Novel anti-oxidation double-sided PCB

Abstract

The utility model relates to the technical field of PCBs (Printed Circuit Board), in particular to a novel anti-oxidation double-sided PCB, which comprises a bearing substrate and a welding substrate, a heat dissipation bin is arranged in the bearing substrate, and a dust removal and dehumidification mechanism is arranged on the welding substrate; the dust removal and dehumidification mechanism comprises a dehumidification base and a dehumidification top cover, a fan is arranged in the dehumidification base, corona electrodes are arranged on the peripheral side of the fan, and a coarse dust collection plate, a coarse dust collection plate and a PTFE water absorption layer are fixedly arranged on the dehumidification top cover. The dust removal and dehumidification mechanisms are distributed on the outer side face of the welding base plate, the dust removal and water vapor removal range is widened, water vapor is sucked into the dust removal and dehumidification mechanisms after the draught fan is started, large-particle impurities in air are filtered through the coarse dust collection plate, small-particle impurities are filtered through the fine dust collection plate, and the dust removal and dehumidification efficiency is improved. Water vapor in air is absorbed through the PTFE water absorption layer, so that the water vapor is prevented from staying on the outer side surface of the welding substrate for a long time to oxidize the welding substrate, and the service life of the PCB is prolonged.

Description

Technical Field

[0001] This utility model relates to an anti-oxidation double-sided PCB board, and more particularly to a novel anti-oxidation double-sided PCB board, belonging to the field of PCB board technology. Background Technology

[0002] Double-sided PCBs typically refer to double-sided boards with special designs or processing techniques. A double-sided PCB is a type of circuit board with circuitry on both sides. Compared to single-sided PCBs, double-sided PCBs can accommodate more circuit components within the same board size. To enhance the oxidation resistance of PCBs, special surface treatment processes are usually used to effectively prevent metal elements such as copper from reacting with oxygen in the air, thereby improving the oxidation resistance of the circuit board.

[0003] However, in humid air, PCB boards generate heat, and water vapor condenses into water upon cooling and drips onto the PCB board, thus accelerating PCB oxidation and significantly reducing the PCB's lifespan.

[0004] Therefore, there is an urgent need to improve the anti-oxidation equipment for double-sided PCBs in order to solve the above-mentioned problems. Utility Model Content

[0005] The purpose of this invention is to provide a novel anti-oxidation double-sided PCB board. Multiple dust removal and dehumidification mechanisms are distributed on the outer side of the soldering substrate, which improves the range of dust removal and water vapor removal. After the fan is started, water vapor is drawn into the interior of the dust removal and dehumidification mechanism. Larger particles of impurities in the air are filtered by the coarse dust collection plate, smaller impurities are filtered by the fine dust collection plate, and water vapor in the air is absorbed by the PTFE water-absorbing layer. This prevents water vapor from staying on the outer side of the soldering substrate for a long time and causing oxidation of the soldering substrate, thereby improving the service life of the PCB board.

[0006] To achieve the above objectives, the main technical solution adopted by this utility model includes: a novel anti-oxidation double-sided PCB board, comprising a receiving substrate and a welding substrate fixedly disposed on the upper and lower sides of the receiving substrate, wherein a heat dissipation chamber is provided inside the receiving substrate, and a dust removal and dehumidification mechanism connected to the interior of the heat dissipation chamber is fixedly disposed on the welding substrate.

[0007] The dust removal and dehumidification mechanism includes a dehumidification base and a dehumidification top cover. The dehumidification base has several evenly distributed air extraction holes on its peripheral side. A metal grid is fixedly installed on the air extraction holes. A fan is fixedly installed inside the dehumidification base. Several corona electrodes are fixedly installed on the periphery of the fan on the dehumidification base. A coarse dust collection plate, a fine dust collection plate, and a PTFE water absorption layer are fixedly installed on the dehumidification top cover.

[0008] The coarse dust collection plate is used to remove large particulate impurities;

[0009] The fine dust collection plate is used to remove small particulate impurities;

[0010] The PTFE absorbent layer is used to remove moisture.

[0011] Preferably, the bottom of the dehumidification base is provided with a threaded connector, which penetrates the welding substrate. The dehumidification top cover is connected to the dehumidification base by threaded engagement, and a top cover handle is fixedly provided on the upper side of the dehumidification top cover.

[0012] Preferably, the fan is fixedly installed inside the dehumidification base by a fan fixing rod, and the fan does not contact the dehumidification top cover.

[0013] Preferably, a limiting plate is fixedly installed inside the dehumidification base, and the coarse dust collection plate on the dehumidification top cover abuts against the limiting plate.

[0014] Preferably, a semiconductor cooling element is fixedly installed inside the heat dissipation chamber. The semiconductor cooling element includes a heat absorption surface and a heat dissipation surface. The semiconductor cooling element has a threaded hole corresponding to the dust removal and dehumidification mechanism. The threaded connector is connected to the threaded connector by threaded engagement, and the dehumidification base is connected to the interior of the heat dissipation chamber.

[0015] Preferably, a copper heat dissipation strip is fixedly installed inside the heat dissipation chamber, and the copper heat dissipation strip abuts against the upper side or the lower side of the semiconductor cooling element;

[0016] The heat dissipation chamber has heat dissipation holes, and the copper heat dissipation strip passes through the heat dissipation holes.

[0017] Preferably, an organic solderable protective agent (OSP) is fixedly disposed on the outer surface of the welding substrate.

[0018] Preferably, both ends of the receiving substrate are fixedly provided with assembly plates, and the assembly plates are provided with positioning holes.

[0019] This utility model has at least the following beneficial effects:

[0020] 1. Multiple dust removal and dehumidification mechanisms are distributed on the outer side of the welding substrate, which improves the range of dust removal and water vapor removal. After the fan is started, water vapor is drawn into the interior of the dust removal and dehumidification mechanism. Larger particles of impurities in the air are filtered by the coarse dust collection plate, smaller impurities are filtered by the fine dust collection plate, and water vapor in the air is absorbed by the PTFE water absorption layer. This prevents water vapor from staying on the outer side of the welding substrate for a long time and causing oxidation of the welding substrate, thus improving the service life of the PCB board.

[0021] 2. The copper heat sink inside the heat dissipation chamber absorbs the heat lost by the semiconductor cooling components and dissipates it to the outside of the receiving substrate through the heat dissipation holes, thereby achieving the purpose of heat dissipation for the receiving substrate. The fan is fixedly installed inside the dehumidification base by the fan fixing rod, and the fan does not contact the dehumidification top cover. Moreover, the fan can accelerate the air flow inside the heat dissipation chamber, further accelerating the heat dissipation efficiency. Attached Figure Description

[0022] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:

[0023] Figure 1 This is a perspective view of the present utility model;

[0024] Figure 2 This is a perspective view of the dust removal and dehumidification mechanism of this utility model;

[0025] Figure 3 This is a cross-sectional view of the dust removal and dehumidification mechanism of this utility model;

[0026] Figure 4 This is a structural diagram of the dehumidification base of this utility model;

[0027] Figure 5 This is a structural diagram of the dehumidifying top cover of this utility model;

[0028] Figure 6 This is a structural diagram of the receiving substrate of this utility model;

[0029] Figure 7 This is a structural diagram of the semiconductor cooling device of this utility model.

[0030] In the diagram, 1. Receiving substrate; 101. Heat dissipation chamber; 102. Heat dissipation hole; 2. Welding substrate; 3. Dust removal and dehumidification mechanism; 4. Dehumidification base; 401. Threaded connector; 402. Limiting plate; 403. Air extraction hole; 404. Corona electrode; 5. Dehumidification top cover; 501. Top cover handle; 502. Coarse dust collection plate; 503. Fine dust collection plate; 504. PTFE water absorption layer; 6. Fan; 601. Fan fixing rod; 7. Copper heat dissipation strip; 8. Metal grille; 9. Semiconductor cooling component; 901. Threaded hole; 10. Assembly plate. Detailed Implementation

[0031] The following will describe in detail the implementation of this application with reference to the accompanying drawings and embodiments, so that the implementation process of how this application uses technical means to solve technical problems and achieve technical effects can be fully understood and implemented accordingly.

[0032] like Figures 1-7As shown, the novel anti-oxidation double-sided PCB board provided in this embodiment includes a receiving substrate 1 and a welding substrate 2 fixedly disposed on the upper and lower sides of the receiving substrate 1. The welding substrate 2 is fixedly disposed on both the upper and lower sides of the receiving substrate 1, thus forming a double-sided PCB board. A heat dissipation chamber 101 is opened inside the receiving substrate 1. A dust removal and dehumidification mechanism 3 connected to the inside of the heat dissipation chamber 101 is fixedly disposed on the welding substrate 2. The dust removal and dehumidification mechanism 3 is disposed on the outer side of the welding substrate 2, which can remove dust and water vapor from the surface of the welding substrate 2. Moreover, an organic solderable protective agent OSP is fixedly disposed on the outer side of the welding substrate 2, thus minimizing the oxidation of the welding substrate 2.

[0033] Multiple dust removal and dehumidification mechanisms 3 are distributed on the outer side of the welding substrate 2, improving the range of dust removal and water vapor removal. Each dust removal and dehumidification mechanism 3 includes a dehumidification base 4 and a dehumidification top cover 5. Several evenly distributed exhaust holes 403 are opened on the peripheral side of the dehumidification base 4. Metal grilles 8 are fixedly installed on the exhaust holes 403. The metal grilles 8 prevent dust from entering the interior of the dust removal and dehumidification mechanism 3, extending its service life. A fan 6 is fixedly installed inside the dehumidification base 4. Several corona electrodes 404 are fixedly installed on the periphery of the fan 6 on the dehumidification base 4. Ions generated by the corona electrodes 404 collide with dust particles in the dust-laden gas, causing the dust particles to become charged. Under the influence of the electric field, the charged dust particles are adsorbed onto the corona electrodes 404 or other electrodes, thereby achieving the purpose of dust removal and ensuring a good dust collection effect. The wet top cover 5 is fixedly equipped with a coarse dust collection plate 502, a fine dust collection plate 503, and a PTFE water absorption layer 504. During the process of removing water vapor and dust, the fan 6 inside the dehumidification base 4 is started. After the fan 6 is started, the dust and water vapor on the surface of the welding substrate 2 are drawn into the interior of the dust removal and dehumidification mechanism 3. After the air enters the interior of the dust removal and dehumidification mechanism 3, the coarse dust collection plate 502 is used to remove large particles of impurities. First, the coarse dust collection plate 502 on the dehumidification top cover 5 filters the larger particles of impurities in the air. The fine dust collection plate 503 is used to remove small particles of impurities. Then, the fine dust collection plate 503 filters the smaller impurities. The PTFE water absorption layer 504 is used to remove moisture. Finally, the PTFE water absorption layer 504 absorbs the water vapor in the air, preventing water vapor from staying on the outer side of the welding substrate 2 for a long time and causing oxidation of the welding substrate 2.

[0034] After a period of time, a threaded connector 401 is provided at the bottom of the dehumidification base 4. The threaded connector 401 passes through the welding substrate 2. The dehumidification top cover 5 is connected to the dehumidification base 4 by threaded engagement. A top cover handle 501 is fixedly provided on the upper side of the dehumidification top cover 5. The dehumidification top cover 5 can be removed from the dehumidification base 4 by using the top cover handle 501 on the dehumidification top cover 5. This makes it convenient to clean the impurities on the coarse dust collection plate 502 and the fine dust collection plate 503, as well as to replace the PTFE water absorption layer 504. It is convenient and quick to use and easy to maintain later.

[0035] Further, such as Figure 6 and Figure 7 As shown, a semiconductor cooling component 9 is fixedly installed inside the heat dissipation chamber 101. The semiconductor cooling component 9 includes a heat absorption surface and a heat dissipation surface of the cooling chip. The semiconductor cooling component 9 has a threaded hole 901 corresponding to the dust removal and dehumidification mechanism 3. The threaded connector 401 is connected to the threaded connector 401 by threaded engagement. The dehumidification base 4 is connected to the inside of the heat dissipation chamber 101. The dehumidification base 4 is directly connected to the inside of the heat dissipation chamber 101 through the threaded connector 401, which facilitates the installation of the dust removal and dehumidification mechanism 3 and improves the ease of use.

[0036] Meanwhile, the heat-absorbing surface of the cooling chip on the semiconductor cooling device 9 can absorb the heat on the welding substrate 2 and then dissipate the heat to the interior of the heat dissipation chamber 101 through the heat dissipation surface of the cooling chip, thereby achieving the purpose of heat dissipation of the welding substrate 2.

[0037] A copper heat dissipation strip 7 is fixedly installed inside the heat dissipation chamber 101. The copper heat dissipation strip 7 abuts against the upper side or the lower side of the semiconductor cooling component 9. The heat dissipation chamber 101 is provided with heat dissipation holes 102. The copper heat dissipation strip 7 passes through the heat dissipation holes 102. The copper heat dissipation strip 7 inside the heat dissipation chamber 101 absorbs the heat dissipated by the semiconductor cooling component 9 and dissipates it to the outside of the receiving substrate 1 through the heat dissipation holes 102, thereby achieving the purpose of heat dissipation of the receiving substrate 1. The fan 6 is fixedly installed inside the dehumidification base 4 by the fan fixing rod 601. The fan 6 does not contact the dehumidification top cover 5. Moreover, under the action of the fan 6, the air flow inside the heat dissipation chamber 101 can be accelerated, further accelerating the heat dissipation efficiency.

[0038] Furthermore, such as Figure 3 and Figure 4 As shown, a limiting plate 402 is fixedly installed inside the dehumidifying base 4. The coarse dust collection plate 502 on the dehumidifying top cover 5 abuts against the limiting plate 402. The limiting plate 402 inside the dehumidifying base 4 abuts against the coarse dust collection plate 502 on the dehumidifying top cover 5, which can prevent the coarse dust collection plate 502 from deforming under force. Assembly plates 10 are fixedly installed at both ends of the receiving base plate 1. Positioning holes are opened on the assembly plates 10. The receiving base plate 1 is fixed by the assembly plates 10, which improves the stability of the receiving base plate 1.

[0039] like Figures 1-7 As shown, the principle of the novel anti-oxidation double-sided PCB board provided in this embodiment is as follows:

[0040] Multiple dust removal and dehumidification mechanisms 3 are distributed on the outer side of the welding substrate 2 to increase the range of dust removal and water vapor removal. During the process of removing water vapor and dust, the fan 6 inside the dehumidification base 4 is activated. After the fan 6 is activated, the dust and water vapor on the surface of the welding substrate 2 are drawn into the interior of the dust removal and dehumidification mechanism 3. After the air enters the interior of the dust removal and dehumidification mechanism 3, the coarse dust collection plate 502 is used to remove large particulate impurities. First, the coarse dust collection plate 502 on the dehumidification top cover 5 filters the larger particulate impurities in the air. The fine dust collection plate 503 is used to remove small particulate impurities. Then, the fine dust collection plate 503 filters the smaller impurities. The PTFE water absorption layer 504 is used to remove moisture. Finally, the PTFE water absorption layer 504 absorbs the water vapor in the air, preventing water vapor from staying on the outer side of the welding substrate 2 for a long time and causing oxidation of the welding substrate 2.

[0041] If certain terms are used in the specification and claims to refer to specific components, those skilled in the art will understand that hardware manufacturers may use different names to refer to the same component. This specification and claims do not distinguish components based on differences in name, but rather on differences in function. The term "comprising" as used throughout the specification and claims is an open-ended term and should be interpreted as "comprising but not limited to." "Approximately" means that within an acceptable margin of error, those skilled in the art can solve the technical problem and substantially achieve the technical effect within a certain margin of error.

[0042] It should be noted that the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a product or system comprising a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a product or system. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the product or system that includes that element.

[0043] The foregoing description illustrates and describes several preferred embodiments of the present invention. However, as previously stated, it should be understood that the present invention is not limited to the forms disclosed herein and should not be construed as excluding other embodiments. It can be used in various other combinations, modifications, and environments, and can be altered within the scope of the inventive concept described herein through the foregoing teachings or techniques or knowledge in related fields. Any modifications and variations made by those skilled in the art that do not depart from the spirit and scope of the present invention should be within the protection scope of the appended claims.

Claims

1. A novel anti-oxidation double-sided PCB board, comprising a receiving substrate (1) and a welding substrate (2) fixedly disposed on the upper and lower sides of the receiving substrate (1), characterized in that, The receiving substrate (1) has a heat dissipation chamber (101) inside, and the welding substrate (2) is fixedly provided with a dust removal and dehumidification mechanism (3) that communicates with the inside of the heat dissipation chamber (101). The dust removal and dehumidification mechanism (3) includes a dehumidification base (4) and a dehumidification top cover (5). The dehumidification base (4) has several evenly distributed air extraction holes (403) on its periphery. A metal grid (8) is fixedly installed on the air extraction holes (403). A fan (6) is fixedly installed inside the dehumidification base (4). Several corona electrodes (404) are fixedly installed on the periphery of the fan (6) on the dehumidification base (4). A coarse dust collection plate (502), a fine dust collection plate (503), and a PTFE water absorption layer (504) are fixedly installed on the dehumidification top cover (5). The coarse dust collection plate (502) is used to remove large particulate impurities; The fine dust collection plate (503) is used to remove small particulate impurities; The PTFE absorbent layer (504) is used to remove moisture.

2. The novel anti-oxidation double-sided PCB board according to claim 1, characterized in that: The bottom of the dehumidification base (4) is provided with a threaded connector (401), which penetrates the welding substrate (2). The dehumidification top cover (5) is connected to the dehumidification base (4) by threaded engagement. The top cover handle (501) is fixedly provided on the upper side of the dehumidification top cover (5).

3. The novel anti-oxidation double-sided PCB board according to claim 1, characterized in that: The fan (6) is fixed inside the dehumidification base (4) by a fan fixing rod (601), and the fan (6) does not contact the dehumidification top cover (5).

4. The novel anti-oxidation double-sided PCB board according to claim 1, characterized in that: The dehumidification base (4) is fixedly provided with a limiting plate (402), and the coarse dust collection plate (502) on the dehumidification top cover (5) abuts against the limiting plate (402).

5. A novel anti-oxidation double-sided PCB board according to claim 2, characterized in that: A semiconductor cooling element (9) is fixedly installed inside the heat dissipation chamber (101). The semiconductor cooling element (9) includes a heat absorption surface and a heat dissipation surface. A threaded hole (901) corresponding to the dust removal and dehumidification mechanism (3) is opened on the semiconductor cooling element (9). The threaded connector (401) is connected to the threaded connector (401) by threaded engagement. The dehumidification base (4) is connected to the interior of the heat dissipation chamber (101).

6. A novel anti-oxidation double-sided PCB board according to claim 5, characterized in that: A copper heat dissipation strip (7) is fixedly installed inside the heat dissipation chamber (101), and the copper heat dissipation strip (7) abuts against the upper side or the lower side of the semiconductor cooling element (9). The heat dissipation chamber (101) has heat dissipation holes (102), and the copper heat dissipation strip (7) passes through the heat dissipation holes (102).

7. A novel anti-oxidation double-sided PCB board according to claim 1, characterized in that: Organic solderable protective agent (OSP) is fixedly disposed on the outer side of the welding substrate (2).

8. A novel anti-oxidation double-sided PCB board according to claim 1, characterized in that: Both ends of the receiving base plate (1) are fixedly provided with assembly plates (10), and the assembly plates (10) are provided with positioning holes.

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