Heat dissipation device for high-end equipment in machine room

Abstract

The utility model discloses a heat dissipation device for high-end equipment in a machine room. The heat dissipation device comprises a bottom plate; a plurality of brackets are arranged in a gap between two adjacent bottom plates, and each bracket is arranged in a slide way on the side edge of the two adjacent bottom plates in a sliding manner; two to four heat exchange parts are arranged on each support from top to bottom, the height of each heat exchange part is adjustable, and every two adjacent heat exchange parts located on the same support communicate with each other through a first heat exchange pipeline. Wherein the lowest heat exchange component on each support is communicated with a first main pipeline, the uppermost heat exchange component on each support is communicated with a second main pipeline through a first pipeline, and the first main pipeline and the second main pipeline are arranged below the bottom plate and connected to the two ends of the heat dissipation box respectively. And a liquid pump is arranged on the first main pipeline. According to the device, high-end equipment in the machine room can be conveniently cooled, and the position of the heat exchange component can be adjusted according to needs.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation in computer rooms. More specifically, this utility model relates to a heat dissipation device for high-end equipment in computer rooms. Background Technology

[0002] Large-scale IT servers, storage devices, and electrical equipment are often centrally located in server rooms, generating significant heat during long-term operation. If this heat cannot dissipate, it can affect equipment efficiency or even damage components, leading to serious consequences. Current technology often employs ventilation fans on the server room walls to exchange air and cool the interior, or air conditioning. However, since all IT cabinets and electrical cabinets require heat dissipation, the temperature inside the server room rises considerably after these devices expel heat through their internal cooling components. Using only ventilation fans or air conditioning is inefficient, failing to dissipate heat effectively and consuming large amounts of electricity. Furthermore, different devices generate varying amounts of heat, leading to excessively high temperatures around high-heat-generating equipment, making it impractical to configure ventilation fans or air conditioning solely for these high-heat-generating devices. Summary of the Invention

[0003] This utility model provides a heat dissipation device for high-end equipment in a computer room, which can conveniently dissipate heat from high-end equipment inside the computer room, and the position of the heat exchange components can be adjusted as needed.

[0004] To achieve these objectives and other advantages of this utility model, this utility model provides a heat dissipation device for high-end equipment in a computer room, comprising:

[0005] The base plate has multiple horizontally arranged side by side, with gaps between adjacent base plates and a slide rail on the side of each of the two opposite base plates. High-end equipment is installed above the base plate.

[0006] The support has multiple supports installed in the gap between two adjacent base plates. Each support is slidably installed in a slide rail on the side of the two adjacent base plates. Each support has 2 to 4 heat exchange components installed from top to bottom. The height of each heat exchange component is adjustable. Adjacent heat exchange components on the same support are connected by a first heat exchange pipe.

[0007] Each support has a heat exchange component at the bottom connected to a first main pipe, and a heat exchange component at the top connected to a second main pipe via a first pipe. The first and second main pipes are located below the base plate and are respectively connected to the two ends of a heat sink. A liquid pump is installed on the first main pipe.

[0008] Preferably, in the aforementioned high-end equipment heat dissipation device for the computer room, each of the brackets includes:

[0009] Two vertical rods are arranged sequentially along the longitudinal axis of the base plate. Two to four adjusting bolts are arranged at intervals on each of the two vertical rods. A heat exchange component is fixedly arranged between the two vertical rods located above the two adjusting bolts at the same height.

[0010] The slider is slidably disposed in the slide rails on the sides of two adjacent base plates, and two vertical rods are fixedly disposed on the top of the slider.

[0011] Preferably, in the aforementioned high-end equipment heat dissipation device for the computer room, the slide is a groove with a cross-section of ┠, and both ends of the slider are provided with protrusions that are adapted to the slide. The protrusions are engaged in the groove so that the slider can slide forward or backward along the longitudinal axis of the base plate, and the surfaces of the groove and the protrusions are both smooth surfaces.

[0012] Preferably, the heat dissipation device for high-end equipment in the computer room further includes a fixing plate, which is fixedly disposed above the slider and located between two opposing vertical rods. A through hole is provided on both the slider and the fixing plate, and a second pipe is disposed in the through hole. One end of the second pipe is connected to the heat exchange component at the bottom of the bracket, and the other end is connected to the first main pipe.

[0013] Preferably, in the heat dissipation device for high-end equipment in the computer room, the heat exchange component is a second heat exchange pipe arranged in an S-shape, and the second heat exchange pipe is connected to the first heat exchange pipe.

[0014] Preferably, in the heat dissipation device for high-end equipment in the computer room, the adjusting bolt is a double-ended bolt, and the upper and lower rods of each adjusting bolt are provided with threads that are compatible with the adjusting bolt. The height of the heat exchange component can be adjusted by rotating the adjusting bolt.

[0015] Preferably, in the high-end equipment heat dissipation device for the computer room, the heat dissipation box is located outside the computer room, and the first main pipe and the second main pipe pass through the wall of the computer room and are connected to the heat dissipation box.

[0016] Preferably, in the heat dissipation device for high-end equipment in the computer room, one end of the first heat exchange pipe is connected to the outlet of the lower heat exchange component, and the other end is connected to the inlet of the upper heat exchange component, with the outlet of the lower heat exchange component and the inlet of the upper heat exchange component located on the same side.

[0017] Preferably, the heat dissipation device for high-end equipment in the computer room is provided with a third pipe between two adjacent supports in the same gap. One end of the third pipe is connected to the outlet of the uppermost heat exchange component on one of the supports, and the other end is connected to the inlet of the uppermost heat exchange component on the other support. The outlet of the uppermost heat exchange component on the end support is connected to the first pipe.

[0018] Preferably, the heat dissipation device for high-end equipment in the computer room further includes a heat insulation pipe, which is vertically fixed on the base plate. The first pipe is disposed inside the heat insulation pipe and passes through the base plate to connect with the second main pipe.

[0019] This utility model has at least the following beneficial effects:

[0020] The presence of a base plate facilitates the placement of high-end equipment above it, while the first and second main heat exchange pipes are positioned below. Multiple base plates are arranged horizontally side-by-side, with gaps between adjacent plates and a sliding track on the side of each plate. Supports are slidably positioned within these tracks, allowing for easy adjustment of their position. Each support has 2-4 heat exchange components arranged from top to bottom, each with an adjustable height. This design allows for convenient height adjustment of the heat exchange components. Therefore, this invention allows for adjusting the support position based on the heat output of the equipment on the base plate, positioning it near equipment with high heat output, and adjusting the height of the heat exchange components according to the height of the heat source. Furthermore, the gaps between the supports and heat exchange components facilitate the passage of connecting cables between the equipment.

[0021] Other advantages, objectives and features of the present invention will be reflected in part through the following description, and in part will be understood by those skilled in the art through research and practice of the present invention. Attached Figure Description

[0022] Figure 1 This is a side view of the heat dissipation device for high-end equipment in a computer room according to this utility model.

[0023] Figure 2 This is a schematic cross-sectional view of the slide rail in the high-end equipment heat dissipation device for computer rooms of this utility model;

[0024] Figure 3 This is a cross-sectional schematic diagram of the slide and slider in the heat dissipation device for high-end equipment in the computer room according to this utility model. Detailed Implementation

[0025] The present invention will now be described in further detail with reference to the accompanying drawings, so that those skilled in the art can implement it based on the description.

[0026] It should be understood that terms such as “having,” “comprising,” and “including” as used herein do not exclude the presence or addition of one or more other elements or combinations thereof.

[0027] It should be noted that, unless otherwise specified, the experimental methods described in the following embodiments are conventional methods, and the reagents and materials described are commercially available. In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "setting" should be interpreted broadly. For example, they can refer to fixed connection or setting, detachable connection or setting, or integral connection or setting. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances. The terms "lateral," "longitudinal," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0028] like Figures 1-3As shown, this utility model embodiment provides a heat dissipation device for high-end equipment in a computer room, including: a base plate 1, on which multiple base plates 1 are arranged horizontally side by side, with gaps between adjacent base plates 1 and a slide rail 16 provided on the side of each of the two opposing base plates 1, wherein high-end equipment is arranged above the base plate 1; a bracket 2, in which multiple brackets 2 are arranged in the gaps between adjacent base plates 1, each bracket 2 being slidably arranged in the slide rail 16 on the side of the two adjacent base plates 1; wherein, on each bracket 2, 2 to 4 heat exchange components 4 are arranged from top to bottom, and the height of each heat exchange component 4 is adjustable, and adjacent heat exchange components 4 on the same bracket 2 are connected by a slide rail 16. A heat exchange pipe 5 is connected to the first heat exchange pipe 5. The heat exchange component 4 is a second heat exchange pipe arranged in an S-shape. The second heat exchange pipe is connected to the first heat exchange pipe 5. The lowest heat exchange component 4 on each support 2 is connected to a first main pipe 7. The highest heat exchange component 4 on each support 2 is connected to a second main pipe 15 through a first pipe 14. The first main pipe 7 and the second main pipe 15 are located below the base plate 1 and are respectively connected to the two ends of a heat dissipation box. A liquid pump is installed on the first main pipe 7. The heat dissipation box is located outside the machine room. The first main pipe 7 and the second main pipe 15 pass through the wall of the machine room and are connected to the heat dissipation box.

[0029] In the above embodiment, the base plate 1 is a rectangular plate with its length along the longitudinal axis. Support columns 11 are provided below the base plate 1, with at least one column at each of the four right-angle positions. If the equipment placed on the base plate 1 is heavy, more support columns 11 can be provided. The material of the base plate 1 is not specifically limited in this invention; any sturdy and stable material available in the prior art can be used. The number of base plates 1 is also not specifically limited in this embodiment and can be determined based on the size of the computer room. The advantages of using the base plate 1 are twofold: firstly, it facilitates the placement of high-end equipment above the base plate 1, preventing direct contact with the floor of the computer room and promoting air circulation within the room; secondly, it facilitates the placement of the first main heat exchange pipe 7 and the second main heat exchange pipe 15 below the base plate 1. Since multiple base plates 1 are arranged horizontally side by side, with gaps between adjacent base plates 1 and a slide rail 16 on the side of each of the two opposing base plates 1, the slide rails extend along the longitudinal axis of the base plates. This allows the brackets 2 to be slidably positioned within the slide rails 16 on the side of adjacent base plates 1, facilitating easy adjustment of the position of the brackets 2. The number of brackets 2 between adjacent base plates 1 can be adjusted according to actual conditions; preferably, 2 to 4 are provided. Each bracket 2 has 2 to 4 heat exchange components 4 arranged from top to bottom, and the height of each heat exchange component 4 is adjustable. This arrangement facilitates the adjustment of the height of the heat exchange components 4. Therefore, this embodiment of the invention can adjust the position of the brackets 2 according to the amount of heat generated by the equipment on the base plate 1, placing them near the equipment with high heat generation, and then adjust the height of the heat exchange components 4 according to the height of the heat source of the equipment. Furthermore, the gaps between the brackets 2 and between the heat exchange components 4 also facilitate the passage of connecting cables between the equipment. It should also be noted that, due to the multiple base plates 1 arranged side by side, multiple rows of supports 2 are also provided. To ensure that the lowest heat exchange component 4 on each support 2 is connected to the first main pipe 7, the first main pipe 7 is positioned sequentially below each base plate 1. To facilitate the connection of the highest heat exchange components 4 on each support 2 to the second main pipe 15 via a first pipe 14, the second main pipe 15 is also sequentially positioned below each base plate 1. The first main pipe 7 and the second main pipe 15 are respectively connected to both ends of a heat sink. A liquid pump is installed on the first main pipe 7, positioned close to the heat sink, forming a liquid circulation loop with the first main pipe 7, the heat exchange components 4, the first pipe 14, the second main pipe 15, and the heat sink. The liquid can be water or other liquids. A liquid channel is provided inside the heat sink to allow the temperature of the liquid, which has increased after heat exchange, to decrease as it passes through the liquid channel. A cooling fan can also be installed on the heat sink to accelerate heat dissipation.Because the liquid in the liquid circulation loop will decrease after a period of time, the first main pipe 7 is connected to a liquid tank via a fourth pipe. A valve body is installed on the fourth pipe, and the connection point between the fourth pipe and the first main pipe 7 is located between the liquid pump and the heat sink. Furthermore, one or two liquid pumps can be installed on other pipes as needed.

[0030] In one specific embodiment, the heat dissipation device for high-end equipment in the computer room includes, for each of the brackets 2:

[0031] Two vertical rods 200 are arranged sequentially along the longitudinal axis of the base plate 1. Two to four adjusting bolts 3 are arranged at intervals on each of the two vertical rods 200. A heat exchange component 4 is fixedly arranged between the two vertical rods above the two adjusting bolts 3 at the same height. The adjusting bolts 3 are double-ended bolts. The rods above and below each adjusting bolt 3 are provided with threads that are compatible with the adjusting bolts 3. The height of the heat exchange component 4 can be adjusted by rotating the adjusting bolts 3.

[0032] The slider 10 is slidably disposed in the slide rails 16 on the sides of two adjacent base plates 1, and two vertical rods 200 are fixedly disposed on the top of the slider 10.

[0033] In the above embodiment, the width of the slider 10 is adapted to the gap between two adjacent base plates 1, and the total length of all sliders 10 is less than the longitudinal axis length of the base plate 1 to ensure that there is a gap between adjacent supports 2. It should also be noted that since two adjacent heat exchange components 4 located on the same support 2 are connected by a first heat exchange pipe 5, in order to facilitate the adjustment of the relative distance between the two adjacent heat exchange components 4, the first heat exchange pipe 5 is a flexible pipe, and the maximum adjustable distance between the two adjacent heat exchange components 4 is determined by the length of the adjusting bolt 3 and the length of the first heat exchange pipe 5. When the adjusting bolt 3 makes the two adjacent heat exchange components 4 at the maximum distance, the first heat exchange pipe 5 is also in a straightened state. It should be noted that the two ends of the adjusting bolt 3 have opposite threads. When the adjusting bolt 3 is rotated counterclockwise or clockwise, both ends of the adjusting bolt 3 extend outward from the vertical rod, increasing the distance between two adjacent heat exchange components 4. When the adjusting bolt 3 is rotated clockwise or counterclockwise, both ends of the adjusting bolt 3 move inward, decreasing the distance between two adjacent heat exchange components 4.

[0034] In one specific embodiment, the heat dissipation device for high-end equipment in the computer room has a slide rail 16 that is a groove with a cross-section of ┠. Both ends of the slider 10 are provided with protrusions 101 that are adapted to the slide rail 16. The protrusions 101 are engaged in the groove so that the slider 10 can slide forward or backward along the longitudinal axis of the base plate 1. The surfaces of the groove and the protrusion are smooth surfaces.

[0035] In the above embodiment, the cross-section of the slide 16 is set to be ┠-shaped, and protrusions adapted to the slide 16 are provided at both ends of the slider 10. With this configuration, the slider 10 can be stably locked inside the slide 16 without affecting the slider 10 sliding along the slide 16.

[0036] In one specific embodiment, the heat dissipation device for high-end equipment in the computer room further includes a fixing plate 9, which is fixedly disposed above the slider 10 and located between two opposing vertical rods. A through hole is provided on both the slider 10 and the fixing plate 9, and a second pipe 8 is disposed in the through hole. One end of the second pipe 8 is connected to the heat exchange component 4 located at the bottom of the bracket 2, and the other end is connected to the first main pipe 7.

[0037] In the above embodiment, the fixing plate 9 further strengthens the stability of the bracket 2. Furthermore, both the slider 10 and the fixing plate 9 are provided with a through hole, facilitating the second pipe 8 to pass through the fixing block and slider 10 and connect to the first main pipe 7. Specifically, the length of the second pipe 8 is determined according to the actual situation.

[0038] In one specific embodiment, in the heat dissipation device for high-end equipment in the computer room, one end of the first heat exchange pipe 5 is connected to the outlet of the lower heat exchange component 4, and the other end is connected to the inlet of the upper heat exchange component 4, and the outlet of the lower heat exchange component 4 and the inlet of the upper heat exchange component 4 are located on the same side.

[0039] In one specific embodiment, the heat dissipation device for high-end equipment in the computer room is provided with a third pipe 12 between two adjacent supports 2 in the same gap. One end of the third pipe 12 is connected to the outlet of the uppermost heat exchange component 4 on one of the supports 2, and the other end is connected to the inlet of the uppermost heat exchange component 4 on the other support 2. The outlet of the uppermost heat exchange component 4 on the end support 2 is connected to the first pipe 14.

[0040] In the above embodiment, a third pipe 12 is also provided between two adjacent supports 2 to facilitate the flow of liquid through the heat exchange components 4 on all supports 2 into the first pipe 14. It should be noted that the heat exchange components 4 installed at the top of each support 2 are all higher than the equipment installed in the machine room to prevent the liquid, whose temperature has increased after heat exchange, from contacting the equipment again. Specifically, the length of the second heat exchange pipe in the heat exchange component 4 located at the top can be shorter than the length of the second heat exchange pipe in the heat exchange component 4 not located at the top. The third pipe 12 is also a flexible pipe, and the maximum adjustable distance between two adjacent supports 2 is determined by the length of the third pipe 12.

[0041] In one specific embodiment, the heat dissipation device for high-end equipment in the computer room further includes a heat insulation pipe 13, which is vertically fixed on the base plate 1. The first pipe 14 is disposed inside the heat insulation pipe 13 and passes through the base plate 1 to connect with the second main pipe 15.

[0042] In the above embodiment, since the heat exchanged liquid flows into the first pipe 14, the liquid temperature in the first pipe 14 is relatively high. In order to prevent the heat in the first pipe 14 from being transferred to the machine room, the first pipe 14 is installed in the heat insulation pipe 13. The heat insulation pipe 13 is made of heat insulation material, such as asbestos, rock wool, or glass fiber.

[0043] The number of devices and processing scale described herein are for the purpose of simplifying the description of this utility model. Applications, modifications, and variations of this utility model will be readily apparent to those skilled in the art.

[0044] Although the embodiments of the present invention have been disclosed above, they are not limited to the applications listed in the description and implementation methods. They can be fully applied to various fields suitable for the present invention. For those familiar with this field, additional modifications can be easily implemented. Therefore, without departing from the general concept defined by the claims and the scope of equivalents, the present invention is not limited to the specific details and illustrations shown and described herein.

Claims

1. A heat dissipation device for high-end equipment in a computer room, characterized in that, include: The base plate has multiple horizontally arranged side by side, with gaps between adjacent base plates and a slide rail on the side of each of the two opposite base plates. High-end equipment is installed above the base plate. The support has multiple supports installed in the gap between two adjacent base plates. Each support is slidably installed in a slide rail on the side of the two adjacent base plates. Each support has 2 to 4 heat exchange components installed from top to bottom. The height of each heat exchange component is adjustable. Adjacent heat exchange components on the same support are connected by a first heat exchange pipe. Each support has a heat exchange component at the bottom connected to a first main pipe, and a heat exchange component at the top connected to a second main pipe via a first pipe. The first and second main pipes are located below the base plate and are respectively connected to the two ends of a heat sink. A liquid pump is installed on the first main pipe.

2. The heat dissipation device for high-end equipment in a computer room as described in claim 1, characterized in that, Each of the aforementioned stents includes: Two vertical rods are arranged sequentially along the longitudinal axis of the base plate. Two to four adjusting bolts are arranged at intervals on each of the two vertical rods. A heat exchange component is fixedly arranged between the two vertical rods located above the two adjusting bolts at the same height. The slider is slidably disposed in the slide rails on the sides of two adjacent base plates, and two vertical rods are fixedly disposed on the top of the slider.

3. The heat dissipation device for high-end equipment in a computer room as described in claim 2, characterized in that, The slide is a groove with a ┠-shaped cross-section. Both ends of the slider are provided with protrusions that are adapted to the slide. The protrusions are engaged in the groove so that the slider can slide forward or backward along the longitudinal axis of the base plate. The surfaces of the groove and the protrusions are smooth surfaces.

4. The heat dissipation device for high-end equipment in a computer room as described in claim 3, characterized in that, It also includes a fixing plate, which is fixedly disposed above the slider and located between two opposing vertical rods. A through hole is provided on both the slider and the fixing plate, and a second pipe is disposed in the through hole. One end of the second pipe is connected to the heat exchange component at the bottom of the bracket, and the other end is connected to the first main pipe.

5. The heat dissipation device for high-end equipment in a computer room as described in claim 1, characterized in that, The heat exchange component is a second heat exchange pipe arranged in an S-shape, and the second heat exchange pipe is connected to the first heat exchange pipe.

6. The heat dissipation device for high-end equipment in a computer room as described in claim 2, characterized in that, The adjusting bolts are double-ended bolts, with threads adapted to the adjusting bolts located inside the upper and lower rods. The height of the heat exchange component can be adjusted by rotating the adjusting bolts.

7. The heat dissipation device for high-end equipment in a computer room as described in claim 1, characterized in that, The heat dissipation box is located outside the computer room, and the first main pipe and the second main pipe pass through the wall of the computer room and are connected to the heat dissipation box.

8. The heat dissipation device for high-end equipment in a computer room as described in claim 1, characterized in that, One end of the first heat exchange pipe is connected to the outlet of the lower heat exchange component, and the other end is connected to the inlet of the upper heat exchange component, with the outlet of the lower heat exchange component and the inlet of the upper heat exchange component located on the same side.

9. The heat dissipation device for high-end equipment in a computer room as described in claim 1, characterized in that, A third pipe is also provided between two adjacent supports located in the same gap. One end of the third pipe is connected to the outlet of the uppermost heat exchange component on one of the supports, and the other end is connected to the inlet of the uppermost heat exchange component on the other support. The outlet of the uppermost heat exchange component on the end support is connected to the first pipe.

10. The heat dissipation device for high-end equipment in a computer room as described in claim 9, characterized in that, It also includes a heat-insulating pipe, which is vertically fixed on the base plate. The first pipe is installed inside the heat-insulating pipe and passes through the base plate to connect with the second main pipe.

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