High-thermal-conductivity aluminum-based circuit board

Abstract

The utility model discloses a high-thermal-conductivity aluminum-based circuit board, and relates to the field of circuit boards. The device comprises an aluminum-based circuit board main body, heat dissipation mounting parts are arranged at the two ends of the aluminum-based circuit board main body, short clamping plates are arranged at the two ends of the aluminum-based circuit board main body, heat dissipation strips are fixedly connected to the outer ends of the short clamping plates, long-strip clamping plates are arranged at the upper end of the aluminum-based circuit board main body, and heat dissipation fins are fixedly connected to the outer ends of the long-strip clamping plates. The heat dissipation installation part comprises an installation base, fixing connection holes are formed in the left end and the right end of the installation base, and a heat dissipation air channel is formed in the installation base. According to the device, the high-thermal-conductivity aluminum-based circuit board does not need to be fixedly connected directly through the circuit board body during installation, the circuit board body is prevented from being damaged or even collapsed due to errors in the connecting process, meanwhile, the heat dissipation performance of the circuit board is more excellent, and the situation that the circuit board is damaged due to too high temperature is prevented.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, specifically to a high thermal conductivity aluminum-based circuit board. Background Technology

[0002] Aluminum-based circuit boards, also known as aluminum-based PCBs or aluminum substrates, are a special type of metal-based copper-clad laminate with excellent thermal conductivity, electrical insulation, and machinability. The working principle of aluminum-based circuit boards is primarily based on their unique heat dissipation structure. Power devices are surface-mounted on the circuit layer. The heat generated during device operation is rapidly conducted through the insulating layer to the metal substrate (aluminum plate), and then the metal substrate transfers the heat away, thus achieving effective heat dissipation for the devices.

[0003] Existing aluminum-based circuit boards have poor overall heat dissipation, often resulting in overheating and damage, thus reducing their overall lifespan. Furthermore, aluminum-based circuit boards are typically installed by directly connecting them to other components, and the aluminum substrate is prone to breakage due to errors during connection or damage from tight installation. To address these issues, this invention provides a high thermal conductivity aluminum-based circuit board. Utility Model Content

[0004] To address the shortcomings of existing technologies, this utility model provides a high thermal conductivity aluminum-based circuit board, which solves the problems of poor overall heat dissipation of existing aluminum-based circuit boards, frequent overheating and damage, and reduced overall service life. In addition, aluminum-based circuit boards are generally installed by directly connecting them to other components, and the aluminum base plate is prone to breakage due to errors in the connection process, or even damage due to tight installation.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a high thermal conductivity aluminum-based circuit board, comprising an aluminum-based circuit board body, with heat dissipation mounting portions at both ends of the aluminum-based circuit board body, wherein short snap-fit ​​plates are provided at both ends of the aluminum-based circuit board body, and heat dissipation strips are fixedly connected to the outer ends of the short snap-fit ​​plates; a long snap-fit ​​plate is provided at the upper end of the aluminum-based circuit board body, and heat dissipation fins are fixedly connected to the outer ends of the long snap-fit ​​plate; wherein the heat dissipation mounting portion includes a mounting base, with fixed connection holes at both ends of the mounting base, and a heat dissipation air duct is provided inside the mounting base.

[0006] Preferably, an edge-sealing aluminum plate frame is fixedly connected to the outer end of the aluminum-based circuit board body, and opening blocks are fixedly connected to the left and right ends of the edge-sealing aluminum plate frame, and a long block is fixedly connected to the upper end of the edge-sealing aluminum plate frame.

[0007] Preferably, the short snap-fit ​​plate is movably snapped onto the outside of the perforated snap-fit ​​block, and the long snap-fit ​​plate is movably snapped onto the outside of the long snap-fit ​​block.

[0008] Preferably, the short snap-fit ​​plate has a fixing hole inside, the inner end of the short snap-fit ​​plate has a snap-fit ​​hole, and the two ends of the long snap-fit ​​plate are fixedly connected to snap-fit ​​posts, which are movably snapped into the snap-fit ​​holes.

[0009] Preferably, the mounting base is further fixedly connected to a fixing stud, which is movably engaged in the fixing hole, and both the short locking plate and the long locking plate are fixedly connected to the mounting base.

[0010] Preferably, the heat dissipation mounting part further includes an upper mounting plate, the upper mounting plate is provided with fixing bolts, the fixing bolts are threaded into fixing studs, and the upper mounting plate is fixedly connected to the mounting base by the fixing bolts.

[0011] This utility model discloses a high thermal conductivity aluminum-based circuit board, which has the following beneficial effects: By setting a heat dissipation mounting part, the installation of this high thermal conductivity aluminum-based circuit board does not require direct fixing through the circuit board body, preventing damage or even breakage of the circuit board body due to errors in the connection process. At the same time, through the heat dissipation air duct of the heat dissipation mounting part and the heat dissipation strip outside the short clip plate and the heat dissipation fin outside the long clip plate, the heat dissipation performance of the circuit board is better, preventing damage due to overheating. Attached Figure Description

[0012] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0013] Figure 1 This is a schematic diagram of the overall front structure of this utility model;

[0014] Figure 2 This is a schematic diagram of the overall exploded structure of this utility model;

[0015] Figure 3 This is a schematic diagram of the exploded structure of the main body of the aluminum-based circuit board of this utility model;

[0016] Figure 4 This is an exploded structural diagram of the heat dissipation mounting part of this utility model.

[0017] In the diagram: 1. Aluminum-based circuit board body; 11. Edge-sealed aluminum plate frame; 111. Opening clip; 112. Long clip; 12. Short clip plate; 121. Fixing hole; 122. Heat sink strip; 123. Clip hole; 13. Long clip plate; 131. Heat sink; 132. Clip post; 2. Heat dissipation mounting part; 21. Mounting base; 211. Fixing connection hole; 212. Fixing stud; 213. Heat dissipation air duct; 22. Upper mounting plate; 221. Fixing bolt. Detailed Implementation

[0018] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions in the embodiments of this utility model are described clearly and completely. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0019] This application provides a high thermal conductivity aluminum-based circuit board, which solves the problems of poor heat dissipation of existing aluminum-based circuit boards, which often lead to overheating and damage, reducing the overall service life. In addition, aluminum-based circuit boards are generally directly connected to other components, and the aluminum base plate is prone to breakage due to errors in the connection process, or even damage due to tight installation.

[0020] In order to better understand the above technical solution, the above technical solution will be described in detail below with reference to the accompanying drawings and specific implementation methods.

[0021] This utility model discloses a high thermal conductivity aluminum-based circuit board.

[0022] According to the appendix Figure 1-4 As shown,

[0023] The system includes an aluminum-based circuit board body 1, with heat dissipation mounting parts 2 at both ends. Short connecting plates 12 are provided at both ends of the aluminum-based circuit board body 1, with heat dissipation strips 122 fixedly connected to the outer ends of the short connecting plates 12. A long connecting plate 13 is provided at the upper end of the aluminum-based circuit board body 1, with heat sinks 131 fixedly connected to the outer ends of the long connecting plate 13. The heat dissipation mounting parts 2 include a mounting base 21, with fixed connection holes 211 at both ends of the mounting base 21. A heat dissipation airflow duct 213 is provided inside the mounting base 21. In use, the long connecting plate 13 and short connecting plates 12 of the aluminum-based circuit board body 1 are fixed to the mounting base 21. Through the cooperation of the heat dissipation strips 122, heat sinks 131, and heat dissipation airflow duct 213, rapid heat dissipation is achieved with the help of external wind. Simultaneously, the mounting base 21 is fixed to other components through the fixed connection holes 211.

[0024] An aluminum-based circuit board body 1 has an edge-sealing aluminum plate frame 11 fixedly connected to its outer end. The left and right ends of the edge-sealing aluminum plate frame 11 are fixedly connected to perforated clips 111. A long clip 112 is fixedly connected to the upper end of the edge-sealing aluminum plate frame 11. A short clip plate 12 is movably clipped onto the outside of the perforated clips 111, and a long clip plate 13 is movably clipped onto the outside of the long clip 112. The short clip plate 12 has a fixing hole 121 inside and a clipping hole 123 at its inner end. Clipping posts 13 are fixedly connected to both ends of the long clip plate 13. 2. The snap-fit ​​post 132 is movably snapped into the snap-fit ​​hole 123. The edge-sealing aluminum plate frame 11 is welded to the aluminum plate base at the bottom of the aluminum base circuit board body 1. The opening snap-fit ​​block 111 and the long snap-fit ​​block 112 are both welded to the edge-sealing aluminum plate frame 11. The opening snap-fit ​​block 111 also has through holes for easy fixing. The edge-sealing aluminum plate frame 11, the opening snap-fit ​​block 111, the long snap-fit ​​block 112, the long snap-fit ​​plate 13 and the short snap-fit ​​plate 12 are all made of aluminum alloy material. The excellent heat dissipation of aluminum alloy further improves the heat dissipation performance.

[0025] The mounting base 21 is also fixedly connected to a fixing stud 212, which is movably engaged in the fixing hole 121. The short connecting plate 12 and the long connecting plate 13 are both fixedly connected to the mounting base 21. The heat dissipation mounting part 2 also includes an upper mounting fixing plate 22, on which a fixing bolt 221 is provided. The fixing bolt 221 is threaded into the fixing stud 212. The upper mounting fixing plate 22 is fixedly connected to the mounting base 21 by the fixing bolt 221. The fixing bolt 221 fixes the upper mounting fixing plate 22 to the mounting base 21. The mounting base 21 and the upper mounting fixing plate 22 serve to protect and support the aluminum-based circuit board body 1 and fix it to other accessories.

[0026] In summary, compared with existing technologies, it has the following beneficial effects:

[0027] This type of high thermal conductivity aluminum-based circuit board, by incorporating a heat dissipation mounting part 2, eliminates the need for direct fixing to the circuit board body during installation. This prevents damage or even breakage of the circuit board body due to errors during connection. Furthermore, the heat dissipation airflow 213 of the mounting part 2, combined with the heat dissipation strips 122 on the short connector 12 and the heat dissipation fins 131 on the long connector 13, further enhances the circuit board's heat dissipation performance, preventing damage due to overheating.

[0028] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A high thermal conductivity aluminum-based circuit board, comprising an aluminum-based circuit board body (1), characterized in that, The aluminum-based circuit board body (1) has heat dissipation mounting parts (2) at both ends; The aluminum-based circuit board body (1) is provided with short card plates (12) at both ends, and heat sink strips (122) are fixedly connected to the outer ends of the short card plates (12). The aluminum-based circuit board body (1) is provided with long card plates (13) at the upper end, and heat sinks (131) are fixedly connected to the outer ends of the long card plates (13). The heat dissipation mounting part (2) includes a mounting base (21), and fixed connection holes (211) are provided at both the left and right ends of the mounting base (21). A heat dissipation air duct (213) is provided inside the mounting base (21).

2. The high thermal conductivity aluminum-based circuit board according to claim 1, characterized in that: The aluminum-based circuit board body (1) is fixedly connected to an edge-sealing aluminum plate frame (11) at its outer end. The left and right ends of the edge-sealing aluminum plate frame (11) are fixedly connected to opening clips (111), and the upper end of the edge-sealing aluminum plate frame (11) is fixedly connected to a long clip (112).

3. The high thermal conductivity aluminum-based circuit board according to claim 2, characterized in that: The short snap-fit ​​plate (12) is movably snapped onto the outside of the opening snap-fit ​​block (111), and the long snap-fit ​​plate (13) is movably snapped onto the outside of the long snap-fit ​​block (112).

4. The high thermal conductivity aluminum-based circuit board according to claim 2, characterized in that: The short snap-fit ​​plate (12) has a fixing hole (121) inside, and the inner end of the short snap-fit ​​plate (12) has a snap-fit ​​hole (123). The long snap-fit ​​plate (13) has snap-fit ​​posts (132) fixedly connected to both ends, and the snap-fit ​​posts (132) are movably snapped into the snap-fit ​​holes (123).

5. The high thermal conductivity aluminum-based circuit board according to claim 1, characterized in that: A fixing stud (212) is also fixedly connected to the mounting base (21). The fixing stud (212) is movably engaged in the fixing hole (121). The short snap-fit ​​plate (12) and the long snap-fit ​​plate (13) are both fixedly connected to the mounting base (21).

6. The high thermal conductivity aluminum-based circuit board according to claim 5, characterized in that: The heat dissipation mounting part (2) also includes an upper mounting fixing plate (22), on which a fixing bolt (221) is provided. The fixing bolt (221) is threaded into the fixing stud (212), and the upper mounting fixing plate (22) is fixedly connected to the mounting base (21) by the fixing bolt (221).

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