Power electronic integrated module assembly

Abstract

The utility model provides a power electronic integrated module assembly. The power electronic integrated module assembly comprises a first shell, a second shell, a shielding cover and a low-voltage circuit board. The second shell is buckled on the first shell, the first shell is provided with a first shielding cavity, and the second shell is provided with a second shielding cavity; the shielding cover abuts against the end face of the first shielding cavity and seals the first shielding cavity. A first conductive layer and a second conductive layer are respectively arranged on two surfaces of the low-voltage circuit board; the first conductive layer abuts against the face, away from the first shell, of the shielding cover, the second conductive layer abuts against the end face of the second shielding cavity, and the low-voltage circuit board is used for sealing the second shielding cavity. The first shielding cavity and the second shielding cavity are formed in the two sides of the low-voltage circuit board respectively, so that electronic devices sensitive to electromagnetic interference on the two sides of the low-voltage circuit board can be arranged in the corresponding closed shielding cavities, and electromagnetic interference of an electromagnetic field in a high-voltage field area can be effectively prevented; and the electromagnetic compatibility with higher requirements can be met in an electric drive system of an automobile.

Description

Technical Field

[0001] This application relates to the field of automotive technology, and more particularly to a power electronics integrated module assembly. Background Technology

[0002] The electric drive system (EDS) of an automobile integrates a power electronics module assembly. This assembly contains numerous electronic components, some of which can generate low-voltage fields, while others can generate high-voltage fields. Due to the close proximity of the high-voltage and low-voltage fields, the high-voltage field can cause electromagnetic interference to the low-voltage field. Current technology typically uses a shielding plate to isolate the high-voltage and low-voltage fields. However, the shielding plate cannot isolate the electronic components requiring electromagnetic shielding in a separate space. This allows the high-voltage field to bypass the shielding plate and interfere with the electronic components within the low-voltage field. Utility Model Content

[0003] The purpose of this application is to provide a power electronic integrated module assembly to solve the problem that the electromagnetic shielding function cannot be effectively achieved by using only a shielding plate in the prior art.

[0004] This application provides a power electronics integrated module assembly, comprising:

[0005] A first housing, wherein the first housing is provided with a first shielding cavity, and the first shielding cavity has a first opening;

[0006] A second housing is fastened to the first housing, and the second housing is provided with a second shielding cavity, the second shielding cavity having a second opening;

[0007] A shielding cover abuts against the end face of the first shielding cavity on the side with the first opening, and closes the first opening;

[0008] A low-voltage circuit board, wherein a first conductive layer is provided on one side of the low-voltage circuit board and a second conductive layer is provided on the other side of the low-voltage circuit board; the first conductive layer abuts against the side of the shielding cover opposite to the first housing, the second conductive layer abuts against the end face of the second shielding cavity having the second opening, and the low-voltage circuit board is used to close the second opening.

[0009] In one possible implementation, the first housing includes a first end cap and a first sidewall, the first sidewall being connected to the first end cap around the first end cap, and a first cavity being formed between the first end cap and the first sidewall.

[0010] The first end cap is provided with a first shielding wall, and the first shielding wall, at least a portion of the first end cap, and at least a portion of the first side wall form a first shielding cavity, which is disposed within the first cavity.

[0011] In one possible implementation, the second housing includes a second end cap and a second sidewall, the second sidewall being connected to the second end cap around the second end cap, and a second cavity being formed between the second end cap and the second sidewall.

[0012] The second end cap is provided with a second shielding wall, and the second shielding wall, at least a portion of the second end cap and at least a portion of the second side wall form a second shielding cavity, which is disposed within the second cavity.

[0013] In one possible implementation, a connector is also included, which passes sequentially through the low-voltage circuit board and the shielding cover and is then fastened to the first housing;

[0014] The connector is electrically connected to the first conductive layer and the second conductive layer, respectively.

[0015] In one possible implementation, a first grounding point is provided on the first housing, and a second grounding point is provided on the second housing.

[0016] In one possible implementation, a signal acquisition device is also included, which is connected to the first housing;

[0017] The first housing is provided with a third shielding wall, which surrounds the signal acquisition device.

[0018] In one possible implementation, the second housing is provided with a fourth shielding wall and a fifth shielding wall, with a gap between the fourth shielding wall and the fifth shielding wall, and the third shielding wall is disposed in the gap.

[0019] In one possible implementation, the low-voltage circuit board includes a mounting area for mounting electronic devices, with both the first conductive layer and the second conductive layer surrounding the mounting area.

[0020] In one possible implementation, the first housing, the second housing, and the shield are all made of conductive materials.

[0021] In one possible implementation, both the first housing and the second housing are integrally formed structures.

[0022] The technical solution provided in this application can achieve the following beneficial effects:

[0023] This application provides a power electronic integrated module assembly. By forming a first shielding cavity and a second shielding cavity on both sides of a low-voltage circuit board, the electromagnetic interference-sensitive electronic devices on both sides of the low-voltage circuit board can be placed in the corresponding closed shielding cavities, thereby effectively preventing electromagnetic interference from electromagnetic fields in high-voltage areas and meeting high electromagnetic compatibility requirements in automotive electric drive systems.

[0024] It should be understood that the above general description and the following detailed description are merely exemplary and do not limit this application. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the structure of the electric drive system provided in the embodiments of this application;

[0026] Figure 2 A partial cross-sectional view of the power electronic integrated module provided in the embodiments of this application;

[0027] Figure 3 A partial structural diagram of the power electronics integrated module assembly provided in the embodiments of this application;

[0028] Figure 4 A plan view of the low-voltage circuit board provided in an embodiment of this application, facing the first housing.

[0029] Figure 5 A plan view of the low-voltage circuit board facing the second housing, provided in an embodiment of this application;

[0030] Figure 6 A partial structural diagram of a power electronics integrated module assembly provided in another embodiment of this application;

[0031] Figure 7 for Figure 2 A magnified view of a portion of the image;

[0032] Figure 8 A partial structural diagram of a power electronic integrated module assembly provided in another embodiment of this application;

[0033] Figure 9 A partial enlarged view of the power electronic integrated module assembly at the signal acquisition device provided in the embodiments of this application;

[0034] Figure 10 A schematic diagram of the structure of the second housing provided in an embodiment of this application;

[0035] Figure 11 This is a state diagram showing the insertion of the third shielding wall between the fourth and fifth shielding walls, as provided in an embodiment of this application.

[0036] Explanation of reference numerals in the attached figures:

[0037] 1-First shell;

[0038] 11-First shielding cavity;

[0039] 12-First end cap;

[0040] 13-First sidewall;

[0041] 14-First shielding wall;

[0042] 15-Third shielding wall;

[0043] 2-Second shell;

[0044] 21-Second shielding cavity;

[0045] 22-Second end cap;

[0046] 23-Second sidewall;

[0047] 24 - Second shielding wall;

[0048] 25 - Fourth shielding wall;

[0049] 26 - The fifth shielding wall;

[0050] 3-Shielding cover;

[0051] 4-Low-voltage circuit board;

[0052] 41 - First conductive layer;

[0053] 42 - Second conductive layer;

[0054] 43 - Installation area;

[0055] 5-Connectors;

[0056] 6-High voltage filter;

[0057] 7-Signal acquisition device;

[0058] 100-Electric drive system;

[0059] 110 - Power Electronics Integrated Module Assembly.

[0060] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application. Detailed Implementation

[0061] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0062] In the description of this application, unless otherwise expressly specified and limited, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance; unless otherwise specified or explained, the term "multiple" refers to two or more; the terms "connected," "fixed," etc., should be interpreted broadly. For example, "connected" can be a fixed connection, a detachable connection, an integral connection, or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0063] In the description of this specification, it should be understood that the directional terms such as "upper" and "lower" used in the embodiments of this application are used to describe the angles shown in the accompanying drawings and should not be construed as limiting the embodiments of this application. Furthermore, in the context, it should also be understood that when it is mentioned that an element is connected "upper" or "lower" to another element, it can be directly connected to the other element "upper" or "lower," or indirectly connected to the other element "upper" or "lower" through an intermediate element.

[0064] Figure 1 This is a schematic diagram of the structure of the electric drive system provided in the embodiments of this application, such as... Figure 1 As shown, the electric drive system (EDS) 100 of an automobile integrates a power electronics integrated module assembly 110. The power electronics integrated module assembly 110 contains numerous electronic devices, some of which can generate a low-voltage field, while others can generate a high-voltage field. The high-voltage field can include a high-voltage electric field and a high-frequency magnetic field, while the low-voltage field can include a low-voltage electric field and a low-frequency magnetic field. Because the high-voltage and low-voltage fields are close together, the high-voltage field can cause electromagnetic interference to the low-voltage field. In existing technologies, a shielding plate is typically used to isolate the high-voltage and low-voltage fields. However, the shielding plate cannot isolate the electronic components requiring electromagnetic shielding in an independent space, which means that the high-voltage field can still bypass the shielding plate and interfere with the electronic components within the low-voltage field.

[0065] Figure 2 A partial cross-sectional view of the power electronic integrated module provided in the embodiments of this application, as shown below. Figure 2As shown, this application provides a Power Electronics Unit (PEU) assembly, hereinafter referred to as the PEU assembly. This PEU assembly can be integrated into an Electrical Drive System (EDS). EDS has corresponding requirements for Electromagnetic Compatibility (EMC). For example, single EDS products have certain EMC requirements, while dual EDS products have higher EMC requirements. The PEU assembly provided in this application can be applied to both single and dual EDS products. This embodiment illustrates the application of the PEU assembly to a dual EDS product.

[0066] Figure 2 A partial cross-sectional view of the power electronic integrated module assembly provided in the embodiments of this application, as shown below. Figure 2 As shown, the PEU assembly in this embodiment may include a first housing 1, a second housing 2, a shielding cover 3, and a low-voltage circuit board 4. Both the first housing 1 and the second housing 2 may have space for accommodating electronic devices. The first housing 1 and the second housing 2 can be interlocked to form a single assembly, capable of housing various electronic devices within the first housing 1 and the second housing 2. In one embodiment, a high-voltage filter 6 may be provided in the first housing 1. The main function of the high-voltage filter 6 is to remove noise and filter in the high-voltage circuit to ensure the normal and stable operation of the circuit. The low-voltage circuit board 4 may be a printed circuit board (PCB), which may integrate power supply devices, filtering devices, etc., and these devices may be located in the second housing 2.

[0067] Figure 3 A partial structural diagram of the power electronics integrated module assembly provided in the embodiments of this application (hiding the second housing 2), as shown below. Figure 3 As shown, a high-voltage field region B and a low-voltage field region A are located between the first housing 1 and the second housing 2. The low-voltage circuit board 4 can be disposed in the low-voltage field region A, while the high-voltage field region B can house electronic components such as a high-voltage circuit board, bus capacitors, and power transmission lines. For example... Figure 2As shown, the first housing 1 may have a first shielding cavity 11 in the low-voltage field region A, and the first shielding cavity 11 has a first opening. The second housing 2 may have a second shielding cavity 21 in the low-voltage field region A, and the second shielding cavity 21 has a second opening. The shielding cover 3 abuts against the end face of the first shielding cavity 11 with the first opening and can close the first opening. That is, when the shielding cover 3 is connected to the first housing 1, the shielding cover 3 can seal the space inside the first shielding cavity 11, so that electronic devices such as the high-voltage filter 6 inside the first shielding cavity 11 are located in an independent and closed space.

[0068] Figure 4 A plan view of the low-voltage circuit board 4 provided in this embodiment of the application, facing the first housing 1, as shown below. Figure 4 As shown, a first conductive layer 41 is provided on one side of the low-voltage circuit board 4. Figure 5 A plan view of the low-voltage circuit board 4 provided in this embodiment of the application, facing the second housing 2, as shown below. Figure 5 As shown, a second conductive layer 42 is provided on the other side of the low-voltage circuit board 4. Both the first conductive layer 41 and the second conductive layer 42 are made of conductive materials, which can be metallic materials such as copper or aluminum, or conductive non-metallic materials such as graphite or graphene. The side of the shielding cover 3 facing away from the first housing 1 can abut against the first conductive layer 41. Both the shielding cover 3 and the first housing 1 can be made of conductive materials, which can be metallic materials such as copper or aluminum, or conductive non-metallic materials such as graphite or graphene. Therefore, by abutting the shielding cover 3 against the first conductive layer 41, the space formed between the low-voltage circuit board 4, the shielding cover 3, and the first shielding cavity 11 can be effectively considered a closed space, effectively shielding the electromagnetic fields from the external high-voltage field region from interfering with the electronic devices inside the first shielding cavity 11.

[0069] Figure 6 A partial structural diagram of a power electronics integrated module assembly provided in another embodiment of this application (with the second housing 2 hidden), as shown below. Figure 6As shown, the second conductive layer 42 on the low-voltage circuit board 4 abuts against the end face of the second shielding cavity 21 with the second opening, and the low-voltage circuit board 4 is used to close the second opening. That is, after the first housing 1 and the second housing 2 are connected and fixed, the end face of the second shielding cavity 21 can abut against the second conductive layer 42 of the low-voltage circuit board 4. The second housing 2 can also be made of conductive material, which can be the aforementioned metallic material, such as copper layer, aluminum layer, etc., or it can be a conductive non-metallic material, such as graphite, graphene, etc. Thus, an electrical contact can be formed between the end face of the second shielding cavity 21 and the second conductive layer 42, making the space inside the second shielding cavity 21 equivalent to a closed space, which can effectively shield the electromagnetic field of the external high-voltage field region from interfering with the electronic devices inside the second shielding cavity 21.

[0070] Therefore, the power electronic integrated module assembly provided in this application, by forming a first shielding cavity 11 and a second shielding cavity 21 on both sides of the low-voltage circuit board 4, allows the electromagnetic interference-sensitive electronic devices on both sides of the low-voltage circuit board 4 to be placed in the corresponding closed shielding cavities, thereby effectively preventing electromagnetic interference from the electromagnetic field of the high-voltage field region and meeting the high EMC requirements in EDS.

[0071] In one embodiment, such as Figure 4 and Figure 5 As shown, the low-voltage circuit board 4 includes a mounting area 43 for mounting electronic devices, with a first conductive layer 41 and a second conductive layer 42 surrounding the mounting area 43. The mounting area 43 can be used to mount power supply devices, filter devices, and other electronic devices that are sensitive to electromagnetic interference. The first conductive layer 41 and the second conductive layer 42 surround these electromagnetically sensitive devices, thus enclosing them within corresponding first shielding cavities 11 and second shielding cavities 21 when the first housing 1 abuts against the first conductive layer 41 and the second housing 2 abuts against the second conductive layer 42. This effectively prevents electromagnetic interference from external high-voltage fields.

[0072] In one embodiment, Figure 7 for Figure 2 A magnified view of a portion, such as Figure 7As shown, the first housing 1 may include a first end cap 12 and a first sidewall 13. The first sidewall 13 is connected to the first end cap 12, and a first cavity is formed between the first end cap 12 and the first sidewall 13. A first shielding wall 14 is provided on the first end cap 12. A first shielding cavity 11 is formed between the first shielding wall 14, at least a portion of the first end cap 12, and at least a portion of the first sidewall 13. The first shielding cavity 11 is disposed within the first cavity, that is, the volume of the first shielding cavity 11 is smaller than the volume of the first cavity. The first sidewall 13 is connected to the edge of the first end cap 12. Both the first sidewall 13 and the first shielding wall 14 protrude toward the same side of the first end cap 12. The first shielding wall 14 can be L-shaped, arc-shaped, straight, or zigzag-shaped. The first shielding cavity 11, formed between the first sidewall 13 and the first end cap 12, can accommodate electronic devices such as a high-voltage filter 6. Electronic devices, at least some of which can generate a high-voltage field, can also be accommodated within the space inside the first cavity but outside the first shielding cavity 11. In one embodiment, for ease of manufacturing, the first housing 1, including the first sidewall 13, the first end cap 12, and the first shielding wall 14, can be a one-piece molded structure, and all of them can be made of conductive materials. Exemplarily, the first housing 1 can be made of a metallic material, thereby enabling the first shielding cavity 11 to be formed as a metallic cavity, which can effectively provide electromagnetic shielding and prevent the high-voltage field outside the first shielding cavity 11 from causing electromagnetic interference to the electronic devices inside the first shielding cavity 11.

[0073] In one embodiment, such as Figure 7As shown, the second housing 2 includes a second end cap 22 and a second sidewall 23. The second sidewall 23 is connected to the second end cap 22, and a second cavity is formed between the second end cap 22 and the second sidewall 23. A second shielding wall 24 is provided on the second end cap 22. A second shielding cavity 21 is formed between the second shielding wall 24, at least a portion of the second end cap 22, and at least a portion of the second sidewall 23. The second shielding cavity 21 is disposed within the second cavity, and its volume is smaller than that of the second cavity. The second sidewall 23 is connected to the edge of the second end cap 22. Both the second sidewall 23 and the second shielding wall 24 protrude to the same side of the second end cap 22. The second shielding wall 24 can be L-shaped, arc-shaped, straight, or zigzag-shaped. The second shielding cavity 21, formed between the second sidewall 23 and the second end cap 22, can accommodate electronic devices such as a high-voltage filter 6. Electronic devices, at least some of which can generate a high-voltage field, can also be accommodated within the space inside the second cavity but outside the second shielding cavity 21. In one embodiment, for ease of manufacturing, the second housing 2, including the second sidewall 23, the second end cap 22, and the second shielding wall 24, can be a one-piece molded structure, and all of them can be made of conductive materials. Exemplarily, the second housing 2 can be made of metal, thereby enabling the second shielding cavity 21 to be formed as a metal cavity, which can effectively provide electromagnetic shielding and prevent the high-voltage field outside the second shielding cavity 21 from causing electromagnetic interference to the electronic devices inside the second shielding cavity 21.

[0074] In one embodiment, such as Figure 7 As shown, the PEU assembly also includes a connector 5, which passes through the low-voltage circuit board 4 and the shielding cover 3 in sequence and is then fastened to the first housing 1. The connector 5 is electrically connected to the first conductive layer 41 and the second conductive layer 42, respectively. In one embodiment, the connector 5 can be a bolt. Both the low-voltage circuit board 4 and the shielding cover 3 can have through holes. The through holes on the low-voltage circuit board 4 can penetrate the first conductive layer 41 and the second conductive layer 42. The first housing 1 can have threaded holes. The bolt can pass through the through holes on the low-voltage circuit board 4 and the shielding cover 3 in sequence and then be fastened to the threaded holes on the first housing 1 by means of a threaded connection. The bolt can make electrical contact with the first conductive layer 41 and the second conductive layer 42, thereby realizing the electrical connection between the first conductive layer 41 and the second conductive layer 42 and the first housing 1 through the bolt to achieve grounding.

[0075] In one embodiment, a first grounding point is provided on the first housing 1, which can be connected to a nearby floor to achieve grounding. A second grounding point is provided on the second housing 2, which can also be connected to a nearby floor to achieve grounding. The floor can be a portion of a nearby structural component, and the grounding point can be connected to the floor via a metal component; exemplarily, the metal component can be a wire, a metal sheet, etc.

[0076] Figure 8 A partial structural diagram of a power electronics integrated module assembly provided in another embodiment of this application (with the second housing 2 hidden), as shown below. Figure 8 As shown, the PEU assembly also includes a signal acquisition device 7, which can be connected to the first housing 1. The signal acquisition device 7 may include a rotor position sensor, a negative temperature coefficient thermistor (NTC thermistor), and its wiring harness. Located in the low-voltage field region within the first housing 1, if no shielding structure is provided around the signal acquisition device 7, it will be subject to electromagnetic interference from the electromagnetic field of the nearby high-voltage field region.

[0077] Therefore, in this embodiment, Figure 9 A partial enlarged view of the power electronic integrated module assembly provided in the embodiments of this application at the signal acquisition device 7, as shown below. Figure 9 As shown, the first housing 1 may be provided with a third shielding wall 15, which may surround the signal acquisition device 7, thereby separating the signal acquisition device 7 from the nearby high voltage field and effectively shielding the electromagnetic interference of the high voltage field to the signal acquisition device 7.

[0078] In one embodiment, Figure 10 This is a schematic diagram of the structure of the second housing 2 provided in an embodiment of this application, as shown below. Figure 10 As shown, the second housing 2 may be provided with a fourth shielding wall 25 and a fifth shielding wall 26, with a gap G between the fourth shielding wall 25 and the fifth shielding wall 26, and a third shielding wall 15 disposed in the gap G.

[0079] Figure 11 A state diagram showing the insertion of the third shielding wall 15 between the fourth shielding wall 25 and the fifth shielding wall 26, provided in an embodiment of this application, is shown below. Figure 11As shown, in the assembled state of the first housing 1 and the second housing 2, the third shielding wall 15 on the first housing 1 extends towards the second housing 2, and the fourth shielding wall 25 and the fifth shielding wall 26 on the second housing 2 both extend towards the first housing 1. Thus, the third shielding wall 15 can be inserted into the gap G between the fourth shielding wall 25 and the fifth shielding wall 26. There may be a gap between the end of the third shielding wall 15 and the second housing 2, and the fourth shielding wall 25 and the fifth shielding wall 26 can block this gap. Furthermore, there may also be a gap between the fourth shielding wall 25 and the fifth shielding wall 26 and the first housing 1, and the third shielding wall 15 can block the gaps between the fourth shielding wall 25 and the fifth shielding wall 26 and the first housing 1 respectively. Therefore, through the cooperation of the third shielding wall 15, the fourth shielding wall 25, and the fifth shielding wall 26, effective electromagnetic shielding of the signal acquisition device 7 can be achieved. In addition, gaps may exist between the third shielding wall 15 and the fourth shielding wall 25, as well as between the third shielding wall 15 and the fifth shielding wall 26. Thus, the gaps between the third shielding wall 15, the fourth shielding wall 25, and the fifth shielding wall 26 can form a wavy gap, thereby increasing the length of the electromagnetic field crawling path on the surface of the conductive material and effectively reducing electromagnetic interference.

[0080] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A power electronic integrated module assembly, characterized in that, include: A first housing, wherein the first housing is provided with a first shielding cavity, and the first shielding cavity has a first opening; A second housing is fastened to the first housing, and the second housing is provided with a second shielding cavity, the second shielding cavity having a second opening; A shielding cover abuts against the end face of the first shielding cavity on the side with the first opening, and closes the first opening; A low-voltage circuit board, wherein a first conductive layer is provided on one side of the low-voltage circuit board and a second conductive layer is provided on the other side of the low-voltage circuit board; the first conductive layer abuts against the side of the shielding cover opposite to the first housing, the second conductive layer abuts against the end face of the second shielding cavity having the second opening, and the low-voltage circuit board is used to close the second opening.

2. The power electronic integrated module assembly according to claim 1, characterized in that, The first housing includes a first end cap and a first sidewall, the first sidewall being connected to the first end cap around the first end cap, and a first cavity being formed between the first end cap and the first sidewall; The first end cap is provided with a first shielding wall, and the first shielding wall, at least a portion of the first end cap, and at least a portion of the first side wall form a first shielding cavity, which is disposed within the first cavity.

3. The power electronic integrated module assembly according to claim 1, characterized in that, The second housing includes a second end cap and a second sidewall, the second sidewall being connected to the second end cap around the second end cap, and a second cavity being formed between the second end cap and the second sidewall; The second end cap is provided with a second shielding wall, and the second shielding wall, at least a portion of the second end cap and at least a portion of the second side wall form a second shielding cavity, which is disposed within the second cavity.

4. The power electronic integrated module assembly according to claim 1, characterized in that, It also includes a connector that passes through the low-voltage circuit board and the shielding cover in sequence and is then fastened to the first housing; The connector is electrically connected to the first conductive layer and the second conductive layer, respectively.

5. The power electronic integrated module assembly according to claim 1, characterized in that, The first housing is provided with a first grounding point, and the second housing is provided with a second grounding point.

6. The power electronic integrated module assembly according to claim 1, characterized in that, It also includes a signal acquisition device, which is connected to the first housing; The first housing is provided with a third shielding wall, which surrounds the signal acquisition device.

7. The power electronic integrated module assembly according to claim 6, characterized in that, The second housing is provided with a fourth shielding wall and a fifth shielding wall, with a gap between the fourth shielding wall and the fifth shielding wall, and the third shielding wall is disposed in the gap.

8. The power electronic integrated module assembly according to claim 1, characterized in that, The low-voltage circuit board includes a mounting area for mounting electronic devices, and both the first conductive layer and the second conductive layer surround the mounting area.

9. The power electronic integrated module assembly according to any one of claims 1-8, characterized in that, The first housing, the second housing, and the shielding cover are all made of conductive materials.

10. The power electronic integrated module assembly according to any one of claims 1-8, characterized in that, Both the first housing and the second housing are integrally formed structures.

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