Double-sided heat dissipation type power module
By introducing a double-sided heat dissipation design and a water-cooled plate cooling medium into the power module, the problem of poor heat dissipation on the front side of the chip is solved, and an efficient double-sided heat dissipation effect is achieved, which is suitable for high-power modules.
Patent Information
- Application Number
- CN202421680078.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-16
- Publication Date
- 2025-10-28
- Estimated Expiration
- 2034-07-16
AI Technical Summary
The existing power modules have poor heat dissipation effects, especially in the large area on the front of the chip due to the poor heat conduction effect of silicone gel, resulting in low heat dissipation efficiency.
A double-sided heat dissipation design is adopted. By installing a water cooling plate on the front of the chip and using a cooling medium for direct cooling in a confined space, combined with a reasonable structural layout and sealing ring design, effective heat dissipation from the front of the chip is achieved.
It achieves efficient heat dissipation on the front of the chip, improves the heat dissipation performance of the module, and has a compact structure, making it suitable for applications with high power density.
Smart Images
Figure CN223487045U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to a double-sided heat dissipation power module. Background Technology
[0002] In the prior art, power modules typically have the following structure: Figure 1 As shown, the main components include busbar terminals, epoxy resin, bonding wires, silicone gel, chip, solder layer, ceramic copper-clad substrate, fasteners, and heat sink. Especially for high-power modules, heat dissipation is one of their most critical performance characteristics. The common practice is to secure the entire module to a water-cooling system. The large amount of heat dissipated by the chip is conducted downwards through the solder layer, ceramic copper-clad substrate, and heat sink to the water-cooling system, where it is absorbed and carried away. The chip's source or emitter electrodes typically serve as interfaces for circuit interconnection, connected to other potentials via bonding wires. While some heat can be carried away through these bonding wires, their cross-sectional area is usually small, limiting the amount of heat dissipated. Furthermore, the bonding wires occupy a small proportion of the chip's front surface area; a large portion of the chip's front surface is in direct contact with the silicone gel, which has poor thermal conductivity. Therefore, a significant portion of the chip's front surface area is not effectively utilized for heat dissipation. Utility Model Content
[0003] To solve the above-mentioned technical problems, this utility model provides a double-sided heat dissipation power module.
[0004] This utility model is achieved through the following technical solution.
[0005] This utility model provides a double-sided heat dissipation power module, including a heat dissipation base plate; base islands are processed on both sides and the middle of the heat dissipation base plate by ceramic copper-clad plates, and several chips are installed on the base islands on the middle and one side of the heat dissipation base plate. Each chip has a power terminal installed next to it, and the base island on the other side has a power terminal and a signal terminal installed. The signal terminal is connected to the base island in the middle of the heat dissipation base plate through connecting copper busbars. The chips are connected to the base islands on both sides of the heat dissipation base plate through connecting copper busbars, and a water-cooling plate is also installed on the top of the chips.
[0006] The signal terminals connected to the same base island are on the same straight line.
[0007] The heat dissipation base plate is also provided with a frame, and the top of the frame is closed by a cover plate.
[0008] The inner side of the frame is also provided with a step, the height of which is the same as the height of the chip, and the two opposite sides of the step are respectively connected to the two ends of the water cooling plate.
[0009] The water-cooled plate includes cooling pipes and sealing rings. Several sealing rings are installed on the edge of the chip. Each sealing ring and the upper surface of the chip form an independent sealing space with the water-cooled plate. Each independent sealing space is connected to the other by cooling pipes.
[0010] A coolant inlet pipe and a coolant outlet pipe are respectively installed in two sealed spaces located in the middle of the water-cooled plate and at its edge. The coolant inlet pipe and the coolant outlet pipe extend out of the top of the water-cooled plate.
[0011] The drain of the chip is soldered to the base island, the gates of the chip are connected by bonding leads, and the sources of the chip are connected by connecting copper busbars.
[0012] The power terminals are arranged in a straight line along the edge of the heat sink base plate on each base island.
[0013] The beneficial effects of this utility model are: the reasonable spatial layout makes the internal structure of the power module compact, and the addition of a water-cooling plate on the top of the chip to directly cool the front of the chip achieves the effect of double-sided heat dissipation. Attached Figure Description
[0014] Figure 1 It is a structural diagram of the utility model;
[0015] Figure 2 This is a schematic diagram of the structure of a chip using existing technology;
[0016] Figure 3 This is a schematic diagram of the external structure of a chip using existing technology.
[0017] In the diagram: 1-frame, 2-power terminal, 3-connecting copper busbar, 4-signal terminal, 5-ceramic copper-clad laminate, 6-heat dissipation base plate, 7-water cooling plate, 8-sealing ring, 9-chip, 10-bonding wire, 11-cooling pipe, 12-coolant inlet pipe, 13-coolant outlet pipe, 14-step. Detailed Implementation
[0018] The technical solution of this utility model is further described below, but the scope of protection is not limited to what is described.
[0019] A double-sided heat dissipation power module includes a heat dissipation base plate 6; base islands are formed on both sides and the middle of the heat dissipation base plate 6 by ceramic copper-clad plates 5; several chips 9 are installed on the base islands on the middle and one side of the heat dissipation base plate 6, and a power terminal 2 is installed next to each chip 9; a power terminal 2 and a signal terminal 4 are installed on the base island on the other side; the signal terminal 4 is connected to the base island in the middle of the heat dissipation base plate 6 by connecting copper busbars 3; the chips 9 are connected to the base islands on both sides of the heat dissipation base plate 6 by connecting copper busbars 3; and a water-cooling plate 7 is installed on the top of the chips 9.
[0020] By dividing the front of the chip into three areas: the gate region, the source region, and the heat dissipation region, such as... Figure 1 As shown, the chip's heat dissipation area undergoes anodizing treatment and surface insulation. Two layers of sealing rings, inner and outer, are installed around the heat dissipation area, and an insulating plastic cover is added on top to form an internal sealed space. Cooling media, including but not limited to air, water, and oil, can then be used within this sealed space to directly cool the front side of the chip. This optimized structure achieves double-sided heat dissipation, which is the main advantage of this invention. Furthermore, the compact layout of this structure effectively utilizes the upper space, enabling high power density, which is another advantage. Due to its excellent heat dissipation performance, this solution is preferably used in high-power IGBT, MOSFET, and SiC MOSFET module products.
[0021] The signal terminals 4 connected to the same base island are on the same straight line.
[0022] The edge of the heat dissipation base plate 6 is also provided with a frame 1, and the top of the frame 1 is closed by a cover plate.
[0023] The inner side of the frame 1 is also provided with a step 14, the height of the step 14 is the same as the height of the chip 9, and the two opposite sides of the step 14 are respectively connected to the two ends of the water-cooled plate 7.
[0024] The water-cooled plate 7 includes cooling pipes 11 and sealing rings 8. Several sealing rings 8 are installed on the edge of the chip 9. Each sealing ring 8 and the upper end face of the chip 9 form an independent sealing space with the water-cooled plate 7. Each independent sealing space is connected to the other by cooling pipes 11.
[0025] Coolant inlet pipe 12 and coolant outlet pipe 13 are respectively installed in two sealed spaces located in the middle of the water-cooled plate 7 and at its edge. Coolant inlet pipe 12 and coolant outlet pipe 13 extend out of the top of the water-cooled plate 7.
[0026] The drain of the chip 9 is soldered to the base island, the gates of the chip 9 are connected by bonding leads 10, and the sources of the chip 9 are connected by connecting copper busbars 3.
[0027] The power terminals 2 are arranged in a straight line along the edge of each base island 6.
[0028] Chip 9 is sintered onto the ceramic copper-clad laminate 5 using a soldering process; the chip gate is connected using an ultrasonic bonding aluminum wire process; a connecting copper busbar 3 is used in the chip source region to lead the potential out to another base island of the DBC; the connecting copper busbar 3 passes through the water-cooling plate 7; the water-cooling plate 7 is made of insulating material and is press-fitted onto the sealing ring 8; the two sides of the water-cooling plate 7 are connected to the heat dissipation base plate 6 with screws to ensure the clamping force between the water-cooling plate 7 and the sealing ring 8, thereby ensuring the sealing performance; the water-cooling plate 7 has an internal flow channel design, allowing the cooling fluid to flow in from the lower right corner of the heat dissipation area of chip 9, pass through the chip surface, and then flow out from the upper left corner; the ceramic copper-clad laminate 5 is sintered onto the heat dissipation base plate 6, which is generally made of copper or aluminum; the power terminal 2 and the signal terminal 4 are sintered onto the ceramic copper-clad laminate 5; the module frame 1 is fastened to the heat dissipation base plate 6 with screws.
Claims
1. A double-sided heat dissipation power module, comprising a heat dissipation base plate (6), characterized in that: The heat dissipation base plate (6) has base islands processed on both sides and the middle part through ceramic copper-clad plates (5). Several chips (9) are installed on the base islands in the middle part and on one side of the heat dissipation base plate (6). Each chip (9) has a power terminal (2) installed next to it. The base island on the other side has a power terminal (2) and a signal terminal (4). The signal terminal (4) is connected to the base island in the middle part of the heat dissipation base plate (6) through connecting copper busbars (3). The chip (9) is connected to the base islands on both sides of the heat dissipation base plate (6) through connecting copper busbars (3). A water cooling plate (7) is also installed on the top of the chip (9).
2. The double-sided heat dissipation power module as described in claim 1, characterized in that: The signal terminals (4) connected to the same base island are on the same straight line.
3. The double-sided heat dissipation power module as described in claim 1, characterized in that: The edge of the heat dissipation base plate (6) is also provided with a frame (1), and the top of the frame (1) is closed by a cover plate.
4. The double-sided heat dissipation power module as described in claim 3, characterized in that: The inner side of the frame (1) is also provided with a step (14), the height of the step (14) is the same as the height of the chip (9), and the two opposite sides of the step (14) are respectively connected to the two ends of the water cooling plate (7).
5. The double-sided heat dissipation power module as described in claim 1, characterized in that: The water-cooled plate (7) includes cooling pipes (11) and sealing rings (8). Several sealing rings (8) are installed on the edge of the chip (9). Each sealing ring (8) and the upper surface of the chip (9) form an independent sealing space with the water-cooled plate (7). Each independent sealing space is connected to the other by cooling pipes (11) in sequence.
6. The double-sided heat dissipation power module as described in claim 5, characterized in that: A coolant inlet pipe (12) and a coolant outlet pipe (13) are respectively installed in two sealed spaces located in the middle of the water-cooled plate (7) and at its edge. The coolant inlet pipe (12) and the coolant outlet pipe (13) extend out of the top of the water-cooled plate (7).
7. The double-sided heat dissipation power module as described in claim 1, characterized in that: The drain of the chip (9) is soldered to the base island, the gates of the chip (9) are connected by bonding leads (10), and the sources of the chip (9) are connected by connecting copper busbars (3).
8. The double-sided heat dissipation power module as described in claim 1, characterized in that: The power terminals (2) are arranged in a straight line on the edge of the heat sink base plate (6) on each base island.