Structure for improving cooling efficiency of integrated circuit and vehicle-mounted controller

By using a fastening frame and abutment with the cooling plate in the vehicle controller, the problems of low integrated circuit cooling efficiency and large layout impact are solved, achieving more efficient cooling and a smaller PCB board design area, reducing manufacturing costs.

CN223487046UActive Publication Date: 2025-10-28ANHUI SHENJI TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202422543915.9
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-10-21
Publication Date
2025-10-28
Estimated Expiration
2034-10-21

AI Technical Summary

Technical Problem

In the prior art, the cooling efficiency of the integrated circuit of the vehicle controller is low, which easily leads to failure, and the fastening frame has a great impact on the layout of the PCB board.

Method used

A fastening frame is used to abut and fit the cooling plate and the integrated circuit, and connected by a connector. The bottom height of the fastening frame is greater than the maximum height of the electronic components on the PCB board to reduce the impact on the layout, and is fixed by threaded connectors or clips.

Benefits of technology

The cooling efficiency of the integrated circuit is improved, the influence of the fastening frame on the PCB board layout is reduced, the design area is significantly reduced, and the manufacturing cost is reduced.

✦ Generated by Eureka AI based on patent content.

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    Figure CN223487046U_ABST
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Abstract

The utility model discloses a structure for improving cooling efficiency of an integrated circuit and a vehicle-mounted controller. The structure for improving the cooling efficiency of the integrated circuit comprises a cooler comprising a cooling plate; the PCB is provided with the integrated circuit, and the integrated circuit is arranged on the side, facing the cooling plate, of the PCB; the fastening frame is arranged on the side, away from the cooling plate, of the PCB, at least two abutting parts are arranged at the bottom of the fastening frame, and the height of the abutting parts is larger than the maximum height of electronic components arranged on the side, close to the abutting parts, of the PCB; and the connecting piece can penetrate through the through hole in the PCB and is connected with the fastening frame and the cooling plate, so that the integrated circuit on the PCB abuts against and is attached to the cooling plate. According to the utility model, the cooling plate and the integrated circuit are abutted and attached through the fastening frame, so that the cooling efficiency of the integrated circuit is improved; the height of the abutting part is greater than the maximum height of the electronic component on the PCB, so that the influence caused by the arrangement of the fastening frame is reduced to the maximum extent.
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Description

Technical Field

[0001] This utility model relates to the field of controller technology, specifically to a structure for improving the cooling efficiency of integrated circuits and an on-board controller. Background Technology

[0002] The vehicle controller is the core control unit of the electric vehicle's overall control system, responsible for functions such as autonomous driving and cockpit control, providing comprehensive control logic for the smooth operation of the vehicle. The vehicle controller includes a PCB board and integrated circuits (i.e., chips) and various electronic components mounted on the PCB board. Integrated circuits, especially high-power BGA (Ball Grid Array) integrated circuits, have high cooling requirements; if the cooling efficiency of the integrated circuits is inadequate, system crashes and other malfunctions can easily occur. Utility Model Content

[0003] This utility model provides a structure and vehicle controller to improve the cooling efficiency of integrated circuits, thereby solving problems such as low cooling efficiency of integrated circuits on existing PCBs and the significant impact of fasteners on the layout of electronic components on PCBs.

[0004] A structure for improving the cooling efficiency of integrated circuits according to one aspect of an embodiment of the present invention includes:

[0005] A cooler, the cooler including a cooling plate;

[0006] A PCB board, wherein the integrated circuit is disposed on the PCB board, the PCB board and the cooling plate are adjacent to each other, and the integrated circuit is disposed on the side of the PCB board facing the cooling plate;

[0007] A fastening bracket is provided on the side of the PCB board away from the cooling plate. The bottom of the fastening bracket is provided with at least two abutment portions, and the height of each abutment portion is greater than the maximum height of the electronic components provided on the side of the PCB board near the abutment portion.

[0008] A connector that can pass through a through hole on the PCB board to connect the fastener and the cooling plate, so that the integrated circuit on the PCB board abuts and adheres to the cooling plate.

[0009] In some embodiments, a restricted area is provided on the PCB board, which is the area where the abutting part abuts against the PCB board.

[0010] In some embodiments, the fastening frame further includes at least two connecting portions and a frame body, the connecting portions being disposed on the side of the frame body and the abutting portion being disposed on the bottom of the frame body.

[0011] In some embodiments, the abutment portion is generally trapezoidal, and the maximum inclination angle between the outer surface of the abutment portion and the vertical surface is less than 30 degrees; and / or,

[0012] The contact portion is a strip-shaped body, and the cross-section of the strip-shaped body is rectangular or arc-shaped.

[0013] In some embodiments, an insulating layer is provided at the bottom of the abutment portion.

[0014] In some embodiments, the end of the connecting portion that is connected to the frame body is lower than the other end of the connecting portion that extends outward.

[0015] In some embodiments, a connection hole is provided on the other end of the connecting portion.

[0016] In some embodiments, the connector is a threaded connector, and the cooling plate is provided with a protrusion, the protrusion having a threaded inner hole that mates with the connector.

[0017] In some embodiments, the frame body is an annular frame with a through hole in the middle.

[0018] According to another aspect of the present invention, the vehicle controller includes a PCB board and an integrated circuit, wherein the integrated circuit is cooled using a structure that improves the cooling efficiency of the integrated circuit according to any one of the above embodiments.

[0019] Compared with the prior art, the present invention has the following advantages:

[0020] The structure proposed in this embodiment of the invention improves the cooling efficiency of integrated circuits by using a fastening bracket to abut and attach the cooling plate and the integrated circuit, thereby improving the cooling efficiency of the integrated circuit. Since the height of the abutment part at the bottom of the fastening bracket is greater than the maximum height of the electronic components on the PCB board, it is possible to place electronic components below the fastening bracket, thereby minimizing the impact of setting the fastening bracket on the layout of the PCB board and significantly reducing the design area of ​​the PCB. Attached Figure Description

[0021] Figure 1 This is a front view schematic diagram of a structure for improving the cooling efficiency of integrated circuits provided in some embodiments of this utility model;

[0022] Figure 2 It is the restricted area formed by the fastener on the PCB board in the existing technology;

[0023] Figure 3 This is a no-fabrication zone formed on a PCB board by a fastening bracket provided in some embodiments of this utility model;

[0024] Figure 4 This is a three-dimensional schematic diagram of a structure for improving the cooling efficiency of integrated circuits provided in some embodiments of this utility model.

[0025] Attached image annotations:

[0026] 1. Cooling section; 2. Cooling plate; 3. PCB board; 4. Integrated circuit; 5. Fastening frame; 6. Abutment part; 7. Connector; 8. Connection part; 9. Connection hole; 10. Protrusion; 11. Frame body; 12. Clothing restriction area; 13. Through hole. Detailed Implementation

[0027] Many specific details are set forth in the following description to provide a full understanding of the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar extensions without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0028] In the description of this utility model, it should be understood that the directional descriptions, such as up, down, front, back, left, right, etc., indicate the directional or positional relationship based on the directional or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0029] In the description of this utility model, unless otherwise explicitly defined, terms such as "setting," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.

[0030] In the description of this utility model, the reference to terms such as "one embodiment", "some embodiments", "illustrative embodiment", "example", "specific example", or "some examples" means that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this utility model.

[0031] See Figure 1-4 As shown, one embodiment of this utility model discloses a structure for improving the cooling efficiency of integrated circuits, comprising:

[0032] Cooler 1, the cooler 1 including a cooling plate 2;

[0033] PCB board 3, on which the integrated circuit 4 is disposed, the PCB board 3 and the cooling plate 2 are adjacent, and the integrated circuit 4 is disposed on the side of the PCB board 3 facing the cooling plate 3;

[0034] A fastening bracket 5 is disposed on the side of the PCB board 3 away from the cooling plate 2. The bottom of the fastening bracket 5 is provided with at least two abutment portions 6, and the height of each abutment portion 6 is greater than the maximum height of the electronic components disposed on the side of the PCB board 3 near the abutment portion 6. The electronic components specifically refer to the components that are partially projected onto the PCB board 3 by the fastening bracket 5. Components that do not interfere with the fastening bracket 5 and affect other parts do not need to be considered in terms of their height.

[0035] The connector 7 can pass through the through hole on the PCB board 3 to connect the fastener 5 and the cooling plate 2, so that the integrated circuit 4 on the PCB board 3 abuts against the cooling plate 2, and also makes the abutting part 6 abut against the PCB board 3.

[0036] According to this embodiment, the cooling plate and integrated circuit are abutted and attached by the fastening bracket, which improves the cooling efficiency of the integrated circuit. Since the height of the abutting part at the bottom of the fastening bracket is greater than the maximum height of the electronic components on the PCB board, the electronic components can be arranged below the fastening bracket, thereby minimizing the impact of setting the fastening bracket on the layout of the PCB board and significantly reducing the design area of ​​the PCB.

[0037] In some embodiments, a restricted area 12 is provided on the PCB board 3, and the restricted area 12 is the area where the contact portion 6 abuts against the PCB board 3.

[0038] contrast Figure 2 and Figure 3 As can be seen from the restricted area, Figure 3 The restricted area is the area where the four contact parts connect to the PCB board, according to... Figure 3 As shown, the restricted area is an irregular ring-shaped region, which has a significant impact on the layout of electronic components on the PCB board. Figure 2 The restricted area is the entire annular area projected onto the PCB by the fastener. The significant reduction in the restricted area effectively reduces the design area of ​​the PCB, shrinks the space occupied, and lowers manufacturing costs.

[0039] In some embodiments, the fastening frame 5 includes at least two connecting portions 8 and a frame body 11, the connecting portions 8 being disposed on the side of the frame body, and the abutting portion 6 being disposed on the bottom of the frame body 11.

[0040] In some embodiments, combined with Figure 1 As shown, the abutting part 6 is generally trapezoidal, and the maximum inclination angle between the outer surface and the vertical surface of the abutting part 6 is less than 30 degrees. Optionally, the trapezoid described above can be an irregular trapezoid, depending on... Figure 1As shown, the abutment part 6 has a vertical structure on the side near the center of the frame body, while the other side away from the center of the frame body has an inclined angle.

[0041] Of course, the abutting part 6 can also be a strip, and the cross-section of the strip is rectangular or arc-shaped. This can not only provide support and abutment, but also reduce the impact on the layout of electronic components on the PCB board.

[0042] In some embodiments, an insulating layer (not shown) is provided at the bottom of the abutment portion 6.

[0043] Optionally, the fastening bracket 5 is a metal part, preferably aluminum or steel, and can be a casting or stamping part. An insulating layer, such as an insulating film or insulating pad, is provided at the bottom of the abutment part 6 to prevent the abutment part 6 from conducting electricity with the PCB board and to prevent the abutment part from affecting the performance of the PCB board.

[0044] In some embodiments, combined with Figure 1 and Figure 4 As shown, one end of the connecting part 8 that is connected to the frame body 11 is lower than the other end of the connecting part that extends outward.

[0045] In some embodiments, see continue to see Figure 2-4 A connection hole 9 is provided on the other end of the connecting part 8.

[0046] Among them, the number of connecting parts is two or more. Figure 4 There are four connecting parts 8. The connecting parts 8 can be connected at the corners of the frame body 11 or at the center of each side of the frame body.

[0047] Furthermore, each connecting part is evenly arranged around the frame body 11, with the center of the frame body 11 as the center, and arranged at intervals of 45 degrees, 60 degrees or 90 degrees respectively, thereby obtaining a layout structure of four connecting parts, three connecting parts and two connecting parts, which makes the support more stable.

[0048] Each connecting part has an open connecting hole 9 at the other end. Of course, the connecting hole 9 can also be a cylindrical hole.

[0049] In some embodiments, the connector 7 is a threaded connector, and the cooling plate 2 is provided with a protrusion 10, the protrusion 10 being provided with a threaded inner hole that mates with the connector 7.

[0050] It should be noted that, in addition to threaded connectors such as screws, connector 5 can also be a snap-fit ​​connector that can be disassembled and assembled. After passing through the connecting hole and the through hole on the PCB board, the snap-fit ​​connector is fixed to the protrusion 11 on the cooling plate 2 by snap-fit.

[0051] In some embodiments, the frame body 11 is an annular frame with a through hole 13 in the center. Electronic components can also be arranged within the through hole 13.

[0052] Specifically, the annular frame includes a circular frame or a polygonal frame, wherein the polygonal frame includes three or more sides, for example... Figure 2-4 The quadrilateral frame shown has connecting portions located at its four corners. Of course, the ring frame can be any type of ring frame besides circular or polygonal frames; no specific limitations are imposed here.

[0053] According to another aspect of the present invention, the vehicle controller includes a PCB board and an integrated circuit, wherein the integrated circuit is cooled using a structure that improves the cooling efficiency of the integrated circuit according to any one of the above embodiments.

[0054] By adopting the above-mentioned structure to improve the cooling efficiency of integrated circuits, the cooling efficiency and effect of integrated circuits on the PCB board inside the vehicle controller are improved, avoiding malfunctions such as vehicle controller crashes caused by the inability to dissipate heat generated by high-power integrated circuits in a timely manner.

[0055] In summary, the structure for improving integrated circuit cooling efficiency disclosed in the above embodiments of this utility model can achieve the following technical effects:

[0056] The structure proposed in this embodiment of the invention for improving the cooling efficiency of integrated circuits improves the cooling efficiency of integrated circuits by using a fastening bracket to abut and adhere the cooling plate and the integrated circuit.

[0057] Furthermore, since the height of the bottom abutment of the fastener is greater than the maximum height of the electronic components on the PCB board, it allows for the placement of electronic components below the fastener, significantly reducing the restricted area compared to existing technologies. This minimizes the impact of fastener placement on the PCB board layout and effectively reduces the PCB board area compared to existing designs where electronic components cannot be placed at the bottom of the fastener. It also reduces the space occupied by the PCB board and lowers the manufacturing cost of the vehicle controller.

[0058] It should be noted that although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make possible changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope defined in the claims of the present invention.

Claims

1. A structure for improving the cooling efficiency of integrated circuits, characterized in that, The structure for improving the cooling efficiency of integrated circuits includes: A cooler, the cooler including a cooling plate; A PCB board, wherein the integrated circuit is disposed on the PCB board, the PCB board and the cooling plate are adjacent to each other, and the integrated circuit is disposed on the side of the PCB board facing the cooling plate; A fastening bracket is provided on the side of the PCB board away from the cooling plate. The bottom of the fastening bracket is provided with at least two abutment portions, and the height of each abutment portion is greater than the maximum height of the electronic components provided on the side of the PCB board near the abutment portion. A connector that can pass through a through hole on the PCB board to connect the fastener and the cooling plate, so that the integrated circuit on the PCB board abuts and adheres to the cooling plate.

2. The structure for improving integrated circuit cooling efficiency according to claim 1, characterized in that, The PCB board has a restricted area, which is the area where the contact part abuts against the PCB board.

3. The structure for improving integrated circuit cooling efficiency according to claim 1, characterized in that, The fastening frame also includes at least two connecting parts and a frame body, the connecting parts being disposed on the side of the frame body, and the abutting part being disposed on the bottom of the frame body.

4. The structure for improving integrated circuit cooling efficiency according to claim 1, characterized in that, The abutting portion is generally trapezoidal, and the maximum inclination angle between the outer side and the vertical surface of the abutting portion is less than 30 degrees; and / or, The contact portion is a strip-shaped body, and the cross-section of the strip-shaped body is rectangular or arc-shaped.

5. The structure for improving integrated circuit cooling efficiency according to claim 1, characterized in that, An insulating layer is provided at the bottom of the contact portion.

6. The structure for improving integrated circuit cooling efficiency according to claim 3, characterized in that, The end of the connecting part that is connected to the frame body is lower than the other end of the connecting part that extends outward.

7. The structure for improving integrated circuit cooling efficiency according to claim 6, characterized in that, A connection hole is provided on the other end of the connecting part.

8. The structure for improving integrated circuit cooling efficiency according to claim 6, characterized in that, The connector is a threaded connector, and the cooling plate is provided with a protrusion, the protrusion having a threaded inner hole that mates with the connector.

9. The structure for improving integrated circuit cooling efficiency according to claim 6, characterized in that, The frame body is an annular frame with a through hole in the middle.

10. A vehicle-mounted controller, characterized in that, The vehicle controller includes a PCB board and an integrated circuit, wherein the integrated circuit is cooled using a structure that improves the cooling efficiency of the integrated circuit according to any one of claims 1-9.