Chip assembly and electronic equipment

Abstract

The utility model provides a chip assembly and electronic equipment. The chip assembly comprises a chip, a first heat conducting plate and a second heat conducting plate, the chip comprises a top surface and a bottom surface which are arranged back to back, the top surface of the chip is connected with the first heat conducting plate, and the bottom surface of the chip is connected with the second heat conducting plate. The chip assembly further comprises a third heat-conducting piece, the first end of the third heat-conducting piece is connected with the first heat-conducting plate, and the second end of the third heat-conducting piece is connected with the second heat-conducting plate. Heat generated by the chip can be transmitted to the first heat conduction plate through the top surface of the chip and can be transmitted to the second heat conduction part through the bottom surface of the chip, and heat transmission between the first heat conduction plate and the second heat conduction plate can be realized through the third heat conduction part, so that the first heat conduction plate and the second heat conduction plate can dissipate heat quickly; therefore, the heat dissipation effect of the chip assembly and the electronic equipment is better.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology, and more particularly to a chip assembly and electronic device. Background Technology

[0002] Current terminal devices have high overall thermal resistance in their internal chip packaging, which makes the chips prone to heat buildup under high load scenarios, affecting chip performance.

[0003] Traditional heat dissipation solutions typically reduce chip junction temperature by increasing the heat dissipation area of ​​the device and increasing the airflow. However, the limited internal space of terminal devices often makes it difficult to increase the heat dissipation area of ​​the device. Increasing the airflow requires a larger fan, which not only occupies the limited internal space of the terminal device, but also worsens the noise of the terminal device and increases power consumption. Utility Model Content

[0004] This application provides a chip component and an electronic device, which have better heat dissipation performance.

[0005] In a first aspect, embodiments of this application provide a chip assembly. The chip assembly includes a chip, a first heat-conducting plate, and a second heat-conducting plate. The chip includes a top surface and a bottom surface disposed opposite to each other. The top surface of the chip is in contact with and connected to the first heat-conducting plate. Alternatively, the chip assembly further includes a first heat-conducting element, at least a portion of which is located between the top surface of the chip and the first heat-conducting plate, and is in contact with and connected to both the top surface of the chip and the first heat-conducting plate. The bottom surface of the chip is in contact with and connected to the second heat-conducting plate. Alternatively, the chip assembly further includes a second heat-conducting element, at least a portion of which is located between the bottom surface of the chip and the second heat-conducting plate, and is in contact with and connected to both the bottom surface of the chip and the second heat-conducting plate. The chip assembly further includes a third heat-conducting element, which includes a first end and a second end. The first end of the third heat-conducting element is connected to the first heat-conducting plate, and the second end of the third heat-conducting element is connected to the second heat-conducting plate.

[0006] In this embodiment, the heat generated by the chip can be transferred to the first heat-conducting plate via the top surface of the chip, and simultaneously transferred to the second heat-conducting component via the bottom surface of the chip. It is understood that both the top and bottom surfaces of the chip can be used for heat transfer, allowing the heat generated by the chip to be transferred from opposite sides of the chip to the outside, achieving dual-sided heat dissipation. Compared to schemes where heat transfer occurs only from the top or bottom surface (i.e., single-sided heat dissipation), the chip assembly in this embodiment improves the chip's heat dissipation efficiency, facilitating rapid cooling and preventing excessively high chip temperatures that could affect chip performance. This, in turn, improves the reliability of the chip assembly and the electronic device.

[0007] Furthermore, in this embodiment, the third heat-conducting component connects the first heat-conducting plate and the second heat-conducting plate, thereby enabling heat transfer between the two plates. It is understood that when the temperature of the first heat-conducting plate is higher than that of the second heat-conducting plate, heat on the first heat-conducting plate can be transferred to the second heat-conducting plate through the third heat-conducting component, allowing the first heat-conducting plate to dissipate heat more quickly, thus further achieving rapid cooling of the chip; conversely, when the temperature of the first heat-conducting plate is lower than that of the second heat-conducting plate, heat on the second heat-conducting plate can be transferred to the first heat-conducting plate through the third heat-conducting component, allowing the second heat-conducting plate to dissipate heat more quickly, thus further achieving rapid cooling of the chip.

[0008] In one possible implementation, the chip assembly further includes a motherboard, a portion of which is located between the chip and the second heat-conducting plate and is fixedly connected to the chip and the second heat-conducting plate; the motherboard has a first through hole, and the second heat-conducting component includes a heat-conducting block, which passes through the first through hole and contacts the chip.

[0009] In this embodiment, the heat-conducting block of the second heat-conducting component can pass through the motherboard and contact the chip, allowing the second heat-conducting plate to transfer heat to the chip via the second heat-conducting component. Furthermore, the second heat-conducting plate does not require an additional protruding structure to protrude from the second through-hole on the motherboard and contact the chip. The structure of the second heat-conducting plate is relatively simple, which simplifies its manufacturing process and saves costs. In addition, the cooperation between the heat-conducting block and the second through-hole on the motherboard facilitates positioning of the second heat-conducting plate during installation.

[0010] In one possible implementation, the second heat-conducting component further includes a heat-conducting sheet, a portion of which is located between the heat-conducting block and the second heat-conducting plate, and contacts both the heat-conducting block and the second heat-conducting plate; a portion of which is located between the main board and the second heat-conducting plate, and contacts both the main board and the second heat-conducting plate.

[0011] In this embodiment, heat transfer can be achieved between the heat-conducting block, the heat-conducting sheet, the motherboard, and the second heat-conducting plate. Thus, after heat from the heat-conducting block is transferred to the heat-conducting sheet, heat from the heat-conducting sheet can be transferred to the second heat-conducting plate, and heat from the heat-conducting sheet can also be transferred to the motherboard. Furthermore, the area of ​​the heat-conducting sheet can be larger than the area of ​​the heat-conducting block, allowing the heat-conducting sheet to evenly transfer heat from the heat-conducting block to the second heat-conducting plate and the motherboard.

[0012] In one possible implementation, the heat-conducting sheet comprises graphite. This results in better thermal conductivity, increasing the heat transfer rate between the heat-conducting block and the second heat-conducting plate, thus facilitating faster heat transfer from the heat-conducting block to the second heat-conducting plate. Furthermore, the heat-conducting sheet can be thinner, which helps reduce the stacking height of the chip components.

[0013] In one possible implementation, the chip includes a processor and a memory, the processor and the memory are fixedly connected and stacked, the memory is in contact with a first heat-conducting plate or a first heat-conducting component; the processor is connected to a second heat-conducting plate or a second heat-conducting component.

[0014] Understandably, in this embodiment, the processor and memory can be assembled using a stacked package technology, that is, the memory is stacked and soldered on top of the processor, which can ensure the communication speed between the processor and the memory. However, this increases the thermal resistance of the chip package and compresses the heat dissipation stacking space of the chip, resulting in a higher thermal resistance between the chip and the environment. The chip then has a greater need for heat dissipation. The chip assembly in this embodiment can dissipate heat from the chip in a timely and rapid manner, which helps ensure the chip's performance.

[0015] In one possible implementation, the chip further includes an adapter board located on the side of the processor opposite to the memory and fixedly connected to the processor. The adapter board is communicatively connected to the processor and the motherboard. The adapter board includes a first side and a second side arranged opposite to each other. The first side of the adapter board is connected to the processor, and a portion of the second side of the adapter board is connected to the motherboard, while a portion is in contact with a second heat-conducting component.

[0016] In this embodiment, a portion of the second side of the adapter board can connect to the motherboard, allowing the processor and memory to transmit signals with the motherboard via the adapter board. It is understood that by providing the adapter board, functions such as integrated interface conversion, high-speed signal transmission, power management, and protection circuitry can be provided for the processor and memory, and the various power requirements of different interfaces can be effectively handled. Furthermore, a portion of the second side of the adapter board can contact the second heat-conducting component, allowing heat transfer between the processor and memory via the adapter board, thus transferring the heat generated by the processor and memory to the second heat-conducting component.

[0017] In one possible implementation, the third heat-conducting element is columnar and extends through the main board. A first end of the third heat-conducting element is fixedly connected to the first heat-conducting plate, and / or a second end is fixedly connected to the second heat-conducting plate. This ensures a more secure connection between the first and / or second heat-conducting plates and the third heat-conducting element, preventing the third heat-conducting element from easily detaching from them. This allows the first and / or second heat-conducting plates to maintain contact for heat transfer, and reduces the likelihood of failure in the heat transfer path between the first and second heat-conducting plates.

[0018] In one possible implementation, the third heat-conducting element is columnar, passes through the motherboard, and is riveted to the motherboard.

[0019] It is understood that, in this embodiment, the second through hole of the motherboard can be a riveting hole. The third heat-conducting component can be fixedly connected to the motherboard, thereby indirectly connecting the first heat-conducting plate and the second heat-conducting plate. A certain displacement is allowed between the first heat-conducting plate, the second heat-conducting plate, and the third heat-conducting component, which can alleviate stress caused by external factors, reduce the risk of breakage due to stress concentration at the connection between the first heat-conducting plate, the second heat-conducting plate, and the third heat-conducting component, and thus improve the connection reliability between the first heat-conducting plate, the second heat-conducting plate, and the third heat-conducting component.

[0020] In one possible implementation, the third heat-conducting component includes a first column portion, a second column portion, and a heat-conducting wire portion, with the heat-conducting wire portion fixedly connected between the first column portion and the second column portion; the main board is provided with a second through hole, the first column portion and the second column portion are respectively located on opposite sides of the second through hole, and both are fixedly connected to the main board, with at least a portion of the heat-conducting wire portion located in the second through hole.

[0021] It is understood that, in this embodiment, the second through hole of the motherboard can be a hot wire hole. The first and second pillar portions of the third heat-conducting component can be fixedly connected to the motherboard, thereby allowing the third heat-conducting component to indirectly connect to the first and second heat-conducting plates. Furthermore, a certain degree of displacement is permitted between the first, second, and third heat-conducting plates, which can alleviate stress caused by external factors and reduce the risk of breakage due to stress concentration at the connection points of the first, second, and third heat-conducting plates, thus improving the reliability of the connection between them.

[0022] In one possible implementation, the chip assembly further includes a first shield and a second shield, the first shield being located between the first heat-conducting plate and the motherboard and connecting the first heat-conducting plate and the motherboard; at least a portion of the second shield is located between the third heat-conducting plate and the first heat-conducting plate and connecting the third heat-conducting plate and the first heat-conducting plate.

[0023] In this embodiment, the first shielding component, the first heat-conducting plate, and the motherboard can form an inner shielding loop. For example, the copper leakage on the side of the first shielding component, the first heat-conducting plate, and the motherboard facing the chip can form an inner shielding loop. The second shielding component, the third heat-conducting component, the second heat-conducting plate, and the motherboard can form an outer shielding loop. For example, the copper leakage on the side of the second shielding component, the third heat-conducting component, the second heat-conducting plate, and the motherboard facing away from the chip can form an outer shielding loop.

[0024] It is understood that the processor and memory in this embodiment employ package stacking technology, which enhances the electromagnetic interference radiation of the chip. However, the chip assembly in this embodiment can form an inner shielding loop and an outer shielding loop around the chip. Compared to a chip assembly with only an inner shielding loop, the chip assembly provided in this embodiment has better radiation resistance and can significantly reduce the risk of EMI radiation from the chip.

[0025] In one possible implementation, the second shielding element is deformable. For example, the second shielding element can be conductive foam or a spring. Thus, when the third heat-conducting element is connected to the first heat-conducting plate, a certain displacement or deformation is allowed between the third heat-conducting element and the first heat-conducting plate. This can absorb or alleviate stress caused by external factors, reducing the risk of breakage due to stress concentration at the connection between the third heat-conducting element and the first heat-conducting plate, thereby improving the reliability of the connection between the third heat-conducting element and the first heat-conducting plate.

[0026] In one possible implementation, the chip assembly further includes a fourth thermal conductive element, at least a portion of which is located between the third thermal conductive element and the first thermal conductive plate, and is connected to and in contact with both the third thermal conductive element and the first thermal conductive plate; at least a portion of the fourth thermal conductive element is disposed in the same layer as the second shielding element.

[0027] It is understood that in this application example, since at least a portion of the second shielding member is disposed between the third heat-conducting member and the first heat-conducting plate, in order to avoid gaps between the third heat-conducting member and the first heat-conducting plate outside the second shielding member, this embodiment provides at least a portion of a fourth heat-conducting member disposed in the same layer as the second shielding member, and the fourth heat-conducting member contacts both the third heat-conducting member and the first heat-conducting plate, thereby eliminating at least a portion of the gap between the third heat-conducting member and the first heat-conducting plate. In this way, heat transfer between the third heat-conducting member and the first heat-conducting plate can be achieved through the fourth heat-conducting member, thereby improving the heat transfer rate between the third heat-conducting member and the first heat-conducting plate.

[0028] In one possible implementation, there are multiple third heat-conducting elements arranged around the chip. This way, when heat is transferred between the first and second heat-conducting plates via the third heat-conducting elements, the heat transfer rate between the first and second heat-conducting plates is faster, and the temperature uniformity between the first and second heat-conducting plates is better, which helps to avoid the risk of localized heat concentration.

[0029] In one possible implementation, the second heat-conducting plate is made of metal. This way, on the one hand, the third heat-conducting element has better thermal conductivity, enabling rapid heat transfer; on the other hand, the third heat-conducting element has sufficient strength to support the first heat-conducting plate.

[0030] In one possible implementation, the chip assembly further includes a fastener that securely connects the first heat-conducting plate and the second heat-conducting plate, and the fastener is used for grounding.

[0031] In this embodiment, the first heat-conducting plate can be fixedly connected to the second heat-conducting plate using fasteners. This improves the connection strength between the first and second heat-conducting plates, preventing the failure of the heat transfer path of the chip assembly; furthermore, the fasteners can be used for grounding, thereby improving the signal stability between the chip and external circuits, reducing signal interference, and improving the reliability of signal transmission.

[0032] In one possible implementation, the chip assembly further includes a first thermally conductive element and a first heat dissipation fin, with the first thermally conductive element connecting the first heat dissipation fin and the first thermally conductive plate. This allows heat on the first thermally conductive plate to be transferred to the first heat dissipation fin via the first thermally conductive element, enabling faster heat dissipation for both the first thermally conductive plate and the chip assembly, thus improving the heat dissipation efficiency of the chip assembly. Furthermore, when the temperature of the first thermally conductive plate is lower than that of the second thermally conductive plate, heat on the second thermally conductive plate can be transferred to the first thermally conductive plate via a third thermally conductive element, allowing the second thermally conductive plate to also dissipate heat quickly, further enabling rapid cooling of the chip.

[0033] In one possible implementation, the chip assembly further includes a first air source for blowing air onto the first heat sink fins. It is understood that in this embodiment, the first air source can blow air onto the first heat sink fins to remove heat, thereby further improving the heat dissipation efficiency of the chip assembly.

[0034] Secondly, embodiments of this application provide an electronic device. The electronic device includes a housing and the aforementioned chip assembly. The housing has an internal space, the chip assembly is mounted in the internal space, and a second heat-conducting plate of the chip assembly is connected to the housing.

[0035] In this embodiment, the second heat-conducting plate of the chip assembly can be connected to the housing of the electronic device, and heat transfer can be achieved between the second heat-conducting plate and the housing. In this way, the heat generated by the chip in the chip assembly can be transferred to the housing through the second heat-conducting plate, and then dissipated from the housing to the outside of the electronic device, thereby improving the heat dissipation efficiency of the chip assembly and the electronic device.

[0036] Thirdly, embodiments of this application provide an electronic device. The electronic device includes a heat dissipation component and the aforementioned chip component, the heat dissipation component being connected to a first heat-conducting plate.

[0037] In this embodiment, heat transfer is achieved between the heat dissipation component and the first heat-conducting plate of the chip component. This allows heat from the chip component to be transferred to the heat dissipation component, which in turn dissipates heat from the chip component, thereby reducing its temperature and ensuring the reliability of the chip component and the electronic device. Furthermore, when the temperature of the first heat-conducting plate is lower than that of the second heat-conducting plate, heat from the second heat-conducting plate can be transferred to the first heat-conducting plate through a third heat-conducting component, allowing the second heat-conducting plate to also dissipate heat more quickly, further enabling rapid cooling of the chip.

[0038] In one possible implementation, the heat dissipation component includes a second thermally conductive element and a second heat dissipation fin, with the second thermally conductive element connecting the second heat dissipation fin and a first thermally conductive plate. In this way, heat on the first heat dissipation plate can be transferred to the second heat dissipation fin through the second thermally conductive element, allowing the chip assembly to dissipate heat more quickly and improving the heat dissipation efficiency of the chip assembly and electronic device.

[0039] In one possible implementation, the heat dissipation component further includes a second air source for blowing air onto the second heat dissipation fins. It is understood that in this embodiment, the second air source can blow air onto the second heat dissipation fins to remove heat from them, which helps to further improve the heat dissipation efficiency of the chip components and electronic devices.

[0040] In one possible implementation, the electronic device further includes a housing having an internal space, in which a chip assembly is mounted, and a second heat-conducting plate of the chip assembly is connected to the housing.

[0041] In this embodiment, heat transfer can be achieved between the second heat-conducting plate of the chip assembly and the housing. In this way, the heat generated by the chip in the chip assembly can be transferred to the housing through the second heat-conducting plate, and then dissipated from the housing to the outside of the electronic device, thereby improving the heat dissipation efficiency of the chip assembly and the electronic device. Attached Figure Description

[0042] To more clearly illustrate the technical solutions in the embodiments of this application or the background art, the accompanying drawings used in the embodiments of this application or the background art will be described below.

[0043] Figure 1 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application;

[0044] Figure 2 yes Figure 1 A partial structural schematic diagram of some embodiments of the electronic device shown from another angle;

[0045] Figure 3 yes Figure 2 The diagram shows a partial structure of the electronic device in some embodiments.

[0046] Figure 4 yes Figure 3 An exploded view of part of the heat dissipation component shown;

[0047] Figure 5 yes Figure 2 The diagram shows a structural schematic of the chip assembly in some embodiments;

[0048] Figure 6 yes Figure 5 The diagram shows a partial exploded view of the chip assembly in some embodiments.

[0049] Figure 7 yes Figure 5 The chip assembly shown is a partial cross-sectional view of the structure cut along point AA in some embodiments;

[0050] Figure 8 yes Figure 5 The diagram shows a partial structural schematic of the chip assembly in some embodiments;

[0051] Figure 9 yes Figure 5 The diagram shows a partial structural schematic of the chip assembly from another angle in some embodiments;

[0052] Figure 10 yes Figure 5 The diagram shows a partial structural schematic of the chip assembly in some embodiments;

[0053] Figure 11A yes Figure 2 The chip assembly shown is a partial front view of its structure in some other embodiments;

[0054] Figure 11B yes Figure 11A A schematic diagram of a partial cross-sectional structure of the chip assembly is shown.

[0055] Figure 12A yes Figure 2 The chip assembly shown is a partial front view of its structure in some other embodiments;

[0056] Figure 12B yes Figure 12A A schematic diagram of a partial cross-sectional structure of the chip assembly is shown.

[0057] Figure 13 yes Figure 5 The diagram shows a partial structural schematic of the chip assembly from another angle in some embodiments;

[0058] Figure 14 yes Figure 5 The chip assembly shown is a partial structural cross-sectional view taken along point AA in some other embodiments;

[0059] Figure 15 yes Figure 5 The diagram shows a partial structural schematic of the chip assembly in some embodiments;

[0060] Figure 16 yes Figure 2 The schematic diagram shown is a structural representation of the chip assembly in some other embodiments;

[0061] Figure 17 yes Figure 2 The electronic device shown is a partial structural cross-sectional view taken along BB in some embodiments. Detailed Implementation

[0062] The embodiments of this application are described below with reference to the accompanying drawings.

[0063] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation" and "connection" should be interpreted broadly. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium. "Fixed connection" refers to a connection where the relative positional relationship remains unchanged after the connection.

[0064] The directional terms mentioned in the embodiments of this application, such as "upper", "inner", "outer", "top", "bottom", "side", etc., are only for reference to the directions in the accompanying drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the embodiments of this application, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0065] In the embodiments of this application, the terms "first," "second," "third," and "fourth" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first," "second," "third," and "fourth" may explicitly or implicitly include one or more of that feature.

[0066] In the embodiments of this application, "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0067] References or phrases such as "some embodiments" described in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, phrases such as "in some embodiments," "in other embodiments," "in still others," "in other still others," etc., appearing in different parts of this specification do not necessarily refer to the same embodiments, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized. The term "a plurality of" means at least two.

[0068] It is understood that the specific embodiments described herein are merely illustrative of related embodiments and not intended to limit the scope of those embodiments. Furthermore, it should be noted that, for ease of description, only the parts relevant to the embodiments are shown in the accompanying drawings.

[0069] It should be noted that, unless there is any conflict, the embodiments and features in the embodiments of this application can be combined with each other.

[0070] The present application will now be described in detail with reference to the accompanying drawings and embodiments.

[0071] Please refer to Figure 1 and Figure 2 , Figure 1 This is a schematic diagram of the structure of an electronic device 100 provided in an embodiment of this application. Figure 2 yes Figure 1 The diagram shows a partial structural schematic of some embodiments of the electronic device 100 from another angle. The electronic device can be a laptop computer, mobile phone, tablet computer, laptop computer, personal digital assistant (PDA), camera, personal computer, or other devices with chips. Figure 1 The electronic device illustrated is based on a laptop computer. Of course, other types of electronic devices 100 can also adopt a similar structure, which will not be described in detail below.

[0072] In some embodiments, the electronic device 100 may include a housing 10, a screen 20, and a keyboard 30. The housing 10 may include a first sub-shell 11 and a second sub-shell 12. The first sub-shell 11 and the second sub-shell 12 are capable of opening or folding relative to each other via a hinge. Exemplarily, the screen 20 may be mounted on the first sub-shell 11, which may support and protect the screen 20. The screen 20 is used to display images, text, and videos, etc. In some examples, the screen 20 may also integrate display and touch sensing functions. The display function of the screen 20 is used to display text, images, videos, etc., and the touch sensing function of the screen 20 is used to detect user touch actions to achieve human-computer interaction. Exemplarily, the screen 20 may be a liquid crystal display (LCD), an organic light-emitting diode (OLED) display, a micro organic light-emitting diode (microorganic light-emitting diode) display, or a quantum dot light-emitting diode (QLED) display, etc.

[0073] For example, the second sub-shell 12 may include a cover plate 121 and a base plate 122. The base plate 122 is fixedly connected to the cover plate 121, and the base plate 122 and the cover plate 121 together enclose the internal space 123 of the second sub-shell 12. It is understood that the base plate 122 can cover the internal space 123 of the second sub-shell 12 to protect the internal components of the electronic device 100. When the electronic device 100 is in the open state, the base plate 122 can be used to support the electronic device 100. When the electronic device 100 is in the closed state, at least a portion of the cover plate 121 of the second sub-shell 12 can be disposed facing the first sub-shell 11, and the base plate 122 of the second sub-shell 12 can be disposed away from the first sub-shell 11.

[0074] For example, the keyboard 30 can be installed on the second sub-shell 12, such as on the cover 121 of the second sub-shell 12, which can be used to support the keyboard 30. The keys of the keyboard 30 can be exposed relative to the second sub-shell 12 and facing away from the internal space 123. The keyboard 30 can be used to input and interact with the screen 20 for various operations.

[0075] Please refer to Figure 2 and Figure 3 , Figure 3 yes Figure 2 The diagram shows a partial structure of the electronic device 100 in some embodiments.

[0076] In some embodiments, the electronic device 100 further includes a chip assembly 40. The chip assembly 40 can be mounted within the internal space 123 of the second sub-shell 12. For example, the chip assembly 40 can be fixedly connected to a cover plate 121. Exemplarily, the chip assembly 40 includes a chip. It is understood that the chip is an important power device inside the electronic device 100. During operation, the chip generates a significant amount of heat, requiring substantial heat dissipation. Therefore, the chip assembly 40 needs to have good heat dissipation performance to quickly transfer the heat generated by the chip to the outside of the electronic device 100, ensuring the reliability of the electronic device 100.

[0077] In this embodiment, the electronic device 100 may include a heat dissipation component 50, which can be connected to the chip component 40, and heat transfer can be achieved between the heat dissipation component 50 and the chip component 40. In this way, the heat from the chip component 40 can be transferred to the heat dissipation component 50, and the heat dissipation component 50 can be used to cool the chip component 40, thereby achieving temperature reduction of the chip component 40 and ensuring the reliability of both the chip component 40 and the electronic device 100.

[0078] Please refer to Figures 2 to 4 , Figure 4 yes Figure 3 An exploded view of part of the structure of the heat dissipation component 50 shown.

[0079] In some embodiments, the heat dissipation assembly 50 may include a second heat-conducting element 51, a second heat dissipation fin 52, and a second air source 53. The second heat dissipation fin 52 may be fixedly connected to the second heat-conducting element 51 and the second air source 53. The second heat-conducting element 51 may be in contact with the second heat dissipation fin 52. Heat transfer can be achieved between the second heat-conducting element 51 and the second heat dissipation fin 52. For example, the second heat-conducting element 51 may have a first heat dissipation surface 511, and the second heat dissipation fin 52 may have a second heat dissipation surface 521, with the second heat dissipation surface 521 of the second heat dissipation fin 52 in contact with the first heat dissipation surface 511 of the second heat-conducting element 51.

[0080] In this embodiment, the second heat-conducting element 51 can be a heat pipe, a vapor chamber (VC), etc. The second air source 53 can be used to blow air onto the second heat dissipation fins 52 to dissipate heat. For example, the second air source 53 can be a fan. In other examples, the second air source 53 can also be a vibrating diaphragm or other devices capable of generating airflow; this application does not impose strict limitations on this.

[0081] In this embodiment, the second heat-conducting element 51 can be connected to the chip assembly 40. Heat from the chip assembly 40 can be transferred to the second heat dissipation fins 52 via the second heat-conducting element 51, thereby achieving heat dissipation for the chip assembly 40. The second air source 53 can blow air onto the second heat dissipation fins 52 to remove heat, further improving the heat dissipation efficiency of the chip assembly 40. In some other embodiments, the heat dissipation assembly 50 may not include the second air source 53.

[0082] The above text introduces the main structure of the electronic device 100 and the basic principle of heat dissipation component 50 for chip component 40. The following text will introduce the structure of chip component 40 and the heat dissipation path of chip component 40 in detail with reference to the relevant figures.

[0083] Please combine Figures 5 to 7 , Figure 5 yes Figure 2 The schematic diagram of the chip assembly 40 shown in some embodiments is shown. Figure 6 yes Figure 5 The diagram shown is a partial exploded view of the chip assembly 40 in some embodiments. Figure 7 yes Figure 5 The chip assembly 40 shown is a partial cross-sectional view taken along point AA in some embodiments. It is understood that... Figure 6 The accompanying drawings below only schematically illustrate some of the components included in the chip assembly 40. The actual shape, size, location, and construction of these components are not subject to change. Figure 6 As defined in the accompanying drawings below. In some embodiments, chip assembly 40 may include more or fewer components.

[0084] In some embodiments, the chip assembly 40 may include a chip 41, a first heat-conducting plate 42, a second heat-conducting plate 43, a first heat-conducting component 44, a second heat-conducting component 45, a motherboard 46, a third heat-conducting component 47, a first shielding component 481, a fastener 491, and a connector 492.

[0085] For example, chip 41 may include a top surface 411 and a bottom surface 412 disposed opposite to each other. The top surface 411 of chip 41 is connected to a first heat-conducting plate 42, and the bottom surface 412 of chip 41 is connected to a second heat-conducting plate 43. That is, the first heat-conducting plate 42 and the second heat-conducting plate 43 are respectively located on opposite sides of chip 41 and connected to chip 41. For example, the top surface 411 of chip 41 may contact and be connected to the first heat-conducting plate 42, and the bottom surface 412 of chip 41 may contact and be connected to the second heat-conducting plate 43. In this way, the heat generated by chip 41 can be transferred to the first heat-conducting plate 42 through the top surface 411 of chip 41, and can also be transferred to the second heat-conducting component 45 through the bottom surface 412 of chip 41. It is understood that both the top surface 411 and the bottom surface 412 of chip 41 can be used for heat transfer, so that the heat generated by chip 41 can be transferred from opposite sides of chip 41 to the outside of chip 41, achieving double-sided heat dissipation. Compared to solutions where heat is transferred from the top or bottom surface of the chip, i.e., single-sided heat dissipation solutions, the chip assembly 40 in this embodiment can improve the heat dissipation efficiency of the chip 41, which is conducive to the rapid cooling of the chip 41. This can prevent the chip 41 from overheating and affecting its performance, thereby improving the reliability of the chip assembly 40 and the electronic device 100.

[0086] For example, the first heat-conducting plate 42 can be made of thermally conductive metals such as copper, aluminum, copper alloy, or aluminum alloy, or it can be made of VC, high thermal conductivity film material, etc. In this way, the first heat-conducting plate 42 can have better thermal conductivity, thereby improving the heat transfer rate between the chip 41 and the first heat-conducting plate 42.

[0087] For example, the second heat-conducting plate 43 can be made of thermally conductive metals such as copper, aluminum, copper alloys, and aluminum alloys, or it can be made of VC, high thermal conductivity film materials, etc. It is understood that in some examples, the material of the second heat-conducting plate 43 can be a thermally conductive metal. In this way, on the one hand, the second heat-conducting plate 43 can have better thermal conductivity, thereby improving the heat transfer rate between the chip 41 and the second heat-conducting plate 43; on the other hand, the second heat-conducting plate 43 can have better heat dissipation effect, so that heat on the second heat-conducting plate 43 can be quickly dissipated, which is beneficial to improving the heat dissipation efficiency of the chip assembly 40; furthermore, the second heat-conducting plate 43 can have a certain strength, so that the second heat-conducting plate 43 can be used to support the chip 41 and can improve the overall structural strength of the chip assembly 40.

[0088] In some embodiments, chip 41 may include processor 413, memory 414, and adapter board 415. Processor 413 may be a central processing unit (CPU). When electronic device 100 is running, processor 413 needs to process a large amount of data, generating considerable heat and requiring significant heat dissipation. Memory 414 may be Double Data Rate (DDR) synchronous dynamic random access memory.

[0089] For example, the processor 413 and the memory 414 are fixedly connected and stacked. It is understood that, to ensure the communication speed between the processor 413 and the memory 414, the processor 413 and the memory 414 are assembled using package-on-package (POP) technology, that is, the memory 414 is stacked and soldered on top of the processor 413. At this time, the thermal resistance of the chip 41 package increases, and the heat dissipation stacking space of the chip 41 is compressed, resulting in a larger thermal resistance between the chip 41 and the environment. The chip 41 has a greater need for heat dissipation. The chip assembly 40 provided in this embodiment can dissipate heat from the chip 41 in a timely and rapid manner, which helps ensure the performance release of the chip 41.

[0090] In this embodiment, the adapter board 415 can be located on the side of the processor 413 opposite to the memory 414, and is fixedly connected to the processor 413. It is understood that the processor 413 and the memory 414 can be disposed on the adapter board 415. Exemplarily, the adapter board 415 may include a first surface 4151 and a second surface 4152 disposed opposite to each other. The first surface 4151 of the adapter board 415 can be connected to the processor 413.

[0091] Please refer to Figures 6 to 8 , Figure 8 yes Figure 5 The diagram shows a partial structural representation of the chip assembly 40 in some embodiments. For example, Figure 8 The diagram mainly shows the assembly structure between chip 41 and motherboard 46.

[0092] In some embodiments, a portion of the motherboard 46 may be located between the chip 41 and the second heat-conducting plate 43, and connect the chip 41 and the second heat-conducting plate 43. In this way, heat from the motherboard 46 can also be transferred to the second heat-conducting plate 43. For example, a portion of the motherboard 46 may be located between the adapter plate 415 and the second heat-conducting plate 43, and connected to the adapter plate 415. For instance, the motherboard 46 can be fixed to the second surface 4152 of the adapter plate 415 by solder 460.

[0093] For example, the mainboard 46 may have a first through hole 461, a second through hole 462, and a third through hole 463 spaced apart. A portion of the second surface 4152 of the adapter plate 415 may be disposed opposite to the first through hole 461. It is understood that the second surface 4152 of the adapter plate 415 may be exposed relative to the first through hole 461. The third through hole 463 may be used for fasteners 491 to pass through. For example, the number of third through holes 463 may be four, and the four third through holes 463 may be disposed around the first through hole 461.

[0094] In this embodiment, the motherboard 46 can be a circuit board. The processor 413 and memory 414 can be communicatively connected to the adapter board 415, and the adapter board 415 can be communicatively connected to the motherboard 46. Thus, the processor 413 and memory 414 can transmit signals to the motherboard 46 through the adapter board 415. It is understood that by setting the adapter board 415, integrated interface conversion, high-speed signal transmission, power management, and protection circuitry can be provided for the processor 413 and memory 414, and various power requirements of different interfaces can be effectively handled. For example, the adapter board 415 can be a Land Grid Array (LGA) adapter board.

[0095] In some other embodiments, chip 41 may not include the adapter board 415. In this case, the surface of processor 413 facing away from memory 414 can be the bottom surface 412 of chip 41. The processor 413 of chip 41 can be soldered onto motherboard 46 and communicate with motherboard 46.

[0096] Please refer to Figure 7 and Figure 9 , Figure 9 yes Figure 5 The diagram shows a partial structural view of the chip assembly 40 from another angle in some embodiments. For example, Figure 9 The diagram mainly shows the assembly structure between the first heat-conducting plate 42 and the first heat-conducting component 44.

[0097] In some embodiments, the first heat-conducting plate 42 may include a first surface 421 and a second surface 422 disposed opposite to each other. The first heat-conducting plate 42 may have a recessed area 423. The recessed area 423 may be formed by a portion of the second surface 422 of the first heat-conducting plate 42 recessed toward the first surface 421.

[0098] For example, the first heat-conducting plate 42 may be provided with a fourth through hole 424, which may penetrate through the first surface 421 and the second surface 422 of the first heat-conducting plate 42. In some examples, the first heat-conducting plate 42 may be approximately quadrilateral. The number of fourth through holes 424 may be four, and they are respectively located at the four corners of the first heat-conducting plate 42.

[0099] In some embodiments, at least a portion of the first heat-conducting element 44 may be located between the top surface 411 of the chip 41 and the first heat-conducting plate 42, and may be in contact with both the top surface 411 of the chip 41 and the first heat-conducting plate 42. It is understood that the first heat-conducting element 44 may be entirely located between the top surface 411 of the chip 41 and the first heat-conducting plate 42, or may be partially located between the top surface 411 of the chip 41 and the first heat-conducting plate 42.

[0100] In some embodiments, the first heat-conducting element 44 may be located between the memory 414 and the first heat-conducting plate 42, and in contact with both the memory 414 and the first heat-conducting plate 42. For example, the first heat-conducting element 44 may be located in the recessed area 423 of the first heat-conducting plate 42. It is understood that in this embodiment, the chip 41 can be connected to the first heat-conducting plate 42 via the first heat-conducting element 44. In this way, the heat generated by the processor 413 and the memory 414 can be transferred to the first heat-conducting plate 42 via the first heat-conducting element 44.

[0101] In this embodiment, the thermal conductivity of the first heat-conducting element 44 can be greater than or equal to 0.55 W / mk. For example, the material of the first heat-conducting element 44 can be thermally conductive metals such as copper, aluminum, copper alloys, or aluminum alloys, or other non-metallic thermally conductive materials such as thermally conductive silicone. Thus, the first heat-conducting element 44 has better thermal conductivity and can quickly transfer the heat from the chip 41 to the first heat-conducting plate 42.

[0102] In some other embodiments, the chip assembly 40 may not include the first heat-conducting element 44. In this case, the top surface 411 of the chip 41 can contact the first heat-conducting plate 42, so that the heat generated by the chip 41 can be transferred to the first heat-conducting plate 42 through the top surface 411 of the chip 41.

[0103] Please refer to Figure 6 , Figure 7 and Figure 10 , Figure 10 yes Figure 5 The diagram shows a partial structural representation of the chip assembly 40 in some embodiments. For example, Figure 10 The diagram mainly shows the assembly structure between the second heat-conducting plate 43, the second heat-conducting component 45, and the third heat-conducting component 47.

[0104] In some embodiments, the first heat-conducting plate 42 may be provided with fixing holes 431. For example, the first heat-conducting plate 42 may be generally quadrilateral, and the number of fixing holes 431 may be four, which may be provided at the four corners of the first heat-conducting plate 42.

[0105] In some embodiments, at least a portion of the second heat-conducting element 45 may be located between the bottom surface 412 of the chip 41 and the second heat-conducting plate 43, and may contact the bottom surface 412 of the chip 41 and the second heat-conducting plate 43 respectively. It is understood that the second heat-conducting element 45 may be entirely located between the bottom surface 412 of the chip 41 and the second heat-conducting plate 43, or may be partially located between the bottom surface 412 of the chip 41 and the second heat-conducting plate 43.

[0106] In some embodiments, the second heat-conducting element 45 may include a heat-conducting block 451 and a heat-conducting sheet 452. The heat-conducting block 451 is fixedly connected to the heat-conducting sheet 452 and is in contact with the heat-conducting sheet 452. Heat can be transferred between the heat-conducting block 451 and the heat-conducting sheet 452, for example, heat on the heat-conducting block 451 can be transferred to the heat-conducting sheet 452.

[0107] The heat-conducting block 451 can pass through the first through-hole 461 of the motherboard 46 and contact the chip 41. For example, the heat-conducting block 451 can contact the second surface 4152 of the adapter plate 415. In this way, the heat generated by the chip 41 can be transferred from the second surface 4152 of the adapter plate 415 to the heat-conducting sheet 452 via the heat-conducting block 451. It is understood that, in this embodiment, the surface of the memory 414 facing away from the processor 413 can be the top surface 411 of the chip 41, and the second surface 4152 of the adapter plate 415 can be the bottom surface 412 of the chip 41. It is understood that a portion of the second surface 4152 of the adapter plate 415 can connect to the motherboard 46, and a portion can contact the second heat-conducting component 45. Thus, the processor 413 and memory 414 can communicate with the motherboard 46 through the adapter plate 415, and heat can also be transferred through the adapter plate 415, allowing the heat generated by the processor 413 and memory 414 to be transferred to the second heat-conducting component 45. In some other embodiments, the chip 41 may not include the adapter plate 415. In this case, the surface of the processor 413 facing away from the memory 414 can be the bottom surface 412 of the chip 41. This surface can contact the second heat-conducting component 45, allowing the heat generated by the processor 413 and memory 414 to be transferred to the motherboard 46 through the second heat-conducting component 45.

[0108] In this embodiment, the heat-conducting block 451 of the second heat-conducting element 45 can pass through the motherboard 46 and contact the chip 41, allowing the second heat-conducting plate 43 to transfer heat between itself and the chip 41 through the second heat-conducting element 45. Furthermore, the second heat-conducting plate 43 does not require additional protrusions to protrude from the second through-hole 462 of the motherboard 46 and contact the chip 41. The structure of the second heat-conducting plate 43 is relatively simple, which simplifies its manufacturing process and saves costs. In addition, the cooperation between the heat-conducting block 451 and the second through-hole 462 of the motherboard 46 facilitates the positioning of the second heat-conducting plate 43 during installation on the motherboard 46.

[0109] In this embodiment, the thermal conductivity of the heat-conducting block 451 can be greater than or equal to 0.55 W / mk. For example, the material of the heat-conducting block 451 can be thermally conductive metals such as copper, aluminum, copper alloys, or aluminum alloys, or other non-metallic thermally conductive materials such as thermally conductive silicone. Thus, the heat-conducting block 451 has better thermal conductivity and can quickly transfer the heat from the chip 41 to the second heat-conducting plate 43.

[0110] The heat-conducting plate 452 can be fixedly connected to the second heat-conducting plate 43. A portion of the heat-conducting plate 452 can be located between the heat-conducting block 451 and the second heat-conducting plate 43, and in contact with both the heat-conducting block 451 and the second heat-conducting plate 43. A portion of the heat-conducting plate 452 can also be located between the motherboard 46 and the second heat-conducting plate 43, and in contact with both the motherboard 46 and the second heat-conducting plate 43. It is understood that heat transfer can be achieved between the heat-conducting plate 452 and both the motherboard 46 and the second heat-conducting plate 43. Thus, after heat from the heat-conducting block 451 is transferred to the heat-conducting plate 452, the heat from the heat-conducting plate 452 can be transferred to the second heat-conducting plate 43, and the heat from the heat-conducting plate 452 can also be transferred to the motherboard 46. In other words, the chip 41 can dissipate heat through the second heat-conducting plate 43 and the motherboard 46. In addition, the area of ​​the heat-conducting plate 452 can be larger than the area of ​​the heat-conducting block 451, so that the heat-conducting plate 452 can evenly transfer the heat on the heat-conducting block 451 to the second heat-conducting plate 43 and the main plate 46.

[0111] In this embodiment, the heat-conducting sheet 452 may include graphite. This results in better thermal conductivity for the heat-conducting sheet 452, increasing the heat transfer rate between the heat-conducting block 451 and the second heat-conducting plate 43, and facilitating faster heat transfer from the heat-conducting block 451 to the second heat-conducting plate 43. Furthermore, the heat-conducting sheet 452 can have a smaller thickness, which helps reduce the stacking height of the chip assembly 40.

[0112] In some other embodiments, the chip assembly 40 may not include the heat-conducting sheet 452. In this case, the heat-conducting block 451 may be connected to and in contact with the second heat-conducting plate 43.

[0113] In some other embodiments, the chip assembly 40 may not include the heat-conducting block 451 and the heat-conducting sheet 452. In this case, a portion of the second heat-conducting plate 43 may be exposed relative to the first through hole 461 of the motherboard 46 and in contact with the bottom surface 412 of the chip 41, so that the heat generated by the chip 41 can be transferred to the second heat-conducting plate 43 through the bottom surface 412 of the chip 41.

[0114] Please refer to Figure 7 , Figure 8 and Figure 10 In some embodiments, the third heat-conducting element 47 can connect the first heat-conducting plate 42 and the second heat-conducting plate 43, thereby enabling heat transfer between the first heat-conducting plate 42 and the second heat-conducting plate 43 through the third heat-conducting element 47. It is understood that when the temperature of the first heat-conducting plate 42 is higher than the temperature of the second heat-conducting plate 43, the heat on the first heat-conducting plate 42 can be transferred to the second heat-conducting plate 43 through the third heat-conducting element 47, allowing the first heat-conducting plate 42 to dissipate heat more quickly, thus further achieving rapid cooling of the chip 41; when the temperature of the first heat-conducting plate 42 is lower than the temperature of the second heat-conducting plate 43, the heat on the second heat-conducting plate 43 can be transferred to the first heat-conducting plate 42 through the third heat-conducting element 47, allowing the second heat-conducting plate 43 to dissipate heat more quickly, thus further achieving rapid cooling of the chip 41.

[0115] For example, the third heat-conducting element 47 can be generally cylindrical, such as a square or round column. The third heat-conducting element 47 may include a first end 471, a second end 472, and a middle portion 473 connecting the first end 471 and the second end 472. The first end 471 of the third heat-conducting element 47 can be connected to the first heat-conducting plate 42, and the second end 472 of the third heat-conducting element 47 can be connected to the second heat-conducting plate 43. It is understood that the first end 471 of the third heat-conducting element 47 can be directly connected to the first heat-conducting plate 42, in which case the first end 471 of the third heat-conducting element 47 can be in contact with the first heat-conducting plate 42; or the first end 471 of the third heat-conducting element 47 can be indirectly connected to the first heat-conducting plate 42, in which case the first end 471 of the third heat-conducting element 47 can be connected to the first heat-conducting plate 42 through some thermally conductive material. Similarly, the second end 472 of the third heat-conducting element can be directly connected to the second heat-conducting plate 43, or it can be indirectly connected to the second heat-conducting plate 43.

[0116] In some embodiments, the third heat-conducting element 47 may be disposed within the motherboard 46. For example, the third heat-conducting element 47 may be disposed within the second through-hole 462 of the motherboard 46. The first end 471 of the third heat-conducting element 47 may be fixedly connected to the first heat-conducting plate 42, and / or the second end 472 of the third heat-conducting element 47 may be fixedly connected to the second heat-conducting plate 43. Exemplarily, the first end 471 of the third heat-conducting element 47 may be fixedly connected to the first heat-conducting plate 42 by means of welding or bonding. The middle portion 473 of the third heat-conducting element 47 may be located in the second through-hole 462 of the motherboard 46.

[0117] In this embodiment, the connection between the first heat-conducting plate 42 and / or the second heat-conducting plate 43 and the third heat-conducting element 47 is relatively firm, and the third heat-conducting element 47 is not easy to detach from the first heat-conducting plate 42 and / or the second heat-conducting plate 43. Thus, the first heat-conducting plate 42 and / or the second heat-conducting plate 43 and the third heat-conducting element 47 can maintain contact to achieve heat transfer, and the heat transfer path between the first heat-conducting plate 42 and the second heat-conducting plate 43 is not easy to fail.

[0118] In this embodiment, the material of the third heat-conducting element 47 can be a heat-conducting metal such as copper, aluminum, copper alloy, or aluminum alloy, or it can be other non-metallic heat-conducting materials such as heat-conducting silicone. For example, the material of the third heat-conducting element 47 can be a metal. In this way, on the one hand, the third heat-conducting element 47 has better thermal conductivity and can quickly transfer heat; on the other hand, the third heat-conducting element 47 has a certain strength and can be used to support the first heat-conducting plate 42.

[0119] In this embodiment, the number of third heat-conducting elements 47 can be one or more, and this application does not strictly limit this. When there are multiple third heat-conducting elements 47, they can be arranged around the chip 41. In this way, when heat is transferred between the first heat-conducting plate 42 and the second heat-conducting plate 43 through the third heat-conducting elements 47, the heat transfer rate between the first heat-conducting plate 42 and the second heat-conducting plate 43 is faster, and the temperature uniformity on the first heat-conducting plate 42 and the second heat-conducting plate 43 is better, which helps to avoid the risk of local heat concentration.

[0120] It is understood that, in the embodiments of this application, the third heat-conducting element 47 can be used to connect the first heat-conducting plate 42, the second heat-conducting plate 43, and the main board 46, and realize heat transfer between the first heat-conducting plate 42, the second heat-conducting plate 43, and the main board 46. In the above embodiments, the third heat-conducting element 47 can be columnar, and the first end 471 of the third heat-conducting element 47 can be fixedly connected to the first heat-conducting element 44, and / or the second end 472 of the third heat-conducting element 47 can be fixedly connected to the second heat-conducting element 45. The structure and connection method of the third heat-conducting element 47 can also be implemented in other ways. The structure and connection method of the third heat-conducting element 47 in some other embodiments will be described below with reference to the relevant drawings.

[0121] Please see Figure 11A and Figure 11B , Figure 11A yes Figure 2 The chip assembly 40 shown is a partial front view of its structure in some other embodiments. Figure 11B yes Figure 11A A partial cross-sectional structural diagram of the chip assembly 40 is shown.

[0122] In this embodiment, the third heat-conducting element 47 can generally be columnar, such as a square column or a cylinder. The third heat-conducting element 47 may include a first end 471, a second end 472, and a middle portion 473 connecting the first end 471 and the second end 472. Exemplarily, the third heat-conducting element 47 can pass through the motherboard 46. For example, the third heat-conducting element 47 can pass through the second through-hole 462 of the motherboard 46. Exemplarily, the first end 471 of the third heat-conducting element 47 can be used to connect to the first heat-conducting plate 42 (see [link]). Figure 7 The second end 472 of the third heat-conducting element 47 can be connected to the second heat-conducting plate 43 (see [link]). Figure 7 In this way, after the heat on the chip 41 is transferred to the first heat-conducting plate 42 and / or the second heat-conducting plate 43, heat transfer between the first heat-conducting plate 42 and the second heat-conducting plate 43 can be achieved through the third heat-conducting component 47.

[0123] In this embodiment, the third heat-conducting element 47 can be riveted to the motherboard 46, that is, the third heat-conducting element 47 is fixedly connected to the motherboard 46. For example, the middle portion 473 of the third heat-conducting element 47 can pass through the second through hole 462 and be riveted to the motherboard 46. In this case, the second through hole 462 of the motherboard 46 can be a riveting hole. In this embodiment, the third heat-conducting element 47 is fixedly connected to the motherboard 46, thereby indirectly connecting the first heat-conducting plate 42 and the second heat-conducting plate 43. A certain displacement is allowed between the first heat-conducting plate 42, the second heat-conducting plate 43, and the third heat-conducting element 47, which can alleviate stress caused by external factors, reducing the risk of breakage due to stress concentration at the connection between the first heat-conducting plate 42, the second heat-conducting plate 43, and the third heat-conducting element 47, thus improving the reliability of the connection between the first heat-conducting plate 42, the second heat-conducting plate 43, and the third heat-conducting element 47.

[0124] Please see Figure 12A and Figure 12B , Figure 12A yes Figure 2 The chip assembly 40 shown is a partial front view of its structure in some other embodiments. Figure 12B yes Figure 12A A partial cross-sectional structural diagram of the chip assembly 40 is shown.

[0125] In some embodiments, the third heat-conducting element 47 may include a first pillar portion 474, a second pillar portion 475, and a heat-conducting wire portion 476. The heat-conducting wire portion 476 may be fixedly connected between the first pillar portion 474 and the second pillar portion 475. It is understood that heat transfer can occur between the first pillar portion 474, the second pillar portion 475, and the heat-conducting wire portion 476. In this embodiment, the material of the heat-conducting wire portion 476 may be a heat-conducting metal, such as gold or copper.

[0126] For example, the first pillar portion 474 and the second pillar portion 475 can be located on opposite sides of the second through hole 462, and both are fixedly connected to the motherboard 46. For example, the first pillar portion 474 and / or the second pillar portion 475 can be fixed to the motherboard 46 by welding or other means. The first pillar portion 474 can be used to connect to the first heat-conducting plate 42 (see [link]). Figure 7 The second column portion 475 can be connected to the second heat-conducting plate 43 (see [link]). Figure 7 In this way, after the heat on the chip 41 is transferred to the first heat-conducting plate 42 and / or the second heat-conducting plate 43, heat transfer between the first heat-conducting plate 42 and the second heat-conducting plate 43 can be achieved through the third heat-conducting element 47. It can be understood that, in this embodiment, the end of the first pillar portion 474 away from the heat-conducting wire portion 476 can be the first end 471 of the third heat-conducting element 47, and the end of the second pillar portion 475 away from the heat-conducting wire portion 476 can be the second end 472 of the third heat-conducting element 47.

[0127] For example, at least a portion of the heat-conducting wire portion 476 may be located in the second through-hole 462 of the motherboard 46. It is understood that the heat-conducting wire portion 476 may be entirely located in the second through-hole 462, or may be partially located in the second through-hole 462. It is understood that the second through-hole 462 of the motherboard 46 may be a heat-conducting hole.

[0128] In this embodiment, the third heat-conducting element 47 is fixedly connected to the main board 46, thereby indirectly connecting the first heat-conducting plate 42 and the second heat-conducting plate 43. A certain displacement is allowed between the first heat-conducting plate 42, the second heat-conducting plate 43 and the third heat-conducting element 47, which can alleviate the stress caused by external factors, reduce the risk of breakage due to stress concentration at the connection between the first heat-conducting plate 42, the second heat-conducting plate 43 and the third heat-conducting element 47, and improve the connection reliability between the first heat-conducting plate 42, the second heat-conducting plate 43 and the third heat-conducting element 47.

[0129] Please refer to Figure 13 and Figure 14 , Figure 13 yes Figure 5 The schematic diagram shown is a partial structural view of the chip assembly 40 from another angle in some embodiments. Figure 14 yes Figure 5 The chip assembly 40 shown is a partial structural cross-sectional view taken along point AA in some other embodiments.

[0130] In some embodiments, the chip assembly 40 may further include a second shield 482. A first shield 481 may be located between the first heat-conducting plate 42 and the motherboard 46, and connect the first heat-conducting plate 42 and the motherboard 46. Exemplarily, the first shield 481 may be disposed around the chip 41. In this embodiment, the first shield 481, the first heat-conducting plate 42, and the motherboard 46 may form an inner shielding loop to reduce the risk of electromagnetic interference (EMI) radiation from the chip 41. It is understood that the copper drains on the surface of the first shield 481, the first heat-conducting plate 42, and the motherboard 46 facing the chip 41 may form an inner shielding loop. Exemplarily, Figure 14 The inner shielding loop is schematically shown using thick solid lines.

[0131] In this embodiment, the material of the first shielding member 481 can be a conductive metal, such as aluminum or copper. The material of the first shielding member 481 can also be a conductive non-metal, such as conductive foam.

[0132] In some embodiments, at least a portion of the second shielding member 482 may be located between the third heat-conducting member 47 and the first heat-conducting plate 42, and connect the third heat-conducting member 47 and the first heat-conducting plate 42. It is understood that the second shielding member 482 may be entirely located between the third heat-conducting member 47 and the first heat-conducting plate 42. The second shielding member 482 may also be partially located between the third heat-conducting member 47 and the first heat-conducting plate 42; for example, a portion of the second shielding member 482 may be located between the first end 471 of the third heat-conducting member 47 and the first heat-conducting plate 42, and another portion may be located between the motherboard 46 and the first heat-conducting plate 42. Exemplarily, the second shielding member 482 may be located on the side of the first shielding member 481 away from the chip 41. The second shielding member 482, the third heat-conducting member 47, the second heat-conducting plate 43, and the motherboard 46 may form an external shielding loop to reduce the risk of EMI radiation from the chip 41. It is understandable that the copper leakage on the surface of the second shield 482, the third heat-conducting component 47, the second heat-conducting plate 43, and the side of the motherboard 46 facing away from the chip 41 can form an external shielding loop. For example, Figure 14 The outer shielding loop is schematically shown using thick dashed lines.

[0133] In this embodiment, the material of the second shielding member 482 can be a conductive metal, such as aluminum or copper. The material of the second shielding member 482 can also be a conductive non-metal, such as conductive foam.

[0134] In some examples, the second shielding element 482 can deform; for example, the second shielding element 482 can be conductive foam or a spring sheet. Thus, when the third heat-conducting element 47 is connected to the first heat-conducting plate 42, a certain displacement or deformation is allowed between the third heat-conducting element 47 and the first heat-conducting plate 42. This can absorb or alleviate stress caused by external factors, reducing the risk of breakage due to stress concentration at the connection between the third heat-conducting element 47 and the first heat-conducting plate 42, thereby improving the reliability of the connection between the third heat-conducting element 47 and the first heat-conducting plate 42.

[0135] It is understandable that the processor 413 and memory 414 employ package stacking technology, which enhances EMI radiation. However, the chip assembly 40 in this embodiment can form an inner shielding loop and an outer shielding loop around the chip 41. Compared to a chip assembly with only an inner shielding loop, the chip assembly 40 provided in this embodiment has better radiation resistance and can significantly reduce the risk of EMI radiation from the chip 41.

[0136] In some embodiments, the chip assembly 40 further includes a fourth heat-conducting element 490, at least a portion of which may be located between the third heat-conducting element 47 and the first heat-conducting plate 42, and is connected to and in contact with both the third heat-conducting element 47 and the first heat-conducting plate 42. It is understood that the fourth heat-conducting element 490 may be entirely located between the third heat-conducting element 47 and the first heat-conducting plate 42, or it may be partially located between the third heat-conducting element 47 and the first heat-conducting plate 42. In some examples, the fourth heat-conducting element 490 may be fixedly connected to the first end 471 of the third heat-conducting element 47 and the first heat-conducting plate 42, thereby allowing the third heat-conducting element 47 to be fixedly connected to the first heat-conducting plate 42 via the fourth heat-conducting element 490.

[0137] For example, at least a portion of the fourth heat-conducting element 490 is disposed in the same layer as the second shielding element 482. It is understood that, since at least a portion of the second shielding element 482 is disposed between the third heat-conducting element 47 and the first heat-conducting plate 42, to avoid gaps between the third heat-conducting element 47 and the first heat-conducting plate 42 at locations other than the second shielding element 482, this embodiment eliminates at least a portion of the gap between the third heat-conducting element 47 and the first heat-conducting plate 42 by disposing of at least a portion of the fourth heat-conducting element 490 in contact with both the third heat-conducting element 47 and the first heat-conducting plate 42. Thus, heat transfer between the third heat-conducting element 47 and the first heat-conducting plate 42 can be achieved through the fourth heat-conducting element 490, thereby improving the heat transfer rate between the third heat-conducting element 47 and the first heat-conducting plate 42.

[0138] In this embodiment, the material of the fourth heat-conducting element 490 can be a heat-conducting metal such as copper, aluminum, copper alloy, or aluminum alloy, or it can be other non-metallic heat-conducting materials such as heat-conducting silicone. Thus, the fourth heat-conducting element 490 has better thermal conductivity, which can improve the heat transfer rate between the third heat-conducting element 47 and the first heat-conducting plate 42.

[0139] It is understood that, in the embodiments of this application, the fourth heat-conducting element 490 and the second shielding element 482 can be arranged along the first direction, for example... Figure 13 The arrangement of the fourth heat-conducting element 490 and the second shielding element 482 is shown. The fourth heat-conducting element 490 and the second shielding element 482 can also be arranged along the second direction, for example... Figure 14 The arrangement of the fourth heat-conducting element 490 and the second shielding element 482 shown indicates that at least a portion of the second shielding element 482 can be located between the first shielding element 481 and the fourth heat-conducting element 490. The first direction and the second direction are arranged at an angle; for example, the first direction and the second direction can be perpendicular.

[0140] Please refer to Figure 5 , Figure 6 and Figure 15 , Figure 15 yes Figure 5 The diagram shows a partial structural representation of the chip assembly 40 in some embodiments. For example, Figure 15 The diagram mainly shows the assembly structure between the second heat-conducting plate 43 and the fastener 491.

[0141] In some embodiments, fastener 491 can securely connect the first heat-conducting plate 42 and the second heat-conducting plate 43. That is, the first heat-conducting plate 42 can be securely connected to the second heat-conducting plate 43 via fastener 491. This improves the connection strength between the first heat-conducting plate 42 and the second heat-conducting plate 43, preventing the heat transfer path of the chip assembly 40 from failing. In this embodiment, fastener 491 can be a stud, bolt, screw, etc.

[0142] For example, fastener 491 can pass through the third through hole 463 of motherboard 46. One end of fastener 491 can be located in the fixing hole 431 of second heat-conducting plate 43 and fixedly connected to second heat-conducting plate 43. The other end of fastener 491 can pass through the fourth through hole 424 of first heat-conducting plate 42. Connector 492 can abut against the first surface 421 of first heat-conducting plate 42 and is fixedly connected to the other end of fastener 491, so that fastener 491 can be fixedly connected to first heat-conducting plate 42.

[0143] In this embodiment, the fastener 491 can be used for grounding, thereby improving the stability of the signal between the chip 41 of the chip assembly 40 and the external circuit, while reducing signal interference and improving the reliability of signal transmission.

[0144] For example, the number of fasteners 491 can be four, with each fastener 491 corresponding to one of the four third through holes 463 on the motherboard 46. The four fasteners 491 can be centrally symmetrically distributed relative to the center of the first heat-conducting plate 42, thereby improving the connection stability between the first heat-conducting plate 42 and the second heat-conducting plate 43. For example, the number of connectors 492 can be two. Each connector 492 can be fixedly connected to two adjacent fasteners 491.

[0145] Please refer to Figure 16 , Figure 16 yes Figure 2 The schematic diagram of the chip assembly 40 shown in some other embodiments.

[0146] In some embodiments, the chip assembly 40 may further include a first thermally conductive element 401, a first heat dissipation fin 402, and a first air source 403. The first thermally conductive element 401 can connect the first heat dissipation fin 402 and the first heat-conducting plate 42, allowing heat from the first heat-conducting plate 42 to be transferred to the first heat dissipation fin 402 via the first thermally conductive element 401. This enables the first heat-conducting plate 42 and the chip assembly 40 to dissipate heat more quickly, improving the heat dissipation efficiency of the chip assembly 40. Furthermore, when the temperature of the first heat-conducting plate 42 is lower than the temperature of the second heat-conducting plate 43, heat from the second heat-conducting plate 43 can be transferred to the first heat-conducting plate 42 via a third thermally conductive element 47, allowing the second heat-conducting plate 43 to also dissipate heat more quickly, further enabling rapid cooling of the chip 41.

[0147] The first air source 403 can be used to blow air onto the first heat sink 402 to remove heat from it, thereby further improving the heat dissipation efficiency of the chip assembly. In some other embodiments, the chip assembly 40 may not include the first air source 403.

[0148] It is understandable that the structure and arrangement of the first heat-conducting element 401, the first heat dissipation fin 402, and the first air source 403 are the same as described above. Figure 4 The second heat-conducting element 51, the second heat dissipation fin 52, and the second air source 53 shown are similar in structure and arrangement. The structure and arrangement of the first heat-conducting element 401, the first heat dissipation fin 402, and the first air source 403 in this embodiment can be... Figure 4 and Figure 5 The relevant descriptions will not be repeated here. It is understandable that when the chip assembly 40 includes the first heat-conducting element 401, the first heat dissipation fin 402 and the first air source 403, the chip assembly 40 itself can use the first air source 403 for heat dissipation, and the electronic device 100 may not include the heat dissipation component 50.

[0149] Please see Figure 17 , Figure 17 yes Figure 2 The electronic device 100 shown is a partial structural cross-sectional view taken along BB in some embodiments.

[0150] In some embodiments, the second heat-conducting element 51 can contact and connect with the first heat-conducting plate 42. For example, the first heat dissipation surface 511 of the second heat-conducting element 51 can contact and connect with the first heat-conducting plate 42, so that heat on the first heat-conducting plate 42 can be transferred to the second heat-conducting element 51. In this way, heat from the chip assembly 40 can be transferred to the outside of the chip assembly 40, thereby achieving heat dissipation of the chip assembly 40. It is understood that, in the embodiments of this application, heat on the first heat-conducting plate 42 can be transferred to the second heat dissipation fin 52 through the second heat-conducting element 51 (see [link to application]). Figure 3 This allows the first heat-conducting plate 42 to dissipate heat more quickly, which is beneficial for improving the heat dissipation efficiency of the chip assembly 40 and the electronic device 100. In addition, when the temperature of the first heat-conducting plate 42 is lower than that of the second heat-conducting plate 43, the heat on the second heat-conducting plate 43 can be transferred to the first heat-conducting plate 42 through the third heat-conducting element 47, so that the second heat-conducting plate 43 can also dissipate heat more quickly, thereby further achieving rapid cooling of the chip 41.

[0151] The second gas source 53 (see also) Figure 3 Air can be blown onto the second heat sink 52 to quickly remove heat from it, which helps to further improve the heat dissipation efficiency of the chip assembly 40 and the electronic device 100. In some other embodiments, the heat dissipation assembly 50 may not include the second air source 53.

[0152] In some embodiments, the second heat-conducting plate 43 of the chip assembly 40 can be connected to the housing 10 of the electronic device 100, and heat transfer can be achieved between the second heat-conducting plate 43 and the housing 10. For example, the surface of the second heat-conducting plate 43 facing away from the chip 41 can contact the second sub-housing 12. In this way, the heat generated by the chip 41 of the chip assembly 40 can be transferred to the housing 10 through the second heat-conducting plate 43, and then dissipated from the housing 10 to the outside of the electronic device 100, thereby improving the heat dissipation efficiency of the chip assembly 40 and the electronic device 100.

[0153] In some other embodiments, the second heat-conducting plate 43 can also be connected to the housing 10 through a heat-conducting material (such as heat-conducting silicone). That is, the second heat-conducting plate 43 can be indirectly connected to the bottom plate 122 of the second sub-housing 12 through the heat-conducting material, so that the heat on the second heat-conducting plate 43 can be transferred to the housing 10 through the heat-conducting material.

[0154] In this embodiment, the heat generated by chip 41 can be transferred to the outside of chip 41 via its top surface 411 and its bottom surface 412. Compared to solutions where heat is transferred only from the top or bottom surface, the chip assembly 40 in this embodiment can improve the heat dissipation efficiency of chip 41, facilitating rapid cooling of chip 41 and improving the reliability of both chip assembly 40 and electronic device 100.

[0155] Furthermore, the chip assembly 40 can have multiple heat dissipation paths to allow the heat generated by the chip 41 to be transferred to the outside more quickly. For example, heat dissipation path one: the heat generated by the chip 41 can be transferred from the top surface 411 of the chip 41 through the first heat conductor 44 to the first heat conductor 42, and then from the first heat conductor 42 to the second heat conductor 51; heat dissipation path two: the heat generated by the chip 41 can be transferred from the top surface 411 of the chip 41 through the first heat conductor 44 to the first heat conductor 42, and then from the first heat conductor 42 through the third heat conductor 47 to the second heat conductor 43; heat dissipation path three: the heat generated by the chip 41 can be transferred from the top surface 411 of the chip 41 through the first heat conductor 44 to the first heat conductor 42, and then from the first heat conductor 42 through the third heat conductor 47 to the second heat conductor 43; The bottom surface 412 of chip 41 is transferred to the motherboard 46 via the second heat-conducting component 45; heat dissipation path four: the heat generated by chip 41 can be transferred from the bottom surface 412 of chip 41 to the second heat-conducting plate 43 via the second heat-conducting component 45, and then to the first heat-conducting plate 42 via the third heat-conducting component 47; heat dissipation path five: the heat generated by chip 41 can be transferred from the bottom surface 412 of chip 41 to the second heat-conducting plate 43 via the second heat-conducting component 45, and then to the housing 10 of electronic device 100 from the second heat-conducting plate 43. Therefore, the chip assembly 40 and electronic device 100 provided in this application have good heat dissipation performance, which is beneficial to improving the reliability of chip assembly 40 and electronic device 100.

[0156] It is understood that all the above figures are exemplary illustrations of this application and do not represent the actual size of the product. Furthermore, the dimensional proportions between the components in the figures are not intended to limit the actual product of this application.

[0157] The above are merely some embodiments of this application, and the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A chip assembly (40), characterized in that, The chip assembly (40) includes a chip (41), a first heat-conducting plate (42), and a second heat-conducting plate (43). The chip (41) includes a top surface (411) and a bottom surface (412) disposed opposite to each other. The top surface (411) of the chip (41) is in contact with and connected to the first heat-conducting plate (42). Alternatively, the chip assembly (40) may also include a first heat-conducting element (44). At least a portion of the first heat-conducting element (44) is located between the top surface (411) of the chip (41) and the first heat-conducting plate (42), and is in contact with and connected to the top surface (411) of the chip (41) and the first heat-conducting plate (42) respectively. The bottom surface (412) of the chip (41) is in contact with and connected to the second heat-conducting plate (43), or the chip assembly (40) further includes a second heat-conducting component (45), at least a portion of which is located between the bottom surface (412) of the chip (41) and the second heat-conducting plate (43), and is in contact with and connected to the bottom surface (412) of the chip (41) and the second heat-conducting plate (43) respectively; The chip assembly (40) further includes a third heat-conducting component (47), which includes a first end (471) and a second end (472). The first end (471) of the third heat-conducting component (47) is connected to the first heat-conducting plate (42), and the second end (472) of the third heat-conducting component (47) is connected to the second heat-conducting plate (43).

2. The chip assembly (40) according to claim 1, characterized in that, The chip assembly (40) also includes a motherboard (46), a portion of which is located between the chip (41) and the second heat-conducting plate (43) and is fixedly connected to the chip (41) and the second heat-conducting plate (43); The motherboard (46) is provided with a first through hole (461), and the second heat-conducting component (45) includes a heat-conducting block (451), which passes through the first through hole (461) and contacts the chip (41).

3. The chip assembly (40) according to claim 2, characterized in that, The second heat-conducting component (45) further includes a heat-conducting sheet (452), a portion of which is located between the heat-conducting block (451) and the second heat-conducting plate (43), and is in contact with the heat-conducting block (451) and the second heat-conducting plate (43) respectively; A portion of the heat-conducting sheet (452) is located between the main board (46) and the second heat-conducting plate (43), and is in contact with the main board (46) and the second heat-conducting plate (43) respectively.

4. The chip assembly (40) according to claim 3, characterized in that, The heat-conducting sheet (452) comprises graphite.

5. The chip assembly (40) according to any one of claims 2 to 4, characterized in that, The chip (41) includes a processor (413) and a memory (414). The processor (413) and the memory (414) are fixedly connected and stacked. The memory (414) is in contact with the first heat-conducting plate (42) or the memory (414) is in contact with the first heat-conducting component (44). The processor (413) is connected to the second heat-conducting plate (43), or the processor (413) is connected to the second heat-conducting component (45).

6. The chip assembly (40) according to claim 5, characterized in that, The chip (41) also includes an adapter board (415), which is located on the side of the processor (413) facing away from the memory (414) and is fixedly connected to the processor (413). The adapter board (415) is communicatively connected to the processor (413) and the motherboard (46). The adapter plate (415) includes a first side (4151) and a second side (4152) arranged opposite to each other. The first side (4151) of the adapter plate (415) is connected to the processor (413), and a portion of the second side (4152) of the adapter plate (415) is connected to the motherboard (46), and a portion is in contact with the second heat-conducting component (45).

7. The chip assembly (40) according to any one of claims 2 to 4, characterized in that, The third heat-conducting element (47) is columnar and passes through the main board (46). The first end (471) of the third heat-conducting element (47) is fixedly connected to the first heat-conducting plate (42), and / or the second end (472) of the third heat-conducting element (47) is fixedly connected to the second heat-conducting plate (43).

8. The chip assembly (40) according to any one of claims 2 to 4, characterized in that, The third heat-conducting component (47) is columnar, and is inserted through the main board (46) and riveted to the main board (46).

9. The chip assembly (40) according to any one of claims 2 to 4, characterized in that, The third heat-conducting component (47) includes a first column portion (474), a second column portion (475), and a heat-conducting wire portion (476), wherein the heat-conducting wire portion (476) is fixedly connected between the first column portion (474) and the second column portion (475); The motherboard (46) is provided with a second through hole (462), the first column portion (474) and the second column portion (475) are respectively located on opposite sides of the second through hole (462) and are both fixedly connected to the motherboard (46), and at least a portion of the heat-conducting wire portion (476) is located in the second through hole (462).

10. The chip assembly (40) according to any one of claims 2 to 4, characterized in that, The chip assembly (40) further includes a first shield (481) and a second shield (482). The first shield (481) is located between the first heat-conducting plate (42) and the motherboard (46) and connects the first heat-conducting plate (42) and the motherboard (46). At least a portion of the second shielding member (482) is located between the third heat-conducting member (47) and the first heat-conducting plate (42), and connects the third heat-conducting member (47) and the first heat-conducting plate (42).

11. The chip assembly (40) according to claim 10, characterized in that, The second shielding element (482) is capable of deformation.

12. The chip assembly (40) according to claim 10, characterized in that, The chip assembly (40) further includes a fourth thermal conductive element (490), at least a portion of which is located between the third thermal conductive element (47) and the first thermal conductive plate (42), and is connected to and in contact with the third thermal conductive element (47) and the first thermal conductive plate (42) respectively; At least a portion of the fourth heat-conducting element (490) is disposed in the same layer as the second shielding element (482).

13. The chip assembly (40) according to any one of claims 1 to 4, characterized in that, The number of the third heat-conducting elements (47) is multiple, and the multiple third heat-conducting elements (47) are arranged around the chip (41).

14. The chip assembly (40) according to any one of claims 1 to 4, characterized in that, The material of the second heat-conducting plate (43) includes metal.

15. The chip assembly (40) according to any one of claims 1 to 4, characterized in that, The chip assembly (40) also includes a fastener (491) that is fixedly connected to the first heat-conducting plate (42) and the second heat-conducting plate (43), and the fastener (491) is used for grounding.

16. The chip assembly (40) according to any one of claims 1 to 4, characterized in that, The chip assembly (40) further includes a first heat-conducting element (401) and a first heat dissipation fin (402), wherein the first heat-conducting element (401) connects the first heat dissipation fin (402) and the first heat-conducting plate (42).

17. The chip assembly (40) according to claim 16, characterized in that, The chip assembly (40) further includes a first air source (403) for blowing air onto the first heat sink fins (402).

18. An electronic device (100), characterized in that, The device includes a housing (10) and a chip assembly (40) as claimed in any one of claims 1 to 17, the housing (10) having an internal space (123), the chip assembly (40) being mounted in the internal space (123), and a second heat-conducting plate (43) of the chip assembly (40) being connected to the housing (10).

19. An electronic device (100), characterized in that, It includes a heat dissipation assembly (50) and a chip assembly (40) as claimed in any one of claims 1 to 15, wherein the heat dissipation assembly (50) is connected to the first heat-conducting plate (42).

20. The electronic device (100) according to claim 19, characterized in that, The heat dissipation assembly (50) includes a second heat-conducting element (51) and a second heat dissipation fin (52), wherein the second heat-conducting element (51) connects the second heat dissipation fin (52) and the first heat-conducting plate (42).

21. The electronic device (100) according to claim 20, characterized in that, The heat dissipation assembly (50) further includes a second air source (53) for blowing air onto the second heat dissipation fins (52).

22. The electronic device (100) according to claim 19, characterized in that, The electronic device (100) further includes a housing (10) having an internal space (123), the chip assembly (40) being mounted in the internal space (123), and a second heat-conducting plate (43) of the chip assembly (40) being connected to the housing (10).

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