Server parallel type full liquid cooling heat dissipation device

Abstract

The utility model provides a server parallel type full liquid cooling heat dissipation device, and relates to the technical field of server heat dissipation, the server parallel type full liquid cooling heat dissipation device comprises a first shunting box, the first shunting box is connected with a plurality of liquid cooling assemblies, each liquid cooling assembly comprises a second shunting box communicated with the first shunting box, and the second shunting box is connected with a plurality of CPU cooling plates in parallel. According to the liquid cooling device, the plurality of liquid cooling assemblies are arranged, the plurality of CPU cooling plates in each liquid cooling assembly are connected in parallel, the plurality of CPU cooling plates are arranged in parallel, and each CPU cooling plate is arranged as an independent water channel management system, so that parallel heat dissipation among the CPU cooling plates is realized, resistance in a water channel is remarkably reduced, the heat dissipation efficiency is improved, and meanwhile, the service life of the CPU cooling plates is prolonged. Each CPU cooling plate can obtain sufficient cooling liquid, the overall pressure drop is reduced, and the overall heat dissipation performance is greatly improved.

Description

Technical Field

[0001] This utility model relates to the field of server heat dissipation technology, and more specifically, to a parallel liquid cooling heat dissipation device for servers. Background Art

[0002] In current data center liquid-cooled server system heat dissipation technology, the commonly used method is to connect multiple CPUs in series for liquid cooling. However, this series connection method has significant drawbacks.

[0003] First, the series connection of multiple CPUs increases resistance in the cooling system, thus affecting heat dissipation efficiency. Furthermore, the heat dissipation capacity of each stage in this series configuration is limited, resulting in poor overall cooling performance. Additionally, the series structure increases the overall voltage drop, raising the system temperature and shortening the server's lifespan. Therefore, we propose an improvement: a parallel-connected full liquid cooling system for servers. Summary of the Invention

[0004] The purpose of this invention is to address the problems of increased resistance in the cooling system, poor heat dissipation, and increased voltage drop caused by the current practice of connecting multiple CPUs in series.

[0005] To achieve the above-mentioned objectives, this invention provides a parallel liquid-cooled heat dissipation device for servers to improve the aforementioned problems.

[0006] The application is as follows:

[0007] A server parallel liquid cooling heat dissipation device includes a first distribution box, which is connected to a plurality of liquid cooling components. The liquid cooling components include a second distribution box that communicates with the first distribution box, and the second distribution box is connected in parallel to a plurality of CPU cooling plates.

[0008] As a preferred technical solution of this application, the number of CPU cooling plates is N times the number of second distribution boxes, and N is greater than or equal to 1.

[0009] As a preferred technical solution of this application, the first diversion box is provided with an outlet chamber and an inlet chamber, and both the outlet chamber and the inlet chamber are connected to a connector.

[0010] As a preferred technical solution of this application, the second diversion box is provided with a second chamber and a third chamber. The second chamber is connected to the inlet chamber through a pipe, and the third chamber is connected to the outlet chamber through a pipe.

[0011] As a preferred technical solution of this application, one end of the CPU cooling plate is connected to the second chamber through a pipe, and the other end of the CPU cooling plate is connected to the third chamber through a pipe.

[0012] As a preferred technical solution of this application, the second shunt box is further provided with two first chambers, which are located on opposite sides of the second and third chambers.

[0013] As a preferred technical solution of this application, the liquid cooling assembly further includes a third distribution box and an IO cold plate. The third distribution box is provided with two fourth chambers, and both fourth chambers are connected to the IO cold plate through pipes.

[0014] As a preferred technical solution of this application, a plurality of memory cooling plates are connected between the two fourth chambers and the two first chambers, and gaps are left between the plurality of memory cooling plates.

[0015] As a preferred technical solution of this application, a connecting pipe is provided between the second distribution boxes of two adjacent liquid cooling components, and the two ends of the connecting pipe are respectively connected to the first chambers in the two adjacent second distribution boxes.

[0016] As a preferred technical solution of this application, the water inlet chamber is connected to the second distribution box in the liquid cooling assembly at the first end through a pipe. Specifically, the water inlet chamber is connected to one of the first chambers in the second distribution box through a pipe, and the water outlet chamber is connected to the second distribution box in the liquid cooling assembly at the tail end through a pipe.

[0017] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0018] In the scheme of this application:

[0019] To address the issues of increased resistance, poor heat dissipation, and increased pressure drop in existing technologies where multiple CPUs are connected in series, this application addresses these problems by using several liquid cooling components, each containing several CPU cooling plates connected in parallel. Each CPU cooling plate is configured with an independent water channel management system, enabling parallel heat dissipation among the CPU cooling plates. This significantly reduces resistance in the water channel, improves heat dissipation efficiency, and ensures that each CPU cooling plate receives sufficient coolant, thereby reducing the overall pressure drop and significantly enhancing overall heat dissipation performance. Attached Figure Description

[0020] Figure 1 A schematic diagram of the parallel liquid-cooled heat dissipation device for servers provided in this application;

[0021] Figure 2 A schematic diagram of the first chamber of the server parallel liquid cooling heat dissipation device provided in this application;

[0022] Figure 3A schematic diagram of the CPU cooling plate structure of the server parallel liquid cooling heat dissipation device provided in this application;

[0023] Figure 4 A schematic diagram of the structure of the IO cold plate of the server parallel liquid cooling heat dissipation device provided in this application.

[0024] The image shows:

[0025] 1. First diversion box; 101. Outlet chamber; 102. Inlet chamber; 103. Connector;

[0026] 2. Second shunt box; 201. First chamber; 202. Second chamber; 203. Third chamber;

[0027] 3. Third distribution box; 301. Fourth chamber; 302. Memory cooling plate;

[0028] 4. CPU cooling plate;

[0029] 5. IO cold plate;

[0030] 6. Connecting pipe;

[0031] 7. Pressure detector. Detailed Implementation

[0032] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of the present invention.

[0033] As described in the background section, the current liquid cooling technology for data center servers commonly uses a series connection of multiple CPUs. However, this series connection method has significant drawbacks. First, the series connection of multiple CPUs increases the resistance in the water channel, which in turn affects the heat dissipation efficiency. Second, the heat that can be removed at each stage is limited, resulting in poor overall heat dissipation. In addition, the series structure also increases the overall voltage drop and raises the system temperature, thereby shortening the service life of the server.

[0034] To solve this technical problem, this utility model provides a server parallel liquid cooling heat dissipation device, which is applied to server heat dissipation.

[0035] For details, please refer to Figures 1-4 The server parallel liquid cooling system specifically includes:

[0036] The first distribution box 1 is connected to several liquid cooling components. The liquid cooling components include a second distribution box 2 connected to the first distribution box 1. The second distribution box 2 is connected in parallel to several CPU cooling plates 4.

[0037] The parallel liquid cooling device for servers provided by this utility model uses several liquid cooling components, each of which has several CPU cooling plates 4 connected in parallel. By setting several CPU cooling plates 4 in parallel and setting each CPU cooling plate 4 as an independent water channel management system, parallel heat dissipation between the CPU cooling plates 4 is realized, which significantly reduces the resistance in the water channel and improves the heat dissipation efficiency. At the same time, each CPU cooling plate 4 can obtain sufficient coolant, which reduces the overall pressure drop and greatly improves the overall heat dissipation performance.

[0038] To enable those skilled in the art to better understand the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings.

[0039] It should be noted that, unless otherwise specified, the embodiments and features and technical solutions in the present invention can be combined with each other.

[0040] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0041] Example 1, please refer to Figures 1-4 A parallel liquid-cooled heat dissipation device for servers includes a first distribution box 1, which is connected to several liquid cooling components. Each liquid cooling component includes a second distribution box 2 connected to the first distribution box 1, and several CPU cooling plates 4 are connected in parallel to the second distribution box 2. This application achieves parallel heat dissipation among the CPU cooling plates 4 by setting several liquid cooling components, and several CPU cooling plates 4 in each liquid cooling component being connected in parallel. Each CPU cooling plate 4 is configured with an independent water channel management system, which significantly reduces the resistance in the water channel and improves the heat dissipation efficiency. At the same time, each CPU cooling plate 4 can obtain sufficient coolant, which reduces the overall pressure drop and greatly improves the overall heat dissipation performance. The CPU cooling plates 4 are used to fit against the CPU of the server for CPU heat dissipation.

[0042] Furthermore, the number of CPU cooling plates 4 is N times the number of second distribution boxes 2, and N is greater than or equal to 1.

[0043] Furthermore, such as Figure 2As shown, the first diversion box 1 is provided with an outlet chamber 101 and an inlet chamber 102. Both the outlet chamber 101 and the inlet chamber 102 are connected to a connector 103. The connector 103 facilitates the connection of the outlet chamber 101 and the inlet chamber 102 to the water inlet and the chilled water outlet of the chiller.

[0044] Furthermore, such as Figure 2 and Figure 3 As shown, the second diversion box 2 is provided with a second chamber 202 and a third chamber 203. The second chamber 202 is connected to the inlet chamber 102 through a pipe, and the third chamber 203 is connected to the outlet chamber 101 through a pipe.

[0045] Furthermore, such as Figures 1-3 As shown, one end of the CPU cooling plate 4 is connected to the second chamber 202 through a pipe, and the other end of the CPU cooling plate 4 is connected to the third chamber 203 through a pipe. This allows cold water to enter through the inlet chamber 102, then through the pipe into the second chamber 202, and then through the pipe into the CPU cooling plate 4 to cool the CPU. After cooling the CPU, the water in the CPU cooling plate 4 enters the third chamber 203 through the pipe, and then through the pipe into the outlet chamber 101, finally flowing back into the chiller.

[0046] Example 2 further optimizes the server parallel liquid cooling device provided in Example 1, specifically, as follows: Figure 3 As shown, the second shunt box 2 is also provided with two first chambers 201, which are located on opposite sides of the second chamber 202 and the third chamber 203.

[0047] Furthermore, such as Figure 1 , Figure 2 and Figure 4 As shown, the liquid cooling assembly also includes a third distribution box 3 and an IO cold plate 5. The third distribution box 3 is provided with two fourth chambers 301. Both fourth chambers 301 are connected to the IO cold plate 5 through pipes. The IO cold plate 5 is used to fit against the server's IO module for heat dissipation of the IO module. Both the second distribution box 2 and the third distribution box 3 are connected to pressure detectors 7.

[0048] Furthermore, such as Figure 4 As shown, several memory cooling plates 302 are connected between the two fourth chambers 301 and the two first chambers 201, and gaps are left between the memory cooling plates 302 for the insertion of memory modules. This arrangement enables the heat dissipation of the memory and IO modules to adopt a separate flow control system from the CPU, achieving precise control and further improving heat dissipation efficiency.

[0049] Example 3 further optimizes the server parallel liquid cooling heat dissipation device provided in Example 1 or 2, specifically, as follows: Figure 2 and Figure 4 As shown, a connecting pipe 6 is provided between the second distribution boxes 2 of two adjacent liquid cooling components. The two ends of the connecting pipe 6 are respectively connected to the first chamber 201 in the two adjacent second distribution boxes 2, so that the refrigerant can flow in the first chamber 201 of each second distribution box 2.

[0050] Furthermore, such as Figure 1 and Figure 2 As shown, the water inlet chamber 102 is connected to the second distribution box 2 in the liquid cooling assembly at the beginning through a pipe. Specifically, the water inlet chamber 102 is connected to one of the first chambers 201 in the second distribution box 2 through a pipe, and the water outlet chamber 101 is connected to the second distribution box 2 in the liquid cooling assembly at the end through a pipe. This arrangement can realize the connection between several second distribution boxes 2, as well as the connection between the second distribution box 2 and the water outlet chamber 101 and the water inlet chamber 102.

[0051] It should be noted that the first chamber 201 connected to the water outlet chamber 101, the connecting pipe 6, and the water inlet chamber 102 is a different first chamber 201.

[0052] The usage process of the server parallel liquid cooling heat dissipation device provided by this utility model is as follows:

[0053] The inlet chamber 102 is connected to the cold water outlet of the existing chiller through pipes and connectors 103, and the outlet chamber 101 is connected to the inlet of the existing chiller. Cold water enters the inlet chamber 102 and enters the second chamber 202 through pipes. Then, after passing through the CPU cooling plate 4 and the outlet chamber 101, it flows back to the chiller.

[0054] according to Figure 2 As shown, from right to left, with the right side as the beginning and the left side as the end, the cold water in the second chamber 202 enters the first chamber 201 at the beginning, and then enters the IO cold plate 5 through the memory cooling plate 302 and the fourth chamber 301. Under the action of the connecting pipe 6, the water flows between the first chamber 201, the fourth chamber 301 and the IO cold plate 5, and finally flows back to the chiller through the water outlet chamber 101.

[0055] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0056] Obviously, the embodiments described above are only some embodiments of this utility model, not all embodiments. The accompanying drawings show preferred embodiments of this utility model, but do not limit the patent scope of this utility model. This utility model can be implemented in many different forms; rather, the purpose of providing these embodiments is to provide a more thorough and comprehensive understanding of the disclosure of this utility model. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing specific embodiments, or make equivalent substitutions for some of the technical features. Any equivalent structures made using the content of this utility model specification and drawings, directly or indirectly applied to other related technical fields, are similarly within the patent protection scope of this utility model.

Claims

1. A parallel liquid-cooled heat dissipation device for servers, characterized in that, It includes a first distribution box (1), which is connected to several liquid cooling components. The liquid cooling components include a second distribution box (2) connected to the first distribution box (1), which is connected in parallel to several CPU cooling plates (4).

2. The server parallel-connected full liquid cooling heat dissipation device according to claim 1, characterized in that, The number of CPU cooling plates (4) is N times the number of second shunt boxes (2), and N is greater than or equal to 1.

3. The server parallel-connected full liquid cooling heat dissipation device according to claim 1, characterized in that, The first diversion box (1) is provided with an outlet chamber (101) and an inlet chamber (102), and both the outlet chamber (101) and the inlet chamber (102) are connected to a connector (103).

4. A server parallel-connected full liquid cooling heat dissipation device according to claim 3, characterized in that, The second diversion box (2) is provided with a second chamber (202) and a third chamber (203). The second chamber (202) is connected to the inlet chamber (102) through a pipe, and the third chamber (203) is connected to the outlet chamber (101) through a pipe.

5. A server parallel-connected full liquid cooling heat dissipation device according to claim 4, characterized in that, One end of the CPU cooling plate (4) is connected to the second chamber (202) through a pipe, and the other end of the CPU cooling plate (4) is connected to the third chamber (203) through a pipe.

6. A server parallel-connected full liquid cooling heat dissipation device according to claim 5, characterized in that, The second shunt box (2) is also provided with two first chambers (201), which are located on the side away from each other of the second chamber (202) and the third chamber (203).

7. A server parallel-connected full liquid cooling heat dissipation device according to claim 6, characterized in that, The liquid cooling assembly also includes a third distribution box (3) and an IO cold plate (5). The third distribution box (3) is provided with two fourth chambers (301), and both fourth chambers (301) are connected to the IO cold plate (5) through pipes.

8. A server parallel-connected full liquid cooling heat dissipation device according to claim 7, characterized in that, A plurality of memory cooling plates (302) are connected between the two fourth chambers (301) and the two first chambers (201), and gaps are left between the plurality of memory cooling plates (302).

9. A server parallel-connected full liquid cooling heat dissipation device according to claim 8, characterized in that, A connecting pipe (6) is provided between the second distribution boxes (2) of two adjacent liquid cooling components. The two ends of the connecting pipe (6) are respectively connected to the first chamber (201) in the two adjacent second distribution boxes (2).

10. A server parallel-type liquid-cooled heat dissipation device according to claim 9, characterized in that, The water inlet chamber (102) is connected to the second distribution box (2) in the liquid cooling assembly at the head end through a pipe. Specifically, the water inlet chamber (102) is connected to one of the first chambers (201) in the second distribution box (2) through a pipe, and the water outlet chamber (101) is connected to the second distribution box (2) in the liquid cooling assembly at the tail end through a pipe.

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