Heat dissipation device and display module

Abstract

The utility model discloses a heat dissipation device and a display module, a heat dissipation plate is arranged on a non-display surface of a display panel, a plurality of open holes are formed in the heat dissipation plate, and the open holes are filled with a bonding layer, so that on one hand, the bonding layer can fix the heat dissipation plate on the non-display surface of the display panel, and on the other hand, the heat dissipation plate can be fixed on the non-display surface of the display panel; on the other hand, one part of the non-display surface of the display panel can be in direct contact with the heat dissipation plate, it is guaranteed that heat generated by the display panel can be better conducted to the outside through the heat dissipation plate, and therefore the heat dissipation performance of the display module is improved; in this way, the supporting plate can be fixed to the non-display face of the display panel through the bonding layer, foam rubber does not need to be additionally arranged for fixing the supporting plate and the display panel when the supporting plate is arranged, and therefore the manufacturing cost of the display module can be reduced.

Description

Technical Field

[0001] This application relates to the field of display technology, specifically to a heat dissipation device and a display module. Background Technology

[0002] OLED (Organic Light-Emitting Diode) display modules generate heat when emitting light. To address this, a heatsink is placed on the back of the display panel to transfer the heat to the outside. However, because the heatsink is not in direct contact with the display panel, the actual heat dissipation performance of the OLED module is reduced. Furthermore, assembling the display panel and support plate requires additional foam adhesive to secure the heatsink, increasing the manufacturing cost of the OLED module. Utility Model Content

[0003] The embodiments of this application provide a heat dissipation device and a display module, which can improve the heat dissipation performance of the display module.

[0004] In a first aspect, embodiments of this application provide a heat dissipation device, comprising:

[0005] A heat sink, wherein the heat sink is provided with multiple openings;

[0006] An adhesive layer that fills the opening.

[0007] Furthermore, at least one main surface of the heat sink is provided with a plurality of first protrusions, and the adhesive layer fills the space formed by the plurality of first protrusions.

[0008] Secondly, embodiments of this application provide a display module, including:

[0009] Display panel;

[0010] A heat sink is disposed on the non-display surface of the display panel, and the heat sink has multiple openings.

[0011] An adhesive layer is disposed on the non-display surface of the display panel and fills the opening;

[0012] A support plate is disposed on a surface of the heat sink away from the display panel, and the support plate is fixed to the adhesive layer.

[0013] Furthermore, at least one main surface of the heat sink is provided with a plurality of first protrusions, and the adhesive layer fills the space formed by the plurality of first protrusions.

[0014] Furthermore, the first protrusion is disposed on the side of the heat sink near the display panel, and the top surface of the first protrusion away from the heat sink is in direct contact with the non-display surface of the display panel.

[0015] Furthermore, the first protrusion is disposed around the edge of the opening, and the first protrusion and the heat sink are integrally formed.

[0016] Furthermore, the heat sink has a plurality of first recesses on the side of the heat sink near the display panel, the adhesive layer is further filled in the first recesses, and the top surface of the adhesive layer located in the first recesses is fixed to the non-display surface of the display panel.

[0017] Furthermore, the surface of the heat sink away from the display panel is flush with the surface of the adhesive layer away from the display panel, and the surface of the heat sink away from the display panel is in direct contact with the support plate.

[0018] Furthermore, the diameter of the opening is 1mm-2mm.

[0019] Furthermore, the spacing between two adjacent openings is 5mm-10mm.

[0020] The beneficial effects of this application are:

[0021] This application provides a heat dissipation device. By providing multiple openings on the heat dissipation plate and filling the openings with an adhesive layer, when the heat dissipation plate is placed on the non-display surface of the display panel, on the one hand, the adhesive layer can fix the heat dissipation plate to the non-display surface of the display panel, and on the other hand, a part of the non-display surface of the display panel can directly contact the heat dissipation plate, ensuring that the heat generated by the display panel connected to the heat dissipation device can be better conducted to the outside through the heat dissipation plate, thereby improving the heat dissipation performance of the display module.

[0022] This application provides a display module in which a heat sink is disposed on the non-display surface of the display panel, and multiple openings are provided on the heat sink. An adhesive layer is filled in the openings. On the one hand, the adhesive layer can fix the heat sink to the non-display surface of the display panel. On the other hand, a portion of the non-display surface of the display panel can directly contact the heat sink, ensuring that the heat generated by the display panel can be better conducted to the outside through the heat sink, thereby improving the heat dissipation performance of the display module. Furthermore, since the adhesive layer is filled in the openings, the support plate can also be fixed to the non-display surface of the display panel through the adhesive layer. Therefore, when setting the support plate, there is no need to use additional foam adhesive to fix the support plate to the display panel, thereby reducing the manufacturing cost of the display module. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of a traditional display module;

[0024] Figure 2 This is a top view of the display module in this application;

[0025] Figure 3 This is a cross-sectional view of the module shown in Figure 2 at point AA′;

[0026] Figure 4 This is a schematic diagram of the structure of the first type of heat sink in the display module of this application;

[0027] Figure 5 This is a schematic diagram of the structure of the second type of heat sink for the display module in this application;

[0028] Figure 6 This is a schematic diagram showing the first release protection layer and the second release protection layer provided on the heat dissipation device of the display module in this application.

[0029] 100 - Display panel; 200 - Heat sink; 210 - Opening; 220 - First protrusion; 230 - First recess; 300 - Adhesive layer; 400 - Support plate; 410 - Second protrusion; 420 - Second recess; 500 - First release liner; 600 - Second release liner.

[0030] 10-Display panel; 20-Adhesive layer; 30-Heat dissipation plate; 40-Foam adhesive; 50-Support plate. Detailed Implementation

[0031] The technical solutions in the embodiments of this application will now be described with reference to the accompanying drawings. The technical solutions described below are for illustrative purposes only and should not be construed as limiting the scope of protection of this application.

[0032] Furthermore, the terms "first," "second," and similar words do not indicate any order, quantity, or importance, but are merely used to distinguish different technical features. The terms "multiple" and similar words indicate two or more unless otherwise expressly specified.

[0033] OLED display modules generate heat when emitting light, see reference. Figure 1To address the heat dissipation issue of the display panel 10, a heat sink 30 is provided on the back of the display panel 10. The heat sink 30 can transfer the heat generated by the display panel 10 to the outside. Since the heat sink 30 of the OLED display module is fixed by the adhesive layer 20, the heat sink 30 of the OLED display module is not in direct contact with the display panel 10, resulting in a reduction in the actual heat dissipation performance of the OLED display module. At the same time, when assembling the display panel 10 of the OLED display module with the support plate 50, additional foam adhesive 40 needs to be applied to fix the heat sink 30 to the support plate 50, which increases the manufacturing cost of the OLED display module.

[0034] The first embodiment of this application provides a heat dissipation device, referencing... Figure 6 The heat dissipation device includes a heat dissipation plate 200 and an adhesive layer 300. The heat dissipation plate 200 has a plurality of openings 210, and the adhesive layer 300 fills the openings 210.

[0035] By providing multiple openings on the heat sink plate and filling the openings 210 with the adhesive layer 300, when the heat sink plate 200 is placed on the non-display surface of the display panel, on the one hand, the adhesive layer 300 can fix the heat sink plate 200 to the non-display surface of the display panel, and on the other hand, a part of the non-display surface of the display panel can directly contact the heat sink plate 200, ensuring that the heat generated by the display panel connected to the heat dissipation device can be better conducted to the outside through the heat sink plate 200, thereby improving the heat dissipation performance of the display module.

[0036] In this embodiment, a plurality of first protrusions 220 are provided on at least one main surface of the heat sink 200, and the adhesive layer 300 fills the space formed by the plurality of first protrusions 220. By providing the first protrusions 220, the area of ​​the heat sink 200 can be increased, so that the heat generated by the display panel 100 can be more effectively transferred to the outside, thereby improving the heat dissipation performance of the display module.

[0037] In this embodiment, a plurality of first protrusions 220 are provided on one of the main surfaces of the heat sink 200.

[0038] In this embodiment, a plurality of first protrusions 220 are provided on two main surfaces of the heat sink 200, and the two main surfaces of the two heat sinks 200 are opposite to each other.

[0039] In this embodiment, reference Figure 6The heat dissipation device also includes a first release layer 500 and a second release layer 600. The first release layer 500 is disposed on the surface of the adhesive layer 300 near the display panel 100, and the second release layer 600 is disposed on the surface of the adhesive layer 300 away from the display panel 100. When installing the heat dissipation device on the display panel 100, the first release layer 500 is first peeled off, and then the non-display surface of the display panel 100 is fixed to the adhesive layer 300 of the heat dissipation device. When installing the support plate 400, the second release layer 600 is first peeled off, and then the support plate 400 is fixed to the adhesive layer 300 of the heat dissipation device.

[0040] Embodiments of this application provide a display module, referencing Figure 2 and Figure 3 The display module includes a display panel 100, a heat sink 200, an adhesive layer 300, and a support plate 400.

[0041] Specifically, the heat sink 200 is disposed on the non-display surface of the display panel 100, and the heat sink 200 is provided with a plurality of openings 210; the adhesive layer 300 is disposed on the non-display surface of the display panel 100, and the adhesive layer 300 fills the openings 210; the support plate 400 is disposed on a surface of the heat sink 200 away from the display panel 100, and the support plate 400 is fixed to the adhesive layer 300.

[0042] By placing the heat sink 200 on the non-display surface of the display panel 100 and providing multiple openings 210 on the heat sink 200, with the adhesive layer 300 filling the openings 210, the adhesive layer 300 can fix the heat sink 200 to the non-display surface of the display panel 100. Furthermore, it allows a portion of the non-display surface of the display panel 100 to directly contact the heat sink 200, ensuring that the heat generated by the display panel 100 can be better conducted to the outside through the heat sink 200, thereby improving the heat dissipation performance of the display module. Additionally, since the adhesive layer 300 fills the openings 210, the support plate 400 can also be fixed to the non-display surface of the display panel 100 through the adhesive layer 300. Therefore, when setting the support plate 400, there is no need to additionally use foam adhesive to fix the support plate 400 to the display panel 100, thus reducing the manufacturing cost of the display module.

[0043] In this embodiment, the display panel 100 is an OLED (Organic Light-Emitting Diode) display panel 100.

[0044] In this embodiment, the display panel 100 is a Micro LED display panel 100 or a Mini LED display panel 100.

[0045] In this embodiment, the heat sink 200 is made of at least one of copper, aluminum, silver, nickel, and iron.

[0046] In this embodiment, the adhesive layer 300 is made of PSA (Pressure Sensitive Adhesive) adhesive.

[0047] In this embodiment, the spacing between two adjacent openings 210 is 5mm-10mm. By setting the spacing between two adjacent openings 210 to 5mm-10mm, it can prevent the material of the heat sink 200 from easily deforming during the opening process due to an excessively small spacing, thus increasing the manufacturing difficulty of the heat sink 200. On the other hand, it can avoid the reduced density of the openings 210 due to an excessively large spacing, which would reduce the adhesion between the heat sink 200 and the support plate 400. Specifically, the distance between two adjacent openings 210 is 5mm, 5.5mm, 6.0mm, 6.5mm, 7.0mm, 7.5mm, 8.0mm, 8.5mm, 9.0mm, 9.5mm, and 10.0mm.

[0048] In this embodiment, the diameter of the opening 210 is 1mm-2mm. By setting the diameter of the opening 210 to 1mm-2mm, on the one hand, it avoids the increased difficulty in manufacturing the heat sink 200 due to the opening diameter being too small, and on the other hand, it avoids the reduced heat dissipation area of ​​the heat sink 200 due to the opening diameter being too large, thus reducing the heat dissipation performance of the display module. Specifically, the diameter of the opening 210 is 1.0mm, 1.2mm, 1.4mm, 1.5mm, 1.6mm, 1.7mm, 1.8mm, 1.85mm, 1.9mm, and 2.0mm.

[0049] In this embodiment, reference Figure 4 A plurality of first protrusions 220 are provided on at least one main surface of the heat sink 200, and the adhesive layer 300 fills the space formed by the plurality of first protrusions 220. By providing the first protrusions 220, the area of ​​the heat sink 200 can be increased, so that the heat generated by the display panel 100 can be more effectively transferred to the outside, thereby improving the heat dissipation performance of the display module.

[0050] In this embodiment, a plurality of first protrusions 220 are provided on one of the main surfaces of the heat sink 200.

[0051] In this embodiment, a plurality of first protrusions 220 are provided on two main surfaces of the heat sink 200, and the two main surfaces of the two heat sinks 200 are opposite to each other.

[0052] In this embodiment, the first protrusion 220 is disposed on the side of the heat sink 200 near the display panel, and the top surface of the first protrusion 220 facing away from the heat sink 200 is in direct contact with the non-display surface of the display panel 100. By setting the top surface of the first protrusion 220 to be in direct contact with the non-display surface of the display panel 100, the heat generated by the display panel 100 can be directly transferred to the first protrusion 220. Compared with the traditional solution where the heat sink 200 is not in direct contact with the display panel 100, this reduces the number of heat transfer steps and the thermal resistance of the adhesive layer 300, thereby further improving the heat dissipation efficiency of the display module.

[0053] In this embodiment, the distance between the top surface of the first protrusion 220 and the bottom surface of the first protrusion 220 is 0.1 mm.

[0054] In this embodiment, the first protrusion 220 is arranged around the edge of the opening 210, and the first protrusion 220 and the heat sink 200 are an integral structure.

[0055] In this embodiment, the width of the first protrusion 220 on the side closer to the display panel 100 is equal to the width of the first protrusion 220 on the side farther from the display panel 100.

[0056] In this embodiment, the width of the first protrusion 220 on the side closer to the display panel 100 is greater than the width of the first protrusion 220 on the side farther from the display panel 100. By setting the width on the side closer to the display panel 100 to be greater than the width on the side of the first protrusion 220 farther from the display panel 100, the contact area between the protrusion and the display panel 100 can be increased, thereby further improving the heat dissipation efficiency of the display module.

[0057] In this embodiment, the first protrusion 220 includes a plurality of first sub-protrusions. Specifically, the number of first sub-protrusions is 2, 4, 5, 6, 7, 8, 9, or 10.

[0058] In this embodiment, a plurality of first sub-protrusions are arranged around the opening 210, and the plurality of first sub-protrusions are located at the edge of the opening 210.

[0059] In this embodiment, reference Figure 5 In the top view of the display module, the sum of the lengths of the edges of the multiple first sub-protrusions is equal to the length of the edge of the opening 210. Specifically, the sidewalls of the multiple first sub-protrusions are connected.

[0060] In this embodiment, in the top view of the display module, the sum of the lengths of the edges of the plurality of first sub-protrusions is less than the length of the edge of the opening 210.

[0061] In this embodiment, the surface of the heat sink 200 near the display panel 100 is provided with a plurality of first recesses 230, and the adhesive layer 300 is further filled in the first recesses 230, and the top surface of the adhesive layer 300 located in the first recesses 230 is fixed to the non-display surface of the display panel 100. By providing a plurality of first recesses 230 on the surface of the heat sink 200 near the display panel 100, and by providing a portion of the adhesive layer 300 to fill the first recesses 230, the adhesive layer 300 can contact the sidewall of the first protrusion 220, increasing the contact area between the adhesive layer 300 and the heat sink 200, thereby improving the stability of the connection between the heat sink 200 and the display panel 100.

[0062] In this embodiment, the space enclosed by the first recess 230 is the same as the space enclosed by the first protrusion 220.

[0063] In this embodiment, the space enclosed by the first recess 230 is different from the space enclosed by the first protrusion 220.

[0064] In this embodiment, the second recess 420 is the area enclosed by the first protrusion 220 at the edge of the opening 210 and the heat sink 200.

[0065] In this embodiment, the first protrusion 220 is perpendicular to the display panel 100 in the thickness direction Y of the display module.

[0066] In this embodiment, the size of the opening on the side of the first recess 230 near the display panel 100 is equal to the size of the opening on the side of the first recess 230 away from the display panel 100.

[0067] In this embodiment, the size of the opening on the side of the first recess 230 closer to the display panel 100 is larger than the size of the opening on the side of the first recess 230 farther from the display panel 100.

[0068] In this embodiment, the size of the opening of the first recess 230 on the side closer to the display panel 100 is smaller than the size of the opening of the first recess 230 on the side farther away from the display panel 100.

[0069] In this embodiment, a plurality of second protrusions 410 are provided on the surface of the support plate 400 near the heat sink 200, and the top surface of the second protrusions 410 contacts the bottom surface of the heat sink 200.

[0070] In this embodiment, a plurality of second recesses 420 are provided on the surface of the support plate 400 near the heat sink 200, and a portion of the adhesive layer 300 is filled in the second recesses 420. By providing the second recesses 420, a height difference is formed between the second recesses 420 and the second protrusions 410, thereby ensuring that the adhesive layer 300 can be fixed to the second recesses 420 of the support plate 400, so as to achieve the connection and fixation between the support plate 400 and the adhesive layer 300.

[0071] In this embodiment, the second recess 420 is located between two adjacent second protrusions 410. The second recess 420 is located between two adjacent second protrusions 410, that is, the second recess 420 is the area formed between two adjacent second protrusions 410, so that the second recess 420 does not need to be set by additional processes, reducing the difficulty of manufacturing the support plate 400 of the display module.

[0072] In this embodiment, in the top view of the display module, the edge of the opening 210 is located within the second recess 420, and the area of ​​the opening 210 is smaller than the area of ​​the second recess 420. By setting the edge of the opening 210 to be located within the second recess 420 and the area of ​​the opening 210 to be smaller than the area of ​​the second recess 420, the contact area between the adhesive layer 300 and the second recess 420 can be increased, thereby increasing the stability of the connection between the adhesive layer 300 and the support plate 400.

[0073] In this embodiment, in the top view of the display module, the edge of the opening 210 is located inside the second recess 420, and the area of ​​the opening 210 is equal to the area of ​​the second recess 420.

[0074] In this embodiment, the surface of the heat sink away from the display panel is flush with the surface of the adhesive layer away from the display panel, and the surface of the heat sink away from the display panel is in direct contact with the support plate.

[0075] The specific implementation plan of this application is as follows:

[0076] In traditional solutions, the display panel of an OLED display module generates heat when emitting light. To address this heat dissipation issue, a heat sink is placed on the back of the display panel to transfer the heat to the outside. However, because the heat sink is fixed to the OLED display module via an adhesive layer, it doesn't directly contact the display panel, resulting in reduced actual heat dissipation performance. Furthermore, after receiving the display panel, the OEM needs to use foam adhesive to attach it to the OLED display module's support plate to assemble the complete device. This foam adhesive increases the manufacturing cost of the OLED display module.

[0077] Therefore, this application provides a display module in which a heat sink 200 is disposed on the non-display surface of the display panel 100, and multiple openings 210 are provided on the heat sink 200. An adhesive layer 300 is bonded to the heat sink 200 through a single coating process, allowing the adhesive layer 300 to fill the openings 210. This results in adhesive layers 300 on both sides of the heat sink 200. On one hand, the adhesive layers 300 can fix the heat sink 200 to the non-display surface of the display panel 100; on the other hand, the non-display surface of the display panel 100 is protected. A portion of the display panel 100 can directly contact the heat sink 200, ensuring that the heat generated by the display panel 100 can be better conducted to the outside through the heat sink 200, thereby improving the heat dissipation performance of the display module. Furthermore, since the adhesive layer 300 fills the opening 210, the support plate 400 can also be fixed to the non-display surface of the display panel 100 through the adhesive layer 300. Therefore, when setting the support plate 400, there is no need to set additional foam adhesive to fix the support plate 400 to the display panel 100, thereby reducing the manufacturing cost of the display module.

[0078] The specific embodiments of this application have been described in detail above. The embodiments disclosed above are merely preferred embodiments of this application. Those skilled in the art can make many modifications and improvements without departing from the concept of this application. All such modifications and improvements fall within the scope of protection defined by the claims of this application.

Claims

1. A heat dissipation device, characterized in that, include: A heat sink plate, wherein the heat sink plate is provided with a plurality of openings, and a plurality of first protrusions protruding from at least one main surface of the heat sink plate, and an adhesive layer fills the space formed by the plurality of first protrusions. An adhesive layer that fills the opening.

2. A display module, characterized in that, The display panel and a heat dissipation device are included. The heat dissipation device is located on the non-display surface of the display panel and includes: A heat sink is disposed on the non-display surface of the display panel. The heat sink has multiple openings and multiple first protrusions protruding from at least one main surface of the heat sink. An adhesive layer fills the space formed by the multiple first protrusions. An adhesive layer is disposed on the non-display surface of the display panel and fills the opening; A support plate is disposed on a surface of the heat sink away from the display panel, and the support plate is fixed to the adhesive layer.

3. The display module according to claim 2, characterized in that, The first protrusion is disposed on the side of the heat sink near the display panel, and the first protrusion is away from the top surface of the heat sink and in direct contact with the non-display surface of the display panel.

4. The display module according to claim 2, characterized in that, The first protrusion is disposed around the edge of the opening, and the first protrusion and the heat sink are integrally formed.

5. The display module according to claim 2, characterized in that, The heat sink has a plurality of first recesses on the side of the heat sink near the display panel. The adhesive layer further fills the first recesses, and the top surface of the adhesive layer located in the first recesses is fixed to the non-display surface of the display panel.

6. The display module according to claim 2, characterized in that, The surface of the heat sink away from the display panel is flush with the surface of the adhesive layer away from the display panel, and the surface of the heat sink away from the display panel is in direct contact with the support plate.

7. The display module according to claim 2, characterized in that, The diameter of the opening is 1mm-2mm.

8. The display module according to claim 3, characterized in that, The spacing between two adjacent openings is 5mm-10mm.

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