Liquid cooling equipment testing device and system

Abstract

The embodiment of the utility model relates to the technical field of equipment testing, and discloses a liquid cooling equipment testing device and system.The liquid cooling equipment testing device comprises a machine box and a circuit board, a containing cavity is formed in the machine box and used for containing cooling liquid and liquid cooling equipment, and an opening is formed in the bottom wall of the machine box; the circuit board is fixedly arranged on the outer side of the bottom wall of the case and seals the opening, one side, facing the accommodating cavity, of the circuit board is provided with an equipment interface, the equipment interface is immersed in the cooling liquid in the accommodating cavity and is electrically connected with liquid cooling equipment which is arranged in the accommodating cavity and is immersed in the cooling liquid, one side, deviating from the case, of the circuit board is provided with a server interface, and the server interface is electrically connected with the liquid cooling equipment. And the server interface is located outside the accommodating cavity and is used for being connected with an external server so as to test the liquid cooling equipment through the external server. Through the mode, the test cost of the liquid cooling equipment is reduced, and the accuracy of the test result is improved.

Description

Technical Field

[0001] This application relates to the field of equipment testing technology, specifically to a liquid cooling equipment testing device and system. Background Technology

[0002] Immersion liquid cooling technology, with its high-efficiency cooling and low PUE (Power Usage Effectiveness), has become one of the main technologies for building data centers. However, in data centers using immersion liquid cooling technology, in addition to liquid-cooled cabinets and servers affecting their operation, liquid-cooled hard drives, liquid-cooled network cards, and other liquid-cooled equipment are also important factors in ensuring the stable and reliable operation of the data center.

[0003] To ensure the normal operation of data centers within liquid cooling systems, liquid-cooled devices such as liquid-cooled hard drives and liquid-cooled network cards require testing in a liquid-cooled environment during manufacturing and system integration. However, existing testing methods require installing the liquid-cooled devices on servers, immersing the servers in the coolant within the liquid-cooled cabinet, and finally testing the devices by running the servers within the cabinet. This results in high testing costs and poor accuracy of test results. Utility Model Content

[0004] In view of the above problems, this application provides a liquid cooling equipment testing device and a liquid cooling equipment testing system to solve the problems of high testing cost and poor accuracy of test results in the prior art for liquid cooling equipment.

[0005] According to one aspect of the embodiments of this application, a liquid cooling equipment testing device is provided. The device includes a chassis and a circuit board. A receiving cavity is formed inside the chassis for containing coolant and liquid cooling equipment. An opening is provided on the bottom wall of the chassis. The circuit board is fixedly disposed on the outside of the bottom wall of the chassis and closes the opening. A device interface is provided on the side of the circuit board facing the receiving cavity. The device interface is immersed in the coolant in the receiving cavity and is electrically connected to the liquid cooling equipment disposed in the receiving cavity and immersed in the coolant. A server interface is provided on the side of the circuit board away from the chassis. The server interface is located outside the receiving cavity and is used to connect to an external server to test the liquid cooling equipment through the external server.

[0006] In one alternative configuration, the top of the chassis has a mounting port for allowing coolant and liquid cooling equipment to enter the accommodating cavity. The circuit board is located at the bottom of the chassis and is sealed to the bottom wall. The chassis also has a support structure for fixing the chassis and suspending the bottom wall from the ground.

[0007] In one alternative approach, the area of ​​the opening is smaller than the area of ​​the circuit board, and the circuit board is sealed to the wall of the chassis located at the edge of the opening.

[0008] In one alternative embodiment, a heating device is attached to the bottom wall of the chassis on the side opposite to the accommodating cavity. The heating device is used to heat the coolant through the chassis when the accommodating cavity contains coolant. A heat dissipation device is provided on the outer surface of the chassis side wall. The heat dissipation device is used to drive gas through the outer surface of the chassis to dissipate heat from the coolant through the chassis.

[0009] In one alternative embodiment, a temperature sensing device is installed inside the accommodating cavity, and a controller is also installed on the side of the circuit board away from the chassis. The controller is located outside the accommodating cavity and is electrically connected to the temperature sensing device via a cable to obtain the temperature of the coolant. The controller is electrically connected to the heating device and the heat dissipation device via cables, and is also used to control the heating device and the heat dissipation device to turn on or off according to the temperature of the coolant.

[0010] In one alternative approach, a thermally insulating seal is sandwiched between the chassis and the circuit board.

[0011] In one alternative approach, the outer surface of the chassis sidewall is provided with multiple heat sinks, and heat dissipation channels are formed between the heat sinks. A heat dissipation device is installed on the heat sinks and is used to drive gas to flow along the extension direction of the heat dissipation channels so that the gas carries away the heat on the heat sinks.

[0012] In one alternative approach, the temperature sensing device is positioned on the wall where the opening in the chassis is located, and is spaced apart from the opening.

[0013] In one alternative embodiment, the top of the chassis is detachably connected to a top cover, the edge of which is provided with snap fasteners for engaging with the side wall of the chassis when the top cover covers the mounting opening on the top of the chassis, and a seal is sandwiched between the top cover and the chassis.

[0014] According to another aspect of the embodiments of this application, a liquid cooling equipment testing system is provided. The liquid cooling equipment testing system includes an external server and the liquid cooling equipment testing device described in any of the above claims. The external server is electrically connected to the server interface via a cable.

[0015] This embodiment of the application creates an opening in the chassis and places the circuit board on the wall where the opening is located. This allows the device interface electrically connected to the liquid cooling equipment to be immersed in the coolant within the containment cavity, while the server interface electrically connected to the external server is located outside the chassis. Therefore, when testing the liquid cooling equipment, it is not necessary to immerse the external server in the coolant. On the one hand, this eliminates the influence of the coolant on components such as the server and cables, maximizing the restoration of the liquid cooling equipment's functionality and performance under coolant conditions and effectively improving the accuracy of test results. On the other hand, the coolant in the containment cavity only needs to immerse the liquid cooling equipment, and since the volume of the liquid cooling equipment is much smaller than that of the external server, the amount of coolant used during testing can be effectively reduced, lowering the testing cost. Furthermore, during the testing process, a liquid cooling device with known functionality and performance can be used as a test component, and different coolants can be selected to test the impact of different coolant conditions on the functionality and performance of the liquid cooling equipment.

[0016] The above description is only an overview of the technical solution of this application. In order to better understand the technical means of this application and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of this application more obvious and understandable, specific embodiments of this application are given below. Attached Figure Description

[0017] Various other advantages and benefits will become apparent to those skilled in the art upon reading the following detailed description of preferred embodiments. The accompanying drawings are for illustrative purposes only and are not intended to limit the scope of this application. Furthermore, the same reference numerals denote the same parts throughout the drawings. In the drawings:

[0018] Figure 1 A perspective view of the liquid cooling equipment testing device provided in an embodiment of the present invention is shown;

[0019] Figure 2 Another perspective view of the liquid cooling equipment testing device provided in this embodiment of the present invention is shown;

[0020] Figure 3 A partial cross-sectional view of the liquid cooling equipment testing device provided in an embodiment of the present invention is shown;

[0021] Figure 4 This is a perspective view of the liquid cooling equipment testing device provided in an embodiment of the present invention from another angle;

[0022] Figure 5 A perspective view of another liquid cooling equipment testing device provided in an embodiment of the present invention is shown.

[0023] The reference numerals in the detailed embodiments are as follows:

[0024] 100. Liquid cooling equipment testing device; 200. Liquid cooling equipment;

[0025] 110. Chassis; 120. Circuit board; 130. Heating equipment; 140. Heat dissipation equipment; 150. Temperature sensing equipment; 160. Thermal insulation seals; 170. Top cover; 180. Display device; 190. Indicator light;

[0026] 111. Receiving cavity; 112. Opening; 113. Bottom wall; 114. Mounting port; 115. Support component; 116. Heat sink; 117. Heat dissipation channel;

[0027] 121. Device interface; 122. Server interface; 123. Through hole; 124. Fixture; 125. Controller; 126. Power interface; 127. Display interface; 128. Communication interface;

[0028] 171. Buckle;

[0029] 210. Connector. Detailed Implementation

[0030] The embodiments of the technical solution of this application will now be described in detail with reference to the accompanying drawings. These embodiments are only used to more clearly illustrate the technical solution of this application and are therefore merely examples, and should not be used to limit the scope of protection of this application.

[0031] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the application; the terms “comprising” and “having”, and any variations thereof, in the specification, claims, and foregoing description of the drawings are intended to cover non-exclusive inclusion.

[0032] In the description of the embodiments of this application, technical terms such as "first" and "second" are used only to distinguish different objects and should not be construed as indicating or implying relative importance or implicitly specifying the number, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this application, "multiple" means two or more, unless otherwise explicitly defined.

[0033] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0034] In the description of the embodiments in this application, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent three cases: A exists, A and B exist simultaneously, and B exists. In addition, the character " / " in this document generally indicates that the related objects before and after it have an "or" relationship.

[0035] In the description of the embodiments of this application, the term "multiple" refers to two or more (including two), similarly, "multiple sets" refers to two or more (including two sets), and "multiple pieces" refers to two or more (including two pieces).

[0036] In the description of the embodiments of this application, the technical terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0037] In the description of the embodiments of this application, unless otherwise expressly specified and limited, technical terms such as "installation," "connection," "joining," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in the embodiments of this application can be understood according to the specific circumstances.

[0038] Immersion liquid cooling technology features high-efficiency cooling and low PUE, meeting the high power density and low PUE requirements of data centers. Therefore, it has become a primary heat dissipation method for data centers. When using immersion liquid cooling to cool a data center, the servers are completely submerged in the coolant within the liquid-cooled cabinet, maximizing the contact between the coolant and the servers to better remove the heat generated.

[0039] The inventors of this application have noted that while completely immersing the server in coolant provides better cooling, components such as hard drives and network cards also need to be submerged in coolant. Therefore, to ensure stable and reliable operation of the data center in a liquid-cooled environment, in addition to testing the server's performance in coolant, it is also necessary to test components such as hard drives and network cards to ensure their stable and reliable operation. However, currently, there is a lack of dedicated immersion liquid-cooled testing environments for components such as hard drives and network cards. Testing these components requires connecting them to the server first, then immersing the entire server in coolant, and testing the components by running the entire liquid-cooling system and server. Since servers are relatively large, a significant amount of coolant is needed to fully submerge them, leading to high testing costs. Furthermore, the coolant can affect other components within the server, potentially impacting the testing process for hard drives and network cards, resulting in inaccurate test results.

[0040] Therefore, to address the issues of high testing costs and poor accuracy for components such as hard drives and network cards, the inventors of this application, after in-depth research, designed a liquid-cooled equipment testing device. This device includes a chassis, with an internal cavity for accommodating coolant and liquid-cooled equipment (e.g., hard drives, network cards, etc.). Furthermore, an opening is formed in the chassis wall, and a circuit board is mounted on the wall containing the opening, sealing the opening to prevent coolant leakage from the cavity. Additionally, a device interface is provided on the side of the circuit board facing the cavity to connect to the liquid-cooled equipment, and this interface is immersed in the coolant within the cavity. A server interface is provided on the other side to connect to an external server, and this server interface is located outside the cavity.

[0041] When testing liquid-cooled equipment, coolant is poured into the enclosure of the chassis, immersing both the equipment interfaces and the liquid-cooled equipment itself. The liquid-cooled equipment is electrically connected to an external server via server interfaces and cables located outside the enclosure. Neither the server interfaces nor the server itself need to come into contact with the coolant, thus avoiding any impact from the coolant on the server, cables, or other components. This maximizes the restoration of the liquid-cooled equipment's functionality and performance within the coolant, resulting in more accurate test results. Furthermore, liquid-cooled equipment is significantly smaller than a server, and testing only requires immersion in coolant, effectively reducing coolant consumption and lowering testing costs.

[0042] The liquid cooling device testing apparatus in this application embodiment can be applied not only to the testing of devices such as hard drives and network cards, but also to other independent devices in a server. It is only necessary to set the corresponding device interface on the circuit board according to the connector of different devices. This application embodiment only uses hard drives as an example for explanation.

[0043] Based on the first aspect of this application example, please refer to Figure 1 and Figure 2 , Figure 1 A perspective view of the liquid cooling equipment testing device provided in an embodiment of the present invention is shown. Figure 2 This illustration shows another perspective view of the liquid cooling equipment testing device provided in an embodiment of the present invention. The device 100 includes a chassis 110 and a circuit board 120. The chassis 110 has an internal cavity 111 for containing coolant and liquid cooling equipment 200. An opening 112 is provided on the bottom wall of the chassis 110. The circuit board 120 is fixedly disposed on the outside of the bottom wall of the chassis 110, closing the opening 112. A device interface 121 is provided on the side of the circuit board 120 facing the cavity 111. The device interface 121 is immersed in the coolant within the cavity 111 and is electrically connected to the liquid cooling equipment 200 disposed in the cavity 111 and immersed in the coolant. A server interface 122 is provided on the side of the circuit board 120 away from the chassis 110. The server interface 122 is located outside the cavity 111 and is used to connect to an external server for testing the liquid cooling equipment 200 via the external server.

[0044] like Figure 1 As shown, the chassis 110 is the main component of the liquid-cooled equipment testing device 100. It contains a accommodating cavity 111 to hold the coolant, creating an immersion liquid-cooled environment for testing the liquid-cooled equipment 200. The accommodating cavity 111 is the space inside the chassis 110 used to hold the coolant and the liquid-cooled equipment 200. Its size can be set according to the specific size of the liquid-cooled equipment 200. Specifically, when the liquid-cooled equipment 200 is large, the accommodating cavity 111 can be larger; when the liquid-cooled equipment 200 is small, the accommodating cavity 111 can be smaller, maximizing the utilization rate of the coolant within the accommodating cavity 111, reducing coolant waste, and lowering testing costs. The coolant can be a liquid with good thermal stability and electrical insulation properties, such as mineral oil, synthetic oil, or fluorinated liquid.

[0045] like Figure 2As shown, an opening 112 is provided on the bottom wall 113 of the chassis 110, allowing the accommodating cavity 111 to communicate with the external environment. When the circuit board 120 is mounted on the bottom wall 113, the two sides of the circuit board 120 opposite to the opening 112 will face the accommodating cavity 111 and the external environment, respectively. Specifically, if interfaces are provided on the two sides of the circuit board 120 opposite to the opening 112, the interface on one side of the circuit board 120 will be located inside the accommodating cavity 111, and the interface on the other side will be located outside the accommodating cavity 111. Therefore, the device interface 121 on the circuit board 120 can be located inside the accommodating cavity 111 through the opening 112, thereby enabling the liquid cooling device 200 and the device interface 121 to be electrically connected in the coolant environment. Meanwhile, the server interface 122 on the other side of the circuit board 120 can be located outside the accommodating cavity 111, preventing the server interface 122 from directly contacting the coolant, reducing the impact of the coolant on the server interface 122, and improving the accuracy of the test results. The specific arrangement between circuit board 120 and chassis 110 is as follows: Figure 2 As shown, a small opening 112 is made on the chassis 110, and the circuit board 120 is placed on the outside of the chassis 110. Only the device interface 121 is inserted through the opening 112 into the receiving cavity 111 so that the device interface 121 can be immersed in the coolant.

[0046] To prevent coolant in the accommodating cavity 111 from leaking from the opening 112 to the outside of the chassis 110, the opening 112 needs to be sealed after the circuit board 120 is connected to the chassis 110. Specifically, structural adhesives, sealants, or other sealing materials can be filled between the circuit board 120 and the chassis 110. Alternatively, sealing gaskets (e.g., rubber gaskets, polytetrafluoroethylene gaskets, etc.), sealing rings, sealing lips, or other sealing components can be sandwiched between the circuit board 120 and the chassis 110 to ensure a sealed connection between the circuit board 120 and the chassis 110.

[0047] Device interface 121 is electrically connected to connector 210 on liquid cooling device 200, specifically, as shown in the example. Figure 2 As shown, the connector 210 at the bottom of the liquid cooling device 200 can be plugged into the device interface 121. Therefore, the device interface 121 needs to be configured according to the type of liquid cooling device 200 and the type of connector 210. For example, when the liquid cooling device 200 is a hard drive (which can be a SAS hard drive, SATA hard drive, or NVMe hard drive, specifically including 2.5-inch and 3.5-inch packaged mechanical hard drives or solid-state drives), the device interface 121 can be an M.2 interface, a U.2 interface (e.g., an SFF-8639 interface), or other hard drive interfaces. When the liquid cooling device 200 is a network card, the device interface 121 can also be a PCIe interface.

[0048] Once the liquid cooling device 200 is successfully connected to the device interface 121, the external server can then test the functionality and performance of the liquid cooling device 200 by electrically connecting it to the server interface 122 and the device interface 121. Of course, the server interface 122 also needs to be configured according to the type of the liquid cooling device 200. For example, if the liquid cooling device 200 is a hard drive, then when it is a SAS or SATA hard drive, the server interface 122 must be a SAS / SATA interface (e.g., a MiniSAS HD interface). When it is an NVMe hard drive, the server interface 122 must be a PCIe interface (e.g., a SlimSAS interface).

[0049] Furthermore, when the same device interface 121 can connect to different types of liquid cooling devices 200, different server interfaces 122 can also be set on the circuit board 120 simultaneously, enabling the liquid cooling device testing device 100 to test different types of liquid cooling devices 200. In this embodiment, as an example, when the device interface 121 is an SFF-8639 interface, the device interface 121 can connect to SAS hard drives, SATA hard drives, and NVMe hard drives. Since the server interface 122 used for testing NVMe hard drives is different from the server interface 122 used for testing SAS hard drives and SATA hard drives, a MiniSAS HD interface and a SlimSAS interface can be set on the side of the circuit board 120 away from the chassis 110. When testing an NVMe hard drive, the SlimSAS interface can be electrically connected to an external server; when testing a SAS hard drive or a SATA hard drive, the MiniSAS HD interface can be electrically connected to an external server.

[0050] When testing the liquid cooling device 200, first connect the connector 210 on the liquid cooling device 200 to the device interface 121 (if there is no coolant in the accommodating cavity 111, you can first put enough coolant into the chassis 110 and then connect the liquid cooling device 200 to the device interface 121, or you can first connect the liquid cooling device 200 to the device interface 121 and then put enough coolant into the chassis 110), then connect the server interface 122 to the external server, and finally test the liquid cooling device 200 through the external server.

[0051] In the above embodiment, by opening 112 in the chassis 110 and placing the circuit board 120 on the wall where the opening 112 is located in the chassis 110, the device interface 121 electrically connected to the liquid cooling device 200 is immersed in the coolant in the accommodating cavity 111, while the server interface 122 electrically connected to the external server is located outside the chassis 110. Therefore, when testing the liquid cooling device 200, it is not necessary to immerse the external server in the coolant. On the one hand, the influence of the coolant on the server, cables, and other components can be eliminated, maximizing the restoration of the function and performance of the liquid cooling device 200 under coolant conditions and effectively improving the accuracy of the test results. On the other hand, the coolant in the accommodating cavity 111 only needs to immerse the liquid cooling device 200, and the volume of the liquid cooling device 200 is much smaller than that of the external server. This effectively reduces the amount of coolant used when testing the liquid cooling device 200, thus lowering the testing cost. In addition, during the testing process, a liquid cooling device 200 with known functions and performance can be used as a test component, and different coolants can be selected to test the impact of different coolant conditions on the functions and performance of the liquid cooling device 200.

[0052] To facilitate the use of liquid cooling equipment testing devices, when the same coolant is used for testing the same liquid cooling equipment, the liquid cooling equipment is typically removed from the housing only after disconnecting it from the equipment interface, rather than draining the coolant from the housing before removing the equipment. Therefore, to prevent coolant leakage, an installation port is usually provided on the top of the chassis for the coolant and liquid cooling equipment to enter the housing, rather than on the side wall of the chassis.

[0053] Therefore, to facilitate the connection between the liquid cooling equipment and its interface, some embodiments of this application, such as... Figure 2 and Figure 3 As shown, Figure 3 A partial cross-sectional view of the liquid cooling equipment testing device provided in this embodiment of the present invention is shown. The top of the chassis 110 is provided with a mounting port 114 for the coolant and liquid cooling equipment 200 to enter the accommodating cavity 111. The circuit board 120 is disposed at the bottom of the chassis 110 and is sealed to the bottom wall 113. A support member 115 is also provided on the chassis 110 for fixing the chassis 110 and suspending the bottom wall 113 below.

[0054] Mounting port 114 is the inlet on the chassis 110 for the coolant and liquid cooling device 200 to enter the receiving cavity 111. If mounting port 114 is located on the side wall of the chassis 110, when the liquid cooling device 200 is electrically connected to the device interface 121 through mounting port 114, the coolant level in the receiving cavity 111 must be lower than mounting port 114; otherwise, coolant will flow out from mounting port 114. Therefore, to prevent coolant leakage when mounting port 114 is not sealed, such as... Figure 2 As shown, the mounting port 114 can be set at the top of the chassis 110, so that no matter what the coolant level is inside the chassis 110, the coolant will not leak from the mounting port 114.

[0055] The top of the chassis 110 may not have a top wall to form the mounting opening 114, such as Figure 1 As shown, the chassis 110 includes a bottom wall 113 located at the bottom and side walls formed by surrounding the bottom wall 113. A mounting opening 114 is formed on the surface of the chassis 110 opposite to the bottom wall 113. Alternatively, a through hole can be made on the top wall of the chassis 110 as the mounting opening 114. Of course, to prevent dust, water vapor, and other substances in the air from entering the receiving cavity 111 through the mounting opening 114 and contaminating the coolant in the receiving cavity 111, the chassis 110 may also include a top cover for covering the mounting opening 114.

[0056] Then, the opening 112 is set on the bottom wall 113 of the chassis 110, and the circuit board 120 is set on the bottom of the chassis 110, so that the device interface 121 is also located on the bottom of the chassis 110. At this time, when disassembling the liquid cooling device 200, it is only necessary to pull the liquid cooling device 200 upward, and due to the existence of the mounting port 114, the upward movement distance of the liquid cooling device 200 is not restricted. When installing the liquid cooling device 200, it is only necessary to insert the liquid cooling device 200 directly into the coolant through the mounting port 114 and electrically connect it to the device interface 121. There is no need to treat the coolant in the accommodating cavity 111, making the disassembly and installation of the liquid cooling device 200 more convenient.

[0057] After the circuit board 120 is installed at the bottom of the chassis 110, the server interface 122 will also be located at the bottom of the chassis 110. If the bottom wall of the chassis 110 is placed directly against a mounting surface (such as the ground or desktop) when fixing the chassis 110, the mounting surface will block the server interface 122, causing the server interface 122 to malfunction. Therefore, to ensure that the server interface 122 can be used normally, such as... Figure 3As shown, a support member 115 can be installed on the chassis 110. In this embodiment, as an example, the support member 115 can be a support rod installed on the bottom wall 113. When the chassis 110 is placed on the mounting surface, the end of the support rod away from the chassis 110 will contact the mounting surface, creating a distance between the bottom wall 113 and the mounting surface equal to the length of the support rod. Alternatively, the support member 115 can be a suspension structure installed on the side wall of the chassis 110. The chassis 110 can be suspended and fixed to a wall at a certain height through this structure, creating a certain distance between the bottom wall 113 and the surface below it (e.g., the ground, a desktop, etc.). This allows cables and the server interface 122 to be electrically connected from the bottom of the chassis 110, thereby enabling the server interface 122 to be electrically connected to an external server via cables.

[0058] The above embodiment provides an installation port 114 at the top of the chassis 110, allowing coolant and liquid cooling equipment 200 to enter the receiving cavity 111. This ensures that regardless of the coolant level in the receiving cavity 111, it can be directly connected to the external environment through the installation port 114 without leakage. Furthermore, placing the circuit board 120 at the bottom of the chassis 110 allows the liquid cooling equipment 200 to move upwards without restriction during disassembly. Installation of the liquid cooling equipment 200 simply requires inserting it downwards into the receiving cavity 111 to electrically connect it to the device interface 121, making disassembly and installation more convenient. Finally, a support member 115 on the chassis 110 allows the bottom wall 113 to be suspended when the chassis 110 is fixed, ensuring the server interface 122 can function normally.

[0059] To further improve the accuracy of the liquid cooling equipment testing device, some embodiments of this application, such as Figure 3 and Figure 4 As shown, Figure 4 This is a perspective view of the liquid cooling equipment testing device provided in an embodiment of the present invention. The area of ​​the opening 112 is smaller than the area of ​​the circuit board 120. The circuit board 120 is sealed to the wall of the chassis 110 located at the edge of the opening 112.

[0060] like Figure 3As shown, the circuit board 120 is located outside the chassis, while the device interface 121 extends through the opening 112 into the receiving cavity 111. The circuit board 120 is sealed to the wall of the opening 112, ensuring that only the portion of the circuit board 120 opposite to the opening 112 comes into contact with the coolant in the receiving cavity 111. Since the opening 112 has a relatively small area, only a small portion of one side of the circuit board 120 will contact the coolant. This structure effectively reduces the contact area between the circuit board 120 and the coolant, thus reducing the impact factors on the testing of the liquid cooling equipment 200.

[0061] Furthermore, since the coolant only comes into contact with the circuit board 120 at the location opposite the opening 112, and the circuit board 120 is located outside the chassis 110, providing through holes 123 at other locations on the circuit board 120 will not cause coolant leakage. Therefore, to facilitate the installation and fixation of the circuit board 120, such as... Figure 4 As shown, through holes 123 can be made on the edge of the circuit board 120, and mounting grooves can be provided at corresponding positions on the bottom wall 113. After the fastener 124 passes through the through hole 123, it is fixedly connected to the mounting groove, thus fixing the circuit board 120 to the chassis 110. The fastener 124 can be a screw, threaded rod, nail, or other components.

[0062] The above embodiment effectively reduces the contact area between the circuit board 120 and the coolant by providing a small opening 112 on the chassis 110, placing the circuit board 120 outside the chassis 110, and sealing the circuit board 120 to the wall surrounding the opening 112. This reduces the impact of the coolant on the circuit board 120 and improves the accuracy of the test results. Furthermore, since only the portion of the circuit board 120 opposite the opening 112 comes into contact with the coolant, through holes 123 can be directly opened at other locations on the circuit board 120, and the circuit board 120 can be fixed using fasteners 124, making the fixing of the circuit board 120 more convenient.

[0063] In some embodiments of this application, such as Figure 3 and Figure 5 As shown, Figure 5 This diagram shows a perspective view of another liquid cooling equipment testing device provided in an embodiment of the present invention. A heating device 130 is attached to the bottom wall 113 of the chassis 110 on the side opposite to the accommodating cavity 111. The heating device 130 is used to heat the coolant through the chassis 110 when the accommodating cavity 111 contains coolant. A heat dissipation device 140 is provided on the outer surface of the side wall of the chassis 110. The heat dissipation device 140 is used to drive gas through the outer surface of the chassis 110 to dissipate heat from the coolant through the chassis 110.

[0064] like Figure 2As shown, the heating device 130 is arranged around the edge of the bottom wall 113, enabling it to provide heat to all side walls of the chassis 110, thus ensuring a relatively uniform temperature of the coolant. The heating device 130 can be a heating element such as a heating rod, heating tube, or heating wire. The heating device 130 is mounted close to the chassis 110. When activated, the heat from the heating device 130 is rapidly conducted to the walls of the chassis 110, and then transferred to the coolant through the walls, raising its temperature. When testing the liquid cooling system 200, the heating device 130 can be turned on to raise the coolant temperature, allowing for testing of the liquid cooling system 200's functionality and performance in high-temperature coolant conditions.

[0065] like Figure 5 As shown, the heat dissipation device 140 is mounted on the side wall of the chassis 110. The heat dissipation device 140 can be a fan, such as an axial fan, mixed-flow fan, or turbo fan, which drives air to blow across the outer surface of the chassis 110 to remove heat from the chassis 110, thereby dissipating heat from the coolant. After being mounted on the side wall of the chassis 110, the heat dissipation device 140 can drive air to flow along a direction parallel to the side wall of the chassis 110 on the outer surface to remove heat from the outer surface of the chassis 110. Alternatively, the heat dissipation device 140 can be positioned facing the side wall of the chassis 110, driving air to flow perpendicular to the side wall of the chassis 110 to the outer surface of the chassis 110.

[0066] The above embodiment, by setting up heating device 130 and heat dissipation device 140, allows the temperature of the coolant to be controlled by controlling the heating rate of heating device 130 and the heat dissipation rate of heat dissipation device 140 when testing liquid cooling device 200, thereby providing different testing environments for liquid cooling device 200 and conducting more comprehensive testing of the functions and performance of liquid cooling device 200.

[0067] To better control the temperature of the coolant, in some embodiments of this application, such as Figure 2 and Figure 3 As shown, a temperature sensing device 150 is installed inside the accommodating cavity 111. A controller 125 is also installed on the side of the circuit board 120 away from the chassis 110. The controller 125 is located outside the accommodating cavity 111 and is electrically connected to the temperature sensing device 150 through a cable to obtain the temperature of the coolant through the temperature sensing device 150. The controller 125 is electrically connected to the heating device 130 and the heat dissipation device 140 through cables respectively. The controller 125 is also used to control the opening or closing of the heating device 130 and the heat dissipation device 140 according to the temperature of the coolant.

[0068] The temperature sensing device 150 can be an immersion temperature sensor, specifically a thermistor sensor, a thermocouple sensor, etc. The temperature of the coolant can be easily obtained through the temperature sensing device 150, enabling real-time monitoring of the testing environment of the liquid cooling equipment 200, thus increasing the controllability of the testing process.

[0069] The controller 125 can be an MCU (Microcontroller Unit), a PLC (Programmable Logic Controller), a CPLD (Complex Programmable Logic Device), etc., and is not limited to any particular type in this embodiment. The controller 125 is electrically connected to the heating device 130, the heat dissipation device 140, and the temperature sensing device 150 via cables, and controls the heating device 130 and the heat dissipation device 140 according to the temperature of the coolant obtained by the temperature sensing device 150.

[0070] In this embodiment, as an example, the controller 125 can fix the coolant in the accommodating cavity 111 at a certain temperature to test the performance of the liquid cooling device 200 after long-term immersion in the coolant at that temperature. Specifically, the user can provide a preset temperature to the controller 125 (for example, by setting an interface on the circuit board 120 to electrically connect the controller 125 to a terminal device such as a mobile phone or tablet, and then providing a preset temperature to the controller 125 through the terminal device). The controller 125 obtains the temperature of the coolant through the temperature sensing device 150 and compares the temperature with the preset temperature. If the temperature of the coolant is lower than the preset temperature, the heating device 130 is turned on and the heat dissipation device 140 is turned off to heat the coolant. If the temperature of the coolant is higher than the preset temperature, the heating device 130 is turned off and the heat dissipation device 140 is turned on to cool the coolant, thereby achieving temperature control of the coolant.

[0071] Of course, the controller 125 can also control the heating device 130 and the heat dissipation device 140 to be turned on simultaneously, and control the temperature of the coolant by controlling the heating efficiency of the heating device 130 and the heat dissipation efficiency of the heat dissipation device 140. Specifically, when the temperature of the coolant is lower than the preset temperature, the heating efficiency of the heating device 130 is increased and the heat dissipation efficiency of the heat dissipation device 140 is decreased, so that the heating efficiency of the heating device 130 is greater than the heat dissipation power of the heat dissipation device 140; when the temperature of the coolant is higher than the preset temperature, the heating efficiency of the heating device 130 is decreased and the heat dissipation efficiency of the heat dissipation device 140 is increased, so that the heating efficiency of the heating device 130 is lower than the heat dissipation efficiency of the heat dissipation device 140.

[0072] In the above embodiments, by setting a temperature sensing device 150 and a controller 125, the controller 125 can obtain the temperature of the coolant through the temperature sensing device 150, and thus monitor the temperature of the coolant in real time, making the testing process of the liquid cooling device 200 more controllable. Furthermore, by electrically connecting the controller 125 to the heating device 130 and the heat dissipation device 140, and by controlling the opening or closing of the heating device 130 and the heat dissipation device 140 based on the coolant temperature obtained by the temperature sensing device 150, the temperature of the coolant can be kept stable. Therefore, the liquid cooling device testing device 100 can be used as an immersion testing device to test the function and performance of the liquid cooling device 200 after immersion in coolant for different times and at different temperatures.

[0073] In addition, such as Figure 4 As shown, a power interface 126 can also be provided on the circuit board 120, and the power interface 126 can be electrically connected to a power source via a cable to supply power to components such as the controller 125 through an external power source. Furthermore, when the controller 125 controls the heating device 130 and the heat dissipation device 140, it can also control the power supply to supply power to the heating device 130 and the heat dissipation device 140, thereby eliminating the need for an external power source to power the heating device 130 and the heat dissipation device 140.

[0074] To enable both heating and cooling devices to control the coolant temperature through the chassis walls, chassis are typically made of stainless steel, aluminum alloy, or other metal materials to ensure good heat exchange capabilities. However, this can cause heat from the heating device to be conducted along the chassis walls to the wall containing the circuit board when the heating device is turned on. Therefore, to avoid the heating device affecting the circuit board, in some embodiments of this application, such as... Figure 3 As shown, a heat-insulating seal 160 is sandwiched between the chassis 110 and the circuit board 120.

[0075] The thermal insulation seal 160 can be made of materials such as silicone rubber, glass fiber, and ceramic fiber, for example... Figure 3 As shown, the heat insulation seal 160 has a certain height. When the heat insulation seal 160 is sandwiched between the chassis 110 and the circuit board 120, the circuit board 120 will not be completely attached to the chassis 110, but there will be a distance D1, so that the heat on the chassis 110 will not be directly transferred to the circuit board 120, thus avoiding the influence of the heat on the chassis 110 on the circuit board 120.

[0076] In the above embodiments, by placing a heat-insulating seal 160 between the chassis 110 and the circuit board 120, the circuit board 120 can not only close the opening 112, but also isolate the circuit board 120 and the chassis 110 from each other. This prevents the heat provided by the heating device 130 from being conducted to the circuit board 120 through the chassis 110, thus avoiding the influence of the heating device 130 on the circuit board 120 and ensuring the accuracy of the test results of the liquid cooling device 200.

[0077] To further accelerate the heat dissipation rate of the coolant, in some embodiments of this application, such as... Figure 5 As shown, a plurality of heat sinks 116 are provided on the outer surface of the side wall of the chassis 110, and heat dissipation channels 117 are formed between the heat sinks 116. The heat dissipation device 140 is disposed on the heat sinks 116 and is used to drive the gas to flow along the extension direction of the heat dissipation channel 117 so that the gas carries away the heat on the heat sinks 116.

[0078] like Figure 5 As shown, multiple heat sinks 116 are vertically arranged on the side wall of the chassis 110 and horizontally arranged, forming a vertical heat dissipation channel 117 between the heat sinks 116. Heat sinks 116 can be installed on all side walls of the chassis 110 to increase the contact area between the outer surface of the chassis 110 and the air, thereby enhancing the heat exchange capacity between the chassis 110 and the air and reducing heat accumulation in the coolant. Alternatively, the heat sinks 116 can be arranged horizontally and vertically to form a horizontal heat dissipation channel 117.

[0079] The heat dissipation device 140 can be like Figure 5 As shown, the heat dissipation device 140 is positioned above the heat sink 116. It can drive gas downwards, causing the gas to flow downwards into the heat dissipation channel 117 and then exit from below the heat sink 116. Alternatively, the heat dissipation device 140 can drive gas upwards, causing the gas in the heat dissipation channel 117 to flow upwards and then exit from above the heat sink 116. This allows gas outside the heat dissipation channel 117 to enter from below or the side of the heat sink 116. Of course, the heat dissipation device 140 can also be positioned below the heat sink 116 to drive the gas to flow along the heat dissipation channel 117, or a groove can be formed in the middle of the heat sink 116, and the heat dissipation device 140 can be placed within the groove to drive the gas to flow vertically. In addition, there can be multiple heat dissipation devices 140. For example, heat dissipation devices 140 can be provided on multiple side walls of the chassis 110, or heat dissipation devices 140 can be provided above and below the heat sink 116 on the same side wall. One heat dissipation device 140 is used to drive gas into the heat dissipation channel 117, and another heat dissipation device 140 is used to drive gas out of the heat dissipation channel 117.

[0080] It is particularly important to note that the placement of the heat dissipation device 140 is closely related to the extension direction of the heat dissipation channel 117. When the heat sink 116 is arranged horizontally to form a horizontal heat dissipation channel 117, the heat dissipation device 140 cannot be placed above or below the heat sink 116. Instead, the heat dissipation device 140 and the heat sink 116 need to be arranged horizontally so that the heat dissipation device 140 can drive the gas to flow horizontally within the heat dissipation channel 117. The number of heat dissipation devices 140 is also related to the heat dissipation requirements of the liquid cooling equipment testing device 100. When the coolant needs to conduct a large amount of heat to the external environment, one or more heat dissipation devices 140 can be installed on each side wall of the chassis 110. When the coolant only needs to conduct a small amount of heat to the external environment, heat dissipation devices 140 can be installed only on the outer surface of one side of the chassis 110.

[0081] In the above embodiments, by providing heat sinks 116 on the outer surface of the chassis 110, the contact area between the chassis 110 and the air is increased, resulting in a faster heat exchange rate between the chassis 110 and the external environment, which accelerates the cooling rate of the coolant. Furthermore, by driving gas to flow along the extension direction of the heat dissipation channel 117 through the heat dissipation device 140, the gas makes full contact with the surface of the heat sinks 116, further accelerating the heat dissipation rate of the chassis 110.

[0082] To effectively reduce coolant consumption, the internal enclosure space of the chassis is not very large, typically only slightly larger than the volume of the liquid cooling unit, just enough to allow for easy insertion and removal of the liquid cooling unit. However, for better coolant temperature detection, temperature sensors are usually immersed in the coolant and need to be electrically connected to the controller on the circuit board via a cable. If the temperature sensor is movable or requires a long cable connection to the controller, the temperature sensor and cable may interfere with the insertion and removal of the liquid cooling unit. Therefore, to facilitate easier insertion and removal of the liquid cooling unit, in some embodiments of this application, such as... Figure 2 As shown, the temperature sensing device 150 is installed on the wall of the housing 110 where the opening 112 is located, and is spaced apart from the opening 112.

[0083] The temperature sensing device 150 needs to be electrically connected to the controller on the circuit board 120 via a cable. Specifically, one end of the cable can be electrically connected to the temperature sensing device 150, and the other end can be electrically connected to the side of the circuit board 120 facing the chassis 110. Finally, the cable is electrically connected to the controller on the circuit board 120 through copper plating or other methods. Therefore, placing the temperature sensing device 150 on the wall where the opening 112 is located can shorten the distance between the temperature sensing device 150 and the circuit board 120, thereby shortening the length of the cable connecting the temperature sensing device 150 and the circuit board 120, effectively avoiding the cable affecting the insertion and removal of the liquid cooling device 200.

[0084] Furthermore, since the temperature sensor 150 typically has a certain thickness, if it is positioned close to the device interface 121, when the connector 210 of the liquid cooling device 200 is inserted into the device interface 121, the end of the connector 210 on the liquid cooling device 200 may come into contact with the temperature sensor 150. This would result in insufficient insertion of the connector 210 into the device interface 121, preventing the external server from testing the liquid cooling device 200. Therefore, the temperature sensor 150 can be spaced apart from the opening 112, maintaining a certain distance between them to avoid interference.

[0085] To facilitate the insertion and removal of liquid cooling equipment, the mounting port for the equipment is typically located at the top of the chassis. If no structure is provided at the top to cover the mounting port, the coolant within the enclosure can evaporate into the external environment, resulting in coolant waste. Therefore, to avoid coolant evaporation and waste, in some embodiments of this application, such as... Figure 2 As shown, a top cover 170 is detachably connected to the top of the chassis 110. A snap fastener 171 is provided on the edge of the top cover 170. The snap fastener 171 is used to engage with the side wall of the chassis 110 when the top cover 170 covers the mounting opening 114 on the top of the chassis 110. A sealing element is sandwiched between the top cover 170 and the chassis 110.

[0086] The top cover 170 is used to mate with the chassis 110 to form a sealed receiving cavity 111, thereby preventing coolant within the receiving cavity 111 from evaporating from the mounting port 114 into the external environment. For example... Figure 2As shown, the top cover 170 and the chassis 110 can be separated. Buckles 171 are provided around the top cover 170. When the liquid cooling equipment 200 needs to be tested, after all the buckles 171 on the top cover 170 are separated from the chassis 110, the top cover 170 is removed from the chassis 110, and the liquid cooling equipment 200 and the equipment interface 121 are electrically connected through the mounting port 114. Then, the top cover 170 is placed back on top of the chassis 110 and covers the mounting port 114. Finally, the buckles 171 are snapped into place with the chassis 110. Of course, one side of the top cover 170 can also be rotatably connected to the chassis 110 via a pivot, hinge or other structure. When the liquid cooling equipment 200 needs to be tested, after separating the snap 171 from the chassis 110, the top cover 170 can be rotated relative to the chassis 110 to expose the mounting port 114. The liquid cooling equipment 200 and the equipment interface 121 can then be electrically connected through the mounting port 114 without removing the top cover 170 from the chassis 110.

[0087] The snap-fit ​​171 is a connector or fastener that secures two or more components by applying pressure, such as a clip, clamp, or quick-release buckle. Specifically, protrusions, grooves, or other structures can be provided on the side wall of the chassis 110, and the snap-fit ​​171 can engage with these structures to secure the top cover 170 and the side wall of the chassis 110. Furthermore, to further improve the sealing performance of the liquid-cooled equipment testing device 100, a sealing element, such as a sealing ring or gasket, can be sandwiched between the top cover 170 and the chassis 110.

[0088] In the above embodiment, by providing a top cover 170 to cover the mounting opening 114 on the top of the chassis 110, on the one hand, it can prevent the coolant in the accommodating cavity 111 from evaporating into the external environment, avoiding waste of coolant; on the other hand, it can form a sealed accommodating cavity 111, preventing moisture, dust, and other substances in the air from entering the coolant, reducing the impact of the external environment on the coolant environment inside the chassis 110, and improving the accuracy of the test results. Furthermore, by sandwiching a sealing element between the top cover 170 and the chassis 110, the airtightness of the liquid cooling equipment testing device 100 is further improved.

[0089] Furthermore, in some embodiments of this application, such as Figure 2 and Figure 4 As shown, a display device 180 can also be installed on the side wall of the chassis 110, and the display device 180 is electrically connected to the display interface 127 on the circuit board 120 via a cable. After the controller 125 collects the temperature information from the temperature sensor 150, it can send the temperature information to the display device 180 through the display interface 127 and the cable, so that the display device 180 can display the temperature of the coolant. The display device 180 can be a digital display device, and the temperature is displayed through its digital tube.

[0090] In addition, buttons, such as temperature setting, "+", and "-" buttons, can be set at the corresponding positions on the display device 180. These buttons are electrically connected to the display device 180. Users can enter the temperature setting mode by clicking the temperature setting button, and then adjust the temperature displayed on the display device 180 by using the "+" and "-" buttons. When the desired temperature is reached, the temperature setting button is clicked again to complete the setting of the coolant temperature. Finally, the display device 180 provides the temperature to the controller 125, so that the controller 125 can keep the temperature of the coolant in the accommodating cavity 111 constant at the set temperature.

[0091] In this embodiment, a display device 180 is provided to display the coolant temperature in real time, allowing users to directly view the coolant temperature inside the accommodating cavity 111 via the display device 180 on the side wall of the chassis 110. This eliminates the need to connect to any external devices such as terminals or servers, making the liquid cooling equipment testing device 100 more convenient to use. Furthermore, buttons can be provided on the chassis 110 to directly set the coolant temperature, further enhancing the convenience of the liquid cooling equipment testing device 100.

[0092] Furthermore, such as Figure 2 and Figure 4 As shown, an indicator light 190 can also be installed on the chassis 110, and the indicator light 190 and the display interface 127 on the circuit board 120 can be electrically connected via a cable. When testing the liquid cooling device 200, after the liquid cooling device 200 is installed, the controller 125 or an external server can detect whether there is an abnormality in the connection between the liquid cooling device 200 and the device interface 121, and control the indicator light 190 according to the detection result (e.g., control the indicator light 190 to turn on or off, control the indicator light 190 to emit different colors of light, etc.), so that the user can directly judge whether the liquid cooling device 200 is connected properly according to the indicator light 190.

[0093] Specifically, a communication interface 128 [e.g., an Inter-Integrated Circuit (I2C) interface] can be set on the circuit board 120, and the controller 125 and an external server can be electrically connected through the communication interface 128 [e.g., the I2C interface on the circuit board 120 can be electrically connected to the I2C interface or Serial General Purpose Input / Output (SGPIO) interface on the external server via a cable]. When the pins of the controller 125 detect an abnormality in the connection between the liquid cooling device 200 and the device interface 121, the indicator light 190 is controlled through the display interface 127 to display the abnormality in the liquid cooling device 200 connection, and the information about the abnormality in the liquid cooling device 200 is notified to the external server through the communication interface 128. In addition, when the external server is electrically connected to the communication interface 128 on the circuit board 120 through its I2C interface or SGPIO interface, the external server can also control the indicator light 190 to display the abnormality in the liquid cooling device 200 connection when it detects an abnormality in the liquid cooling device 200 connection.

[0094] In the above embodiments, by setting an indicator light 190 on the chassis 110, the user can directly check whether the connection of the liquid cooling device 200 is abnormal after completing the installation of the liquid cooling device 200, and then make timely adjustments when the connection of the liquid cooling device 200 is abnormal, making the use of the liquid cooling device testing device 100 more convenient.

[0095] According to another aspect of the embodiments of this application, a liquid cooling equipment testing system is also provided. The liquid cooling equipment testing system includes an external server and the liquid cooling equipment testing device described in any of the above embodiments. The external server is electrically connected to the server interface via a cable.

[0096] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and not to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application, and they should all be covered within the scope of the claims and specification of this application. In particular, as long as there is no structural conflict, the various technical features mentioned in the embodiments can be combined in any way. This application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A testing device for liquid cooling equipment, characterized in that, The device includes: a chassis and a circuit board; The chassis has an internal cavity for accommodating coolant and liquid cooling equipment. The bottom wall of the chassis has an opening, the circuit board is fixedly installed on the outside of the bottom wall of the chassis and the opening is closed, the circuit board has a device interface on the side facing the cavity, the device interface is immersed in the coolant in the cavity and is electrically connected to the liquid cooling device installed in the cavity and immersed in the coolant. A server interface is provided on the side of the circuit board away from the chassis. The server interface is located outside the accommodating cavity and is used to connect to an external server to test the liquid cooling device through the external server.

2. The liquid cooling equipment testing device according to claim 1, characterized in that, The top of the chassis has an installation port for allowing coolant and liquid cooling equipment to enter the accommodating cavity. The circuit board is located at the bottom of the chassis and is sealed to the bottom wall. The chassis is also provided with a support member for fixing the chassis and suspending the bottom wall below.

3. The liquid cooling equipment testing device according to claim 1, characterized in that, The area of ​​the opening is smaller than the area of ​​the circuit board, and the circuit board is sealed to the wall of the chassis located at the edge of the opening.

4. The liquid cooling equipment testing apparatus according to any one of claims 1 to 3, characterized in that, A heating device is attached to the bottom wall of the chassis on the side opposite to the accommodating cavity. The heating device is used to heat the coolant through the chassis when the accommodating cavity contains the coolant. The outer surface of the side wall of the chassis is provided with a heat dissipation device, which is used to drive gas through the outer surface of the chassis to dissipate heat from the coolant through the chassis.

5. The liquid cooling equipment testing device according to claim 4, characterized in that, A temperature sensing device is installed inside the accommodating cavity. A controller is also installed on the side of the circuit board away from the chassis. The controller is located outside the accommodating cavity and is electrically connected to the temperature sensing device via a cable to obtain the temperature of the coolant through the temperature sensing device. The controller is electrically connected to the heating device and the heat dissipation device via cables, and the controller is also used to control the heating device and the heat dissipation device to turn on or off according to the temperature of the coolant.

6. The liquid cooling equipment testing device according to claim 4, characterized in that, A heat-insulating seal is sandwiched between the chassis and the circuit board.

7. The liquid cooling equipment testing device according to claim 4, characterized in that, The outer surface of the side wall of the chassis is provided with a plurality of heat sinks, and heat dissipation channels are formed between the heat sinks. The heat dissipation device is disposed on the heat sinks and is used to drive gas to flow along the extension direction of the heat dissipation channels so that the gas carries away the heat on the heat sinks.

8. The liquid cooling equipment testing device according to claim 5, characterized in that, The temperature sensing device is installed on the wall of the chassis where the opening is located, and is spaced apart from the opening.

9. The liquid cooling equipment testing device according to claim 1, characterized in that, The top of the chassis is detachably connected to a top cover, and the edge of the top cover is provided with a snap fastener. The snap fastener is used to engage with the side wall of the chassis when the top cover covers the mounting opening on the top of the chassis. A sealing element is sandwiched between the top cover and the chassis.

10. A liquid cooling equipment testing system, characterized in that, The liquid cooling equipment testing system includes: an external server and a liquid cooling equipment testing device as described in any one of claims 1-9, wherein the external server is electrically connected to the server interface via a cable.

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