Adhesive sample preparation device

Abstract

The utility model relates to the technical field of adhesive testing, in particular to an adhesive sample preparation device which comprises a bottom plate assembly, a limiting assembly and an upper cover plate assembly, and two first limiting parts are formed on a first non-polar contact layer in the bottom plate assembly; the limiting assembly comprises a limiting cushion block detachably connected to the first limiting part. A second non-polar contact layer in the upper cover plate assembly abuts against the end, away from the first surface, of the limiting cushion block, and the bottom plate assembly, the upper cover plate assembly and the limiting cushion block jointly define an adhesive sample containing space. According to the mode, during sample preparation, only the upper cover plate assembly needs to be covered in the direction close to the first surface, the distance between the bottom plate assembly and the upper cover plate assembly is determined by the height of the limiting cushion block, then the adhesive layer thickness of an adhesive sample is controlled, the uniformity of the adhesive layer thickness can be guaranteed, meanwhile, extrusion film forming is completed through the covering operation, and the production efficiency is improved. One-time forming of coating and extrusion film forming is guaranteed, and improvement of the quality of an adhesive sample is facilitated.

Description

Technical Field

[0001] This application relates to the field of adhesive testing technology, and in particular to an adhesive sample preparation apparatus. Background Art

[0002] Currently, photovoltaic (PV) modules can convert solar thermal radiation into electrical energy through the photoelectric or photochemical effects, and are used in daily life and industrial production. Cell stringing is a crucial step in PV module manufacturing. In gridless cell stringing, adhesive bonding is used to fix solder ribbons to the grid lines formed on the cell surface, thus creating the cell string. Given the harsh outdoor environments and long service life of PV modules, performance testing of the adhesives used in stringing is necessary.

[0003] In the background technology, for thermosetting adhesives with strong adhesion, they are generally coated evenly onto a transparent substrate, the adhesive layer thickness is controlled using a scraper, and then another transparent substrate is covered on top of the adhesive layer. Pressure is applied to the transparent substrate to thin the adhesive layer. Finally, the transparent substrate and the resulting adhesive film sample are placed in a high-temperature environment for curing, and then the adhesive film sample is removed for testing. This sample preparation method cannot guarantee the uniformity of the adhesive layer thickness, and the one-step coating and extrusion film formation process is difficult, which is detrimental to improving the quality of the adhesive sample. Utility Model Content

[0004] Based on this, this application provides an adhesive sample preparation apparatus to solve the above-mentioned technical problems that are detrimental to improving the quality of adhesive samples.

[0005] In a first aspect, embodiments of this application provide an adhesive sample preparation apparatus, comprising:

[0006] A base plate assembly, the base plate assembly including a base plate and a first non-polar contact layer disposed on the base plate, wherein two parallel and spaced first limiting portions are formed on the first surface of the first non-polar contact layer.

[0007] A limiting component, the limiting component including a limiting pad block detachably connected to the first limiting portion;

[0008] An upper cover assembly is provided at a distance from the first surface of the first non-polar contact layer. The upper cover assembly includes a second non-polar contact layer, which abuts against the end of the limiting pad away from the first surface. The base plate assembly, the upper cover assembly, and the two limiting pads together form a space for receiving the adhesive sample.

[0009] Optionally, multiple limiting components are provided, and the height of the limiting pads of different limiting components is different.

[0010] Optionally, the first limiting part is a first limiting groove, and the limiting pad is placed in the first limiting groove.

[0011] Optionally, the first limiting part is a first protrusion, and the bottom of the limiting pad has a first groove that mates with the first protrusion, and the first protrusion is engaged in the first groove.

[0012] Optionally, the base plate includes a first metal thermally conductive layer stacked on the second surface of the first non-polar contact layer and a first insulating thermal insulation layer stacked on the first metal thermally conductive layer.

[0013] Optionally, the upper cover assembly further includes a second metal thermally conductive layer stacked on the second non-polar contact layer and a second insulating thermal insulation layer stacked on the second metal thermally conductive layer.

[0014] Optionally, the first non-polar contact layer and the second non-polar contact layer are both polytetrafluoroethylene layers.

[0015] Optionally, the limiting pad is made of polytetrafluoroethylene material.

[0016] Optionally, the adhesive sample preparation device further includes a clamping plate, which includes two plates that respectively contact the first non-polar contact layer and the second non-polar contact layer, and a connector connecting the two plates.

[0017] Optionally, the base plate assembly further includes a first extension portion connected to the first insulating and heat-insulating layer, and the upper cover plate assembly further includes a second extension portion connected to the second insulating and heat-insulating layer, wherein the first extension portion and the second extension portion are rotatably connected.

[0018] The adhesive sample preparation apparatus provided in this application includes a base plate assembly, a limiting assembly, and a top cover assembly. Two parallel and spaced-apart first limiting portions are formed on the first surface of the first non-polar contact layer in the base plate assembly. The limiting assembly includes a limiting pad detachably connected to the first limiting portions. A second non-polar contact layer in the top cover assembly abuts against the end of the limiting pad away from the first surface. The base plate assembly, the top cover assembly, and the two limiting pads together form a space for accommodating the adhesive sample. In this manner, during sample preparation, the top cover assembly is simply closed towards the first surface. The height of the limiting pad determines the distance between the base plate assembly and the top cover assembly, thereby controlling the adhesive layer thickness of the adhesive sample and ensuring the uniformity of the adhesive layer thickness. Simultaneously, the closing operation completes the extrusion film formation, ensuring that coating and extrusion film formation are completed in one step, which is beneficial for improving the quality of the adhesive sample. Attached Figure Description

[0019] Figure 1 This is a top view of an adhesive sample preparation apparatus according to an embodiment of this application.

[0020] Figure 2 for Figure 1 An exploded view of part of the adhesive sample preparation apparatus shown.

[0021] Figure 3 for Figure 1 The adhesive sample preparation apparatus shown is a cross-sectional view along the AA direction.

[0022] Figure 4 This is a schematic diagram of the structure of an adhesive sample preparation apparatus according to an embodiment of this application.

[0023] Figure 5 This is a partial exploded view of an adhesive sample preparation apparatus according to an embodiment of this application.

[0024] Figure 6 This is a side view of an adhesive sample preparation apparatus according to an embodiment of this application.

[0025] Figure 7 This is a side view of an adhesive sample preparation apparatus according to an embodiment of this application.

[0026] Figure 8 for Figure 7 An exploded view of the adhesive sample preparation apparatus shown.

[0027] Figure 9 This is a side view of an adhesive sample preparation apparatus according to an embodiment of this application.

[0028] The meanings of the labels in the attached diagram are as follows:

[0029] 100-Adhesive sample preparation device; 10-Base plate assembly; 11-Base plate; 111-First metal thermally conductive layer; 112-First insulating and heat-insulating layer; 12-First non-polar contact layer; 121-First surface; 122-First limiting part; 21-Limiting pad; 211-First slot; 30-Cover plate assembly; 31-Second non-polar contact layer; 30a-Upper cover plate; 32-Second metal thermally conductive layer; 33-Second insulating and heat-insulating layer; 100a-Accommodation space; 123-First non-overlapping area; 311-Second non-overlapping area; 40-Clamping plate; 41-Plate body; 42-Connector; 13-First extension part; 34-Second extension part; 50-Rotating shaft; S1-First direction; S2-Second direction. DETAILED DESCRIPTION

[0030] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings. Preferred embodiments of this application are shown in the drawings. However, this application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a thorough and complete understanding of the disclosure of this application.

[0031] It should be noted that when a component is said to be "fixed to" another component, it can be directly attached to the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component.

[0032] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0033] like Figures 1 to 8 As shown, it is an adhesive sample preparation apparatus according to an embodiment of this application.

[0034] like Figures 1 to 4 As shown, the adhesive sample preparation device 100 includes: a base plate assembly 10, a limiting assembly, and an upper cover plate assembly 30.

[0035] The base plate assembly 10 includes a base plate 11 and a first non-polar contact layer 12 disposed on the base plate 11. The first surface 121 of the first non-polar contact layer 12 has two parallel and spaced-apart first limiting portions 122. The first surface 121 is the upper surface of the first non-polar contact layer 12 and is the adhesive coating surface. The area between the two first limiting portions 122 is the adhesive coating area.

[0036] The limiting component includes two limiting pads 21, which respectively cooperate with two first limiting portions 122. The limiting pads 21 are detachably connected to the first limiting portions 122. The upper cover assembly 30 covers the end of the limiting pad 21 away from the first surface 121. The upper cover assembly 30 is spaced apart from the first surface 121 of the first non-polar contact layer 12. The upper cover assembly 30 includes a second non-polar contact layer 31. When closed, the second non-polar contact layer 31 abuts against the end of the limiting pad 21 away from the first surface 121. The base plate assembly, the upper cover assembly, and the two limiting pads together form a space 100a for receiving the adhesive sample. The first non-polar contact layer 12, the second non-polar contact layer 31, and the two limiting pads 21 are in contact with the adhesive sample. The first non-polar contact layer 12 and the second non-polar contact layer 31 are in non-polar contact with the adhesive sample at the contact interface, and can be directly separated after the adhesive sample has cured.

[0037] Please see Figure 3 As shown, the distance between the first non-polar contact layer 12 and the second non-polar contact layer 31 is the thickness of the adhesive sample. The height of the limiting pad 21 limits the distance between the first non-polar contact layer 12 and the second non-polar contact layer 31. The height of the limiting pad 21 can control the thickness of the adhesive sample.

[0038] During sample preparation, the adhesive is first applied to the coating area between the two first limiting portions 122 on the first surface 121 of the first non-polar contact layer 12. Then, the upper cover assembly 30 is closed in the direction close to the first surface 121 until the second non-polar contact layer 31 abuts against the end of the limiting pad 21 away from the first surface 121, thus completing the coating and extrusion film forming in one step.

[0039] In this embodiment, during sample preparation, the upper cover plate assembly is simply closed towards the direction of the first surface. The height of the limiting pad determines the distance between the bottom plate assembly and the upper cover plate assembly, thereby controlling the adhesive layer thickness of the adhesive sample and ensuring the uniformity of the adhesive layer thickness. At the same time, the above-mentioned closing operation completes the extrusion film formation, ensuring that coating and extrusion film formation are completed in one step, which is beneficial to improving the quality of the adhesive sample.

[0040] In one implementation, multiple limiting components can be provided, with different heights of the limiting pads 21 in different limiting components. In this embodiment, when the required thickness of the adhesive sample changes, only the height of the limiting pads 21 needs to be adjusted, which is beneficial for adapting to adhesive sample testing with diverse thickness requirements.

[0041] As one implementation method, please refer to Figure 2 and Figure 3As shown, the first limiting part 122 is a first limiting groove. Two first limiting grooves extend along the first direction S1, and the second direction S2 is perpendicular to the first direction S1. The first direction S1 is perpendicular to the height direction of the limiting pad 21, and the second direction S2 is perpendicular to the height direction of the limiting pad 21. The limiting pad 21 is placed in the first limiting groove. The limiting pad 21 is elongated, and its length extends along the first direction S1. In this embodiment, the bottom of the limiting pad 21 is limited within the first limiting groove, making installation and disassembly relatively simple.

[0042] As one implementation method, please refer to Figure 5 As shown, the first limiting part 122 is a first protruding strip, and the bottom of the limiting pad 21 has a first groove 211 that mates with the first protruding strip, with the first protruding strip engaging within the first groove 211. Two first protruding strips extend along the first direction S1, and the limiting pad 21 is elongated, with its length extending along the first direction S1. In this embodiment, the first limiting part 122 and the limiting pad 21 are connected by a snap-fit ​​mechanism, resulting in a more secure installation.

[0043] As one implementation method, please refer to Figure 6 As shown, the base plate 11 includes a first metal thermally conductive layer 111 laminated on the second surface of the first non-polar contact layer 12 and a first insulating and heat-insulating layer 112 laminated on the first metal thermally conductive layer 111. The second surface of the first non-polar contact layer 12 is the lower surface of the first non-polar contact layer 12. In this embodiment, heat can be transferred to the adhesive sample through the first non-polar contact layer 12 by heating the first metal thermally conductive layer 111 to cure the adhesive sample.

[0044] In some embodiments, the upper cover assembly 30 further includes an upper cover 30a, which includes a second metal thermally conductive layer 32 stacked on the second non-polar contact layer 31 and a second insulating and heat-insulating layer 33 stacked on the second metal thermally conductive layer 32. In this embodiment, the adhesive sample can be cured by heating the second metal thermally conductive layer 32 and transferring heat through the second non-polar contact layer 31. Heating the second metal thermally conductive layer 32 and the first metal thermally conductive layer 111 simultaneously helps to shorten the curing time and improve the heating uniformity.

[0045] In some embodiments, a first temperature sensor for collecting the temperature of the first metal thermally conductive layer 111 and a second temperature sensor for collecting the temperature of the second metal thermally conductive layer 32 can be respectively provided to control the curing temperature of the adhesive sample.

[0046] In one embodiment, the first non-polar contact layer 12 and the second non-polar contact layer 31 are both polytetrafluoroethylene (PTFE) layers. In this embodiment, the interface between the PTFE material and the adhesive sample is non-polar, allowing for direct separation after the adhesive sample has cured without sticking together.

[0047] In some embodiments, the limiting pad 21 is made of polytetrafluoroethylene (PTFE). In this embodiment, the side of the limiting pad 21 facing the adhesive sample may come into contact with the adhesive sample. The interface between the PTFE material and the adhesive sample is non-polar, allowing for direct separation after the adhesive sample has cured without sticking together.

[0048] As one implementation method, please refer to Figure 7 and Figure 8 As shown, the projection of the base plate 11 along the height direction of the limiting pad 21 within the first non-polar contact layer 12 is located within the first non-polar contact layer 12, and the first non-polar contact layer 12 has a first non-overlapping region 123 that does not overlap with the base plate 11. The projection of the upper cover plate 30a along the height direction of the limiting pad 21 within the second non-polar contact layer 31 is located within the second non-polar contact layer 31, and the second non-polar contact layer 31 has a second non-overlapping region 311 that does not overlap with the upper cover plate 30a. The adhesive sample preparation apparatus 100 of this embodiment also includes a clamping plate 40, which includes two plates 41 that respectively contact the first non-polar contact layer 12 and the second non-polar contact layer 31, and a connector 42 connecting the two plates 41. The two plates 41 contact the first non-overlapping area 123 and the second non-overlapping area 311 respectively. By setting the clamping plate 40, the first non-polar contact layer 12, the adhesive sample and the second non-polar contact layer 31 are more firmly bonded together.

[0049] As one implementation method, please refer to Figure 9 As shown, with the height of the limiting pad 21 remaining constant, the base plate assembly 10 further includes a first extension portion 13 connected to the edge of the first insulating heat insulation layer 112, and the upper cover plate assembly 30 further includes a second extension portion 34 connected to the edge of the second insulating heat insulation layer 33. The first extension portion 13 and the second extension portion 34 are rotatably connected to achieve the closing or opening of the upper cover plate assembly 30 and the base plate assembly 10. Exemplarily, the first extension portion 13 and the second extension portion 34 are rotatably connected via a pivot 50.

[0050] The technical features of the above embodiments can be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0051] The above embodiments merely illustrate preferred implementations of this application, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. An adhesive sample preparation apparatus, characterized in that, include: A base plate assembly, the base plate assembly including a base plate and a first non-polar contact layer disposed on the base plate, wherein two parallel and spaced first limiting portions are formed on the first surface of the first non-polar contact layer. A limiting component, the limiting component including a limiting pad block detachably connected to the first limiting portion; An upper cover assembly is provided at a distance from the first surface of the first non-polar contact layer. The upper cover assembly includes a second non-polar contact layer, which abuts against the end of the limiting pad away from the first surface. The base plate assembly, the upper cover assembly, and the two limiting pads together form a space for receiving the adhesive sample.

2. The adhesive sample preparation apparatus according to claim 1, characterized in that, The limiting components are provided in multiple ways, and the height of the limiting pads of different limiting components is different.

3. The adhesive sample preparation apparatus according to claim 2, characterized in that, The first limiting part is a first limiting groove, and the limiting pad is placed in the first limiting groove.

4. The adhesive sample preparation apparatus according to claim 2, characterized in that, The first limiting part is a first protrusion, and the bottom of the limiting pad has a first groove that cooperates with the first protrusion, and the first protrusion is engaged in the first groove.

5. The adhesive sample preparation apparatus according to claim 1, characterized in that, The base plate includes a first metal thermally conductive layer stacked on the second surface of the first non-polar contact layer and a first insulating thermal insulation layer stacked on the first metal thermally conductive layer.

6. The adhesive sample preparation apparatus according to claim 5, characterized in that, The upper cover assembly further includes a second metal thermally conductive layer stacked on the second non-polar contact layer and a second insulating thermal insulation layer stacked on the second metal thermally conductive layer.

7. The adhesive sample preparation apparatus according to claim 1, characterized in that, The first non-polar contact layer and the second non-polar contact layer are both polytetrafluoroethylene layers.

8. The adhesive sample preparation apparatus according to claim 7, characterized in that, The limiting pad is made of polytetrafluoroethylene.

9. The adhesive sample preparation apparatus according to claim 1, characterized in that, The adhesive sample preparation device further includes a clamping plate, which comprises two plates that respectively contact the first non-polar contact layer and the second non-polar contact layer, and a connector connecting the two plates.

10. The adhesive sample preparation apparatus according to claim 6, characterized in that, The base plate assembly further includes a first extension portion connected to the first insulating and heat-insulating layer, and the upper cover plate assembly further includes a second extension portion connected to the second insulating and heat-insulating layer, wherein the first extension portion and the second extension portion are rotatably connected.

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