the two movable plates.

3. The wave soldering equipment tin dipping parameter measuring device according to claim 2, characterized in that, All the measuring holes located on the same movable plate are in different positions, located at the first end, middle and / or second end of the movable plate.

4. The wave soldering equipment immersion tin parameter measuring device according to claim 1, characterized in that, The width adjustment component includes two connecting rails, which are arranged in parallel and spaced apart, and both ends of all the connecting rails are connected to the two movable plates respectively.

5. The wave soldering equipment immersion tin parameter measuring device according to claim 4, characterized in that, The connecting guide rail includes a first connecting block, a second connecting block, and a sliding guide rail; wherein: The first connecting block and the second connecting block are respectively fixed on the two movable plates; The two ends of the sliding guide rail are respectively slidably disposed within the first connecting block and the second connecting block.

6. The wave soldering equipment immersion tin parameter measuring device according to claim 1, characterized in that, The measurement module includes a solder immersion time measurement module and a solder melt temperature measurement module. The measurement holes include a first measurement hole and a second measurement hole with different specifications. The first measurement hole is used to fix the solder immersion time measurement module, and the second measurement hole is used to fix the solder melt temperature measurement module.

7. The wave soldering equipment immersion tin parameter measuring device according to claim 1, characterized in that, The height of the measuring module is the same as the height of the movable plate. When the measuring module is installed in the measuring hole, the bottom of the measuring module is flush with the bottom surface of the movable plate.

8. The wave soldering equipment immersion tin parameter measuring device according to claim 1, characterized in that, The movable plate is made of high-temperature resistant material.

9. The wave soldering equipment immersion tin parameter measuring device according to claim 5, characterized in that, The sliding guide rail has a square cross-section.

10. A wave soldering device, characterized in that, Includes the tin-immersion parameter measuring device as described in any one of claims 1-9.

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