Power conversion equipment

Abstract

The utility model provides power conversion equipment, and relates to the technical field of electronics. The power conversion equipment comprises a circuit board, a power device and a magnetic device. The circuit board is provided with a conductive layer. In the thickness direction of the circuit board, the power device is installed on one side of the circuit board and electrically connected with the conductive layer, and the magnetic device is installed on one side of the circuit board and electrically connected with the power device. Wherein a shielding layer is arranged between the magnetic device and the circuit board, the conducting layer is located on the side, opposite to the magnetic device, of the shielding layer, the conducting layer and the shielding layer are arranged in a spaced and insulated mode, and the projection of the shielding layer in the thickness direction of the circuit board, the projection of the magnetic device in the thickness direction of the circuit board and the projection of the conducting layer in the thickness direction of the circuit board are overlapped. Leakage magnetic flux generated by the magnetic device is shielded by the shielding layer, so that the working temperature of the conductive layer is reduced, and the working efficiency and the use safety are improved; the leakage magnetic flux is prevented from influencing signal transmission in the conductive layer, and the performance of the power conversion equipment is improved.

Description

Technical Field

[0001] This application relates to the field of electronic technology, and more particularly to a power conversion device. Background Technology

[0002] In existing power conversion equipment, magnetic components are mounted on a circuit board with a conductive layer. The leakage flux generated by the magnetic components passes through the conductive layer and induces eddy current losses. As the power density of power conversion equipment increases, the eddy current losses induced in the conductive layer by the leakage flux generated by the magnetic components become significant, causing the temperature of the conductive layer to rise too quickly. This not only affects the current carrying efficiency of the conductive layer, resulting in low operating efficiency of the power conversion equipment, but also makes the conductive layer prone to burnout, leading to low safety in the use of the power conversion equipment. Utility Model Content

[0003] This application provides a power conversion device aimed at solving the problems of low operating efficiency and low safety in the use of power conversion devices.

[0004] This application provides a power conversion device. The power conversion device includes a circuit board, a power device, and a magnetic device. The circuit board has a conductive layer. In the thickness direction of the circuit board, the power device is mounted on one side of the circuit board and electrically connected to the conductive layer. In the thickness direction of the circuit board, the magnetic device is mounted on one side of the circuit board and electrically connected to the power device; wherein, a shielding layer is provided between the magnetic device and the circuit board, and in the thickness direction of the circuit board, the conductive layer is located on the side of the shielding layer opposite to the magnetic device and is spaced apart from and insulated from the shielding layer, and the projection of the shielding layer in the thickness direction of the circuit board overlaps with the projection of the magnetic device in the thickness direction of the circuit board and the projection of the conductive layer in the thickness direction of the circuit board.

[0005] In the power conversion device provided in this application embodiment, power devices and magnetic devices cooperate to achieve power conversion function, and power current and signal current can be transmitted in the conductive layer. The design of the shielding layer's projection in the thickness direction of the circuit board, the projection of the magnetic device in the thickness direction of the circuit board, and the projection of the conductive layer in the thickness direction of the circuit board overlaps to ensure that the leakage flux generated by the magnetic device is shielded by the shielding layer, preventing the leakage flux generated by the magnetic device from passing through the conductive layer. On the one hand, this can prevent the leakage flux generated by the magnetic device from inducing eddy current losses in the conductive layer, which would cause the operating temperature of the conductive layer to rise too quickly, thus improving the working efficiency and safety of the power conversion device. On the other hand, it can prevent the leakage flux generated by the magnetic device from generating interference signals in the conductive layer, thereby affecting the signal transmission in the conductive layer, which is beneficial to improving the signal transmission quality in the conductive layer and improving the performance of the power conversion device.

[0006] In one possible implementation, the resistivity of the shielding layer is greater than that of the conductive layer.

[0007] The design of having a shielding layer with a resistivity greater than that of the conductive layer helps to reduce eddy current losses induced by the shielding layer when shielding leakage flux generated by magnetic devices, helps to lower the operating temperature of the shielding layer, helps to reduce the amount of heat generated by the shielding layer during operation that is transferred to the conductive layer, helps to lower the operating temperature of the conductive layer, and helps to improve the operating efficiency and safety of power conversion equipment.

[0008] In one possible implementation, the magnetic permeability of the shielding layer is greater than that of the conductive layer.

[0009] Designing the shielding layer to have a higher permeability than the conductive layer improves the shielding effect against leakage flux generated by magnetic devices, reduces heat generated by induced eddy current losses in the conductive layer, lowers the operating temperature of the conductive layer, and enhances the efficiency and safety of power conversion equipment. Furthermore, it reduces the impact of leakage flux generated by magnetic devices on signal transmission in the conductive layer, improves the quality of signal transmission in the conductive layer, and ultimately enhances the performance of the power conversion equipment.

[0010] In one possible implementation, the shielding layer is made of amorphous or nanocrystalline materials.

[0011] Amorphous and nanocrystalline materials are materials that possess both high permeability and high resistivity. The design of a shielding layer made of amorphous or nanocrystalline materials not only ensures excellent shielding against leakage flux generated by magnetic devices, but also helps reduce eddy current losses induced in the shielding layer, lowers the operating temperature of the shielding layer, reduces the amount of heat transferred from the shielding layer to the conductive layer, and ultimately improves the efficiency and safety of the power conversion equipment.

[0012] In one possible implementation, the shielding layer includes multiple shielding strips, which are sequentially contacted and fixedly stacked in the thickness direction of the circuit board.

[0013] Electromagnetic shielding is achieved through multiple shielding strips. The thickness of the shielding layer can be adjusted by changing the number of shielding strips, which in turn adjusts the electromagnetic shielding capability of the shielding layer. This reduces the difficulty of adjusting the electromagnetic shielding capability of the shielding layer, reduces the adjustment cost of the shielding layer, and reduces the processing cost of power conversion equipment.

[0014] In one possible implementation, the thickness of the shielding layer is less than the thickness of the circuit board.

[0015] The design of having a shielding layer thickness smaller than the circuit board thickness ensures that the shielding layer can shield the leakage flux generated by magnetic devices, while avoiding excessive size of the power conversion device in the thickness direction of the circuit board, which is beneficial for the miniaturization design of the power conversion device.

[0016] In one possible implementation, the magnetic device includes a magnetic core, the projection of which onto the thickness of the circuit board lies within the projection of the shielding layer onto the thickness of the circuit board.

[0017] The leakage flux generated by magnetic devices is concentrated in the magnetic core. Designing the projection of the magnetic core along the thickness direction of the circuit board to fall within the projection of the shielding layer along the thickness direction of the circuit board improves the shielding effect of the shielding layer on the leakage flux generated by the magnetic devices, reduces eddy current losses induced by the leakage flux in the conductive layer, lowers the operating temperature of the conductive layer, and improves the efficiency and safety of the power conversion equipment. Furthermore, it helps reduce the impact of the leakage flux generated by the magnetic devices on signal transmission in the conductive layer, improving the quality of signal transmission in the conductive layer and ultimately enhancing the performance of the power conversion equipment.

[0018] In one possible implementation, the shielding layer is in contact with the magnetic device.

[0019] The design of the shielding layer in contact with the magnetic components avoids the presence of other components between the shielding layer and the magnetic components, which helps to reduce the size of the power conversion device in the thickness direction of the circuit board and facilitates the miniaturization design of the power conversion device.

[0020] In one possible implementation, in the thickness direction of the circuit board, a shielding layer contacts and is fixedly stacked between the magnetic device and the circuit board, and a conductive layer is embedded in the circuit board.

[0021] The design of embedding the conductive layer within the circuit board improves space utilization, reduces the thickness of the power conversion device, and facilitates miniaturization. The design of a shielding layer contacting and fixing the magnetic components between the magnetic components and the circuit board, with the magnetic components mounted on the board through the shielding layer, ensures stable shielding against leakage flux generated by the magnetic components. This improves the reliability of the shielding layer against leakage flux and enhances the structural stability and reliability of the power conversion device. Furthermore, the simple and stable structure facilitates design and reduces manufacturing costs.

[0022] In one possible implementation, in the thickness direction of the circuit board, a shielding layer is contacted and fixedly stacked between the magnetic device and the circuit board, and a conductive layer is stacked on the side of the circuit board facing away from the magnetic device.

[0023] The design of stacking the conductive layer on the side of the circuit board opposite to the magnetic components, with the magnetic components and conductive layer respectively positioned on opposite sides of the circuit board, facilitates the placement of the conductive layer, reduces its complexity, and lowers the circuit board's manufacturing costs. Furthermore, it avoids the shielding layer between the magnetic components and the circuit board occupying the conductive layer's footprint, improving space utilization, reducing the circuit board's area, and promoting miniaturization of the power conversion device. The design of the shielding layer contacting and fixing the stacked layer between the magnetic components and the circuit board, with the magnetic components mounted on the circuit board through the shielding layer, ensures that the shielding layer stably blocks the leakage flux generated by the magnetic components. This improves the reliability of the shielding layer's protection against leakage flux and enhances the structural stability and reliability of the power conversion device. Additionally, the simple and stable structure facilitates design and reduces the manufacturing costs of the power conversion device.

[0024] In one possible implementation, the circuit board has mounting holes on the side facing the magnetic device. The mounting holes are spaced apart from the conductive layer in the thickness direction of the circuit board, and the shielding layer is at least partially housed in the mounting holes.

[0025] The design of housing the shielding layer within the mounting hole improves the space utilization of the circuit board, reduces the thickness dimension of the power conversion device in the circuit board, and facilitates the miniaturization design of the power conversion device.

[0026] In one possible implementation, a conductive layer is stacked on the side of the circuit board facing the magnetic device in the thickness direction of the circuit board, and an insulating layer is provided between the conductive layer and the shielding layer. The projection of the insulating layer in the thickness direction of the circuit board covers the projection of the shielding layer in the thickness direction of the circuit board.

[0027] The design of stacking conductive layers on the side of the circuit board facing the magnetic components facilitates the placement of conductive layers, reduces the difficulty of conductive layer placement, and lowers the circuit board manufacturing cost. Furthermore, it avoids placing other components on the side of the circuit board away from the magnetic components, facilitating the installation of the circuit board and external components and reducing the installation cost of the power conversion equipment. Insulation between the conductive and shielding layers is achieved through an insulating layer, resulting in a simple and easy-to-design structure. The design where the projection of the insulating layer along the thickness direction of the circuit board overlaps with the projection of the shielding layer along the thickness direction of the circuit board improves the insulation effect between the conductive and shielding layers, and enhances the shielding effect of the shielding layer.

[0028] In one possible implementation, the shielding layer has a receiving hole on the side facing the magnetic device, and the magnetic device is partially received in the receiving hole.

[0029] The design of housing the magnetic components in the receiving hole is beneficial to improving the space utilization of the shielding layer, reducing the size of the power conversion device in the thickness direction of the circuit board, and facilitating the miniaturization design of the power conversion device. Attached Figure Description

[0030] To more clearly illustrate the technical solutions in the embodiments of this application or the background art, the accompanying drawings used in the embodiments of this application or the background art will be described below.

[0031] Figure 1 This is a structural block diagram of a power conversion device, photovoltaic module, and power grid provided in an embodiment of this application;

[0032] Figure 2 yes Figure 1 The diagram shows the structure of the power conversion device.

[0033] Figure 3 yes Figure 2 A schematic diagram of the power conversion device shown from another angle;

[0034] Figure 4 yes Figure 2 The diagram shows the structure of the circuit board of the power conversion device.

[0035] Figure 5 yes Figure 4 The diagram shows the structure of the circuit board from another angle;

[0036] Figure 6 This is a schematic diagram of another power conversion device provided in an embodiment of this application;

[0037] Figure 7 This is a schematic diagram of another power conversion device provided in an embodiment of this application;

[0038] Figure 8 This is a schematic diagram of another power conversion device provided in an embodiment of this application;

[0039] Figure 9 This is a schematic diagram of another power conversion device provided in an embodiment of this application. Detailed Implementation

[0040] The embodiments of this application are described below with reference to the accompanying drawings.

[0041] Please see Figure 1 , Figure 2 and Figure 3 , Figure 1 This is a structural block diagram of a power conversion device 100 cooperating with a photovoltaic module 200 and a power grid 300, as provided in an embodiment of this application. Figure 2yes Figure 1 The diagram shows the structure of the power conversion device 100. Figure 3 yes Figure 2 The power conversion device 100 shown is a structural schematic diagram from another angle.

[0042] like Figure 1 As shown, exemplarily, the power conversion device 100 is a photovoltaic inverter. In other embodiments, the power conversion device 100 may also be an electronic device used for power conversion, such as a rectifier, transformer, charging pile, or energy storage PCS (Power Conversion System, converter). The power conversion device 100 is used to convert the direct current output from the photovoltaic module 200 into alternating current and supply it to the power grid 300. In other embodiments, the power conversion device 100 may also be used to convert the direct current output from the photovoltaic module 200 into alternating current and supply it to a load device. The load device may be an electronic device that uses alternating current, including but not limited to motors, fans, or air conditioners. In other embodiments, the power conversion device 100 may also be applied to an electric drive controller. For example, the power conversion device 100 can convert the direct current output from a battery into alternating current to supply a motor.

[0043] For ease of description, this application defines any three directions as the first direction (i.e., the Z-axis direction in the diagram), the second direction (the X-axis direction in the diagram), and the third direction (i.e., the Y-axis direction in the diagram). The first direction (i.e., the Z-axis direction in the diagram) is the thickness direction of the circuit board 10.

[0044] The second direction (i.e., the Z-axis direction shown in the diagram), the third direction (i.e., the X-axis direction shown in the diagram), and the fourth direction (i.e., the Y-axis direction shown in the diagram) are perpendicular to each other. In this embodiment, the second direction (i.e., the X-axis direction shown in the diagram) is the length direction of the circuit board 10, and the third direction (i.e., the Y-axis direction shown in the diagram) is the width direction of the circuit board 10. In some other embodiments, the second direction (i.e., the X-axis direction shown in the diagram) may also be the width direction of the circuit board 10, and the third direction (i.e., the Y-axis direction shown in the diagram) may also be the length direction of the circuit board 10.

[0045] like Figure 1 , Figure 2 and Figure 3 As shown, the power conversion device 100 includes a circuit board 10, a power device 20, a magnetic device 30, and multiple connection terminals 40. The power device 20, the magnetic device 30, and each connection terminal 40 are mounted on the circuit board 10. The magnetic device 30 is electrically connected to the power device 20. Specifically, the magnetic device 30 is electrically connected to the power device 20 via the connection terminals 40 and the circuit board 10.

[0046] The direct current (DC) output from the photovoltaic module 200 is transmitted to the power device 20 via the connection terminal 40 and the circuit board 10. The power device 20 is a packaged module or device used to convert the DC output from the photovoltaic module 200 into alternating current (AC). For example, the power device 20 may be, but is not limited to, an IGBT (Insulated Gate Bipolar Transistor) chip, an FRD (Fast Recovery Diode) chip, or a MOSFET (Metal Oxide Field-Effect Transistor) chip. The AC output from the power device 20 is transmitted to the power grid 300 via the circuit board 10 and the connection terminal 40 to supply power to the grid. The magnetic device 30 can be used to filter the current transmitted in the circuit. For example, the magnetic device 30 is an inductor. In some other embodiments, the magnetic device 30 may also be a transformer. For example, the magnetic device 30 may be used to perform voltage transformation on the current supplied from the photovoltaic module 200 to the power device 20. This application does not specifically limit this.

[0047] Please see Figure 4 and Figure 5 and combined Figure 2 and Figure 3 , Figure 4 yes Figure 2 A schematic diagram of the circuit board 10 of the power conversion device 100 shown. Figure 5 yes Figure 4 The schematic diagram of the circuit board 10 shown from another angle.

[0048] like Figure 2 , Figure 4 and Figure 5 As shown, the circuit board 10 has a conductive layer 11. Specifically, the conductive layer 11 is embedded in the circuit board 10. Exemplarily, there are multiple conductive layers 11, specifically, there are two conductive layers 11. In the Z-axis direction, the multiple conductive layers 11 are spaced apart. In some other embodiments, the number of conductive layers 11 may also be one, three, or more. Exemplarily, the conductive layer 11 is made of copper; in some other embodiments, the conductive layer 11 may also be made of other metal materials such as aluminum or copper-aluminum alloy. The circuit board 10 includes a first surface 12 and a second surface 13. In the Z-axis direction, the first surface 12 and the second surface 13 are opposite to each other and spaced apart. The first surface 12 and the second surface 13 are located on both sides of the conductive layer 11 and are spaced apart from the conductive layer 11.

[0049] In some embodiments, the circuit board 10 further includes connection holes 14, which extend from the first surface 12 along the Z-axis and penetrate the conductive layer 11. Specifically, the connection holes 14 penetrate each conductive layer 11 along the Z-axis. Exemplarily, there are multiple connection holes 14, including a first connection hole 14a, a second connection hole 14b, a third connection hole 14c, a fourth connection hole 14d, and a fifth connection hole 14e. In the X-axis direction, the first connection hole 14a, the second connection hole 14b, and the third connection hole 14c are sequentially spaced apart. In the X-axis direction, the fourth connection hole 14d and the fifth connection hole 14e are both located between the first connection hole 14a and the second connection hole 14b, and are spaced apart from both the first and second connection holes 14a and 14b. In the Y-axis direction, the fourth connection hole 14d and the fifth connection hole 14e are located on both sides of the first connection hole 14a and the second connection hole 14b, and are spaced apart from both the first and second connection holes 14a and 14b. In some other embodiments, the number of connection holes 14 may also be two, three, or more.

[0050] In some embodiments, the circuit board 10 further includes fixing holes 15, which extend from the first surface 12 along the Z-axis and penetrate the conductive layer 11. Specifically, the fixing holes 15 penetrate each conductive layer 11 along the Z-axis. The fixing holes 15 are spaced apart from the connecting holes 14. Specifically, in the X-axis direction, the fixing holes 15 are located between the second connecting hole 14b and the third connecting hole 14c, and are spaced apart from the second connecting hole 14b and the third connecting hole 14c. Exemplarily, there are multiple fixing holes 15, specifically, there are two fixing holes 15. In the X-axis direction, the multiple fixing holes 15 are spaced apart. In other embodiments, the number of fixing holes 15 may also be one, three, or more.

[0051] like Figure 2 , Figure 3 and Figure 5 As shown, in some embodiments, in the Z-axis direction (i.e., the thickness direction of the circuit board 10), the power device 20 is mounted on one side of the circuit board 10 and electrically connected to the conductive layer 11. Specifically, the power device 20 includes a power body 21 and pins 22. In the Z-axis direction, the pins 22 are fixedly connected to one side of the power body 21. In the Z-axis direction, the power body 21 is fixedly connected to one side of the circuit board 10; specifically, the power body 21 is fixedly connected to the side of the first surface 12 facing away from the second surface 13. The pins 22 are inserted into the mounting holes 15 and contact the conductive layer 11, and are electrically connected to the conductive layer 11. Exemplarily, there are multiple pins 22, specifically, there are two pins 22. The multiple pins 22 correspond one-to-one with the multiple mounting holes 15, and the pins 22 are inserted into the corresponding mounting holes 15. In other embodiments, the number of pins 22 may also be one, three, or more.

[0052] In some embodiments, in the Z-axis direction (i.e., the thickness direction of the circuit board 10), the magnetic device 30 is mounted on one side of the circuit board 10 and electrically connected to the power device 20. Specifically, in the Z-axis direction, the magnetic device 30 is mounted on the side of the circuit board 10 facing the power device 20, that is, the magnetic device 30 is mounted on the side of the first surface 12 facing away from the second surface 13. In the Z-axis direction, the magnetic device 30 is spaced apart from the circuit board 10 and spaced apart from the conductive layer 11. In other embodiments, the magnetic device 30 may also be mounted on the side of the circuit board 10 facing away from the power device 20 and located on one side of the conductive layer 11. Exemplarily, the number of magnetic devices 30 is multiple, specifically, the multiple magnetic devices 30 include a first magnetic device 30a and a second magnetic device 30b. In the X-axis direction, the first magnetic device 30a and the second magnetic device 30b are spaced apart. In other embodiments, the number of magnetic devices 30 may also be one, three, or more.

[0053] The magnetic device 30 includes a magnetic core 31, a winding 32, and a base 33. Exemplarily, the magnetic core 31 is a toroidal core, specifically a rectangular toroidal core. In other embodiments, the magnetic core 31 may also be a circular toroidal core, a triangular toroidal core, or other irregularly shaped core. The axis of the magnetic core 31 is perpendicular to the Z-axis direction, specifically, the axis of the magnetic core 31 is parallel to the Y-axis direction. In other embodiments, the axis of the magnetic core 31 may also be perpendicular to or inclined to the Y-axis direction. The winding 32 is wound on the magnetic core 31. In the Z-axis direction, the base 33 is disposed on the side of the magnetic core 31 facing the circuit board 1. Specifically, the base 33 is fixedly connected to the side of the magnetic core 31 on the circuit board 1.

[0054] The magnetic device 30 is electrically connected to the conductive layer 11 via connecting terminals 40. The magnetic device 30 is also electrically connected to the power device 20 via the conductive layer 11. Specifically, multiple connecting terminals 40 are inserted into multiple connecting holes 14 in a one-to-one correspondence and are all in contact with and electrically connected to the conductive layer 11. The multiple connecting terminals 40 include a first connecting terminal 40a, a second connecting terminal 40b, a third connecting terminal 40c, a fourth connecting terminal 40d, and a fifth connecting terminal 40e. The first connecting terminal 40a corresponds to the first connecting hole 14a, the second connecting terminal 40b corresponds to the second connecting hole 14b, the third connecting terminal 40c corresponds to the third connecting hole 14c, the fourth connecting terminal 40d corresponds to the fourth connecting hole 14d, and the fifth connecting terminal 40e corresponds to the fifth connecting hole 14e. The first connecting terminals 40a, the second connecting terminal 40b, the fourth connecting terminal 40d, and the fifth connecting terminal 40e surround the first magnetic device 30a and the second magnetic device 30b.

[0055] The two ends of the winding 32 of the first magnetic device 30a are connected to the first connecting terminal 40a and the fourth connecting terminal 40d, respectively. The two ends of the winding 32 of the second magnetic device 30b are connected to the second connecting terminal 40b and the fifth connecting terminal 40e, respectively. The first magnetic device 30a is electrically connected to the conductive layer 11 through the first connecting terminal 40a and the fourth connecting terminal 40d, and thus electrically connected to the power device 20. The second magnetic device 30b is electrically connected to the conductive layer 11 through the second connecting terminal 40b and the fifth connecting terminal 40e, and thus electrically connected to the power device 20. In some other embodiments, the windings 32 of the first magnetic device 30a and the second magnetic device 30b can also be directly connected to the power device 20 for electrical connection.

[0056] like Figure 1 , Figure 2 and Figure 3 As shown, in Figure 2 and Figure 3 In the illustrated embodiment, the direct current output by the photovoltaic module 200 is transmitted to the power device 20 through the first connection terminal 40a and the conductive layer 11. The power device 20 converts the direct current into alternating current. The alternating current output by the power device 20 is transmitted to the power grid 300 through the conductive layer 11 and the third connection terminal 40c to supply the power grid 300. The conductive layer 11 can transmit power current for driving the power device 20 and signal current for controlling the operation of the power device 20. The first magnetic device 30a and the second magnetic device 30b filter the current transmitted in the circuit through the conductive layer 11. During the operation of the power conversion device 100, due to the current flowing through the windings 32 of the first magnetic device 30a and the second magnetic device 30b, a large amount of magnetic flux is generated at the magnetic core 31; most of the magnetic flux flows in the magnetic core 31, and some of the magnetic flux diffuses from the magnetic core 31 to the external environment. The magnetic flux that diffuses from the magnetic core 31 to the external environment is leakage flux. That is, the magnetic device 30 will generate leakage flux. Some of the leakage flux flows from the magnetic core 31 toward the circuit board 10.

[0057] like Figure 2 and Figure 3As shown, a shielding layer 50 is provided between the magnetic device 30 and the circuit board 10. In the Z-axis direction (i.e., the thickness direction of the circuit board 10), the conductive layer 11 is located on the side of the shielding layer 50 facing away from the magnetic device 30 and is spaced apart from and insulated from the shielding layer 50. Further, the shielding layer 50 is in contact with the magnetic device 30. In some embodiments, the shielding layer 50 is contacted and fixedly stacked between the circuit board 10 and the magnetic device 30 in the Z-axis direction (i.e., the thickness direction of the circuit board 10) by means including but not limited to adhesive bonding, bonding, or embedding. Specifically, the shielding layer 50 is contacted and fixedly stacked between the first surface 12 and the base 33 of each magnetic device 30. Each magnetic device 30 is mounted on the circuit board 10 through the shielding layer 50.

[0058] Specifically, the projection of the shielding layer 50 in the thickness direction (i.e., the Z-axis direction) of the circuit board 10 overlaps with the projections of the magnetic devices 30 and the conductive layer 11 in the thickness direction (i.e., the Z-axis direction) of the circuit board 10. In particular, the projection of the shielding layer 50 in the Z-axis direction overlaps with the projection of each magnetic device 30 in the Z-axis direction.

[0059] In the power conversion device 100 provided in this application embodiment, the power device 20 and the magnetic device 30 (first magnetic device 30a and second magnetic device 30b) cooperate to realize the power conversion function, and the power current and signal current can be transmitted in the conductive layer 11. The design of the overlapping of the projection of the shielding layer 50 on the thickness direction (i.e., the Z-axis direction) of the circuit board 10, the projection of the magnetic device 30 on the thickness direction (i.e., the Z-axis direction) of the circuit board 10, and the projection of the conductive layer 11 on the thickness direction (i.e., the Z-axis direction) of the circuit board 10 ensures that the leakage magnetic flux generated by the magnetic device 30 is shielded by the shielding layer 50, preventing the leakage magnetic flux generated by the magnetic device 30 from passing through the conductive layer 11. On the one hand, this can prevent the leakage magnetic flux generated by the magnetic device 30 from inducing eddy current losses in the conductive layer 11, which would cause the operating temperature of the conductive layer 11 to rise too quickly, thus improving the working efficiency and safety of the power conversion device 100. On the other hand, it can prevent the leakage magnetic flux generated by the magnetic device 30 from generating interference signals in the conductive layer 11, thereby affecting the signal transmission in the conductive layer 11, which is beneficial to improving the signal transmission quality in the conductive layer 11 and improving the performance of the power conversion device 100.

[0060] The design of the shielding layer 50 contacting the magnetic device 30 avoids the presence of other components between the shielding layer 50 and the magnetic device 30, which helps to reduce the size of the power conversion device 100 in the thickness direction (i.e., the Z-axis direction) of the circuit board 10, and is conducive to the miniaturization design of the power conversion device 100.

[0061] The design of the conductive layer 11 embedded in the circuit board 10 improves the space utilization of the circuit board 10, reduces the size of the power conversion device 100 in the thickness direction (i.e., the Z-axis direction) of the circuit board 10, and facilitates the miniaturization design of the power conversion device 100. The design of the shielding layer 50 contacting and fixing the magnetic device 30 between the magnetic device 30 and the circuit board 10, with the magnetic device 30 mounted on the circuit board 10 through the shielding layer 50, ensures that the shielding layer 50 can stably shield the leakage magnetic flux generated by the magnetic device 30. This improves the reliability of the shielding layer 50 in shielding the leakage magnetic flux generated by the magnetic device 30, and also improves the structural stability and reliability of the power conversion device 100. Furthermore, the simple and stable structure facilitates design and reduces the processing cost of the power conversion device 100.

[0062] In some embodiments, the resistivity of the shielding layer 50 is greater than that of the conductive layer 11. This design, where the resistivity of the shielding layer 50 is greater than that of the conductive layer 11, helps reduce eddy current losses induced by the shielding layer 50 when shielding leakage flux generated by the magnetic device 30. It also helps lower the operating temperature of the shielding layer 50, reduces the amount of heat generated by the shielding layer 50 during operation that is transferred to the conductive layer 11, further lowers the operating temperature of the conductive layer 11, and ultimately improves the efficiency and safety of the power conversion device 100.

[0063] In some embodiments, the permeability of the shielding layer 50 is greater than that of the conductive layer 11. This design, where the permeability of the shielding layer 50 is greater than that of the conductive layer 11, is beneficial for improving the shielding effect of the shielding layer 50 on the leakage flux generated by the magnetic device 30, reducing the heat generated by the induced eddy current losses of the magnetic device 30 in the conductive layer 11, lowering the operating temperature of the conductive layer 11, and improving the operating efficiency and safety of the power conversion device 100. Furthermore, it helps to reduce the impact of the leakage flux generated by the magnetic device 30 on signal transmission in the conductive layer 11, improving the quality of signal transmission in the conductive layer 11, and ultimately enhancing the performance of the power conversion device 100.

[0064] exist Figure 2 and Figure 3 In the illustrated embodiment, the resistivity of the shielding layer 50 is greater than that of the conductive layer 11, and the permeability of the shielding layer 50 is greater than that of the conductive layer 11. The shielding layer 50 is made of an amorphous material or a nanocrystalline material. The resistivity of the amorphous material and the resistivity of the nanocrystalline material are greater than that of copper (the material of the conductive layer 11). Furthermore, the permeability of the amorphous material and the permeability of the nanocrystalline material are greater than that of copper.

[0065] The resistivity of the material of conductive layer 11. Amorphous and nanocrystalline materials are materials that combine high permeability and high resistivity. The design of shielding layer 50, which is made of amorphous or nanocrystalline materials, not only ensures that shielding layer 50 has a good shielding effect on leakage flux generated by magnetic device 30, but also helps to reduce eddy current losses induced by magnetic device 30 in shielding layer 50, helps to reduce the operating temperature of shielding layer 50, helps to reduce the amount of heat generated by shielding layer 50 during operation and transferred to conductive layer 11, helps to reduce the operating temperature of conductive layer 11, and helps to improve the working efficiency and safety of power conversion equipment 100.

[0066] Specifically, the shielding layer 50 includes multiple shielding strips 51, which are sequentially contacted and fixedly stacked in the Z-axis direction (i.e., the thickness direction of the circuit board 10). For example, the shielding strips 51 can be amorphous strips. The thickness of the amorphous strips ranges from 10 to 30 μm (micrometers), for example, the thickness of the amorphous strips can be 10 μm, 13 μm, 20 μm, or 30 μm. At 100 kHz (kilohertz), the permeability of the amorphous strips ranges from 200 to 10000, for example, the permeability of the amorphous strips can be 200, 500, 1000, 3000, 6000, or 10000. The number of amorphous strips is 1 to 100, for example, the number of amorphous strips can be 2, 5, 10, 20, 60, or 100. The number of amorphous ribbons can also be one, that is, the shielding layer 50 is an amorphous ribbon.

[0067] In some other embodiments, the shielding tape 51 may also be a nanocrystalline tape. The thickness of the nanocrystalline tape ranges from 10 to 30 μm.

[0068] (Micrometers), for example, the thickness of the nanocrystalline ribbon can be 10μm, 13μm, 20μm, or 30μm. At 100kHz, the permeability of the nanocrystalline ribbon ranges from 2000 to 100000, for example, the permeability can be 2000, 4000, 8000, 10000, 25000, 60000, or 100000. The number of nanocrystalline ribbons is 1-100, for example, 2, 5, 10, 20, 60, or 100. The number of nanocrystalline ribbons can also be a single piece, i.e., the shielding layer 50 is made of nanocrystalline ribbon material.

[0069] Electromagnetic shielding is achieved through multiple shielding strips 51. The thickness of the shielding layer 50 can be adjusted by changing the number of shielding strips 51, thereby adjusting the electromagnetic shielding capability of the shielding layer 50. This helps to reduce the difficulty of adjusting the electromagnetic shielding capability of the shielding layer 50, reduce the adjustment cost of the shielding layer 50, and reduce the processing cost of the power conversion equipment 100.

[0070] In some embodiments, the thickness of the shielding layer 50 (i.e., the dimension of the shielding layer 50 in the Z-axis direction) is smaller than the thickness of the circuit board 10 (i.e., the dimension of the circuit board 10 in the Z-axis direction). This design, where the thickness of the shielding layer 50 is smaller than the thickness of the circuit board 10, ensures that the shielding layer 50 can shield the leakage flux generated by the magnetic device 30, while avoiding an excessively large dimension of the power conversion device 100 in the thickness direction (i.e., the Z-axis direction) of the circuit board 10. This facilitates the miniaturization design of the power conversion device 100.

[0071] In some embodiments, the projection of the magnetic core 31 in the thickness direction (i.e., the Z-axis direction) of the circuit board 10 lies within the projection of the shielding layer 50 in the thickness direction (i.e., the Z-axis direction) of the circuit board 10. Specifically, the projection of the magnetic core 31 of each magnetic device 30 in the Z-axis direction lies within the projection of the shielding layer 50 in the Z-axis direction.

[0072] The leakage flux generated by the magnetic device 30 is concentrated in the magnetic core 31. The design that the projection of the magnetic core 31 onto the thickness direction (i.e., the Z-axis direction) of the circuit board 10 lies within the projection of the shielding layer 50 onto the thickness direction (i.e., the Z-axis direction) of the circuit board 10 is beneficial for improving the shielding effect of the shielding layer 50 on the leakage flux generated by the magnetic device 30, reducing the eddy current loss induced by the leakage flux in the conductive layer 11, lowering the operating temperature of the conductive layer 11, and improving the operating efficiency and safety of the power conversion device 100. Furthermore, it helps reduce the impact of the leakage flux generated by the magnetic device 30 on signal transmission in the conductive layer 11, improving the quality of signal transmission in the conductive layer 11 and ultimately enhancing the performance of the power conversion device 100.

[0073] Please see Figure 6 and combined Figure 2 , Figure 6 This is a schematic diagram of another power conversion device 100 provided in the embodiments of this application.

[0074] like Figure 2 and Figure 6 As shown, Figure 6 The illustrated embodiments and Figure 2 The embodiments shown are structurally similar, differing only in the position of the conductive layer 11 and the mating relationship between the power device 20 and the connection terminal 40 and the conductive layer 11. Figure 6 In the illustrated embodiment, the shielding layer 50 is contacted and fixedly stacked between the magnetic device 30 and the circuit board 10. Specifically, the shielding layer 50 is contacted and fixedly stacked between the magnetic device 30 and the first surface 12. The conductive layer 11 is stacked on the side of the circuit board 10 facing away from the magnetic device 30. Specifically, the conductive layer 11 is fixedly stacked on the side of the second surface 13 facing away from the first surface 12.

[0075] The connection hole 14 penetrates the circuit board 10 and the conductive layer 11 along the Z-axis. The connection terminal 40 is inserted into the connection hole 14 and contacts the conductive layer 11. The magnetic device 30 is also electrically connected to the conductive layer 11 through the connection terminal 40, and then electrically connected to the power device 20. For details, please refer to [reference needed]. Figure 2 The relevant descriptions of the illustrated embodiment will not be repeated. The mounting hole 15 can be omitted. The power device 20 is fixedly connected to the conductive layer 11 on the side facing away from the circuit board 10. Specifically, the pin 22 is fixedly connected to the conductive layer 11, and the power body 21 faces away from the conductive layer 11.

[0076] The conductive layer 11 is stacked on the side of the circuit board 10 facing away from the magnetic device 30. The magnetic device 30 and the conductive layer 11 are respectively disposed on opposite sides of the circuit board 10. This design facilitates the placement of the conductive layer 11 on the circuit board 10, reduces the difficulty of placing the conductive layer 11, and reduces the processing cost of the circuit board 10. Moreover, it avoids the shielding layer 50 between the magnetic device 30 and the circuit board 10 occupying the board area of ​​the conductive layer 11, which helps to improve the space utilization of the circuit board 10, reduce the area of ​​the circuit board 10, and facilitate the miniaturization design of the circuit board 10 and the power conversion device 100.

[0077] exist Figure 6 In the illustrated embodiment, the projection of the power device 20 in the Z-axis direction overlaps with the projections of the magnetic device 30 and the shielding layer 50 in the Z-axis direction. This design, where the projections of the power device 20, the magnetic device 30, and the shielding layer 50 overlap in the Z-axis direction, improves the space utilization of the power device 20 and the magnetic device 30, reduces the area of ​​the circuit board 10, facilitates the miniaturization of the circuit board 10, and ultimately contributes to the miniaturization of the power conversion device 100.

[0078] Please see Figure 7 and combined Figure 2 , Figure 7 This is a schematic diagram of another power conversion device 100 provided in the embodiments of this application.

[0079] like Figure 2 and Figure 7 As shown, Figure 7 The illustrated embodiments and Figure 2 The structures of the illustrated embodiments are similar, but the difference lies in the mating relationship between the shielding layer 50 and the circuit board 10. Specifically, in Figure 7In the illustrated embodiment, the circuit board 10 has a mounting hole 16 on the side facing the magnetic device 30. Specifically, the mounting hole 16 extends from the first surface 12 along the Z-axis towards the second surface 13. The mounting hole 16 is spaced apart from the conductive layer 11 in the thickness direction (i.e., the Z-axis direction) of the circuit board 10. The shielding layer 50 is at least partially housed in the mounting hole 16. This design, where the shielding layer 50 is housed in the mounting hole 16, improves the space utilization of the circuit board 10, reduces the size of the power conversion device 100 in the thickness direction (i.e., the Z-axis direction) of the circuit board 10, and facilitates the miniaturization design of the power conversion device 100. It can be understood that... Figure 7 The design of the shielding layer 50 being housed in the mounting hole 16 in the illustrated embodiment can also be applied to... Figure 6 The illustrated embodiment.

[0080] Please see Figure 8 and combined Figure 2 , Figure 8 This is a schematic diagram of another power conversion device 100 provided in the embodiments of this application.

[0081] like Figure 2 and Figure 8 As shown, Figure 8 The illustrated embodiments and Figure 2 The embodiments shown are structurally similar, differing only in the position of the conductive layer 11 and the arrangement of the power device 20, magnetic device 30, and shielding layer 50. Figure 8 In the illustrated embodiment, a conductive layer 11 is stacked on the side of the circuit board 10 facing the magnetic device 30 along the thickness direction (i.e., the Z-axis direction). An insulating layer 60 is provided between the conductive layer 11 and the shielding layer 50, and the insulating layer 60 contacts and fixes the conductive layer 11 and the shielding layer 50. It can be understood that the conductive layer 11, the insulating layer 60, the shielding layer 50, and the magnetic device 30 are sequentially and fixedly stacked on the side of the first surface 12 facing away from the second surface 13. The insulating layer 60 is made of materials including but not limited to silicone or epoxy resin. The connecting hole 14, the fixing hole 15, and the connecting terminal 40 can all be omitted. The power device 20 is fixedly connected to the side of the conductive layer 11 facing away from the circuit board 10 and is electrically connected to the conductive layer 11. The two ends of the winding 32 of the magnetic device 30 can be fixedly connected to the conductive layer 11 and electrically connected to the conductive layer 11, and thus can also be electrically connected to the power device 20.

[0082] In this design, the projection of the insulating layer 60 on the thickness direction (Z-axis) of the circuit board 10 covers the projection of the shielding layer 50 on the thickness direction (Z-axis) of the circuit board 10. The design of the conductive layer 11 being stacked on the side of the circuit board 10 facing the magnetic device 30 facilitates the placement of the conductive layer 11 on the circuit board 10, reducing the difficulty of its placement and the processing cost of the circuit board 10. Furthermore, it avoids placing other devices on the side of the circuit board 10 facing away from the magnetic device 30, facilitating the installation of the circuit board 10 with external devices and reducing the installation cost of the power conversion device 100. Moreover, the insulation between the conductive layer 11 and the shielding layer 50 is achieved through the insulating layer 60, resulting in a simple structure that is easy to design. The design of the insulating layer 60 on the thickness direction (Z-axis) of the circuit board 10 covering the projection of the shielding layer 50 on the thickness direction (Z-axis) of the circuit board 10 improves the insulation effect between the conductive layer 11 and the shielding layer 50, and also improves the shielding effect of the shielding layer 50.

[0083] Please see Figure 9 and combined Figure 2 , Figure 9 This is a schematic diagram of another power conversion device 100 provided in the embodiments of this application.

[0084] like Figure 2 and Figure 9 As shown, Figure 9 The illustrated embodiments and Figure 2 The structures of the illustrated embodiments are similar, the difference being that the cooperation between the shielding layer 50 and the magnetic device 30 differs. Specifically, in... Figure 9 In the illustrated embodiment, the shielding layer 50 has a receiving hole 52 on the side facing the magnetic device 30, and the magnetic device 30 is partially received in the receiving hole 52. Specifically, the base 33 of the magnetic device 30 is partially received in the receiving hole 52. The design of partially receiving the magnetic device 30 in the receiving hole 52 is beneficial to improving the space utilization of the shielding layer 50, reducing the size of the power conversion device 100 in the thickness direction (i.e., the Z-axis direction) of the circuit board 10, and facilitating the miniaturization design of the power conversion device 100.

[0085] Understandable. Figure 9 The design of housing the magnetic device 30 portion within the receiving hole 52 in the illustrated embodiment can be applied to... Figures 1-8 In any of the embodiments shown.

Claims

1. A power conversion device, characterized in that, The power conversion device includes: A circuit board, wherein the circuit board is provided with a conductive layer; A power device, in the thickness direction of the circuit board, is mounted on one side of the circuit board and electrically connected to the conductive layer; and A magnetic device is mounted on one side of the circuit board and electrically connected to the power device in the thickness direction of the circuit board; wherein a shielding layer is provided between the magnetic device and the circuit board, and a conductive layer is located on the side of the shielding layer opposite to the magnetic device in the thickness direction of the circuit board and is spaced apart from and insulated from the shielding layer; the projection of the shielding layer in the thickness direction of the circuit board overlaps with the projection of the magnetic device in the thickness direction of the circuit board and the projection of the conductive layer in the thickness direction of the circuit board.

2. The power conversion device according to claim 1, characterized in that, The resistivity of the shielding layer is greater than that of the conductive layer.

3. The power conversion device according to claim 1, characterized in that, The magnetic permeability of the shielding layer is greater than that of the conductive layer.

4. The power conversion device according to claim 1, characterized in that, The shielding layer is made of amorphous or nanocrystalline materials.

5. The power conversion device according to claim 1, characterized in that, The shielding layer includes multiple shielding strips, which are sequentially contacted and fixedly stacked in the thickness direction of the circuit board.

6. The power conversion device according to claim 1, characterized in that, The thickness of the shielding layer is less than the thickness of the circuit board.

7. The power conversion device according to claim 1, characterized in that, The magnetic device includes a magnetic core, the projection of which in the thickness direction of the circuit board lies within the projection of the shielding layer in the thickness direction of the circuit board.

8. The power conversion device according to any one of claims 1 to 7, characterized in that, The shielding layer is in contact with the magnetic device.

9. The power conversion device according to claim 8, characterized in that, In the thickness direction of the circuit board, the shielding layer contacts and is fixedly stacked between the magnetic device and the circuit board; The conductive layer is embedded in the circuit board, or the conductive layer is stacked on the side of the circuit board facing away from the magnetic device.

10. The power conversion device according to claim 9, characterized in that, The circuit board has mounting holes on the side facing the magnetic device. The mounting holes are spaced apart from the conductive layer in the thickness direction of the circuit board, and the shielding layer is at least partially housed in the mounting holes.

11. The power conversion device according to claim 8, characterized in that, In the thickness direction of the circuit board, the conductive layer is stacked on the side of the circuit board facing the magnetic device, and an insulating layer is provided between the conductive layer and the shielding layer. The projection of the insulating layer in the thickness direction of the circuit board covers the projection of the shielding layer in the thickness direction of the circuit board.

12. The power conversion device according to claim 8, characterized in that, The shielding layer has a receiving hole on the side facing the magnetic device, and the magnetic device is partially received in the receiving hole.

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