Optical module assembly, printed circuit board assembly and optical communication equipment
By setting heat sink windows and thermally conductive adhesive in the optical module assembly, the heat dissipation path is optimized, solving the problem of high junction temperature and interface thermal resistance caused by tolerance accumulation in the prior art, and achieving more efficient heat dissipation and stronger production adaptability.
Patent Information
- Application Number
- CN202521865984.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-01
- Publication Date
- 2025-10-28
- Estimated Expiration
- 2035-09-01
AI Technical Summary
In existing optical module assemblies, the gap is difficult to control due to the accumulated tolerances of the shell cavity processing accuracy, the thickness of the digital signal processor and the thickness of the printed circuit board, resulting in high junction temperature and increased interface thermal resistance.
Windows adapted to the heat sink are provided on the mounting cage and housing, allowing the heat sink to penetrate into the housing to dissipate heat from the digital signal processor. The heat dissipation path is optimized by using thermal adhesive and fin assemblies, and the heat dissipation effect is ensured by combining various connection methods.
Effectively controlling gap values shortens the heat dissipation path, reduces junction temperature, eliminates interface thermal resistance, improves heat dissipation, adapts to digital signal processors with a wider thickness range, and enhances production flexibility.
Smart Images
Figure CN223486244U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of optical communication technology, specifically to an optical module assembly, a printed circuit board assembly having the optical module assembly, and an optical communication device having the aforementioned printed circuit board assembly. Background Technology
[0002] An optical module is an integrated module used for photoelectric signal conversion, playing a crucial role in the field of optical communication. For example... Figure 1 As shown, an existing optical module assembly 9 includes a mounting cage 91, an optical module 92, and a heat sink 93. The optical module 92 is installed inside the mounting cage 91. The optical module 92 includes a housing 921, a printed circuit board 922, a digital signal processor (DSP) 923, a boss 924, and a thermally conductive pad 925. The printed circuit board 922 is installed inside the housing 921, the digital signal processor 923 is installed on the printed circuit board 922, the thermally conductive pad 925 is attached to the digital signal processor 923, the boss 924 is disposed between the thermally conductive pad 925 and the inner wall of the housing 921, and the heat sink 93 is installed on the mounting cage 91.
[0003] However, the structural design of the aforementioned optical module component 9 results in the following defects:
[0004] Due to the cumulative impact of tolerances in the machining precision of the inner cavity of the housing 921, the thickness of the digital signal processor 923, and the thickness of the printed circuit board 922, the gap between the digital signal processor 923 and the inner cavity wall of the housing 921 is difficult to control and tends to be large (greater than 0.3 mm). The thickness of the thermally conductive pad 925 has a significant impact on the junction temperature of the optical module 92, and this thickness is determined by the gap between the digital signal processor 923 and the inner cavity wall of the housing 921. Therefore, the larger the gap between the digital signal processor 923 and the inner cavity wall of the housing 921, the larger the thickness of the thermally conductive pad 925, and the corresponding higher the junction temperature. (See [reference needed]). Figure 2 The graph shows the trend of the thickness of the thermally conductive adhesive pad 925 and the junction temperature of the optical module 92. Furthermore, when the optical module 92 is inserted into the mounting cage 91, the interfacial thermal resistance between the optical module 92 and the mounting cage 91 also increases the junction temperature. Utility Model Content
[0005] To address the aforementioned problems, the primary objective of this invention is to provide an optical module assembly that can reduce junction temperature.
[0006] The second objective of this invention is to provide a printed circuit board assembly incorporating the aforementioned optical module component.
[0007] The third objective of this invention is to provide an optical communication device equipped with the aforementioned printed circuit board assembly.
[0008] To achieve the first objective of this utility model, this utility model provides an optical module assembly, including a mounting cage, an optical module, and a first heat sink. The optical module includes a housing, a first printed circuit board, and a digital signal processor. The housing is installed inside the mounting cage, the first printed circuit board is installed inside the housing, and the digital signal processor is installed on the first printed circuit board. The housing has a first window at the digital signal processor, and the mounting cage has a second window at the first window. The first window connects the second window and the interior of the housing. The first heat sink passes through the first window and the second window and is connected to the digital signal processor.
[0009] As can be seen from the above, by providing windows on the mounting cage and housing that are compatible with the first heat sink, the first heat sink can penetrate into the housing to dissipate heat from the digital signal processor. Furthermore, based on this mating structure design, the cumulative effects of tolerances such as the machining accuracy of the housing cavity, the thickness of the digital signal processor, and the thickness of the PCB board can be effectively eliminated during the assembly of the optical module assembly. This allows for better control of the gap between the digital signal processor and the inner wall of the housing, which helps to shorten the heat dissipation path and thus reduce the junction temperature. In addition, it can also eliminate the interface thermal resistance between the optical module and the mounting cage, further reducing the junction temperature. Moreover, the structural design of this optical module assembly allows for a wider range of compatible digital signal processor thicknesses, resulting in greater production flexibility.
[0010] A further solution is to place thermally conductive adhesive between the first heat sink and the digital signal processor.
[0011] As can be seen from the above, thermal conductive adhesive can further improve the heat dissipation effect of the first heat sink on the digital signal processor. At the same time, based on the cooperative structural design of the mounting cage, housing and the first heat sink, the thickness of the thermal conductive adhesive can be set to be thinner, thereby improving the heat dissipation effect while avoiding the junction temperature from rising.
[0012] A further embodiment is that the first heat sink has a first base and a first fin assembly, the first base passes through a first window and a second window, and thermally conductive adhesive is disposed between the first base and the digital signal processor; the first fin assembly is disposed on the first base and is located outside the mounting cage.
[0013] As can be seen from the above, this design helps to further improve the heat dissipation effect of the first heat sink on the digital signal processor and further optimize the heat dissipation path to reduce the junction temperature.
[0014] A further alternative is that the first seat is located inside the mounting cage, with the side of the first seat facing away from the digital signal processor flush with the outer surface of the side wall of the mounting cage having the second window; or the first seat extends out of the mounting cage.
[0015] As can be seen from the above, the first radiator can be positioned inside or outside the mounting cage according to the heat dissipation requirements, so as to meet the heat dissipation requirements and ensure the heat dissipation effect.
[0016] A further option is to make the first seat part interference fit with the first window and the second window; and / or to weld and fix the first seat part to the first window and the second window, or to bond and fix the first seat part to the first window and the second window.
[0017] As can be seen from the above, the connection between the first base and the first window and the second window is diverse. At the same time, the above connection methods can ensure the reliability and firmness of the connection between the first base and the shell and the mounting cage, while avoiding the impact on the heat dissipation effect of the first radiator.
[0018] A further embodiment is that the first width of the first base is greater than or equal to the second width of the digital signal processor; and / or the first length of the first base is greater than or equal to the second length of the digital signal processor.
[0019] As can be seen from the above, the design can ensure that the digital signal processor is effectively cooled while avoiding an increase in junction temperature.
[0020] A further improvement is that the optical module assembly also includes a second heat sink, which is mounted on the mounting cage.
[0021] As can be seen from the above, adding a second heat sink can improve the heat dissipation effect and enable the optical module to support a wider power consumption range.
[0022] A further proposed solution is to integrate the second radiator with the first radiator.
[0023] As can be seen from the above, this design can further improve the heat dissipation effect and eliminate the interface thermal resistance between the optical module and the mounting cage.
[0024] To achieve the second objective of this utility model, this utility model provides a printed circuit board assembly, including a second printed circuit board, which further includes the aforementioned optical module assembly, the optical module assembly being mounted on the second printed circuit board.
[0025] As can be seen from the above, by configuring the aforementioned optical module components, the performance stability and reliability of printed circuit board assemblies can be improved, and their service life can be extended.
[0026] To achieve the third objective of this utility model, this utility model provides an optical communication device, which includes the above-mentioned printed circuit board assembly.
[0027] As can be seen from the above, by configuring the aforementioned printed circuit board components, optical communication equipment can achieve stronger performance stability, higher reliability, and longer service life. At the same time, the optical module itself also has better power redundancy capabilities, which helps to improve the performance of optical communication equipment. Attached Figure Description
[0028] Figure 1 This is a cross-sectional schematic diagram of an existing optical module assembly.
[0029] Figure 2 This is a graph showing the relationship between the thickness of the thermally conductive adhesive pads and the junction temperature of existing optical module components.
[0030] Figure 3 This is a cross-sectional view of the first heat sink and the second heat sink in an embodiment of the optical module component of this utility model, when they are set up separately.
[0031] Figure 4 This is a schematic diagram of the structure of the first heat sink and the second heat sink in an embodiment of the optical module component of this utility model, when they are set up separately.
[0032] Figure 5 This is a reference diagram of the first state during the molding process of an embodiment of the optical module component of this utility model.
[0033] Figure 6 This is a reference diagram of the second state during the molding process of an embodiment of the optical module component of this utility model.
[0034] Figure 7 This is a reference diagram of the third state during the molding process of an embodiment of the optical module component of this utility model.
[0035] Figure 8 This is a reference diagram of the fourth state during the molding process when the first heat sink and the second heat sink of this utility model optical module component are set separately.
[0036] Figure 9 This is a cross-sectional view of the first and second heat sinks integrally formed in an embodiment of the optical module component of this utility model.
[0037] Figure 10 This is a schematic diagram of the structure of the first heat sink and the second heat sink integrally formed in an embodiment of the optical module component of this utility model.
[0038] Figure 11 This is a reference diagram showing the fourth state during the molding process of the first and second heat sinks in an embodiment of the optical module component of this utility model.
[0039] The present invention will be further described below with reference to the accompanying drawings and embodiments. Detailed Implementation
[0040] Optical module component embodiment
[0041] Reference Figure 3 and Figure 4The optical module assembly 100 includes a mounting cage 1, an optical module 2, a first heat sink 3, and a second heat sink 4. The optical module 2 is installed inside the mounting cage 1, the first heat sink 3 is connected between the mounting cage 1 and the optical module 2, and the second heat sink 4 is installed on the mounting cage 1 and located outside the mounting cage 1. The optical module 2 includes a housing 21, a first printed circuit board 22, and a digital signal processor 23.
[0042] A first printed circuit board 22 is installed inside a housing 21, and a digital signal processor 23 is installed on the first printed circuit board 22. A first window 211 is provided on a side wall of the housing 21 parallel to the first printed circuit board 22 and close to the digital signal processor 23. The first window 211 penetrates the side wall to communicate with a first inner cavity of the housing 21. The first window 211 is located at the digital signal processor 23; that is, in the direction through which the first window 211 penetrates, the projection of the digital signal processor 23 completely overlaps with the projection of the first window 211, or the projection of the digital signal processor 23 is located within the projection of the first window 211.
[0043] The mounting cage 1 has a second inner cavity, and the shell 21 is fitted into the second inner cavity. The mounting cage 1 has a second window 11 at the first window 211. The second window 11 penetrates the side wall where it is located and communicates with the second inner cavity, thereby connecting the first window 211 with the second window 11 and the first inner cavity. Preferably, in the penetrating direction of the first window 211, the projection of the second window 11 completely overlaps with the projection of the first window 211; of course, as another optional solution, in the penetrating direction of the first window 211, the projection of the first window 211 may also be located within the projection of the second window 11.
[0044] The first heat sink 3 passes through the first window 211 and the second window 11, and is connected to the digital signal processor 23, so that the first heat sink 3 can dissipate heat from the digital signal processor 23 and improve the heat dissipation effect of the digital signal processor 23.
[0045] Preferably, as in this embodiment, thermally conductive adhesive 24 is provided between the first heat sink 3 and the digital signal processor 23. Providing thermally conductive adhesive 24 can, on the one hand, further improve the heat dissipation effect of the first heat sink 3 on the digital signal processor 23; on the other hand, the cooperation between the second window 11 of the mounting cage 1, the first window 211 of the housing 21, and the first heat sink 3 with the first window 211 and the second window 11 allows the thickness of the thermally conductive adhesive 24 to be thinner than that of existing optical module components, thereby improving the heat dissipation effect on the digital signal processor 23 while effectively preventing the junction temperature from rising.
[0046] The first heat sink 3 has a first base 31 and a first fin assembly 32. The first base 31 passes through the first window 211 and the second window 11, and thermally conductive adhesive 24 is disposed between the first base 31 and the digital signal processor 23. The first fin assembly 32 is disposed on the first base 31 and is located outside the mounting cage 1. The first base 31 can increase the contact area between the first heat sink 3 and the thermally conductive adhesive 24 (digital signal processor 23), thereby improving the heat conduction efficiency. The first fin assembly 32 can increase the contact area with the outside air, improve the heat exchange efficiency between the first heat sink 3 and the outside air, and thus improve the heat dissipation effect of the first heat sink 3 on the digital signal processor 23. It can be seen that the design of the first fin assembly 32 can optimize the heat dissipation path to further reduce the junction temperature.
[0047] Furthermore, in this embodiment, the first base 31 is located inside the mounting cage 1, and the side of the first base 31 facing away from the digital signal processor 23 is flush with the outer surface of the side wall of the mounting cage 1 where the second window 11 is located, so as to avoid excessive dust accumulation on the surface of the optical module assembly 100 and also help to reduce electrical interference. It is understood that in some embodiments, the first base 31 may also extend outside the mounting cage 1 (see the description below); thus, the first heat sink 3 can be positioned inside or outside the mounting cage 1 according to the heat dissipation requirements to meet the heat dissipation requirements and ensure the heat dissipation effect.
[0048] As an optional solution, the first base 31 is interference-fitted with the first window 211 and the second window 11 to fix the first heat sink 3 to the mounting cage 1 and the housing 21. Alternatively, the first base 31 can be welded to the first window 211 and the second window 11; or, the first base 31 can be bonded to the first window 211 and the second window 11 using adhesive. The adhesive can also be a thermally conductive adhesive to further improve the heat dissipation of the digital signal processor 23. It is understood that while the first base 31 is interference-fitted with the first window 211 and the second window 11, further welding or bonding can be performed to fix the first base 31 to the first window 211 and the second window 11. It can be seen that the connection between the first base 31 and the first window 211 and the second window 11 is diverse. Therefore, it can be flexibly adjusted according to the actual production requirements and usage needs of the optical module assembly 100. This ensures the reliability and firmness of the connection between the first base 31 and the housing 21 and the mounting cage 1, and avoids weakening the heat dissipation effect on the first heat sink 3.
[0049] Furthermore, the first width W1 of the first base portion 31 is preferably greater than or equal to the second width W2 of the digital signal processor 23, and / or the first length of the first base portion 31 is preferably greater than or equal to the second length of the digital signal processor 23, so that there is a sufficiently large contact area between the digital signal processor 23 and the first heat sink 3, thereby ensuring the heat dissipation effect of the digital signal processor 23 and avoiding an increase in junction temperature. It is understood that, as other optional solutions, in some embodiments, the first width W1 of the first base portion 31 is smaller than the second width W2 of the digital signal processor 23, and / or the first length of the first base portion 31 is smaller than the second length of the digital signal processor 23. However, it should be noted that the first width W1 cannot be excessively smaller than the second width W2, and the first length cannot be excessively smaller than the second length, to avoid the digital signal processor 23 not receiving effective heat dissipation.
[0050] The installation of the second heat sink 4 enhances the heat dissipation of the optical module assembly 100, enabling the optical module 2 to support a wider power consumption range. For example... Figure 3 As shown, in some embodiments, the second heat sink 4 and the first heat sink 3 are separately arranged. The number and position of the second heat sink 4 can be flexibly adjusted according to the distribution position of the digital signal processor 23 in the housing 21. For example, when the digital signal processor 23 is located in the middle in the width direction of the housing 21, the number of second heat sinks 4 is preferably two, and the two second heat sinks 4 are located on opposite sides of the first heat sink 3. Or, for example, when the digital signal processor 23 is located at one end in the width direction of the housing 21, the number of second heat sinks 4 can be set to one and placed next to the first heat sink 3.
[0051] like Figure 9 and Figure 10 As shown, in some embodiments, the second heat sink 4 can also be integrally formed with the first heat sink 3. In this case, the first base 31 of the first heat sink 3 extends outside the mounting cage 1, and the first base 31 of the first heat sink 3 and the second base 41 of the second heat sink 4 are integrally formed and preferably set at the same height. The second heat sink 4 preferably also has a second fin group 42. Integrating the second heat sink 4 with the first heat sink 3 can further improve the heat dissipation effect and eliminate the interface thermal resistance between the optical module 2 and the mounting cage 1.
[0052] Furthermore, as in this embodiment, the fins of the first fin group 32 are substantially parallel to the fins of the second fin group 42; however, it is understood that in some embodiments, the fins of the first fin group 32 may also be set at a non-zero angle to the fins of the second fin group 42.
[0053] When the first heat sink 3 and the second heat sink 4 are arranged separately, the molding process of the optical module assembly 100 is as follows:
[0054] First, such as Figure 5 As shown, the digital signal processor 23 is soldered onto the first printed circuit board 22;
[0055] Next, as Figure 6 As shown, thermally conductive adhesive 24 is mounted on the surface of the digital signal processor 23;
[0056] Next, as Figure 7 As shown, the first printed circuit board 22 is installed inside the housing 21, and the digital signal processor 23 is positioned facing the first window 211 of the housing 21 to form the optical module 2;
[0057] Next, as Figure 8 As shown, the optical module 2 is installed into the mounting cage 1, and the first window 211 is matched with the second window 11. At this time, the second heat sink 4 can be installed at the same time. Of course, the second heat sink 4 can also be installed after the first heat sink 3 is installed.
[0058] Next, as Figure 1 As shown, the first base 31 of the first heat sink 3 is passed through the first window 211 and the second window 11 until the first base 31 is tightly attached to the thermally conductive adhesive 24 and the digital signal processor 23. Then the first heat sink 3, the mounting cage 1 and the housing 21 are fixed.
[0059] When the first heat sink 3 and the second heat sink 4 are integrally formed, the forming process of the optical module assembly 100 is as follows:
[0060] First, such as Figure 5 As shown, the digital signal processor 23 is soldered onto the first printed circuit board 22;
[0061] Next, as Figure 6 As shown, thermally conductive adhesive 24 is mounted on the surface of the digital signal processor 23;
[0062] Next, as Figure 7 As shown, the first printed circuit board 22 is installed inside the housing 21, and the digital signal processor 23 is positioned facing the first window 211 of the housing 21 to form the optical module 2;
[0063] Next, as Figure 11 As shown, the optical module 2 is installed into the mounting cage 1, and the first window 211 is matched with the second window 11;
[0064] Next, as Figure 9 As shown, the first base 31 of the first heat sink 3 is passed through the first window 211 and the second window 11 until the first base 31 is tightly attached to the thermal conductive adhesive 24 and the digital signal processor 23. Then the first heat sink 3, the second heat sink 4, the mounting cage 1 and the housing 21 are fixed.
[0065] In summary, by providing windows on the mounting cage 1 and housing 21 that are compatible with the first heat sink 3, the first heat sink 3 can penetrate into the housing 21 to dissipate heat from the digital signal processor 23. Furthermore, based on this mating structure design, the cumulative effects of tolerances such as the machining accuracy of the inner cavity of the housing 21, the thickness of the digital signal processor 23, and the thickness of the PCB board can be effectively eliminated during the assembly of the optical module assembly. This allows for better control of the gap between the digital signal processor 23 and the inner wall of the housing 21 (the gap value after structural design improvement is smaller, reaching less than 0.1 mm), which helps to shorten the heat dissipation path and thus reduce the junction temperature. In addition, it can also eliminate the interface thermal resistance between the optical module 2 and the mounting cage 1, further reducing the junction temperature. Moreover, the structural design of this optical module assembly 100 allows for a wider range of thicknesses of the compatible digital signal processor 23, increasing production flexibility and enabling the optical module assembly 100 to be configured in more models.
[0066] Printed Circuit Board Assembly Examples
[0067] The printed circuit board assembly includes a second printed circuit board and the optical module component described in the above-described optical module assembly embodiment, wherein the optical module component is mounted on the second printed circuit board. By configuring the optical module component, the printed circuit board assembly can improve its performance stability and reliability, and extend its service life.
[0068] Examples of optical communication equipment
[0069] The optical communication equipment includes the printed circuit board assembly described in the above-mentioned printed circuit board assembly embodiment. By configuring the above-mentioned printed circuit board assembly, the optical communication equipment can achieve stronger performance stability, higher reliability, and longer service life. At the same time, the optical module itself also has better power redundancy capability, which helps to improve the performance of the optical communication equipment.
[0070] Finally, it should be emphasized that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. For those skilled in the art, the present utility model can have various changes and modifications. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.
Claims
1. An optical module assembly, comprising a mounting cage, an optical module, and a first heat sink, wherein the optical module comprises a housing, a first printed circuit board, and a digital signal processor, the housing being mounted within the mounting cage, the first printed circuit board being mounted within the housing, and the digital signal processor being mounted on the first printed circuit board, characterized in that: The housing has a first window at the digital signal processor, and the mounting cage has a second window at the first window. The first window connects the second window and the interior of the housing. The first heat sink passes through the first window and the second window and is connected to the digital signal processor.
2. The optical module assembly according to claim 1, characterized in that: Thermal adhesive is provided between the first heat sink and the digital signal processor.
3. The optical module assembly according to claim 2, characterized in that: The first heat sink has a first base and a first fin group, the first base passes through the first window and the second window, and the thermally conductive adhesive is disposed between the first base and the digital signal processor; The first fin assembly is disposed on the first seat and is located outside the mounting cage.
4. The optical module assembly according to claim 3, characterized in that: The first seat is located inside the mounting cage, and the side of the first seat facing away from the digital signal processor is flush with the outer surface of the side wall of the mounting cage having the second window; or The first seat extends outside the mounting cage.
5. The optical module assembly according to claim 4, characterized in that: The first seat is interference-fitted with the first window and the second window; and / or The first seat is welded and fixed to the first window and the second window, or The first seat is glued and fixed to the first window and the second window.
6. The optical module assembly according to claim 3, characterized in that: The first width of the first seat portion is greater than or equal to the second width of the digital signal processor; and / or The first length of the first seat is greater than or equal to the second length of the digital signal processor.
7. The optical module assembly according to any one of claims 1 to 6, characterized in that: The optical module assembly also includes a second heat sink, which is mounted on the mounting cage.
8. The optical module assembly according to claim 7, characterized in that: The second heat sink is integrally formed with the first heat sink.
9. A printed circuit board assembly, including a second printed circuit board, characterized in that, It also includes the optical module assembly as described in any one of claims 1 to 8, the optical module assembly being mounted on the second printed circuit board.
10. An optical communication device, characterized in that, Includes the printed circuit board assembly as described in claim 9.