High-precision photoetching machine with feeding structure

Abstract

The utility model discloses a high-precision photoetching machine with a feeding structure, which relates to the technical field of photoetching machines, and comprises a photoetching machine body and a feeding conveyor belt, the feeding conveyor belt is arranged on the inner wall surface of the photoetching machine body, a detection structure is arranged on the inner wall surface of the photoetching machine body, and the feeding conveyor belt is arranged on the detection structure. A feeding fixing frame is mounted on the inner wall surface of the photoetching machine body, a feeding structure is mounted on the upper wall surface of the feeding fixing frame, and a recycling structure is mounted below the feeding conveyor belt; when the silicon wafers pass through the first detection module, the detection modules mark defective silicon wafers in the system, and when the silicon wafers pass through the second detection module, the second detection module controls the feeding structure to operate, recover the defective silicon wafers and feed qualified silicon wafers, so that the problems that the feeding line of the photoetching machine is relatively long, part of the silicon wafers are possibly damaged during feeding, and the production efficiency is high are solved. The problems that the existing high-precision photoetching machine needs to manually detect whether the fed silicon wafer has flaws or not during feeding, and the manpower consumption is relatively serious are solved.

Description

Technical Field

[0001] This utility model relates to the field of lithography machine technology, and in particular to a high-precision lithography machine with a feeding structure. Background Technology

[0002] Photolithography is the most complex and critical process in semiconductor chip manufacturing, characterized by its long processing time and high cost. The difficulty and key to semiconductor chip production lies in how to create the target circuit pattern on a silicon wafer, a process achieved through photolithography. The level of photolithography directly determines the chip's manufacturing process and performance.

[0003] Because the lithography machine's feeding line is long, some silicon wafers may be damaged during feeding, affecting the lithography progress. Existing high-precision lithography machines require manual inspection of the fed silicon wafers for defects, which is quite labor-intensive. Existing high-precision lithography machines also require manual waste collection, and the collection port requires dedicated personnel to wait, which is tedious and labor-intensive. Utility Model Content

[0004] The technical problem this utility model aims to solve is that due to the long feeding line of the lithography machine, some silicon wafers may be damaged during feeding, affecting the lithography progress. Existing high-precision lithography machines require manual inspection of the fed silicon wafers for defects, which is labor-intensive. Existing high-precision lithography machines also require manual waste collection, and the collection port requires dedicated personnel to wait, which is tedious and labor-intensive.

[0005] To solve the above-mentioned technical problems, the technical solution of this utility model is a high-precision lithography machine with a feeding structure, including a lithography machine body and a feeding conveyor belt. The feeding conveyor belt is installed on the inner wall of the lithography machine body, a detection structure is installed on the inner wall of the lithography machine body, a loading fixing frame is installed on the inner wall of the lithography machine body, a loading structure is installed on the upper wall of the loading fixing frame, and a recycling structure is installed below the feeding conveyor belt.

[0006] As a further embodiment of this utility model: the detection structure includes: two sets of adjusting rods and two detection modules; the two sets of adjusting rods are respectively installed on the inner wall surface of the lithography machine body, and the two detection modules are respectively installed on the lower wall surface of the two sets of adjusting rods.

[0007] As a further embodiment of this utility model: the feeding structure includes: a telescopic rod, a feeding rotating sleeve, two support arms, and two vacuum suction cups; the telescopic rod is installed on the upper wall of the feeding fixing frame, the feeding rotating sleeve is fitted on the upper end face of the telescopic rod, the two support arms are symmetrically distributed and installed on the outer wall of the feeding rotating sleeve, and the two vacuum suction cups are respectively installed on the lower wall of the two support arms.

[0008] As a further embodiment of this utility model: the recycling structure includes: a load-bearing seat, a guide rod, a return spring, a recycling rotating sleeve, a support seat, two sliding grooves, two sliding tables, two recycling boxes, two infrared emitting contacts, and an infrared receiving contact; the load-bearing seat is installed on the lower wall of the feeding conveyor belt, the guide rod is installed on the upper wall of the load-bearing seat, the return spring is fitted on the outer wall of the guide rod, the recycling rotating sleeve is fitted on the upper end face of the guide rod, the support seat is installed on the upper wall of the recycling rotating sleeve, the two sliding grooves are respectively opened on the upper wall of the support seat, the two sliding tables are respectively installed in the two sliding grooves, the two recycling boxes are respectively installed on the upper wall of the two sliding tables, the two infrared emitting contacts are respectively installed on the lower wall of the support seat, and the infrared receiving contact is installed on the upper wall of the load-bearing seat.

[0009] As a further embodiment of this utility model: a waste guide frame is installed on the side wall of the feeding and fixing frame.

[0010] As a further embodiment of this utility model: a wafer support stage is installed on the inner wall surface of the lithography machine body.

[0011] As a further embodiment of this utility model: a damper is connected between the guide rod and the recycling swivel.

[0012] The present invention adopts the above technical solution and has the following advantages compared with the prior art:

[0013] When a silicon wafer passes through the first inspection module, the module marks the defective wafer in the system. When it passes through the second inspection module, the second inspection module controls the feeding structure to recover the defective wafer and feed the qualified wafer. This solves the problem that due to the long feeding line of the lithography machine, some silicon wafers may be damaged during feeding, affecting the lithography progress. The existing high-precision lithography machines require manual inspection of the fed silicon wafers for defects, which is a serious labor cost.

[0014] When the recycling bin recycles defective silicon wafers, the support base drives the recycling rotating sleeve to move downwards along the guide rod. The return spring contracts, and the infrared emitting contact gets closer and closer to the infrared receiving contact. When the infrared receiving contact receives the distance signal and reaches the set value, the recycling rotating sleeve rotates half a revolution around the guide rod, and another recycling bin continues to recycle defective silicon wafers. This solves the problem that existing high-precision lithography machines require manual waste recycling, and the recycling port requires a dedicated person to wait, which is tedious and consumes a lot of manpower. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of a high-precision lithography machine with a feeding structure according to an embodiment of the present invention;

[0016] Figure 2This is a schematic diagram of the detection structure of a high-precision lithography machine with a feeding structure according to an embodiment of the present invention.

[0017] Figure 3 This is a schematic diagram of the feeding structure of a high-precision lithography machine with a feeding structure according to an embodiment of the present invention;

[0018] Figure 4 This is a schematic diagram of the recycling structure of a high-precision lithography machine with a feeding structure according to an embodiment of the present invention.

[0019] In the diagram: 1. Lithography machine body; 2. Feeding conveyor belt; 3. Loading fixing frame; 4. Adjusting rod; 5. Detection module; 6. Telescopic rod; 7. Loading rotating sleeve; 8. Support arm; 9. Vacuum chuck; 10. Loading seat; 11. Guide rod; 12. Return spring; 13. Recycling rotating sleeve; 14. Support base; 15. Slide groove; 16. Slide table; 17. Recycling box; 18. Infrared emitting contact; 19. Infrared receiving contact; 20. Waste guide frame; 21. Wafer carrier platform. Detailed Implementation

[0020] The following further describes specific embodiments of the present invention in conjunction with the accompanying drawings. It should be noted that the descriptions of these embodiments are intended to aid understanding of the present invention and do not constitute limitations on the present invention. Furthermore, the technical features involved in the various embodiments of the present invention described below may be combined with one another as long as they do not conflict with one another.

[0021] Example 1, please refer to Figures 1-4 A high-precision lithography machine with a feeding structure includes a lithography machine body 1 and a feeding conveyor belt 2. The feeding conveyor belt 2 is installed on the inner wall of the lithography machine body 1. A detection structure is installed on the inner wall of the lithography machine body 1. A loading fixing frame 3 is installed on the inner wall of the lithography machine body 1. A loading structure is installed on the upper wall of the loading fixing frame 3. A recycling structure is installed below the feeding conveyor belt 2.

[0022] Please see Figure 2 The detection structure includes two sets of adjusting rods 4 and two detection modules 5; the two sets of adjusting rods 4 are respectively installed on the inner wall surface of the lithography machine body 1, and the two detection modules 5 are respectively installed on the lower wall surface of the two sets of adjusting rods 4.

[0023] Please see Figure 3 The feeding structure includes: a telescopic rod 6, a feeding rotating sleeve 7, two support arms 8, and two vacuum suction cups 9; the telescopic rod 6 is installed on the upper wall of the feeding fixing frame 3, the feeding rotating sleeve 7 is fitted on the upper end face of the telescopic rod 6, the two support arms 8 are symmetrically distributed and installed on the outer wall of the feeding rotating sleeve 7, and the two vacuum suction cups 9 are installed on the lower wall of the two support arms 8 respectively.

[0024] Please see Figure 3 The side wall of the loading and fixing frame 3 is equipped with a waste guide frame 20. In this embodiment, the defective silicon wafers enter the recycling box 17 through the waste guide frame 20 to wait for processing.

[0025] Please see Figure 1 The inner wall of the lithography machine body 1 is equipped with a wafer carrier stage 21. In this embodiment, the telescopic rod 6 drives the two support arms 8 to descend, and the vacuum chuck 9 above the wafer carrier stage 21 stops adsorbing the silicon wafer and places the silicon wafer on the wafer carrier stage 21.

[0026] In this embodiment, when the silicon wafer passes through the first detection module 5, the detection module 5 marks the defective silicon wafer in the system. When it passes through the second detection module 5, the second detection module 5 controls the operation of the feeding structure to recover the defective silicon wafer and feed the qualified silicon wafer.

[0027] Specifically, the operator places a label on the feeding conveyor belt 2 and controls the two sets of adjusting rods 4 to extend and retract, allowing the two detection modules 5 to focus. Then, the feeding conveyor belt 2 is started. When the feeding conveyor belt 2 transports the silicon wafer, it marks the defective silicon wafer in the system when it passes the first detection module 5. When it passes the second detection module 5, the second detection module 5 controls the operation of the loading structure. When the silicon wafer surface is undamaged, the telescopic rod 6 drives the loading rotating sleeve 7 to descend. The loading rotating sleeve 7, through two support arms 8, drives two vacuum suction cups 9 to descend. The vacuum suction cups 9 in the direction of the feeding conveyor belt 2 adsorb the silicon wafer. Afterwards, the telescopic rod 6 drives the two vacuum suction cups 9 to reset. Then, the loading rotating sleeve 7 drives the two support arms 8 to rotate 90 degrees. When the photolithography on the silicon wafer on the wafer carrier stage 21 is finished, the loading rotating sleeve... 7 drives the vacuum chuck 9, which adsorbs silicon wafers, to continue rotating 90 degrees. Then, the telescopic rod 6 drives the two support arms 8 to descend, and the vacuum chuck 9 above the wafer carrier 21 stops adsorbing silicon wafers and places them on the wafer carrier 21. At the same time, another vacuum chuck 9 adsorbs the silicon wafers on the feeding conveyor belt 2 again. Then, the telescopic rod 6 drives the two vacuum chucks 9 to reset, and the loading rotating sleeve 7 drives the two support arms 8 to rotate 90 degrees, clearing the photolithography operation position above the wafer carrier 21. After the silicon wafer has completed photolithography, the operator removes the silicon wafer and repeats the above operation. When the second detection module 5 confirms that the silicon wafer on the feeding conveyor belt 2 has defects, it controls the loading structure to remain stationary and controls the feeding conveyor belt 2 to continue conveying new silicon wafers. The defective silicon wafers enter the recycling bin 17 through the waste guide 20 to wait for processing.

[0028] Example 2, please refer to Figure 4The recycling structure includes: a load-bearing seat 10, a guide rod 11, a return spring 12, a recycling rotating sleeve 13, a support seat 14, two slides 15, two sliding tables 16, two recycling boxes 17, two infrared emitting contacts 18, and an infrared receiving contact 19. The load-bearing seat 10 is installed on the lower wall of the feeding conveyor belt 2, the guide rod 11 is installed on the upper wall of the load-bearing seat 10, the return spring 12 is fitted on the outer wall of the guide rod 11, the recycling rotating sleeve 13 is fitted on the upper end face of the guide rod 11, the support seat 14 is installed on the upper wall of the recycling rotating sleeve 13, the two slides 15 are respectively opened on the upper wall of the support seat 14, the two sliding tables 16 are respectively installed in the two slides 15, the two recycling boxes 17 are respectively installed on the upper wall of the two sliding tables 16, the two infrared emitting contacts 18 are respectively installed on the lower wall of the support seat 14, and the infrared receiving contact 19 is installed on the upper wall of the load-bearing seat 10.

[0029] Please see Figure 3 A damper is connected between the guide rod 11 and the recycling sleeve 13. In this embodiment, after the recycling box 17 is separated from the support base 14, the reset spring 12 expands and, together with the damper, drives the recycling sleeve 13 to move upward along the guide rod 11. The damper can enhance the stability of the reset.

[0030] In this embodiment, when the recycling bin 17 recycles defective silicon wafers, the recycling rotating sleeve 13 is driven to move downward along the guide rod 11 by the support base 14. The reset spring 12 contracts, and the infrared emitting contact 18 gets closer and closer to the infrared receiving contact 19. When the infrared receiving contact 19 receives a distance signal that reaches the set value, the recycling rotating sleeve 13 rotates half a turn around the guide rod 11, and the other recycling bin 17 continues to recycle defective silicon wafers.

[0031] Specifically, when recycling bin 17 recycles defective silicon wafers, the recycling rotating sleeve 13 moves downward along the guide rod 11 via the support base 14. The reset spring 12 contracts, and the infrared emitting contact 18 gets closer and closer to the infrared receiving contact 19. When the infrared receiving contact 19 receives a distance signal that reaches the set value, the recycling rotating sleeve 13 rotates half a turn around the guide rod 11, and another recycling bin 17 continues to recycle defective silicon wafers. At this time, the infrared receiving contact 19 temporarily stops receiving signals, triggering the internal alarm device of the lithography machine body 1 to remind the operator to replace the recycling bin 17 filled with defective silicon wafers. When replacing, the operator holds the recycling bin 17 and pulls it out along the slide 15. The recycling bin 17 drives the slide table 16 to move outward. After the recycling bin 17 is separated from the support base 14, the reset spring 12 expands, and in conjunction with the damper, drives the recycling rotating sleeve 13 to move upward along the guide rod 11. The damper can enhance the stability of the reset. After the operator replaces the recycling bin 17, the infrared receiving contact 19 is restarted to continue the above process.

[0032] The embodiments of the present invention are described in detail above with reference to the accompanying drawings, but the present invention is not limited to the described embodiments. It is clear to those skilled in the art that various changes, modifications, substitutions, and variations to these embodiments may be made without departing from the principles and spirit of the present invention, and these changes and modifications still fall within the scope of protection of the present invention.

Claims

1. A high-precision lithography machine with a feeding structure, comprising a lithography machine body (1) and a feeding conveyor belt (2), characterized in that, The feeding conveyor belt (2) is installed on the inner wall of the lithography machine body (1). A detection structure is installed on the inner wall of the lithography machine body (1). A loading fixing frame (3) is installed on the inner wall of the lithography machine body (1). A loading structure is installed on the upper wall of the loading fixing frame (3). A recycling structure is installed below the feeding conveyor belt (2).

2. A high-precision lithography machine with a feeding structure according to claim 1, characterized in that, The detection structure includes: two sets of adjusting rods (4) and two detection modules (5); The two sets of adjustment rods (4) are respectively installed on the inner wall of the lithography machine body (1), and the two detection modules (5) are respectively installed on the lower wall of the two sets of adjustment rods (4).

3. A high-precision lithography machine with a feeding structure according to claim 1, characterized in that, The feeding structure includes: a telescopic rod (6), a feeding rotating sleeve (7), two support arms (8), and two vacuum suction cups (9); The telescopic rod (6) is installed on the upper wall of the loading fixing frame (3), the loading rotating sleeve (7) is fitted on the upper end face of the telescopic rod (6), the two support arms (8) are symmetrically distributed and installed on the outer wall of the loading rotating sleeve (7), and the two vacuum suction cups (9) are installed on the lower wall of the two support arms (8).

4. A high-precision lithography machine with a feeding structure according to claim 1, characterized in that, The recycling structure includes: a load-bearing base (10), a guide rod (11), a return spring (12), a recycling rotating sleeve (13), a support base (14), two slides (15), two slide tables (16), two recycling boxes (17), two infrared emitting contacts (18), and an infrared receiving contact (19). The load-bearing seat (10) is installed on the lower wall of the feeding conveyor belt (2), the guide rod (11) is installed on the upper wall of the load-bearing seat (10), the reset spring (12) is fitted on the outer wall of the guide rod (11), the recycling sleeve (13) is fitted on the upper end face of the guide rod (11), the support seat (14) is installed on the upper wall of the recycling sleeve (13), the two slides (15) are respectively opened on the upper wall of the support seat (14), the two slides (16) are respectively installed in the two slides (15), the two recycling boxes (17) are respectively installed on the upper wall of the two slides (16), the two infrared emitting contacts (18) are respectively installed on the lower wall of the support seat (14), and the infrared receiving contact (19) is installed on the upper wall of the load-bearing seat (10).

5. A high-precision lithography machine with a feeding structure according to claim 1, characterized in that, The side wall of the feeding fixing frame (3) is equipped with a waste guide frame (20).

6. A high-precision lithography machine with a feeding structure according to claim 1, characterized in that, The inner wall of the lithography machine body (1) is equipped with a wafer carrier stage (21).

7. A high-precision lithography machine with a feeding structure according to claim 4, characterized in that, A damper is connected between the guide rod (11) and the recovery swivel (13).

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