Package structure

Abstract

The embodiment of the utility model provides a packaging structure. The packaging structure comprises a shell; the electronic element is arranged in the shell; a glass substrate electrically connected to the electronic component and forming a space with the housing, in which the glass substrate includes a circuit portion electrically connected to the electronic component and a body portion adjacent to the housing; and the liquid material is filled in the space. The packaging structure provided by the utility model has relatively good heat dissipation performance.

Description

Technical Field

[0001] This application relates to the field of power device technology, and more specifically, to a packaging structure. Background Technology

[0002] With the rapid development of communication technology, the demand for high-speed data transmission is increasing daily. According to the Shannon-Hartley Theorem in communication theory, the maximum achievable channel capacity is C = B.log 2 (1+S / N), where C represents capacity (unit: bps), B represents bandwidth (unit: Hz), and S / N represents signal-to-noise ratio. The maximum achievable data rate is proportional to the bandwidth B. It is known that 5G communication primarily uses frequency bands below 6GHz. Even when using millimeter-wave bands (24GHz to 100GHz), the transmission rate and latency of these bands are approaching their theoretical limits, making it impossible to meet the vision of future 6G communication systems that aim for higher data rates, greater bandwidth, and lower latency. Specific specifications are as follows:

[0003] 1. Data rate: 6G is expected to reach a data rate of 1Tbps (terabit per second).

[0004] 2. Bandwidth: 6G will use frequency bands above 100GHz to provide greater bandwidth and higher data transmission capabilities.

[0005] 3. Latency: The goal of 6G is to achieve ultra-low latency of less than 1 millisecond, supporting real-time applications and high-precision control.

[0006] 4. Connection density: 6G will support a connection density of more than 1 million devices per square kilometer.

[0007] 5. Reliability: 6G systems will offer near 100% reliability, meeting the needs of critical applications.

[0008] In 6G, potential new frequency bands for achieving terabit-class data rates have been widely discussed in the D band (110GHz–170GHz), G band (140GHz–220GHz), and H / J band (220GHz–330GHz).

[0009] Furthermore, thermal management is an important issue in array antennas operating at frequencies above 100 GHz, primarily for the following reasons:

[0010] 1. High power density: High-frequency electronic components and circuits generate a significant amount of heat during operation. Because high-frequency operation requires high power to maintain signal stability and transmission quality, this leads to increased power density and consequently, more heat generation.

[0011] 2. Material Properties: In frequency bands above 100 GHz, many traditional materials such as epoxy molding compounds (EMC) may not be effective at dissipating heat. Furthermore, these high-frequency circuits typically use materials with high electron mobility, such as gallium arsenide (GaAs) or gallium nitride (GaN), which generate more heat under high-power operation.

[0012] 3. Packaging and Thermal Design: High-frequency array antennas require highly sophisticated packaging technology to reduce signal loss, but these packages often limit heat dissipation pathways. Effectively dissipating heat from high-power areas is a major design challenge.

[0013] 4. Antenna Size and Layout: As frequency increases, antenna components become smaller, but this also means higher integration density. High-density component layout makes heat dissipation more difficult, causing localized overheating problems.

[0014] In summary, in array antennas operating at frequencies above 100 GHz, the high power required to maintain signal stability and transmission quality leads to increased power density and consequently generates significant heat. Furthermore, as... Figure 1A and Figure 1B As shown, Figure 1B It shows Figure 1A The diagram shows a perspective view of the antenna module 10. Generally, the antenna module 10 comprises many conventional materials. The antenna assembly 11 (or die) mounted on a substrate 13 (on which metal wires 14, such as copper, are disposed) is encapsulated by an epoxy molding compound (EMC) 12. The EMC 12 may have poor heat dissipation due to its solid-state dielectric properties. Furthermore, as... Figure 1B As shown, in order to dissipate heat, in the prior art, a heat sink 15 is usually provided on the side of the substrate 13 opposite to the antenna assembly 11 for heat dissipation, but the heat dissipation effect still cannot meet the corresponding requirements.

[0015] It is evident that the existing technology has the following drawbacks:

[0016] 1) For frequency bands above 100 GHz, antenna design, packaging structure, wire roughness and substrate material are key factors affecting RF performance.

[0017] 2) Glass substrates have superior performance, but face the following challenges and require industry standardization:

[0018] Glass is fragile, especially thin glass panels with a thickness of 100μm or less. Specialized equipment and processes are required to handle it; furthermore, there is a lack of unified industry standards. Currently, glass substrates lack standardized dimensions, thicknesses, and performance specifications. Unlike silicon wafers, each manufacturer has its own specifications, which may vary in performance, affecting compatibility and efficiency. To address these challenges, industry-wide collaboration is needed to develop and adopt glass substrate standards to improve the feasibility of mass production. Utility Model Content

[0019] This application aims to solve the above-mentioned problems by providing a packaging structure (i.e., an array antenna design structure) that changes the solid-state interface heat conduction to a gaseous interface heat conduction. Furthermore, in this packaging structure, the antenna is made using a glass substrate, solving the problem of high high-frequency loss in existing substrates. The antenna plate is used as part of the structure to form a sealed cavity structure, which can be filled with a non-conductive coolant or mineral oil, giving the liquid low boiling point characteristics and allowing it to carry away heat through vaporization and circulation.

[0020] Some embodiments of this application provide a packaging structure including: a housing; electronic components disposed within the housing; a glass substrate electrically connected to the electronic components and forming a space with the housing, wherein the glass substrate includes a circuit portion electrically connected to the electronic components and a body portion adjacent to the housing; and a liquid material filling the space.

[0021] In some embodiments, the electronic components are in direct contact with the liquid material.

[0022] In some embodiments, the packaging structure further includes a redistribution structure disposed around the electronic component, wherein the redistribution structure is spaced apart below the electronic component.

[0023] In some embodiments, the packaging structure further includes a redistribution structure disposed around the electronic component, wherein the redistribution structure extends continuously beneath the electronic component.

[0024] In some embodiments, the electronic components are electrically connected to the redistribution structure and thermally connected to the liquid material.

[0025] In some embodiments, the electronic components are spaced apart from the liquid material by the redistribution structure.

[0026] In some embodiments, the liquid material covers a portion of the redistribution structure.

[0027] In some embodiments, the encapsulation structure further includes: a plurality of substrates spaced apart from each other and disposed directly below the redistribution structure, wherein the glass substrate is connected to the substrates via the redistribution structure and a connector below the redistribution structure, and the substrates are covered by the liquid material.

[0028] In some embodiments, the packaging structure further includes a substrate extending continuously beneath the glass substrate and the electronic component, wherein the glass substrate is connected to the substrate via the redistribution structure and a connector beneath the redistribution structure, and the substrate is covered by the liquid material.

[0029] In some embodiments, the connector is covered by the liquid material.

[0030] In some embodiments, the encapsulation structure further includes a cold plate disposed below the housing, wherein the housing is attached to the cold plate via a thermal interface material. The cold plate is a hollow structure and includes a cold plate inlet and a cold plate outlet.

[0031] In some embodiments, the circuit portion includes an antenna structure.

[0032] In some embodiments, the circuit portion is formed on the body portion and exposed by the housing.

[0033] In some embodiments, the liquid material is a cooling material.

[0034] In some embodiments, the liquid material is mineral oil.

[0035] In some embodiments, the conductivity of the liquid material is 0.

[0036] In some embodiments, the cold plate has a comb-like structure on the side opposite to the thermal interface material.

[0037] Other embodiments of this application provide a packaging structure including: a housing; electronic components disposed within the housing, wherein the top surface of the electronic components is exposed through the housing; a glass substrate disposed around and electrically connected to the electronic components, forming a space with the housing, wherein the space surrounds the electronic components and the glass substrate, and the space has a portion disposed directly below the electronic components and the glass substrate; and a liquid material filling the space.

[0038] In some embodiments, the glass substrate includes a circuit portion electrically connected to the electronic components and a body portion adjacent to the housing.

[0039] In some embodiments, the liquid material is in contact with the bottom surface of the electronic component, wherein the bottom surface of the electronic component is opposite to the top surface.

[0040] In summary, the packaging structure provided in this application has the following advantages:

[0041] 1. High integration packaging: The packaging structure can efficiently integrate antennas, electronic components and heat dissipation components, reduce space occupation and improve the stability and performance of the overall system.

[0042] 2. Thermal Management: Combined with an immersion water-cooled packaging structure, it has excellent thermal management performance, which can effectively dissipate heat and ensure the stability of the system under high power and high frequency operation.

[0043] 3. Reduced signal loss using a glass substrate: This antenna is made using a glass substrate, which reduces signal loss and allows it to operate effectively in high-frequency bands such as those above 100GHz.

[0044] 4. Suitable for panel-level packaging: The glass substrate has a low coefficient of thermal expansion (CTE 3~9ppm / ℃), low modulus (Young's modulus 65~83GPa), is not prone to warping, and has extremely high flatness, which can ensure that photolithography is focused on the same plane. It can be made into thin films (<100μm) without grinding during processing, making it suitable for panel-level packaging to reduce production costs. Attached Figure Description

[0045] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0046] Figures 1A to 1C The packaging structure of the prior art is shown.

[0047] Figures 2A to 2E The various cooling methods are shown.

[0048] Figures 3 to 7 The packaging structure according to some embodiments of this application is shown. Detailed Implementation

[0049] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art are within the scope of protection of this application. In addition, when using terms such as "approximately," "about," "substantial," or "basically" to describe numerical values ​​or numerical ranges, unless otherwise stated, the term is intended to cover values ​​within ±10% of the described value. For example, the term "about 5nm" covers a size range from 4.5nm to 5.5nm.

[0050] The following disclosure provides numerous different embodiments or instances for implementing various features of the provided subject matter. Specific examples of elements and arrangements will be described below to simplify the present invention. These are merely examples and are not intended to limit the present invention. For example, in the following description, forming a first component above or on a second component may include embodiments where the first and second components are in direct contact, or embodiments where an additional component is formed between the first and second components such that the first and second components are not in direct contact. Furthermore, reference numerals and / or letters may be repeated in various instances of the present invention. Such repetition is merely for brevity and clarity and does not in itself indicate a relationship between the various embodiments and / or configurations discussed.

[0051] The purpose and objective of this application is to develop a water-cooled high-frequency array antenna to effectively support data rates of up to 1 Tbps (terabit per second) even in extreme environments with temperatures exceeding 50°C. By applying water-cooling technology, the heat dissipation performance of the antenna system is improved, ensuring its stability and reliability in high-temperature environments, thereby enhancing the efficiency and performance of the overall communication system.

[0052] The following will refer to Figures 2A to 2E Let's compare the heat dissipation effects of air cooling, water cooling, and immersion water cooling. First... Figure 2A The air-cooled packaging structure 20 is shown. Figure 2B The water-cooled packaging structure 20' is shown and Figure 2C The package structure 20” of the SPIC (Surfing Integrated Circuit) is shown, specifically, as... Figures 2A to 2C As shown, the CPU (Central Processing Unit) 22 (including CPU1 22-1 and CPU2 22-2) is housed in the casing 21 and is equipped with a heat sink 23. Figure 2A The air-cooled packaging structure 20 shown further illustrates the heat dissipation direction S1. Figure 2B The water-cooled encapsulation structure 20' further illustrates the liquid cold plate 23', the heat dissipation direction S2, the heat exchanger 24, the pump 25, and the circulation path L, and Figure 2CThe immersion water cooling system also shows the radiator 23, heat exchanger 24, pump 25, and circulation path L'.

[0053] Figures 2D to 2E They are shown respectively Figure 2A The maximum temperature (Tmax) and corresponding thermal resistance (Rth) of CPU1 22-1 and CPU2 22-2 are shown in the air-cooled package structure 20, the water-cooled package structure 20', and the immersion water-cooled package structure 20”. Specifically, as Figure 2D As shown, from the highest temperatures of CPU122-1 and CPU2 22-2 in the air-cooled package structure 20, the water-cooled package structure 20', and the immersion water-cooled package structure 20”, it can be seen that the highest temperature of CPU122-1 and CPU2 22-2 in the air-cooled package structure 20 is higher than that in the water-cooled package structure 20' and the immersion water-cooled package structure 20”, and the highest temperature of CPU122-1 and CPU2 22-2 in the immersion water-cooled package structure 20” is the lowest. Furthermore, from... Figure 2E As can be seen from the thermal resistance figures, the thermal resistance of CPU1 22-1 and CPU2 22-2 in the air-cooled package structure 20 is greater than that in the water-cooled package structure 20' and the immersion water-cooled package structure 20”, while the thermal resistance of CPU1 22-1 and CPU2 22-2 in the immersion water-cooled package structure 20” is the lowest. Therefore, the immersion water-cooled package structure 20” has the best heat dissipation performance, the lowest maximum temperature (Tmax), and the lowest thermal resistance.

[0054] In summary, this application utilizes immersion liquid cooling technology, providing a packaging structure with superior heat dissipation performance, and is specifically designed for heat dissipation in high-frequency antenna packaging. For details, see [link to relevant documentation]. Figure 3 , Figure 3A packaging structure 100 using immersion liquid cooling technology is shown. The packaging structure 100 includes: a housing 101; electronic components 102 disposed within the housing 101; and a glass substrate 103 electrically connected to the electronic components 102 and forming a space V with the housing. The glass substrate 103 includes a circuit portion 103A electrically connected to the electronic components and a body portion 103B adjacent to the housing 101. In some embodiments, the body portion 103B is a glass core. Further, the circuit portion 103A is formed on the body portion 103B (such as an antenna structure 103A1) and exposed by the housing 101. In some embodiments, the circuit portion 103A includes the antenna structure 103A1 for transmitting signals and also includes a line portion 103A2. In some embodiments, the circuit portion 103A is made of metal, including but not limited to metals such as copper, gold, and silver. In some embodiments, the housing 101 may be made of any suitable metal, such as copper or iron, for support. In some embodiments, the electronic component 102 may be an integrated circuit, such as a monolithic microwave integrated circuit (MMIC). As can be seen, the glass substrate 103 of the antenna structure 103 used in this application is exposed outside the housing 101 of the cooling system and connected to the housing 101. The high hardness of the glass substrate 103 and its connection to the housing increases the sealing performance and reduces the possibility of liquid material Lq (described below) flowing out.

[0055] In some embodiments, the encapsulation structure 100 further includes a liquid material Lq filling the space V. Figure 3 As can be seen, electronic component 102 is in direct contact with liquid material Lq. Furthermore, electronic component 102 is exposed from object 101, thus having upward and downward heat dissipation paths H. It is evident that electronic component 102 is electrically connected to electronic component 102 while simultaneously being thermally connected to liquid material Lq. In this application, the liquid material is a coolant (any suitable coolant in the art) or mineral oil. In some embodiments, the conductivity of the liquid material is approximately 0. In some embodiments, the coolant includes, but is not limited to, water.

[0056] Continue to refer to Figure 3 The packaging structure 100 of this application also includes a redistribution structure 104 disposed around the electronic component 102, and as shown in the image. Figure 3As shown, the redistribution structures 104 are spaced apart below the electronic component 102. Therefore, there are multiple redistribution structures 1041, 1042, ... spaced apart from each other. It should be noted that redistribution structures 1041 and 1042 are only for illustration, and more redistribution structures may exist. In some embodiments, the redistribution structure 104 includes a dielectric layer 104I and metal lines 104m and vias 104v embedded within the dielectric layer 104I. The dielectric layer 104I can be formed of any suitable dielectric material, including but not limited to polyimide, imide, polypropylene, etc. The metal lines 104m and vias 104v can be formed of metals, including but not limited to metals such as copper, gold, silver, etc.

[0057] In this embodiment, electronic component 102 is electrically connected to redistribution structure 104 and thermally connected to liquid material Lq. Further, from Figure 3 As can be seen, the liquid material Lq covers the redistribution structure 104. In a further embodiment, the encapsulation structure 100 also includes: a plurality of substrates 1051, 1052..., spaced apart from each other and disposed directly below the redistribution structures 1041, 1042, from... Figure 3 As can be seen, multiple substrates 1051, 1052 correspond to redistribution structures 1041, 1042. It should be noted that the multiple substrates 1051, 1052 are only for illustration, and more substrates may exist. In some embodiments, the glass substrate 103 is connected to the substrates 1051 / 1052 via redistribution structures 1041 / 1042 and connectors 106 below the redistribution structures 1041 / 1042, the substrates 1051 / 1052 being covered by a liquid material Lq. Specifically, connectors 106 are connected to the substrates 1051 / 1052 via pads 105P, and connectors 106 are covered by a liquid material Lq. Furthermore, from... Figure 3 As can be further seen, the substrates 1051 / 1052 are separated from the housing 101 by a liquid material Lq. In some embodiments, the plurality of substrates 1051, 1052, etc., may be substrates including but not limited to printed circuit boards, or any other suitable substrate. The connectors 106, pads 105P, etc., may be made of any suitable metal, including but not limited to metals such as copper, gold, silver, etc.

[0058] like Figure 3 As shown, the encapsulation structure 100 further includes a cold plate 107 (or heat sink), disposed below the housing 101, wherein the housing 101 is attached to the cold plate 107 via a thermal interface material 108. In some embodiments, the thermal interface material 108 may be a thermal interface material commonly used in the art, including but not limited to materials with high thermal conductivity such as resins. In some embodiments, the side of the cold plate 107 opposite to the thermal interface material 108 has a comb-like structure. Furthermore, from... Figure 3 As can be further seen, the body portion 103B of the glass substrate 103 is connected to the housing 101 via a resin frame 109, that is, a resin frame 109 exists between the glass substrate 103 and the housing 101. In some embodiments, the resin frame 109 is used to seal the gap between the glass substrate 103 and the housing 101, and to preferably connect the housing 101 to the glass substrate 103. In some embodiments, the resin frame 109 can be made of any suitable resin, such as epoxy resin.

[0059] join Figure 3 Other embodiments of this application also provide an encapsulation structure 100, including: a housing 101; an electronic component 102 disposed within the housing 101, wherein the top surface of the electronic component 102 is exposed through the housing 101; a glass substrate 103 disposed around and electrically connected to the electronic component 102, and forming a space V with the housing 101, wherein the space V surrounds the electronic component 102 and the glass substrate 103, and the space V has a portion disposed directly below the electronic component 102 and the glass substrate 103; and a liquid material Lq filling the space V. In some embodiments, the glass substrate 103 includes a circuit portion 103A electrically connected to the electronic component 102 and a body portion 103B adjacent to the housing 101. In some embodiments, the liquid material Lq contacts the bottom surface of the electronic component 102, wherein the bottom surface of the electronic component 102 is opposite to the top surface.

[0060] In summary, the packaging structure 100 provided in this application uses a glass substrate 103, immersion water cooling technology, electronic components 102 that can perform double-sided heat dissipation (i.e., top-up heat dissipation H and bottom-down heat dissipation H), and panel-level packaging, thus enabling the provided packaging structure 100 to have good heat dissipation performance.

[0061] Next, see Figure 4 , Figure 4 A packaging structure 101 according to some other embodiments is shown, which is related to Figure 3 The packaging structure shown is similar to 100, except that... Figure 4 In the encapsulation structure 101 shown, the cold plate 107 is a hollow structure and includes a cold plate inlet 107i and a cold plate outlet 107o. In this case, coolant can flow in the cold plate 107, and the heat dissipation of the encapsulation structure 101 can be further enhanced by circulation.

[0062] See Figure 5 , Figure 5 A packaging structure 102 according to another embodiment is shown, which is related to... Figure 3The encapsulation structure 100 shown is similar, except that in encapsulation structure 102, a redistribution structure 104 disposed around the electronic component 102 extends continuously below the electronic component 102. The electronic component 102 is spaced apart from the liquid material Lq by the redistribution structure 104. Similarly, a substrate 105 also extends continuously below the glass substrate 103 and the electronic component 102, corresponding to the redistribution structure 104. In some embodiments, the glass substrate 103 is connected to the substrate 105 via the redistribution structure 104 and a connector 106 below the redistribution structure 104, and the substrate 105 is still covered by the liquid material Lq.

[0063] See Figure 6 , Figure 6 A packaging structure 103 according to another embodiment is shown, which is related to Figure 3 The encapsulation structure 100 shown is similar, except that there is no cold plate 107 in the encapsulation structure 103, and there is a housing inlet 101i and a housing outlet 101o on the housing 101. In this embodiment, the liquid material Lq can be made to flow, and the encapsulation structure 103 can be better cooled.

[0064] See Figure 7 , Figure 7 A packaging structure 104 according to another embodiment is shown, which is related to Figure 3 The encapsulation structure 100 shown is similar, except that in encapsulation structure 104, the redistribution structure 104 surrounding the electronic component 102 extends continuously below the electronic component 102. The electronic component 102 is separated from the liquid material Lq by the redistribution structure 104. Similarly, the substrate 105 also extends continuously below the glass substrate 103 and the electronic component 102, corresponding to the redistribution structure 104. Furthermore, in encapsulation structure 104, there is no cold plate 107, and a housing inlet 101i and a housing outlet 101o are present on the housing 101. In this embodiment, the liquid material Lq can be made to flow, and better heat dissipation can be achieved for the encapsulation structure 103.

[0065] The packaging structure 100-104 provided in this application is an array antenna design structure. The antenna is made of glass substrate, which solves the problem of high loss at high frequencies of existing substrates. The antenna board is used as part of the structure to form a closed cavity structure. This cavity can be filled with non-conductive coolant or mineral oil, so that the liquid has low boiling point characteristics and carries away heat energy in the form of vaporization circulation.

[0066] There are two heat dissipation methods on the back of the cavity: 1. Directly attaching a metal cold plate 107, and then controlling the flow path of the coolant (such as a water channel) through the cold plate inlet 107i, cold plate outlet 107o, and possibly a coolant distributor (CDU) and manifold, allowing the coolant to flow through the cold plate 107 to achieve heat dissipation. The coolant (which can be hot water) flows out of the cold plate 107, is cooled by a fan, and then returns to the CDU, continuously helping to cool the package structure 100-104. 2. Directly attaching a heat sink, achieving heat dissipation through natural convection, thereby maintaining good thermal management. It is evident that this application has broad application prospects, especially suitable for future 6G communication base stations.

[0067] As previously described, the 100GHz to 3THz frequency band is the frequency band for next-generation wireless technology. This application is designed for future needs. Compared with current 5G base stations, the packaging structure provided in this application has a competitive advantage in bandwidth that is more than 100 times that of current 5G.

[0068] Furthermore, it should be noted that the forming processes of the packaging structures 100-104 provided in this application all adopt the forming processes commonly used in the art, such as attaching the redistribution structure 104 (a redistribution structure commonly used in the art) on the substrate 15, and attaching the electronic components 102 and the glass substrate 103 on the redistribution structure 104. Then, the packaging is performed by the housing 101 and the resin frame 109, and the cold plate 107 is selectively attached to obtain the packaging structures 100-104 of this application. Therefore, they will not be described in detail here.

[0069] In summary, the packaging structure provided in this application has the following advantages:

[0070] 1. High integration packaging: The packaging structure can efficiently integrate antennas, electronic components and heat dissipation components, reduce space occupation and improve the stability and performance of the overall system.

[0071] 2. Thermal Management: Combined with an immersion water-cooled packaging structure, it has excellent thermal management performance, which can effectively dissipate heat and ensure the stability of the system under high power and high frequency operation.

[0072] 3. Reduced signal loss using a glass substrate: This antenna is made using a glass substrate, which reduces signal loss and allows it to operate effectively in high-frequency bands such as those above 100GHz.

[0073] 4. Suitable for panel-level packaging: The glass substrate has a low coefficient of thermal expansion (CTE 3~9ppm / ℃), low modulus (Young's modulus 65~83GPa), is not prone to warping, and has extremely high flatness, which can ensure that photolithography is focused on the same plane. It can be made into thin films (<100μm) without grinding during processing, making it suitable for panel-level packaging to reduce production costs.

[0074] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A packaging structure, comprising: case; Electronic components are housed within the housing; A glass substrate electrically connected to the electronic components and forming a space with the housing, wherein the glass substrate includes a circuit portion electrically connected to the electronic components and a body portion adjacent to the housing; as well as Liquid material is filled within the space.

2. The packaging structure according to claim 1, wherein, The electronic components are in direct contact with the liquid material.

3. The packaging structure according to claim 1 further includes: A redistribution structure is disposed around the electronic component. The redistribution structures are spaced apart below the electronic components.

4. The packaging structure according to claim 1 further includes: A redistribution structure is disposed around the electronic component. The redistribution structure extends continuously beneath the electronic component.

5. The packaging structure according to claim 3, wherein, The electronic components are electrically connected to the redistribution structure and thermally connected to the liquid material.

6. The packaging structure according to claim 3, wherein, The electronic components are spaced apart from the liquid material by the redistribution structure.

7. The packaging structure according to claim 3 or 4, wherein, The redistribution structure is partially covered by the liquid material.

8. The packaging structure according to claim 3 further includes: Multiple bases, spaced apart from each other and positioned directly beneath the redistribution structure, The glass substrate is connected to the base via the redistribution structure and a connector below the redistribution structure, and the base is covered by the liquid material.

9. The packaging structure according to claim 3 further includes: The substrate extends continuously beneath the glass substrate and the electronic components. The glass substrate is connected to the base via the redistribution structure and a connector below the redistribution structure, and the base is covered by the liquid material.

10. The packaging structure according to claim 9, wherein, The connector is covered by the liquid material.

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