Low-cost phased-array antenna general test heat dissipation tool

Abstract

The utility model discloses a low-cost phased-array antenna general test heat dissipation tool, which comprises a heat dissipation assembly, a liquid cooling system, an air cooling assembly and a heat conduction adapter plate, the liquid cooling system is arranged in the heat dissipation assembly, the air cooling assembly and the heat conduction adapter plate are respectively connected with the heat dissipation assembly, and the heat conduction adapter plate is connected with the liquid cooling system. The heat conduction adapter plate is provided with a plurality of adapter holes to be connected with various products, heat of the products is transmitted to the heat dissipation assembly through the heat conduction adapter plate, and the air cooling assembly and / or the liquid cooling system can conduct heat dissipation and cooling on the heat dissipation assembly.

Description

Technical Field

[0001] This utility model relates to the field of antenna heat dissipation technology, and in particular to a low-cost universal test heat dissipation fixture for phased array antennas. Background Art

[0002] With the rapid development of electronic products, the demand for heat dissipation is increasing. To ensure that products operate normally under specified environmental conditions and achieve reliability targets, strict limits must be placed on the temperature rise of each part of the product. For phased array antennas, which have high heat dissipation during operation, thermal control is necessary to ensure normal operation. Most commercially available test fixtures use either liquid cooling or air cooling for heat dissipation. However, these fixtures are not compatible with both liquid and air cooling, requiring a specific test fixture for each product being tested (some products require air-cooled fixtures, others liquid-cooled fixtures). This significantly increases product design and time costs. Utility Model Content

[0003] The purpose of this invention is to at least solve one of the technical problems existing in the prior art and to provide a low-cost universal test heat dissipation fixture for phased array antennas.

[0004] A low-cost universal test heat dissipation fixture for phased array antennas according to an embodiment of the present invention includes a heat dissipation component, a liquid cooling system, an air cooling component, and a thermally conductive adapter plate. The liquid cooling system is disposed in the heat dissipation component. The air cooling component and the thermally conductive adapter plate are respectively connected to the heat dissipation component. The thermally conductive adapter plate is provided with multiple adapter holes to connect various products. The heat of the products is transferred to the heat dissipation component through the thermally conductive adapter plate. The air cooling component and / or the liquid cooling system can dissipate heat and cool the heat dissipation component.

[0005] The low-cost universal test heat dissipation fixture for phased array antennas according to embodiments of this utility model has at least the following beneficial effects: First, since each product has its own different mounting hole positions, a thermally conductive adapter plate is used to ensure the installation requirements of the product under test. The thermally conductive adapter plate has multiple adapter holes to meet the installation and testing needs of various products. Only the corresponding adapter holes need to be added for each product being tested, which simplifies the design and processing and reduces costs. Second, it can be used for separate air cooling or liquid cooling according to the actual power consumption. When using separate air cooling, the liquid cooling system does not need to be turned on. When mainly used in high heat dissipation environments, the liquid cooling system needs to be turned on, and the heat is mainly carried away by the liquid cooling liquid. When the product under test is an ultra-high heat source, the air cooling component and the liquid cooling system can be turned on to work simultaneously to meet the heat dissipation requirements. That is, it is compatible with multiple installation designs. The thermally conductive adapter plate can adapt to the installation and testing needs of different products, saving costs. At the same time, it is compatible with both liquid cooling and liquid cooling, applicable to different heat dissipation products, without the need to match a separate heat dissipation test fixture for each product, saving time and usage costs.

[0006] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0007] The specific embodiments of this utility model will be further described below with reference to the accompanying drawings;

[0008] Figure 1 This is an overall structural diagram of the heat dissipation testing fixture;

[0009] Figure 2 This is a structural diagram of the heat-conducting adapter plate;

[0010] Figure 3 This is a structural diagram of the heat dissipation component;

[0011] Figure 4 This is a structural diagram of a liquid cooling system. DETAILED DESCRIPTION

[0012] This section will describe in detail the specific embodiments of the present utility model. The preferred embodiments of the present utility model are shown in the accompanying drawings. The purpose of the drawings is to supplement the textual description with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the present utility model, but they should not be construed as limiting the scope of protection of the present utility model.

[0013] In the description of this utility model, it should be understood that the directional descriptions, such as up, down, front, back, left, right, etc., indicate the directional or positional relationship based on the directional or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0014] In the description of this utility model, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. If "first" or "second" is used in the description, it is only for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0015] Reference Figures 1 to 4This utility model discloses a low-cost universal test heat dissipation fixture for phased array antennas, comprising a heat dissipation component, a liquid cooling system, an air cooling component 100, and a thermally conductive adapter plate 10. The liquid cooling system is disposed within the heat dissipation component. The air cooling component 100 and the thermally conductive adapter plate 10 are respectively connected to the heat dissipation component. The thermally conductive adapter plate 10 has multiple adapter holes 11 for connecting various products 20 and solder holes 12 for connecting the heat dissipation component. The air cooling component 100 includes a fan disposed on the side of a metal plate 21. The heat from the product 20 is transferred to the heat dissipation component through the thermally conductive adapter plate 10, and the air cooling component 100 and / or the liquid cooling system can dissipate heat and cool the heat dissipation component. Firstly, since each product 20 has its own different mounting hole positions, a thermally conductive adapter plate 10 is used to ensure the installation requirements of the product under test. The thermally conductive adapter plate 10 has multiple adapter holes 11 to meet the installation and testing of various products. Only the corresponding adapter hole 11 needs to be added for each product being tested, which simplifies the design and processing and reduces costs. Secondly, it can be cooled by air or liquid cooling separately depending on the actual power consumption. When using air cooling alone, the liquid cooling system does not need to be turned on. When mainly used in high-heat-dissipation environments, the liquid cooling system needs to be turned on, and heat is mainly carried away by the liquid coolant. When the product under test is an extremely high heat source, both the air cooling component 100 and the liquid cooling system can be turned on simultaneously to meet the heat dissipation requirements. It is compatible with various installation designs, and the thermal adapter plate 10 can adapt to the installation and testing needs of different products, saving costs. It is also compatible with both liquid cooling and liquid cooling systems, suitable for products with different heat dissipation requirements, eliminating the need to match each product with a separate heat dissipation test fixture, saving time and operating costs.

[0016] The heat dissipation component includes a metal plate 21 and heat dissipation fins 22 disposed on the metal plate 21. The bottom of the metal plate 21 is connected to the heat conduction adapter plate 10. The heat of the product is transferred to the metal plate 21 and the heat dissipation fins 22 through the heat conduction adapter plate 10, resulting in good heat dissipation effect.

[0017] like Figure 3 and Figure 4 The liquid cooling system includes a liquid cooling channel, an inlet 31, and an outlet 32, all respectively disposed on a metal plate 21. Preferably, it also includes a sealing plate 30. The metal plate 21 has a groove 33, and the sealing plate 30 is used to seal the opening of the groove 33. The inlet and outlet are located on the sides of the sealing plate 30 to communicate with the groove 33. The groove 33 forms a liquid cooling channel, and a sealing strip 34 is provided on the edge of the groove 33 to abut against the sealing plate 30. This liquid cooling channel can be machined into the metal plate 21 using only simple machining methods. The sealing structure is simple, meets the sealing requirements, and the process is simple with a short processing cycle, saving the high costs of other processing techniques (such as vacuum welding, friction stir welding, etc.).

[0018] It will be readily understood by those skilled in the art that the above preferred methods can be freely combined and superimposed without conflict.

[0019] The above are merely preferred embodiments of this utility model and do not limit the patent scope of this utility model. Any equivalent structural transformations made based on the inventive concept of this utility model and the contents of this utility model specification and drawings, or direct or indirect applications in other related technical fields, are included within the patent protection scope of this utility model.

Claims

1. A low-cost universal test heat dissipation fixture for phased array antennas, characterized in that, include: The heat dissipation assembly includes a liquid cooling system, an air cooling assembly (100), and a heat-conducting adapter plate (10). The liquid cooling system is disposed in the heat dissipation assembly. The air cooling assembly (100) and the heat-conducting adapter plate (10) are respectively connected to the heat dissipation assembly. The heat-conducting adapter plate (10) is provided with multiple adapter holes (11) to connect various products (20). The heat of the product (20) is transferred to the heat dissipation assembly through the heat-conducting adapter plate (10). The air cooling assembly (100) and / or the liquid cooling system can dissipate heat and cool the heat dissipation assembly.

2. The low-cost universal test heat dissipation fixture for phased array antennas according to claim 1, characterized in that: The heat dissipation assembly includes a metal plate (21) and heat dissipation fins (22) disposed on the metal plate (21).

3. The low-cost universal test heat dissipation fixture for phased array antennas according to claim 2, characterized in that: The liquid cooling system includes a liquid cooling channel, an inlet (31), and an outlet (32) respectively disposed on the metal plate (21).

4. The low-cost universal test heat dissipation fixture for phased array antennas according to claim 3, characterized in that: Includes a sealing plate (30), the metal plate (21) is provided with a groove (33), the sealing plate (30) is used to seal the opening of the groove (33), the water inlet (31) and the water outlet (32) are respectively located on the side of the sealing plate (30) to communicate with the groove (33), and the groove (33) forms the liquid cooling channel.

5. The low-cost universal test heat dissipation fixture for phased array antennas according to claim 4, characterized in that: The edge of the groove (33) is provided with a sealing strip (34) to abut against the sealing plate (30).

6. The low-cost universal test heat dissipation fixture for phased array antennas according to claim 2, characterized in that: The air-cooled assembly (100) includes a fan disposed on the side of the metal plate (21).

Images