Pad structure

Abstract

The utility model discloses a bonding pad structure, the bonding pad is used for welding elements, the peripheral side of the bonding pad is provided with a plurality of solder resisting parts, and the height of the solder resisting parts is greater than that of the bonding pad; the lower end face of the element abuts against the upper end face of the solder resisting part, a welding space is formed between the upper end face of the bonding pad and the lower end face of the element, and a welding material is filled in the welding space. According to the utility model, the peripheral side of the bonding pad is provided with the plurality of solder resist parts, and the solder resist parts are higher than the welding area at the center of the bonding pad, and the solder resist parts are used for supporting the element, so that the height of the element can be increased, the bottom space of the element is further increased, the fluidity of plastic package materials is better during plastic package, bubbles are not easy to generate, and the plastic package quality is higher.

Description

Technical Field

[0001] This utility model relates to the field of molding process technology, and in particular to a solder pad structure. Background Technology

[0002] Molding (molding) is an encapsulation process in which components are soldered onto a substrate, and then the gaps between the substrate and the components are filled with molding compound. This process provides mechanical protection, electrical insulation, and environmental protection, and is widely used in the manufacture of various electronic products. Through proper process design and technology selection, product performance and reliability can be significantly improved.

[0003] However, existing molding processes have the following drawbacks: Figure 1 As shown, the edge of the pad 200 is flush with the soldering area. After the component 100 is soldered onto the pad, it is almost in contact with the pad. This results in the gap between the component 100 and the substrate 300 being too small. When filling with molding compound, the molding compound has difficulty flowing, is filled with air bubbles, and has low molding quality. Summary of the Invention

[0004] In view of the above-mentioned shortcomings of the prior art, the technical problem to be solved by this utility model is to propose a pad structure to solve the problems of insufficient space at the bottom of components leading to difficulty in the flow of molding compound and the generation of air bubbles.

[0005] The technical solution adopted by this utility model to solve its technical problem is a solder pad structure. The solder pad is used to solder components. The peripheral side of the solder pad has a plurality of solder resist portions. The height of the solder resist portions is higher than the height of the solder pad. The lower end face of the component abuts against the upper end face of the solder resist portion, and a welding space is formed between the upper end face of the solder pad and the lower end face of the component. The welding space is filled with welding material.

[0006] Furthermore, it also includes a substrate, on which at least two oppositely arranged pads are provided, on which one component is simultaneously soldered, and on each of the two pads one or more solder resist portions simultaneously supporting the lower end face of the component.

[0007] Furthermore, the pad is arranged in a quadrilateral shape, and the pad has a first side and a second side that are opposite to each other, as well as a third side and a fourth side that are opposite to each other. Solder resist portions are provided on the first side, the second side, the third side and the fourth side, and the lower end face of the component can abut against the upper end face of one or more of the solder resist portions.

[0008] Furthermore, the fourth side of each of the pads is located on the side close to the other pad, and the solder mask portions of the two fourth sides simultaneously support the component.

[0009] Furthermore, the fourth side of each of the pads is located on the side close to the other pad, and the solder mask on the second and third side plates of the two pads simultaneously supports the component.

[0010] Furthermore, the fourth side of each of the pads is located on the side close to the other pad, and the solder mask on the second side, third side plate and fourth side of the two pads simultaneously supports the component.

[0011] Furthermore, the pads are arranged in a quadrilateral shape, and the pads have a first side and a second side that are opposite to each other, as well as a third side and a fourth side that are opposite to each other, with the fourth side of each pad being located on the side closer to the other pad.

[0012] Solder resist portions are provided on the first side plate, the second side and the third side. On the fourth side, conductive posts are provided on the two fourth side edges, and the upper end surfaces of the two conductive posts simultaneously support the component.

[0013] Furthermore, the solder resist portions on the second and third sides of the two pads, together with the two conductive pillars, support the component.

[0014] Furthermore, the conductive pillar is a copper pillar.

[0015] Compared with the prior art, the present invention has at least the following beneficial effects:

[0016] (1) Multiple solder resist parts are set around the pads, and the height of the solder resist parts is higher than the height of the soldering area in the center of the pads. By supporting the components through the solder resist parts, the height of the components can be increased, thereby increasing the bottom space of the components. During plastic encapsulation, the plastic encapsulation material has better flowability and is less prone to generating bubbles, resulting in higher plastic encapsulation quality.

[0017] (2) A copper pillar is set on the fourth side, and the upper end of the copper pillar supports the component. When welding the component, even if there is a gap between the copper pillar and the component, the solder paste can fill the gap and weld the component and the copper pillar into one piece. There is no phenomenon of poor filling when filling the molding compound. Attached Figure Description

[0018] Figure 1 This is a cross-sectional view of the pad structure and components in the background art;

[0019] Figure 2 This is a cross-sectional view of the pad structure and components in Example 1;

[0020] Figure 3 This is a top view of the pad structure in Example 1;

[0021] Figure 4 This is a cross-sectional view of the pad structure and components in Example 2;

[0022] In the picture:

[0023] 100. Components;

[0024] 200, solder pad; 210, first side; 220, second side; 230, third side; 240, fourth side; 250, solder mask; 260, conductive post;

[0025] 300. Substrate. Detailed Implementation

[0026] The following are specific embodiments of the present invention and the accompanying drawings to further describe the technical solution of the present invention, but the present invention is not limited to these embodiments.

[0027] Example 1

[0028] Please refer to Figure 2-Figure 3 This utility model discloses a solder pad structure. The solder pad 200 is used to solder component 100. The solder pad 200 has a plurality of solder resist portions 250 on its periphery. The height of the solder resist portions 250 is higher than the height of the solder pad 200. The lower end face of the component 100 abuts against the upper end face of the solder resist portion 250, and a welding space is formed between the upper end face of the solder pad 200 and the lower end face of the component 100. The welding space is filled with welding material.

[0029] Specifically, after placing component 100 on pad 200, one or more solder mask portions 250 support component 100, and then solder paste is filled into the gap between component 100 and the soldering area of ​​pad 200 for soldering. After soldering is completed, molding compound is filled into the bottom space of component 100 for molding.

[0030] Importantly, multiple solder mask portions 250 are provided around the pad 200, and the height of the solder mask portions 250 is higher than the height of the soldering area in the center of the pad 200. By supporting the component 100 through the solder mask portions 250, the height of the component 100 can be increased, thereby increasing the bottom space of the component 100. During molding, the molding compound flows better, is less prone to air bubbles, and the molding quality is higher.

[0031] Furthermore, it also includes a substrate 300, on which at least two oppositely arranged pads 200 are provided, on which one component 100 is simultaneously soldered, and on each of the two pads 200, one or more solder resist portions 250 simultaneously support the lower end face of the component 100.

[0032] Specifically, by supporting the component 100 with the solder mask 250, the height of the component 100 can be increased, thereby increasing the space between the component 100 and the substrate 300. This results in better flowability of the molding compound during molding, reduces the likelihood of air bubbles, and improves the molding quality.

[0033] Furthermore, the pad 200 is quadrilateral in shape, and the pad 200 has a first side 210 and a second side 220 that are opposite to each other, as well as a third side 230 and a fourth side 240 that are opposite to each other. Solder resist portions 250 are provided on the first side plate, the second side 220, the third side 230 and the fourth side 240. The lower end face of the component 100 can abut against the upper end face of one or more of the solder resist portions 250.

[0034] Specifically, a solder mask 250 is provided at each of the four edges of each pad 200, and the element 100 is supported by one or more of the solder mask 250 to raise the height of the element 100.

[0035] Furthermore, the fourth side 240 of each of the pads 200 is located on the side close to the other pad 200, and the solder mask portion 250 of the two fourth sides 240 simultaneously supports the component 100.

[0036] Furthermore, the fourth side 240 of each of the pads 200 is located on the side close to the other pad 200, and the solder mask portion 250 on the second side 220 and third side plate of the two pads 200 simultaneously supports the component 100.

[0037] Furthermore, the fourth side 240 of each of the pads 200 is located on the side close to the other pad 200, and the solder mask 250 on the second side 220, third side plate and fourth side 240 of the two pads 200 simultaneously supports the component 100.

[0038] In this embodiment, the substrate 300 is provided with two left and right pads 200 respectively. A component 100 is soldered on the two pads 200 at the same time, and the component 100 is supported by one, two, three or four solder resist parts 250 on the left and right pads 200.

[0039] Specifically, the component 100 can be supported individually by the solder mask 250 on the fourth side 240 of the two left and right pads 200; the component 100 can also be supported by the solder mask 250 on the second side 220 and the third side 230 of the two left and right pads 200; the component 100 can also be supported by the solder mask 250 on the second side 220, the third side 230 and the fourth side 240 of the two left and right pads 200; or the component 100 can be supported by all the solder mask 250 on the two left and right pads 200. However, if the solder mask 250 on all sides supports the component 100, gaps or channels for filling solder paste need to be left, for example, by opening notches in one or more solder mask 250s for filling solder paste.

[0040] It should be noted that the solder resist 250 refers to the coating of solder resist such as green paint or solder resist ink around the solder pad 200.

[0041] Example 2

[0042] In Embodiment 1, after the component 100 is soldered, there may be a gap between the solder mask 250 and the bottom surface of the component 100. However, since the gap is very small, the molding compound is difficult to enter the gap for filling, resulting in poor filling.

[0043] Based on this, the following improvements are made to Embodiment 1:

[0044] Please refer to Figure 4 The pads 200 are arranged in a quadrilateral shape. The pads 200 have a first side 210 and a second side 220 that are opposite to each other, as well as a third side 230 and a fourth side 240 that are opposite to each other. The fourth side 240 of each pad 200 is located on the side closer to the other pad 200.

[0045] Solder resist portions 250 are provided on the first side plate, the second side 220 and the third side 230. Conductive posts 260 are provided on the fourth side 240 and the upper end faces of the two conductive posts 260 simultaneously support the component 100.

[0046] Furthermore, the solder resist portions 250 on the second side 220 and the third side 230 of the two solder pads 200, together with the two conductive posts 260, support the element 100.

[0047] Furthermore, the conductive pillar 260 is a copper pillar.

[0048] Specifically, the solder mask 250 at the fourth side 240 is replaced with a copper pillar. The upper end of the copper pillar supports the component 100. When soldering the component 100, even if there is a gap between the copper pillar and the component 100, the solder paste can fill the gap and solder the component 100 and the copper pillar into one piece. There is no phenomenon of poor filling when filling the molding compound.

[0049] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in this utility model embodiment are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.

[0050] Furthermore, in this utility model, the use of terms such as "first," "second," and "a" is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0051] In this utility model, unless otherwise explicitly specified and limited, the terms "connection," "fixing," etc., should be interpreted broadly. For example, "fixing" can mean a fixed connection, a detachable connection, or an integral part; it can mean a mechanical connection or an electrical connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean the internal communication of two elements 100 or the interaction between two elements 100, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0052] Furthermore, the technical solutions of the various embodiments of this utility model can be combined with each other, but only if they are based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

Claims

1. A solder pad structure, the solder pad being used for soldering components, the solder pad having a plurality of solder resist portions on its periphery, characterized in that, The height of the solder mask portion is higher than the height of the pad; the lower end face of the component abuts against the upper end face of the solder mask portion, and a welding space is formed between the upper end face of the pad and the lower end face of the component, and the welding space is filled with welding material.

2. The pad structure according to claim 1, characterized in that, It also includes a substrate, on which at least two oppositely arranged pads are provided, on which one component is simultaneously soldered, and on each of the two pads one or more solder resist portions simultaneously supporting the lower end face of the component.

3. The pad structure according to claim 2, characterized in that, The pads are arranged in a quadrilateral shape, and each pad has a first side and a second side that are opposite to each other, as well as a third side and a fourth side that are opposite to each other. Solder resist portions are provided on the first side, the second side, the third side and the fourth side, and the lower end face of the component can abut against the upper end face of one or more of the solder resist portions.

4. The pad structure according to claim 3, characterized in that, The fourth side of each of the pads is located on the side closest to the other pad, and the solder mask portions of the two fourth sides simultaneously support the component.

5. A pad structure according to claim 3, characterized in that, The fourth side of each of the pads is located on the side closest to the other pad, and the solder mask on the second and third sides of the two pads simultaneously supports the component.

6. A pad structure according to claim 3, characterized in that, The fourth side of each of the pads is located on the side closest to the other pad, and the solder mask on the second side, third side plate and fourth side of the two pads simultaneously supports the component.

7. A pad structure according to claim 2, characterized in that, The pads are arranged in a quadrilateral shape, and each pad has a first side and a second side that are opposite to each other, as well as a third side and a fourth side that are opposite to each other. The fourth side of each pad is located on the side closer to the other pad. Solder resist portions are provided on the first side, the second side, and the third side. On the fourth side, conductive posts are provided on both fourth sides, and the upper end faces of the two conductive posts simultaneously support the component.

8. A pad structure according to claim 7, characterized in that, The solder mask portions on the second and third sides of the two pads, together with the two conductive pillars, support the component.

9. A pad structure according to claim 7, characterized in that, The conductive pillar is a copper pillar.

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