Artificial intelligence terminal cooling device

Abstract

The utility model relates to the technical field of heat dissipation structures, in particular to an artificial intelligence terminal cooling device, which comprises a terminal rear cover, a heat absorber, a packaging structure and a heat dissipation structure, and is characterized in that the terminal rear cover comprises a rear cover main body; the heat absorber is fixedly installed in the middle of the rear side in the rear cover body. The packaging structure comprises packaging shells, and the packaging shells are fixedly installed on the two sides of the rear cover body. The heat dissipation structure comprises a first plate-type water tank and a second plate-type water tank, the first plate-type water tank and the second plate-type water tank are fixedly installed on the rear side, close to the upper side and the lower side, in the packaging shell, the surface of the front side of the first plate-type water tank fixedly communicates with a plurality of first hollow fins, and the surface of the front side of the second plate-type water tank fixedly communicates with a plurality of second hollow fins. According to the utility model, the substrate of the heat dissipation structure is designed into the water tank, and the fins at the heat dissipation part are designed into the hollow structure communicated with the water tank, so that the internal volume of the water tank is increased, the contact area between a coolant and the inner wall of the water tank can be increased, and the heat dissipation efficiency is greatly improved.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation structure technology, specifically a cooling device for an artificial intelligence terminal. Background Technology

[0002] Artificial intelligence terminals refer to electronic devices that integrate artificial intelligence technology and are capable of performing complex tasks, providing intelligent services and interactive experiences. Through built-in AI algorithms and hardware support, these terminals have achieved functions such as voice recognition, image processing, natural language understanding, and predictive analysis, thereby improving user experience and device performance. The widespread application of AI terminals is reshaping the industrial landscape. From mobile phones to smart homes, and then to autonomous driving and humanoid robots, the evolution of AI terminals has brought enormous potential to the industry.

[0003] Because smart terminals have the ability to replace humans in performing tasks, they often need to operate for extended periods and autonomously provide solutions and make decisions based on the current situation. Therefore, they also need to perform a large amount of computational work frequently, placing a heavy workload on the internal components and generating a lot of heat. Efficient cooling is essential for smart terminals. However, most current smart terminals still use the same heat dissipation methods as ordinary computers, employing multiple fans for cooling. This approach requires a lot of space to install the fans, and the cooling efficiency of airflow is barely adequate for smart terminals. Utility Model Content

[0004] The purpose of this invention is to provide a cooling device for an artificial intelligence terminal to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solutions:

[0006] A cooling device for an artificial intelligence terminal, comprising:

[0007] A terminal back cover, the terminal back cover comprising a back cover body;

[0008] The heat absorber is fixedly installed in the middle of the rear side inside the main body of the rear cover;

[0009] The encapsulation structure includes an encapsulation shell, and the encapsulation shell is fixedly installed on both sides of the rear cover body.

[0010] The heat dissipation structure includes a No. 1 plate water tank and a No. 2 plate water tank. The No. 1 plate water tank and the No. 2 plate water tank are fixedly installed inside the encapsulation shell on the rear side near the upper and lower sides. The front surface of the No. 1 plate water tank is fixedly connected with a number of No. 1 hollow fins, and the front surface of the No. 2 plate water tank is fixedly connected with a number of No. 2 hollow fins.

[0011] Furthermore, the terminal back cover also includes:

[0012] A radiator mounting slot is provided in the middle of the rear surface inside the main body of the rear cover.

[0013] A substrate mounting groove is provided on both sides of the rear cover body.

[0014] A panel mounting slot is intersected and opened on the front surface of the rear cover body.

[0015] Furthermore, the heat absorber includes:

[0016] A heat-absorbing substrate, wherein the heat-absorbing substrate is embedded in a heat sink mounting groove;

[0017] The first heat-absorbing fin assembly is fixedly installed on the upper half of the front surface of the heat-absorbing substrate.

[0018] The second heat-absorbing fin assembly is fixedly installed on the lower half of the front surface of the heat-absorbing substrate;

[0019] The No. 1 heat-conducting pipe group has the No. 1 heat-absorbing fin group penetrating through both sides of the No. 1 heat-conducting pipe group.

[0020] The second heat-conducting pipe group has two heat-absorbing fin groups that extend through both sides.

[0021] Furthermore, the packaging structure also includes:

[0022] The encapsulation shell is provided in two parts, and the two encapsulation shells are fixedly installed in the heat sink mounting slot.

[0023] Fan No. 1 is fixedly installed inside the upper part of the encapsulation shell;

[0024] An air inlet is provided, which is interposed at the upper rear side of the encapsulation shell.

[0025] Fan No. 2, which is fixedly installed inside the lower end of the encapsulation shell;

[0026] An air outlet is provided at the lower rear end of the air outlet.

[0027] Furthermore, the heat dissipation structure also includes:

[0028] A liquid pump is fixedly installed inside the enclosure, on one side in the middle. The liquid pump's suction port is connected to a first plate-type water tank, and the liquid pump's outlet is connected to a second plate-type water tank.

[0029] Furthermore, the heat dissipation structure also includes:

[0030] The infusion channel has four infusion channels. Each infusion channel is fixedly connected to a multi-port pipe at both ends. The first heat-conducting pipe group is connected to the first plate water tank at both ends through the multi-port pipe and the infusion channel, respectively. The second heat-conducting pipe group is connected to the second plate water tank at both ends through the multi-port pipe and the infusion channel, respectively.

[0031] Compared with the prior art, the beneficial effects of this utility model are:

[0032] 1. The upper and lower parts of the heat absorber are connected to two sets of plate water tanks, No. 1 and No. 2, respectively, forming a circulation channel. The heat inside the main body of the back cover is absorbed and transferred to the heat dissipation structure on both sides. The heat dissipation structure is isolated from the electronic components inside the main body of the back cover by the encapsulation shell, and dust is isolated from the No. 1 and No. 2 plate water tanks storing coolant, achieving relative protection. The base plate of the heat dissipation structure is designed as a water tank, and the fins at the heat dissipation point are designed as a hollow structure connected to the water tank. While increasing the internal volume of the water tank, it can also increase the contact area between the coolant and the inner wall of the water tank, which can greatly improve the heat dissipation efficiency.

[0033] 2. Fan 1 draws in outside air from the air inlet and blows it into the encapsulation shell. At the same time, Fan 2 draws in air from inside the encapsulation shell and discharges it from the air outlet. This creates a fast-flowing, continuous airflow inside the encapsulation shell, which quickly dissipates heat from the heat dissipation structure installed inside the encapsulation shell.

[0034] 3. A liquid pump draws coolant from the No. 1 plate water tank on one side into the No. 2 plate water tank, increasing the hydraulic pressure in the No. 2 plate water tank. The coolant then flows through a multi-port pipe and a liquid delivery channel through the No. 2 heat conduction pipe group into the No. 2 plate water tank on the other side. Another set of liquid pumps with a reverse connection between the extraction port and the outlet draws coolant from the No. 2 plate water tank on this side into the No. 1 plate water tank on the same side. The coolant then flows back into the original No. 1 plate water tank through a multi-port pipe and a liquid delivery channel through the No. 1 heat conduction pipe group, completing a cycle. The coolant continuously flows from both directions through the upper and lower parts of the heat absorber. In conjunction with the No. 1 and No. 2 heat absorber fin groups, it can continuously remove air from the interior of the rear cover body, achieving extremely high heat dissipation effect. Attached Figure Description

[0035] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0036] Figure 2 This is a schematic diagram of the terminal back cover in this utility model;

[0037] Figure 3 This is a schematic diagram of the heat absorber in this utility model;

[0038] Figure 4 This is a cross-sectional view of the packaging structure in this utility model;

[0039] Figure 5 This is a schematic diagram of the packaging structure in this utility model;

[0040] Figure 6 This is a schematic diagram of the heat dissipation structure in this utility model.

[0041] In the diagram: 1. Terminal back cover; 101. Back cover body; 102. Heat sink mounting slot; 103. Substrate mounting slot; 104. Panel mounting slot; 2. Heat absorber; 201. Heat-absorbing substrate; 202. Heat-absorbing fin group 1; 203. Heat-absorbing fin group 2; 204. Heat-conducting pipe group 1; 205. Heat-conducting pipe group 2; 3. Encapsulation structure; 301. Encapsulation shell; 302. Fan 1; 303. Air inlet; 304. Fan 2; 305. Air outlet; 4. Heat dissipation structure; 401. Plate-type water tank 1; 402. Hollow fin 1; 403. Plate-type water tank 2; 404. Hollow fin 2; 405. Liquid pump; 406. Liquid delivery channel; 407. Multi-port pipe. Detailed Implementation

[0042] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0043] Please see Figure 1-6 In this embodiment of the present invention, an artificial intelligence terminal cooling device includes a terminal back cover 1, a heat absorber 2, an encapsulation structure 3, and a heat dissipation structure 4. The terminal back cover 1 includes a back cover body 101; the heat absorber 2 is fixedly installed in the middle of the rear side inside the back cover body 101; the encapsulation structure 3 includes an encapsulation shell 301, and the encapsulation shell 301 is fixedly installed on both sides of the back cover body 101; the heat dissipation structure 4 includes a first plate water tank 401 and a second plate water tank 403, the first plate water tank 401 and the second plate water tank 403 are fixedly installed in the rear side of the encapsulation shell 301 near the upper and lower sides, a plurality of first hollow fins 402 are fixedly connected to the front surface of the first plate water tank 401, and a plurality of second hollow fins 404 are fixedly connected to the front surface of the second plate water tank 403.

[0044] Specifically, the upper and lower parts of the heat absorber 2 are connected to two sets of plate-type water tanks 401 and 403 respectively, forming a circulation channel. The heat inside the back cover body 101 is absorbed and transferred to the heat dissipation structure 4 on both sides. The heat dissipation structure 4 is isolated from the electronic components inside the back cover body 101 by the encapsulation shell 301, which isolates dust from the plate-type water tanks 401 and 403 storing coolant, thus achieving relative protection. The base plate of the heat dissipation structure 4 is designed as a water tank, and the fins at the heat dissipation point are designed as a hollow structure that is connected to the water tank. This increases the internal volume of the water tank and increases the contact area between the coolant and the inner wall of the water tank, thus greatly improving the heat dissipation efficiency.

[0045] Example 1

[0046] like Figure 4-5 As shown, in this embodiment, the terminal back cover 1 also includes a heat sink mounting groove 102, a substrate mounting groove 103, and a panel mounting groove 104. The heat sink mounting groove 102 is formed in the middle of the rear surface inside the back cover body 101; the substrate mounting groove 103 is formed on both sides of the back cover body 101; the panel mounting groove 104 is interposed on the front surface of the back cover body 101; the encapsulation structure 3 also includes an encapsulation shell 301, a first fan 302, an air inlet 303, a second fan 304, and an air outlet 305. There are two encapsulation shells 301, and the two encapsulation shells 301 are fixedly installed in the heat sink mounting groove 102; the first fan 302 is fixedly installed in the upper part of the encapsulation shell 301; the air inlet 303 is interposed in the upper rear side of the encapsulation shell 301; the second fan 304 is fixedly installed in the lower part of the encapsulation shell 301; and the air outlet 305 is interposed in the lower rear side of the air outlet 305.

[0047] In this embodiment, the back cover body 101 is fixedly installed on the rear surface of the smart terminal panel to encapsulate the internal electronic components of the terminal. At the same time, the encapsulation shell 301 isolates the heat dissipation structure 4 from the internal components of the terminal, preventing dust carried by the airflow from entering the back cover body 101 and affecting the components. The first fan 302 draws in outside air from the air inlet 303 and blows it into the encapsulation shell 301. Meanwhile, the second fan 304 draws in air from inside the encapsulation shell 301 and discharges it from the air outlet 305, forming a fast-flowing continuous airflow inside the encapsulation shell 301 to quickly dissipate heat from the heat dissipation structure 4 installed inside the encapsulation shell 301.

[0048] Example 2

[0049] Based on Embodiment 1, this invention supplements the specific method for removing heat from the interior of the back cover body 101, which was not mentioned in Embodiment 1.

[0050] like Figure 1 , 3As shown in Figures 4 and 6, in this embodiment, the heat absorber 2 includes a heat-absorbing substrate 201, a first heat-absorbing fin group 202, a second heat-absorbing fin group 203, a first heat-conducting pipe group 204, and a second heat-conducting pipe group 205. The heat-absorbing substrate 201 is embedded in the heat sink mounting groove 102; the first heat-absorbing fin group 202 is fixedly installed on the upper half of the front surface of the heat-absorbing substrate 201; the second heat-absorbing fin group 203 is fixedly installed on the lower half of the front surface of the heat-absorbing substrate 201; the first heat-conducting pipe group 204 penetrates the first heat-absorbing fin group 202 in both directions; the second heat-conducting pipe group 205 penetrates the second heat-absorbing fin group 203 in both directions; heat dissipation structure 4 It also includes a liquid pump 405 and a delivery channel 406. The liquid pump 405 is fixedly installed in the middle of one side inside the encapsulation shell 301. The liquid pump 405's suction port is connected to the first plate water tank 401, and the liquid pump 405's outlet is connected to the second plate water tank 403. There are four delivery channels 406. The two ends of the delivery channels 406 are fixedly connected to multi-port pipes 407. The two ends of the first heat conduction pipe group 204 are connected to the first plate water tank 401 through the multi-port pipes 407 and the delivery channels 406, respectively. The two ends of the second heat conduction pipe group 205 are connected to the second plate water tank 403 through the multi-port pipes 407 and the delivery channels 406, respectively.

[0051] In practice, the entire coolant circulation channel is filled with coolant. A liquid pump 405 draws coolant from the No. 1 plate tank 401 on one side into the No. 2 plate tank 403. The hydraulic pressure in the No. 2 plate tank 403 increases, and the coolant flows through a multi-port pipe 407, a liquid delivery channel 406, and a No. 2 heat-conducting pipe group 205 into the No. 2 plate tank 403 on the other side. Then, another liquid pump 405, with its reverse connection of suction and discharge ports, draws coolant from the No. 2 plate tank 403 on this side... The coolant in the water tank 403 is drawn into the No. 1 plate water tank 401 on this side, and then flows back into the original No. 1 plate water tank 401 through the multi-port pipe 407, the liquid delivery channel 406 and the No. 1 heat conduction pipe group 204 to complete a cycle. It continuously passes through the upper and lower parts of the heat absorber 2 from two directions. Together with the No. 1 heat absorption fin group 202 and the No. 2 heat absorption fin group 203, it can continuously remove the air inside the rear cover body 101, and has a very high heat dissipation effect.

[0052] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0053] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A cooling device for an artificial intelligence terminal, characterized in that, include: Terminal back cover (1), the terminal back cover (1) includes a back cover body (101); Heat absorber (2), which is fixedly installed in the middle of the rear side inside the rear cover body (101); The encapsulation structure (3) includes an encapsulation shell (301), and the encapsulation shell (301) is fixedly installed on both sides of the back cover body (101). The heat dissipation structure (4) includes a first plate water tank (401) and a second plate water tank (403). The first plate water tank (401) and the second plate water tank (403) are fixedly installed inside the encapsulation shell (301) on the rear side near the upper and lower sides. The front surface of the first plate water tank (401) is fixedly connected with several first hollow fins (402), and the front surface of the second plate water tank (403) is fixedly connected with several second hollow fins (404).

2. The artificial intelligence terminal cooling device according to claim 1, characterized in that, The terminal back cover (1) also includes: A radiator mounting slot (102) is provided in the middle of the rear surface inside the rear cover body (101); A substrate mounting groove (103) is provided on both sides of the rear cover body (101); A panel mounting groove (104) is provided on the front surface of the rear cover body (101).

3. The artificial intelligence terminal cooling device according to claim 2, characterized in that, The heat absorber (2) includes: A heat-absorbing substrate (201) is embedded in a heat sink mounting groove (102); The first heat-absorbing fin assembly (202) is fixedly installed on the upper half of the front surface of the heat-absorbing substrate (201); The second heat-absorbing fin assembly (203) is fixedly installed on the lower half of the front surface of the heat-absorbing substrate (201); The No. 1 heat-conducting pipe group (204) has the No. 1 heat-absorbing fin group (202) penetrating on both sides. The second heat-conducting pipe group (205) has the second heat-absorbing fin group (203) penetrating on both sides.

4. The artificial intelligence terminal cooling device according to claim 3, characterized in that, The packaging structure (3) also includes: Encapsulation shell (301), there are two encapsulation shells (301), and the two encapsulation shells (301) are fixedly installed in the heat sink mounting slot (102); Fan No. 1 (302) is fixedly installed inside the upper part of the encapsulation shell (301); An air inlet (303) is provided at the upper rear side of the encapsulation shell (301); Second fan (304), the second fan (304) is fixedly installed inside the lower end of the encapsulation shell (301); An air outlet (305) is provided at the lower rear end of the air outlet (305).

5. The artificial intelligence terminal cooling device according to claim 4, characterized in that, The heat dissipation structure (4) also includes: Liquid pump (405) is fixedly installed in the middle of one side of the encapsulation shell (301). The liquid pump (405) has its liquid inlet connected to the first plate water tank (401) and its liquid outlet connected to the second plate water tank (403).

6. The artificial intelligence terminal cooling device according to claim 5, characterized in that, The heat dissipation structure (4) also includes: There are four infusion channels (406). The two ends of each infusion channel (406) are fixedly connected to multi-port pipes (407). The two ends of the first heat-conducting pipe group (204) are connected to the first plate water tank (401) through the multi-port pipes (407) and the infusion channels (406), respectively. The two ends of the second heat-conducting pipe group (205) are connected to the second plate water tank (403) through the multi-port pipes (407) and the infusion channels (406), respectively.

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