Silicon wafer supporting and adjusting structure and silicon wafer loader

Abstract

The utility model relates to the technical field of silicon wafer storage, in particular to a silicon wafer bearing adjusting structure and a silicon wafer loader, which comprise a first baffle plate, a second baffle plate, a supporting rod and an adjusting rod, a silicon wafer bearing frame is formed by the first baffle plate, the second baffle plate and the supporting rod, and opposite clamping grooves are formed by bearing tooth pieces on two tooth rods which are arranged in parallel at intervals. The two adjusting rods are used for bearing silicon wafers, the distance between the two opposite clamping grooves is controlled by adjusting the two adjusting rods to move in the axis direction of the bearing tooth piece, then the silicon wafers of different sizes and specifications can be borne in a matched mode, and meanwhile, due to the fact that the adjusting rods move in the axis direction of the bearing tooth piece, the tooth length of the silicon wafers borne by the bearing tooth piece can be adjusted. According to the silicon wafer bearing adjusting structure and the silicon wafer loader, the situation that the specifications of silicon wafer loaders need to be frequently replaced when the silicon wafer loaders are of a traditional structure can be avoided, the production cost is reduced, the production time is saved, and the production efficiency is improved.

Description

Technical Field

[0001] This utility model relates to the field of silicon wafer storage technology, and in particular to a silicon wafer support and adjustment structure and a silicon wafer carrier. Background Technology

[0002] A silicon wafer carrier is used to support silicon wafers. Currently, carriers used to support monocrystalline silicon wafers typically consist of a frame and side bars with slots into which the silicon wafers are inserted.

[0003] Different types of silicon wafers not only have strict requirements on the spacing of the side rods, but also on the length of the slot. In general, in the existing silicon wafer carrier structure, the side rods and the baffle are welded together, making the whole structure relatively fixed. This means that the silicon wafer carrier can only be used to carry silicon wafers of a fixed type. Even if a few improved devices allow the side rods to move, the length of the slot cannot be adjusted as the size of the silicon wafer increases, which can easily lead to silicon wafer sticking. This results in each type of silicon wafer carrier being able to carry only one or a few types of silicon wafers. When storing multiple types of silicon wafers, different specifications of silicon wafer carriers are required, which increases production costs. Utility Model Content

[0004] This utility model provides a silicon wafer support adjustment structure and a silicon wafer carrier to solve the defect that the silicon wafer carrier in the prior art can only support one or a few types of silicon wafers, and realize the ability to support different types of silicon wafers.

[0005] This utility model provides a silicon wafer support adjustment structure, including a baffle assembly, a support rod, a rack assembly, and an adjusting rod. The baffle assembly includes a first baffle and a second baffle arranged opposite to each other. The two ends of the support rod are fixedly connected to the first baffle and the second baffle, respectively. The rack assembly includes at least a pair of parallel, spaced racks, with the two ends of each rack connected to the first baffle and the second baffle, respectively. Multiple supporting teeth are distributed along the length of each rack, and a groove is formed between adjacent supporting teeth. Each rack is equipped with an adjusting rod, with the supporting teeth of the rack passing through it. The two ends of the adjusting rod are movably connected to the first baffle and the second baffle, respectively, so that the adjusting rod is suitable for moving along the axial direction of the supporting teeth.

[0006] According to the silicon wafer support adjustment structure provided by this utility model, a plurality of supporting teeth on the rack are evenly distributed along the length direction of the rack, and each supporting tooth is a conical tooth.

[0007] According to the silicon wafer support adjustment structure provided by this utility model, the adjustment rod includes a rod body with a plurality of through holes distributed on the rod body. The plurality of through holes are respectively arranged in correspondence with the supporting teeth of the toothed rod, and the supporting teeth pass through the through holes.

[0008] According to the silicon wafer support adjustment structure provided by this utility model, the first baffle and the second baffle are respectively provided with waist-shaped holes, and the two ends of the adjustment rod are respectively located in the waist-shaped holes of the first baffle and the second baffle, so that the adjustment rod can move along the waist-shaped holes.

[0009] According to the silicon wafer support adjustment structure provided by this utility model, the end of the adjustment rod is detachably sleeved with a first locking nut, which is used to position and fix the adjustment rod in the waist-shaped hole.

[0010] According to the silicon wafer support adjustment structure provided by this utility model, the two ends of the toothed bar are movably connected to the first baffle and the second baffle respectively through an adjustment mechanism, so that the pair of toothed bars can move closer to each other or further away from each other.

[0011] According to the present invention, a silicon wafer support adjustment structure is provided, wherein the adjustment mechanism includes the waist-shaped hole and a second locking nut detachably sleeved on the end of the toothed rod. The end of the toothed rod passes through the waist-shaped hole, and the second locking nut is detachably sleeved on the end of the toothed rod for positioning and fixing the toothed rod in the waist-shaped hole.

[0012] According to the silicon wafer support adjustment structure provided by this utility model, the first baffle and the second baffle are both U-shaped baffles, including a base plate and side plates located at both ends of the base plate. At least one set of waist-shaped holes are provided on the two side plates for movably passing through the end of the toothed rod and the end of the adjustment rod.

[0013] There are multiple support rods, and at least one support rod is connected between the bottom plate of the first baffle and the bottom plate of the second baffle, and at least one support rod is connected between the side plate of the first baffle and the side plate of the second baffle.

[0014] According to the silicon wafer support adjustment structure provided by this utility model, the support rod is detachably connected to the first baffle and the second baffle via a connector.

[0015] This utility model also provides a silicon wafer carrier, including the silicon wafer support and adjustment structure described in any one of the above.

[0016] The silicon wafer support adjustment structure and silicon wafer carrier provided by this utility model consist of a silicon wafer support frame composed of a first baffle, a second baffle, and support rods. Supporting teeth on two parallel, spaced-apart rods form opposing slots for supporting silicon wafers. The distance between the two opposing slots is controlled by adjusting the movement of the two adjusting rods along the axial direction of the supporting teeth, thus adapting to support silicon wafers of different sizes and specifications. Simultaneously, because the adjusting rods move along the axial direction of the supporting teeth, the tooth length of the supporting teeth supporting the silicon wafer can also be adjusted, reducing silicon wafer adhesion and improving production quality. This silicon wafer support adjustment structure and silicon wafer carrier of this utility model avoids the need for frequent changes in silicon wafer support specifications required by traditional structures, reducing production costs, saving production time, and improving production efficiency. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0018] Figure 1 This is a front view schematic diagram of the silicon wafer support and adjustment structure provided by this utility model.

[0019] Figure 2 This is a top view schematic diagram of the silicon wafer support and adjustment structure provided by this utility model.

[0020] Figure 3 This is a side view schematic diagram of the silicon wafer support and adjustment structure provided by this utility model.

[0021] Figure 4 This is a schematic diagram of the structure of the toothed rod provided by this utility model.

[0022] Figure 5 This is a schematic diagram of the structure of the adjusting rod provided by this utility model.

[0023] Reference numerals in the attached drawings: 1. First baffle; 2. Second baffle; 3. Support rod; 4. Gear; 5. Support gear; 6. Adjusting rod; 601. Rod body; 602. Through hole; 7. Waist-shaped hole; 8. First locking nut; 9. Second locking nut. Detailed Implementation

[0024] To make the objectives, technical solutions, and advantages of this utility model clearer, the technical solutions of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0025] In the description of the embodiments of this utility model, it should be noted that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this utility model. In addition, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0026] In the description of the embodiments of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this utility model based on the specific circumstances.

[0027] In this embodiment of the utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0028] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0029] The following combination Figures 1 to 5 This invention describes the specific structure of the silicon wafer support and adjustment structure and the silicon wafer carrier of this utility model.

[0030] One embodiment of this utility model provides a silicon wafer support adjustment structure, see [link to relevant documentation]. Figure 1 As shown, the silicon wafer support and adjustment structure includes a baffle assembly, a support rod 3, a rack assembly, and an adjustment rod 6. The baffle assembly includes a first baffle 1 and a second baffle 2 arranged opposite to each other. The two ends of the support rod 3 are fixedly connected to the first baffle 1 and the second baffle 2, respectively. The rack assembly includes at least a pair of racks 4 arranged in parallel and spaced apart. The two ends of the racks 4 are connected to the first baffle 1 and the second baffle 2, respectively. Multiple support teeth 5 are distributed along the length of the racks 4, and a groove is formed between two adjacent support teeth 5. Each rack 4 is equipped with an adjustment rod 6. The support teeth 5 of the rack 4 pass through the adjustment rod 6. The two ends of the adjustment rod 6 are movably connected to the first baffle 1 and the second baffle 2, respectively, so that the adjustment rod 6 is suitable for moving along the axial direction of the support teeth 5.

[0031] Combination Figure 1 , Figure 2 and Figure 3 The various views of the silicon wafer support adjustment structure shown in this embodiment illustrate that the silicon wafer support adjustment structure consists of a first baffle 1, a second baffle 2, and a support rod 3 forming a silicon wafer support frame. Supporting teeth 5 on two parallel, spaced-apart toothed rods 4 form opposing slots for supporting the silicon wafer. The distance between the two opposing slots is controlled by adjusting the movement of the two adjusting rods 6 along the axial direction of the supporting teeth 5, thus adapting to support silicon wafers of different sizes and specifications. Simultaneously, because the adjusting rods 6 move along the axial direction of the supporting teeth 5, the tooth length of the supporting teeth 5 supporting the silicon wafer can also be adjusted, reducing wafer adhesion and improving production quality. This silicon wafer support adjustment structure of this embodiment avoids the need for frequent changes in silicon wafer support specifications required by traditional structures, reducing production costs, saving production time, and improving production efficiency.

[0032] In some embodiments of the silicon wafer support adjustment structure of this utility model, see [reference needed]. Figure 4 As shown, multiple supporting teeth 5 on the rack 4 are evenly distributed along the length of the rack 4, and each supporting tooth 5 is a conical tooth. See also Figure 5 As shown, the adjusting rod 6 includes a rod body 601, on which a plurality of through holes 602 are distributed. The plurality of through holes 602 are arranged in a one-to-one correspondence with the supporting teeth 5 of the rack 4, and the supporting teeth 5 pass through the through holes 602.

[0033] Understandably, the supporting gear 5 can be a tapered pointed tooth or a frustum-shaped tooth, and the inner diameter of the through hole 602 on the adjusting rod 6 should be at least larger than the maximum diameter of the supporting gear 5 to ensure that the through hole 602 can move to any depth of the supporting gear 5. See also Figure 1 As shown, the relative position of the through hole 602 and the support tooth 5 can be adjusted by moving the adjusting rod 6. The groove between two adjacent support teeth 5 is a slot for supporting silicon wafers. By moving the adjusting rod 6, the position of the through hole 602 on the support tooth 5 can be adjusted, thereby adjusting the depth of the groove between two adjacent support teeth 5, which in turn reflects the adjustment of the distance between the two opposing slots. Different slot distances can support silicon wafers of different sizes and specifications.

[0034] In other embodiments of the silicon wafer support adjustment structure of this utility model, see [link to other embodiments]. Figure 2 As shown, the first baffle 1 and the second baffle 2 are respectively provided with waist-shaped holes 7, and the two ends of the adjusting rod 6 are located in the waist-shaped holes 7 of the first baffle 1 and the second baffle 2, so that the adjusting rod 6 can move along the waist-shaped holes 7.

[0035] It is understood that in the silicon wafer support adjustment structure of this utility model, the key to adjusting the distance between the two opposing slots lies in the movement adjustment of the adjustment rod 6. In this embodiment, the end of the adjustment rod 6 is located in the waist-shaped hole 7. The waist-shaped hole 7 is an elongated hole with a groove parallel to the axis of the support tooth 5, which is suitable for the end of the adjustment rod 6 to move along the axis of the support tooth 5 in the waist-shaped hole 7, thereby realizing the movement adjustment of the adjustment rod 6.

[0036] Furthermore, in some specific examples, a first locking nut 8 is detachably fitted onto the end of the adjusting rod 6. The first locking nut 8 is used to position and fix the adjusting rod 6 within the oblong hole 7. See also... Figure 2As shown, it can be understood that the two ends of the adjusting rod 6 are respectively located in the waist-shaped hole 7 on the first baffle 1 and the waist-shaped hole 7 on the second baffle 2. After the adjusting rod 6 is adjusted to a suitable position in the waist-shaped hole 7, it can be fixed by the first locking nut 8. Specifically, the waist-shaped hole 7 is a countersunk hole. Countersunk waist-shaped holes 7 are provided on the side of the first baffle 1 facing away from the second baffle 2 and on the side of the second baffle 2 facing away from the first baffle 1. The two ends of the adjusting rod 6 are respectively inserted into the two waist-shaped holes 7. Then, a first locking nut 8 is threaded onto each of the two ends of the adjusting rod 6. By rotating the first locking nut 8, when the two first locking nuts 8 move away from each other, the adjusting rod 6 is unlocked and can move laterally in the waist-shaped hole 7. When the two first locking nuts 8 approach each other and abut against the countersunk waist-shaped hole 7, the adjusting rod 6 is locked and can no longer move.

[0037] In other embodiments of the silicon wafer support adjustment structure of this utility model, the two ends of the toothed rod 4 are movably connected to the first baffle 1 and the second baffle 2 respectively through the adjustment mechanism, so that a pair of toothed rods 4 can move closer to each other or further away from each other.

[0038] It is understood that in this embodiment, in addition to the relative movement of the two adjusting rods 6, the two toothed rods 4 can also move relative to each other. The relative movement of the two toothed rods 4 causes the supporting teeth 5 on the two toothed rods 4 to move relatively away or relatively close, thereby realizing the mutual movement of the slots. In this embodiment, the positions of both the toothed rods 4 and the adjusting rods 6 are adjustable. The adjusting rod 6 with the through hole 602 adjusts the spacing of the silicon wafers by moving laterally along the baffle and positioning itself. The toothed rods 4 can precisely adjust the tooth length of the silicon wafers according to the specifications of the silicon wafers by moving laterally along the baffle and positioning themselves, thereby reducing silicon wafer adhesion and improving production quality.

[0039] Specifically, in some specific examples of the silicon wafer support adjustment structure of this utility model, the adjustment mechanism connected to the rack 4 includes a slotted hole 7 and a second locking nut 9 detachably sleeved on the end of the rack 4. The end of the rack 4 passes through the slotted hole 7, and the second locking nut 9 is detachably sleeved on the end of the rack 4 for positioning and fixing the rack 4 within the slotted hole 7. See also... Figure 2 As shown, it can be understood that the rack 4 and the adjusting rod 6 can share a waist-shaped hole 7 to achieve lateral position adjustment, and then be positioned and fixed by the second locking nut 9 and the first locking nut 8 respectively.

[0040] In some specific embodiments of the silicon wafer support adjustment structure of this utility model, combined with Figure 1 , Figure 2 and Figure 3As shown, both the first baffle 1 and the second baffle 2 are U-shaped baffles, including a base plate and side plates at both ends of the base plate. At least one set of oblong holes 7 are provided on each of the two side plates for the movable passage of the end of the toothed rod 4 and the end of the adjusting rod 6. There are multiple support rods 3; at least one support rod 3 is connected between the base plate of the first baffle 1 and the base plate of the second baffle 2, and at least one support rod 3 is connected between the side plates of the first baffle 1 and the side plates of the second baffle 2.

[0041] It is understood that the silicon wafer support and adjustment structure provided by this utility model can be used vertically or horizontally. In this embodiment, see [reference needed]. Figure 1 As shown, this is a vertically oriented structure. Both the first baffle 1 and the second baffle 2 are U-shaped baffles, with the first baffle 1 serving as the top plate and the second baffle 2 as the bottom plate. Four support rods 3 connect the first baffle 1 and the second baffle 2, with two support rods 3 connecting to the bottom plates of both baffles. The two side plates of the first baffle 1 and the second baffle 2 are each connected by a support rod 3. The first baffle 1, the second baffle 2, and the four support rods 3 form a stable frame structure. (See also...) Figure 2 As shown, four waist-shaped holes 7 are respectively provided on the first baffle 1 and the second baffle 2, which can be connected to four sets of toothed rods 4 and adjusting rods 6. By adjusting the four sets of toothed rods 4 and adjusting rods 6 in pairs, the spacing and tooth length of the silicon wafers can be adjusted to accommodate silicon wafers of more sizes.

[0042] Furthermore, the support rod 3 is detachably connected to the first baffle 1 and the second baffle 2 via connectors, such as bolts, screws, and nuts. It is understood that the components of this invention have simple structures and are all detachable, facilitating maintenance and component replacement.

[0043] In another aspect, this utility model also provides a silicon wafer carrier, which includes the silicon wafer support adjustment structure in any of the above embodiments or examples. It is understood that because the silicon wafer carrier provided by this utility model includes the silicon wafer support adjustment structure in the above embodiments, the silicon wafer carrier of this utility model necessarily possesses the function of the silicon wafer support adjustment structure in any of the above embodiments. It can adjust the spacing and tooth length of the supported silicon wafers through the relative adjustment of the toothed rod 4 and the adjusting rod 6, so as to accommodate the support and placement of silicon wafers of more sizes and specifications. At the same time, the structure is simple and easy to maintain and replace components.

[0044] Furthermore, an indicator mark for the moving distance (not shown in the figure) can be set on the edge of the waist-shaped hole 7, and an indicator arrow (not shown in the figure) can be set at the end of the toothed bar 4 and the adjusting rod 6. Through the coordination of the indicator arrow and the indicator mark, the adjustment distance of the toothed bar 4 and the adjusting rod 6 can be accurately guided, so as to achieve precise adjustment of the spacing of the silicon wafers and the tooth length of the silicon wafers. In some specific examples, the silicon wafer support adjustment structure and silicon wafer carrier of this utility model can also be equipped with egg-shaped adjustment plates of various sizes (not shown in the figure). The egg-shaped adjustment plates can be attached to the end of the supporting tooth 5 to adjust the spacing of the silicon wafers. By using egg-shaped adjustment plates of different sizes, the depth and width of the groove between adjacent supporting tooth 5 can also be adjusted, which can accommodate silicon wafers of more sizes.

[0045] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and not to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.

Claims

1. A silicon wafer support and adjustment structure, characterized in that, include: The baffle assembly includes a first baffle (1) and a second baffle (2) disposed opposite to each other. Support rod (3), the two ends of which are fixedly connected to the first baffle (1) and the second baffle (2) respectively; The rack assembly includes at least one pair of racks (4) arranged in parallel and spaced apart. The two ends of the racks (4) are respectively connected to the first baffle (1) and the second baffle (2). Multiple support teeth (5) are distributed on the racks (4) along the length direction of the racks (4), and a groove is formed between two adjacent support teeth (5). Adjusting rod (6), each of the racks (4) is provided with one adjusting rod (6), the supporting tooth (5) of the rack (4) passes through the adjusting rod (6), and the two ends of the adjusting rod (6) are respectively movably connected to the first baffle (1) and the second baffle (2) so that the adjusting rod (6) is adapted to move along the axial direction of the supporting tooth (5).

2. The silicon wafer support and adjustment structure according to claim 1, characterized in that, The plurality of supporting teeth (5) on the rack (4) are evenly distributed along the length direction of the rack (4), and each supporting tooth (5) is a conical tooth.

3. The silicon wafer support and adjustment structure according to claim 1, characterized in that, The adjusting rod (6) includes a rod body (601), on which a plurality of through holes (602) are distributed. The plurality of through holes (602) are provided in a one-to-one correspondence with the supporting tooth (5) of the toothed rod (4), and the supporting tooth (5) passes through the through holes (602).

4. The silicon wafer support and adjustment structure according to any one of claims 1 to 3, characterized in that, The first baffle (1) and the second baffle (2) are respectively provided with waist-shaped holes (7), and the two ends of the adjusting rod (6) are respectively located in the waist-shaped holes (7) of the first baffle (1) and the second baffle (2) so that the adjusting rod (6) can move along the waist-shaped holes (7).

5. The silicon wafer support and adjustment structure according to claim 4, characterized in that, The end of the adjusting rod (6) is detachably fitted with a first locking nut (8), which is used to position and fix the adjusting rod (6) in the waist-shaped hole (7).

6. The silicon wafer support and adjustment structure according to claim 4, characterized in that, The two ends of the rack (4) are movably connected to the first baffle (1) and the second baffle (2) respectively through the adjustment mechanism, so that the pair of racks (4) can move closer to each other or further away from each other.

7. The silicon wafer support and adjustment structure according to claim 6, characterized in that, The adjustment mechanism includes the waist-shaped hole (7) and a second locking nut (9) detachably sleeved on the end of the toothed rod (4). The end of the toothed rod (4) passes through the waist-shaped hole (7), and the second locking nut (9) is detachably sleeved on the end of the toothed rod (4) for positioning and fixing the toothed rod (4) in the waist-shaped hole (7).

8. The silicon wafer support and adjustment structure according to claim 7, characterized in that, Both the first baffle (1) and the second baffle (2) are U-shaped baffles, including a bottom plate and side plates located at both ends of the bottom plate. At least one set of waist-shaped holes (7) are provided on the two side plates for the end of the toothed rod (4) and the end of the adjusting rod (6) to pass through movably. There are multiple support rods (3), and at least one support rod (3) is connected between the bottom plate of the first baffle (1) and the bottom plate of the second baffle (2), and at least one support rod (3) is connected between the side plate of the first baffle (1) and the side plate of the second baffle (2).

9. The silicon wafer support and adjustment structure according to claim 8, characterized in that, The support rod (3) is detachably connected to the first baffle (1) and the second baffle (2) via a connector.

10. A silicon wafer carrier, characterized in that, Includes the silicon wafer support and adjustment structure as described in any one of claims 1 to 9.

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