Switchable heat dissipation mechanism for domain controller, domain controller and vehicle
By designing a switchable heat dissipation mechanism, combined with cooling medium pipes, heat dissipation base and fans, the problem of single and poor compatibility of domain controller heat dissipation solutions is solved, and efficient and low-cost heat dissipation effects are achieved to adapt to different thermal power consumption requirements.
Patent Information
- Application Number
- CN202422389512.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-29
- Publication Date
- 2025-10-28
- Estimated Expiration
- 2034-09-29
AI Technical Summary
The existing heat dissipation solutions are single and have poor compatibility. They cannot meet the heat dissipation requirements of domain controllers under different thermal power consumption conditions, resulting in high costs and long development cycles.
A switchable heat dissipation mechanism is designed, which includes first, second and third heat dissipation modules, which respectively adopt a cooling medium pipe, a heat dissipation base and a fan combination, and are connected to the upper cover by bolts to achieve switching of different heat dissipation schemes.
It improves the compatibility and cooling efficiency of the heat dissipation structure, reduces product costs and development cycles, and meets the needs of domain controllers with different performance and power consumption.
Smart Images
Figure CN223488462U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to a heat dissipation mechanism, and more particularly to a heat dissipation mechanism for a domain controller. Background Technology
[0002] As the application areas of domain controllers continue to expand, the requirements for domain controllers are becoming more diversified, and the pace of updates and iterations is very rapid. Currently, low-end domain controllers are increasingly evolving into mid-to-high-end models, and the corresponding thermal power consumption is also increasing. Therefore, it is particularly important to know how to quickly and evenly dissipate heat from the domain controller to meet its operating temperature requirements and ensure stable operation.
[0003] Currently known heat dissipation solutions are all single-function solutions, such as single passive heat dissipation or single water cooling, and these single solutions have low compatibility. Utility Model Content
[0004] One of the objectives of this invention is to provide a switchable heat dissipation mechanism for domain controllers, which can switch between different heat dissipation schemes according to the heat dissipation requirements of the domain controller, thereby improving the compatibility of the heat dissipation structure and reducing product costs.
[0005] To achieve the above objectives, this utility model proposes a switchable heat dissipation mechanism for a domain controller, comprising:
[0006] Bottom cover;
[0007] The upper cover is connected to the lower cover to form a housing, the housing having a cavity for accommodating the electronics of the domain controller;
[0008] A heat dissipation assembly includes a first heat dissipation module, a second heat dissipation module, and a third heat dissipation module; the first heat dissipation module, the second heat dissipation module, and the third heat dissipation module are selectively disposed on the upper cover;
[0009] The first heat dissipation module includes a cooling medium pipe disposed on the upper cover, the cooling medium pipe having a cooling medium inlet and a cooling medium outlet;
[0010] The second heat dissipation module includes a first heat dissipation base disposed on the upper cover, and a plurality of first heat dissipation fins are erected on the first heat dissipation base;
[0011] The third heat dissipation module includes a second heat dissipation base mounted on the top cover. Several second heat dissipation fins are vertically mounted on the second heat dissipation base, and a fan is also mounted on the side of the second heat dissipation fins.
[0012] Furthermore, in the switchable heat dissipation mechanism described in this utility model, the upper cover is provided with a through groove, and the first heat dissipation module, the second heat dissipation module and the third heat dissipation module are selectively nested in the through groove.
[0013] Furthermore, in the switchable heat dissipation mechanism described in this utility model, the bottom surface of the cooling medium pipe has a first protrusion, which is used to connect with the electronic device to perform heat exchange.
[0014] Furthermore, in the switchable heat dissipation mechanism described in this utility model, the surface of the first protrusion used to connect with the electronic device for heat exchange is provided with a first thermally conductive layer.
[0015] Furthermore, in the switchable heat dissipation mechanism described in this utility model, the bottom surface of the first heat dissipation base has a second protrusion, which is used to connect with the electronic device to perform heat exchange.
[0016] Furthermore, in the switchable heat dissipation mechanism described in this utility model, the surface of the second protrusion used to connect with the electronic device for heat exchange is provided with a second thermally conductive layer.
[0017] Furthermore, in the switchable heat dissipation mechanism described in this utility model, the bottom surface of the second heat dissipation base has a third protrusion, which is used to connect with the electronic device to perform heat exchange.
[0018] Furthermore, in the switchable heat dissipation mechanism described in this utility model, the surface of the third protrusion used to connect with the electronic device for heat exchange is provided with a third thermally conductive layer.
[0019] Furthermore, in the switchable heat dissipation mechanism described in this utility model, the first heat dissipation base and the first heat dissipation fin are aluminum or aluminum alloy components; and / or the second heat dissipation base and the second heat dissipation fin are aluminum or aluminum alloy components.
[0020] Furthermore, in the switchable heat dissipation mechanism described in this utility model, the second heat dissipation base is also provided with a recessed portion lower than the top of the second heat dissipation fins, and the fan is disposed in the recessed portion.
[0021] Another objective of this invention is to provide a domain controller that includes a printed circuit board on which electronic devices are disposed. In addition, the domain controller also includes a switchable heat dissipation mechanism as described above, and the printed circuit board is disposed within the housing.
[0022] Another object of this invention is to provide a vehicle having a domain controller as described above.
[0023] The switchable heat dissipation structure described in this utility model allows for the selection and switching of different heat dissipation modules to suit the varying performance and power consumption of the domain controller without altering the overall structure of the domain controller's casing. This on-demand configuration reduces product costs. Attached Figure Description
[0024] Figure 1 The diagram shows a three-dimensional structural schematic of the switchable heat dissipation structure of the present invention, in one embodiment, with a first heat dissipation module installed.
[0025] Figure 2 This diagram shows a three-dimensional structural schematic of the switchable heat dissipation structure of the present invention, in one embodiment, with a second heat dissipation module installed.
[0026] Figure 3 This diagram shows a three-dimensional structural schematic of the switchable heat dissipation structure of the present invention, in one embodiment, with a third heat dissipation module installed.
[0027] Figure 4 The diagram shows a split structure of the switchable heat dissipation structure of the present invention, in one embodiment, with a first heat dissipation module installed.
[0028] Figure 5 This diagram shows a schematic representation of the bottom surface of the cooling medium pipe in one embodiment of the switchable heat dissipation structure described in this invention.
[0029] Figure 6 This diagram shows a split structure of the cooling medium pipeline in one embodiment of the switchable heat dissipation structure described in this utility model.
[0030] Figure 7 The diagram shows a split structure of the switchable heat dissipation structure of the present invention, in one embodiment, with a second heat dissipation module installed.
[0031] Figure 8 This diagram shows a schematic representation of the bottom surface of the first heat sink base in one embodiment of the switchable heat dissipation structure described in this invention.
[0032] Figure 9 The diagram shows a split structure of the switchable heat dissipation structure of the present invention, in one embodiment, with a third heat dissipation module installed.
[0033] Figure 10 This diagram shows a schematic representation of the bottom surface of the second heat sink base in one embodiment of the switchable heat dissipation structure described in this invention. Detailed Implementation
[0034] The switchable heat dissipation structure, domain controller, and vehicle described in this utility model will be further explained and described below with reference to the accompanying drawings and specific embodiments. However, this explanation and description do not constitute an undue limitation on the technical solution of this utility model.
[0035] Currently, chips are updated and iterated at a rapid pace, and user-defined functions are often upgraded as user needs increase. Therefore, it is becoming increasingly common to improve the performance of domain controller chips. In addition, users often expect that when switching to high-end chips, the product's casing and other parts should be changed as little as possible to reduce development costs and component mold costs.
[0036] Furthermore, given the increased heat dissipation requirements for higher thermal power consumption, it is also desirable to provide a structure compatible with various heat dissipation solutions.
[0037] To address the aforementioned problems, this invention proposes a switchable heat dissipation structure in one embodiment.
[0038] Figure 1 The diagram shows a three-dimensional structural schematic of the switchable heat dissipation structure of the present invention, in one embodiment, with a first heat dissipation module installed.
[0039] Figure 2 This diagram shows a three-dimensional structural schematic of the switchable heat dissipation structure of the present invention, in one embodiment, with a second heat dissipation module installed.
[0040] Figure 3 This diagram shows a three-dimensional structural schematic of the switchable heat dissipation structure of the present invention, in one embodiment, with a third heat dissipation module installed.
[0041] like Figure 1 , Figure 2 and Figure 3 As shown, the switchable heat dissipation mechanism for a domain controller includes an upper cover 1 and a bottom cover 2 connected to the upper cover 1 to form a housing with an internal cavity in which the printed circuit board and electronic components of the domain controller are disposed.
[0042] The switchable heat dissipation mechanism also includes a heat dissipation component disposed on the upper cover 1. The heat dissipation component includes, for example: Figure 1 The first heat dissipation module 100 shown is as follows: Figure 2 The second heat dissipation module 200 shown and as follows Figure 3 The third heat dissipation module 300 is shown. The first heat dissipation module 100, the second heat dissipation module 200 and the third heat dissipation module 300 are selectively disposed on the upper cover 1.
[0043] In some more specific embodiments, the bottom cover 2 can be fastened to the top cover 1 by connecting bolts 21.
[0044] Figure 4 The diagram shows a split structure of the switchable heat dissipation structure of the present invention, in one embodiment, with a first heat dissipation module installed.
[0045] like Figure 1 and Figure 4 As shown, the first heat dissipation module includes a cooling medium pipe 101 disposed on the upper cover 1, the cooling medium pipe 101 having a cooling medium inlet 102 and a cooling medium outlet 103.
[0046] like Figure 4 As shown, in some more specific embodiments, the upper cover 1 is provided with a through groove 11, the cooling medium pipe 101 is nested in the through groove 11, and can be fastened to the upper cover 1 by bolts 12.
[0047] Figure 5 This diagram shows a schematic representation of the bottom surface of the cooling medium pipe in one embodiment of the switchable heat dissipation structure described in this invention.
[0048] In some preferred embodiments, the bottom surface of the cooling medium conduit 101 has a first protrusion 1011, for example, as shown in the image. Figure 5 As shown, there are several first protrusions 1011, which are used to connect to the electronic devices 31 of the domain controller respectively, so as to exchange heat with each electronic device 31.
[0049] With this configuration, the cooling medium pipe 101 can cool each electronic component on the printed circuit board 3 almost simultaneously, which improves cooling efficiency and ensures cooling uniformity.
[0050] In some more preferred embodiments, such as Figure 4 As shown, the surface of the first protrusion, which is used to connect with the electronic device 31 for heat exchange, is also provided with a first thermally conductive layer 104 to reduce thermal resistance and thereby further improve the heat conduction effect.
[0051] In some more specific embodiments, the first thermally conductive layer 104 may include a thermally conductive silicone grease layer. Those skilled in the art can select the thermal conductivity of the thermally conductive grease according to actual needs; generally, the higher the thermal conductivity of the thermally conductive grease, the more beneficial it is for heat dissipation. Of course, in other more specific embodiments, the thermally conductive layer may also include thermally conductive putty, thermally conductive gel, thermally conductive double-sided adhesive, thermally conductive graphite sheet, or similar thermally conductive elements.
[0052] Figure 6 The diagram shows a split structure of the cooling medium pipeline in one embodiment of the switchable heat dissipation structure described in this utility model.
[0053] like Figure 6 As shown, in some more specific embodiments, the cooling medium conduit 101 includes a cooling medium conduit upper cover 1012 and a cooling medium conduit lower cover 1013 that are separately disposed but connected together, so as to facilitate the installation of the cooling medium inlet 102 and the cooling medium outlet 103 at the ends of the cooling medium conduit 101. A first protrusion 1011 is provided on the bottom surface of the cooling medium conduit lower cover. In some more specific embodiments, the cooling medium conduit upper cover 1012 and the cooling medium conduit lower cover 1013 can be connected by welding.
[0054] When the first heat dissipation module 100 is installed on the top cover 1, the cooling medium (e.g., a low-temperature coolant or cooling gas) flows into the cooling medium pipe through the cooling medium inlet 102, exchanges heat with the heat-generating electronic components 31 on the printed circuit board 3 of the domain controller to dissipate heat and cool them, and then flows out through the cooling medium outlet 103, thereby carrying away the heat from the domain controller. This first heat dissipation module offers the best heat dissipation effect, but it is also more expensive, making it suitable as a heat dissipation mechanism for domain controllers with high performance requirements.
[0055] Figure 7 The diagram shows a split structure of the switchable heat dissipation structure of the present invention, in one embodiment, with a second heat dissipation module installed.
[0056] like Figure 2 and Figure 7 As shown, the second heat dissipation module 200 includes a first heat dissipation base 201 disposed on the upper cover 1, and a plurality of first heat dissipation fins 202 are erected on the first heat dissipation base 201.
[0057] In some more specific embodiments, taking into account heat dissipation performance and lightweight design factors, the first heat dissipation base 201 and the first heat dissipation fins 202 can be aluminum or aluminum alloy components.
[0058] In some more specific embodiments, the first heat sink 201 is nested in the through slot 11 and can be fastened to the upper cover 1 by bolts 12.
[0059] Figure 8 This diagram shows a schematic representation of the bottom surface of the first heat sink base in one embodiment of the switchable heat dissipation structure described in this invention.
[0060] like Figure 8 As shown, in some preferred embodiments, the bottom surface of the first heat sink 201 has a plurality of second protrusions 2011, each second protrusion 2011 being connected to each electronic device 31 in a corresponding manner to exchange heat with each electronic device 31.
[0061] With this configuration, the second heat dissipation module 200 can cool and dissipate heat from each electronic component 31 on the printed circuit board 3 almost simultaneously, which improves cooling efficiency and ensures uniform cooling.
[0062] In some more preferred embodiments, such as Figure 7 As shown, the surface of the second protrusion, which is used to connect with the electronic device 31 for heat exchange, is also provided with a second thermally conductive layer 203 to reduce thermal resistance and thereby further improve the heat conduction effect.
[0063] In some more specific embodiments, the second thermally conductive layer 203 may include a thermally conductive silicone grease layer. Those skilled in the art can select the thermal conductivity of the thermally conductive grease according to actual needs; generally, the higher the thermal conductivity of the thermally conductive grease, the more beneficial it is for heat dissipation. Of course, in other more specific embodiments, the thermally conductive layer may also include thermally conductive putty, thermally conductive gel, thermally conductive double-sided adhesive, thermally conductive graphite sheet, or similar thermally conductive elements.
[0064] When the second heat dissipation module 200 is installed on the top cover 1, the first heat dissipation fins greatly increase the heat dissipation area of the first heat dissipation base. The heat of the electronic components of the domain controller is conducted from the first heat dissipation base to the first heat dissipation fins. This solution is a passive heat dissipation solution, and its heat dissipation effect is worse than the solution with the first heat dissipation module and the third heat dissipation module installed, but the cost is also the lowest, and there is no problem with fan noise.
[0065] Figure 9 The diagram shows a split structure of the switchable heat dissipation structure of the present invention, in one embodiment, with a third heat dissipation module installed.
[0066] like Figure 3 and Figure 9 As shown, the third heat dissipation module 300 includes a second heat dissipation base 301 disposed on the upper cover 1. A plurality of second heat dissipation fins 302 are erected on the second heat dissipation base 301, and a fan 303 is disposed on the side of the second heat dissipation fins.
[0067] In some more specific embodiments, the second heat dissipation base 301 is nested in the through groove 11 of the upper cover and can be fastened to the upper cover 1 by bolts 12.
[0068] In some more specific embodiments, the second heat sink 301 is further provided with a recess 3013 lower than the top of the second heat sink fins, and the fan 303 is disposed in the recess 3013 and located beside the second heat sink fins. In some more specific embodiments, the fan 303 can be fixedly connected to the recess 3013 by a fan connecting bolt 3031.
[0069] In some more specific embodiments, taking into account heat dissipation performance and lightweight design factors, the second heat sink 301 and the second heat dissipation fin 302 can be aluminum or aluminum alloy components.
[0070] Figure 10 This diagram shows a schematic representation of the bottom surface of the first heat sink base in one embodiment of the switchable heat dissipation structure described in this invention.
[0071] like Figure 10 As shown, in some preferred embodiments, the bottom surface of the second heat sink 301 has a plurality of third protrusions 3011, each third protrusion 3011 being connected to each electronic device 31 of the domain controller to exchange heat with each electronic device 31 respectively.
[0072] With this configuration, the third heat dissipation module 300 can cool and dissipate heat from each electronic component 31 on the printed circuit board 3 almost simultaneously, which improves cooling efficiency and ensures uniform cooling.
[0073] In some more preferred embodiments, such as Figure 9 As shown, the surface of the third protrusion, which is used to connect with the electronic device 31 for heat exchange, is also provided with a third thermally conductive layer 304 to reduce thermal resistance and thereby further improve the heat conduction effect.
[0074] In some more specific embodiments, the third thermally conductive layer 304 may include a thermally conductive silicone grease layer. Those skilled in the art can select the thermal conductivity of the thermally conductive grease according to actual needs; generally, the higher the thermal conductivity of the thermally conductive grease, the more beneficial it is for heat dissipation. Of course, in other more specific embodiments, the thermally conductive layer may also include thermally conductive putty, thermally conductive gel, thermally conductive double-sided adhesive, thermally conductive graphite sheet, or similar thermally conductive elements.
[0075] When the third heat dissipation module 300 is installed on the top cover 1, the second heat dissipation fins significantly increase the heat dissipation area of the second heat dissipation base. Heat from the domain controller's electronic components is conducted from the second heat dissipation base to the second heat dissipation fins. Simultaneously, the fan can also direct airflow to the second heat dissipation fins, thereby accelerating the heat dissipation process and improving the cooling effect. This is an active cooling solution. While its cooling effect is slightly inferior to the solution using the first heat dissipation module, it is better than the solution using the third heat dissipation module, and its cost is also slightly lower than that of the first heat dissipation module. Therefore, it can be considered a cooling option for domain controllers with mid-range performance.
[0076] Furthermore, the first and second heat sink bases can be manufactured using the same mold, thereby reducing production costs. The structures of the first and second heat sink bases are basically the same, except that... Figure 10As shown, since the third heat dissipation module is equipped with a fan, the second heat dissipation base has a hole 3012 for the connector 3032 of the fan 303 to pass through. This hole 3012 can be machined by adding an insert to the mold, or it can be obtained by subsequent machining.
[0077] This invention employs a switchable heat dissipation mechanism, allowing for the use of three different heat dissipation modules to meet varying heat dissipation needs. All three heat dissipation modules can be fixedly connected to the same top cover 1 using the same connectors (e.g., bolts 12). Therefore, different heat dissipation modules can be selected or switched at any time to suit the different performance and power consumption of the chip, thereby achieving the technical effects of reducing costs, providing on-demand configuration, and reducing development cycle and mold costs.
[0078] In another embodiment, this invention also provides a domain controller. The domain controller includes a printed circuit board 3 with electronic components, and a switchable heat dissipation mechanism as described above, with the printed circuit board housed within a housing.
[0079] In this invention, the printed circuit board (PCB) of the domain controller can be a printed circuit board integrating various electronic components. The domain controller can be a vehicle domain controller, which is used for vehicle status control and status monitoring, including but not limited to an in-vehicle mobile data center, a hardware monitor (HMI) that implements human-machine interface controller functions, an in-vehicle entertainment (IVI) controller, a body control module (BCM), and a vehicle control unit (VCU).
[0080] In this invention, the electronic devices on the printed circuit board can be a system on a chip (SOC), or other electronic components that generate heat and consume power, such as resistors, capacitors, inductors, diodes, and transistors.
[0081] The domain controller described in this invention can be used in vehicles, for example, in the automated driving of intelligent vehicles. Intelligent vehicles may include electric vehicles or gasoline-powered vehicles that support unmanned driving, driver assistance systems (ADAS), intelligent driving, connected driving, intelligent network driving, and car sharing.
[0082] Therefore, in another embodiment, this invention also provides a vehicle having the domain controller described above. Since this invention does not improve other components of the vehicle, these components will not be described in detail here.
[0083] It should be noted that the prior art within the scope of protection of this utility model is not limited to the embodiments given in this utility model document. All prior art that does not contradict the solution of this utility model, including but not limited to prior patent documents, prior publications, prior public uses, etc., can be included in the scope of protection of this utility model.
[0084] Furthermore, the combination of the technical features in this case is not limited to the combination methods described in the claims of this case or the combination methods described in the specific embodiments. All technical features described in this case can be freely combined or combined in any way, unless they contradict each other.
[0085] It should also be noted that the embodiments listed above are merely specific embodiments of this utility model. Obviously, this utility model is not limited to the above embodiments, and any similar changes or modifications made thereto that can be directly derived or easily conceived by those skilled in the art from the content disclosed in this utility model should fall within the protection scope of this utility model.
Claims
1. A switchable heat dissipation mechanism for a domain controller, characterized in that, include: Bottom cover (2); The upper cover (1) is connected to the bottom cover to form a housing having a cavity for accommodating the electronic components of the domain controller; A heat dissipation assembly includes a first heat dissipation module (100), a second heat dissipation module (200), and a third heat dissipation module (300); the first heat dissipation module, the second heat dissipation module, and the third heat dissipation module are selectively disposed on the upper cover; The first heat dissipation module includes a cooling medium pipe (101) disposed on the upper cover, the cooling medium pipe having a cooling medium inlet (102) and a cooling medium outlet (103); The second heat dissipation module includes a first heat dissipation base (201) disposed on the upper cover, and a plurality of first heat dissipation fins (202) are erected on the first heat dissipation base; The third heat dissipation module includes a second heat dissipation base (301) disposed on the upper cover, a plurality of second heat dissipation fins (302) are erected on the second heat dissipation base, and a fan (303) is disposed on the side of the second heat dissipation fins.
2. The switchable heat dissipation mechanism as described in claim 1, characterized in that, The upper cover is provided with a through groove (11), and the first heat dissipation module, the second heat dissipation module and the third heat dissipation module are selectively nested in the through groove.
3. The switchable heat dissipation mechanism as described in claim 1, characterized in that, The bottom surface of the cooling medium pipe has a first protrusion (1011), which is used to connect to the electronic device for heat exchange.
4. The switchable heat dissipation mechanism as described in claim 3, characterized in that, The surface of the first protrusion, which is used to connect with the electronic device for heat exchange, is provided with a first thermally conductive layer (104).
5. The switchable heat dissipation mechanism as described in claim 1, characterized in that, The bottom surface of the first heat sink has a second protrusion (2011), which is used to connect with the electronic device for heat exchange.
6. The switchable heat dissipation mechanism as described in claim 5, characterized in that, The surface of the second protrusion, which is used to connect with the electronic device for heat exchange, is provided with a second thermally conductive layer (203).
7. The switchable heat dissipation mechanism as described in claim 1, characterized in that, The bottom surface of the second heat sink has a third protrusion (3011), which is used to connect with the electronic device for heat exchange.
8. The switchable heat dissipation mechanism as described in claim 7, characterized in that, The surface of the third protrusion, which is used to connect with the electronic device for heat exchange, is provided with a third thermally conductive layer (304).
9. The switchable heat dissipation mechanism as described in claim 1, characterized in that, The first heat sink base and the first heat sink fins are made of aluminum or aluminum alloy; and / or the second heat sink base and the second heat sink fins are made of aluminum or aluminum alloy.
10. The switchable heat dissipation mechanism as described in claim 1, characterized in that, The second heat sink base is also provided with a recess (3013) that is lower than the top of the second heat sink fin, and the fan is located in the recess.
11. A domain controller comprising a printed circuit board (3) on which electronic devices (31) are disposed, characterized in that, The domain controller further includes a switchable heat dissipation mechanism as described in any one of claims 1-10, wherein the printed circuit board is disposed within the housing.
12. A vehicle, characterized in that, It has a domain controller as described in claim 11.