Classification device based on chip packaging test

Abstract

The utility model relates to the field of semiconductor testing equipment, in particular to a classifying device based on chip packaging testing, which comprises an optical detection module, a performance detection module, a clamping device and a controller, the optical detection module, the performance detection module and the clamping device are electrically connected with the controller, and the optical detection module comprises a support and an image collector. The image collector is hinged to the top of the support, the performance detection module comprises a first lifting frame, a first adjusting frame, a mechanical arm, an electrical probe and a data probe, the first lifting frame is provided with a first driving assembly, and the optical detection module, the performance detection module, the clamping device and the controller are electrically connected. According to the full-automatic chip packaging test system, the full-automatic process of chip packaging test is achieved, the test efficiency is remarkably improved, and the performance detection module can achieve comprehensive test of chip performance through precise cooperation of the lifting frame, the adjusting frame, the mechanical arm, the electrical probe and the data probe.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor testing equipment, specifically a classification device based on chip packaging testing. Background Technology

[0002] In the electronics manufacturing industry, chip packaging and testing is a crucial step in ensuring product quality and performance. However, traditional chip packaging and testing methods have many shortcomings. On the one hand, traditional testing methods typically rely on manual operation and simple mechanical equipment, resulting in low testing efficiency and limited accuracy. On the other hand, as chip size continues to shrink and integration increases, the requirements for testing equipment are becoming increasingly stringent, making it difficult for traditional testing methods to meet the needs of modern electronics manufacturing.

[0003] Specifically, traditional optical inspection methods typically use fixed image acquisition devices, which cannot be flexibly adjusted according to the actual position and angle of the chip, resulting in poor inspection results. Meanwhile, in performance testing, traditional robotic arms and probe systems often lack sufficient flexibility and accuracy, making it difficult to adapt to the testing needs of chips of different specifications and types. Furthermore, traditional gripping devices also suffer from instability and low efficiency when gripping and sorting chips. Utility Model Content

[0004] (a) Technical problems to be solved

[0005] To address the shortcomings of existing technologies, this invention provides a classification device based on chip packaging testing.

[0006] (II) Technical Solution

[0007] To achieve the above objectives, this utility model provides the following technical solution: A classification device based on chip packaging testing, comprising an optical inspection module, a performance inspection module, a clamping device, and a controller. The optical inspection module, performance inspection module, and clamping device are electrically connected to the controller. The optical inspection module includes a support and an image acquisition device, the image acquisition device being hinged to the top of the support. The performance inspection module includes a lifting frame, an adjusting frame, a robotic arm, an electrical probe, and a data probe. A driving component is provided on the lifting frame, and the adjusting frame is slidably mounted on the lifting frame via the driving component. Equipped with an adjustment assembly, the robotic arm includes arm one and arm two. Arm one is slidably mounted on an adjustment frame one via the adjustment assembly. A rotary motor is fixedly mounted at the front end of arm one, and the output end of the rotary motor passes through arm one. The top of arm two is mounted on the output end of the rotary motor. Electrical probes and data probes are mounted on both sides of the bottom end of arm two. The gripping device includes a lifting frame two, an adjustment frame two, and a pneumatic gripping cylinder. A drive assembly two is provided on the lifting frame two, and the adjustment frame two is slidably mounted on the lifting frame two via the drive assembly two. A displacement assembly is provided on the adjustment frame two, and the pneumatic gripping cylinder is slidably mounted on the adjustment frame two via the displacement assembly.

[0008] Preferably, the bottom of the lifting frame two is provided with a sliding rail, and a driving component three is provided on the sliding rail. The lifting frame two is slidably installed on the sliding rail through the driving component three.

[0009] More preferably, the top of the bracket is provided with a hinge frame, the image acquisition device is hinged on the hinge frame, an adjustment motor is installed on the hinge frame, and the output end of the adjustment motor is connected to the image acquisition device.

[0010] Preferably, the drive assembly one, drive assembly two, drive assembly three, adjustment assembly and displacement assembly adopt the same structure, all including a drive motor and a threaded screw. The lifting frame one, lifting frame two, adjustment frame one, adjustment frame two and sliding rail are all provided with track grooves. The drive motor is installed at the end of each track groove, and the threaded screw is rotatably installed in each track groove, and the threaded screw is connected to the output end of the drive motor.

[0011] Preferably, lifting frame one, lifting frame two, adjusting frame one, adjusting frame two, and pneumatic clamping cylinder are mounted on threaded screw via sliders, and arm one is mounted on the threaded screw of adjusting frame one via a threaded groove.

[0012] More preferably, the lifting frame one, the lifting frame two, and the sliding rail are provided with guide grooves on their sides. The bottom of the lifting frame two is slidably connected to the guide groove of the sliding rail through guide rollers. The adjusting frame one and the adjusting frame two are slidably connected to the guide grooves on the lifting frame one and the lifting frame two, respectively, through guide rollers.

[0013] (III) Beneficial Effects

[0014] Compared with the prior art, this utility model provides a classification device based on chip packaging testing, which has the following beneficial effects:

[0015] High-efficiency integration and automation:

[0016] By electrically connecting the optical inspection module, performance inspection module, clamping device, and controller, a fully automated process for chip packaging testing is achieved, significantly improving testing efficiency.

[0017] The collaborative work between modules reduces manual intervention, lowers human error, and improves the accuracy and consistency of testing.

[0018] Flexible optical inspection:

[0019] The optical inspection module adopts an image acquisition hinge design, which can be adjusted as needed to achieve comprehensive and accurate inspection of the chip's appearance.

[0020] The optimized motor makes adjusting the image acquisition unit more convenient and precise, improving detection efficiency and accuracy.

[0021] Precise performance testing:

[0022] The performance testing module, through the precise coordination of the lifting frame, adjusting frame, robotic arm, and electrical and data probes, can achieve comprehensive testing of chip performance.

[0023] The flexible adjustment of the robotic arm and the precise arrangement of electrical and data probes ensure the accuracy and reliability of the test data.

[0024] Efficient gripping and sorting:

[0025] The gripping device uses a pneumatic gripping cylinder, which achieves precise control through drive and displacement components, enabling stable and rapid gripping and sorting of chips.

[0026] The sliding design of the lifting and adjusting frame allows the gripping device to adapt to chips at different heights and positions, improving the flexibility and efficiency of sorting.

[0027] Optimized driving and regulation mechanisms:

[0028] The drive assembly, adjustment assembly, and displacement assembly adopt the same structure, including the drive motor and the lead screw, which simplifies the device structure and reduces maintenance costs.

[0029] Enhanced sliding and guiding performance:

[0030] The lifting frame, adjusting frame, and sliding rail are equipped with guide grooves and guide rollers to ensure the stability and accuracy of each component during the sliding process.

[0031] This design reduces friction and wear during the sliding process, extending the service life of the device. Attached Figure Description

[0032] Figure 1 This is a schematic diagram of the overall layout structure of this utility model;

[0033] Figure 2 This is a schematic diagram of the performance testing module structure of this utility model;

[0034] Figure 3 This is a schematic diagram of the optical detection module structure of this utility model;

[0035] Figure 4 This is a schematic diagram of the drive motor and threaded screw assembly transmission structure of this utility model;

[0036] In the diagram: 1. Optical inspection module; 2. Performance inspection module; 3. Clamping device; 4. Controller; 5. Lifting frame one; 6. Lifting frame two; 7. Adjusting frame one; 8. Adjusting frame two; 9. Pneumatic clamping cylinder; 10. Sliding rail; 11. Arm one; 12. Arm two; 13. Electrical probe; 14. Data probe; 15. Rotary motor; 16. Guide groove; 17. Support; 18. Hinge frame; 19. Image acquisition device; 20. Adjusting motor; 21. Drive motor; 22. Threaded screw. Detailed Implementation

[0037] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0038] Please see Figure 1-4This utility model discloses a classification device based on chip packaging testing, comprising an optical inspection module 1, a performance inspection module 2, a clamping device 3, and a controller 4. The optical inspection module 1, performance inspection module 2, and clamping device are electrically connected to the controller 4. The optical inspection module 1 includes a bracket 17 and an image acquisition device 19, the image acquisition device 19 being hinged to the top of the bracket 17. The performance inspection module 2 includes a lifting frame 5, an adjusting frame 7, a robotic arm, an electrical probe 13, and a data probe 14. The lifting frame 5 is equipped with a driving assembly, and the lifting frame 5 is slidably mounted with the adjusting frame 7 via the driving assembly. The adjusting frame 7 is equipped with an adjusting assembly. The robotic arm includes… Arm 11 and Arm 2 12 are provided. Arm 11 is slidably mounted on Adjustment Frame 1 7 via Adjustment Assembly. A Rotary Motor 15 is fixedly mounted at the front end of Arm 11. The output end of Rotary Motor 15 passes through Arm 11. The top of Arm 2 12 is mounted on the output end of Rotary Motor 15. Electrical probes and data probes 14 are mounted on both sides of the bottom end of Arm 2 12. The clamping device 3 includes Lifting Frame 2 6, Adjustment Frame 2 8, and Pneumatic Clamping Cylinder 9. Lifting Frame 2 6 is provided with Drive Assembly 2. Adjustment Frame 2 8 is slidably mounted on Lifting Frame 2 6 via Drive Assembly 2. Adjustment Frame 2 8 is provided with Displacement Assembly. Pneumatic Clamping Cylinder 9 is slidably mounted on Adjustment Frame 2 8 via Displacement Assembly.

[0039] Overall working principle of the classification device based on chip packaging testing

[0040] Optical inspection module 1:

[0041] Function: Used to detect surface defects in chips.

[0042] Structure: Includes a bracket 17 and an image acquisition unit 19. The image acquisition unit 19 is hinged to the top of the bracket 17 and its angle can be adjusted as needed.

[0043] Performance testing module 2:

[0044] Function: Used to test the functionality of the chip.

[0045] Structure: Includes lifting frame 5, adjusting frame 7, robotic arm, electrical probe 13 and data probe 14.

[0046] Working principle: The lifting frame 15 is connected to the adjusting frame 17 through the driving component 1. The robotic arm includes arm 11 and arm 2 12. Arm 11 is slidably mounted on the adjusting frame 17 through the adjusting component. Arm 2 12 is mounted on the output end of the rotating motor 15. Electrical probe 13 and data probe 14 are mounted on both sides of the bottom end of arm 2 12.

[0047] Clamping device 3:

[0048] Function: Used for gripping and moving chips.

[0049] Structure: Includes lifting frame 2 6, adjusting frame 2 8, and pneumatic clamping cylinder 9.

[0050] Working principle: The lifting frame 2 6 is connected to the adjusting frame 2 8 through the driving component 2, and the pneumatic clamping cylinder 9 is slidably installed on the adjusting frame 2 8 through the displacement component, which is used to accurately clamp the chip.

[0051] Controller 4:

[0052] Function: Integrates and controls optical inspection module 1, performance inspection module 2 and clamping device 3.

[0053] Working principle: The operation of each module is controlled by electrical connection to achieve automated detection and classification.

[0054] Controller 4 can be coded and used using a conventional CNC machine in the field of mechanical control equipment.

[0055] This chip packaging test-based sorting device mainly uses an optical inspection module 1, a performance inspection module 2, a clamping device 3, and a controller 4 to perform chip sorting tests. During use, it works in conjunction with a chip conveying device. The optical inspection module 1, performance inspection module 2, clamping device 3, and controller 4 are installed at different stations on the frame of the chip conveying device. The chip conveying device is used to transport the chips to be tested to each station. The chip conveying device can be a conventional crawler conveyor.

[0056] Optical inspection: The optical inspection module 1 includes a bracket 17 and an image acquisition unit 19, which are used to capture images of the chip's appearance and analyze them through the controller 4 to detect defects in the chip's appearance.

[0057] Performance Testing: The lifting frame 5 drives the adjusting frame 7 to slide up and down via the drive assembly 1. The adjusting assembly on the adjusting frame 7 allows the robotic arm to slide back and forth. A rotary motor 15 is installed at the front end of the robotic arm 11, which drives the second arm 12 and the electrical probe 13 and data probe 14 installed at the bottom of the second arm 12 to rotate. This allows the electrical probe 13 and data probe 14 to contact the test pins of the chip, so as to perform electrical performance testing and data reading on the chip.

[0058] Clamping and Sorting: The lifting frame 2 6 drives the adjusting frame 2 8 to slide up and down via the driving component 2. The displacement component on the adjusting frame 2 8 enables the pneumatic clamping cylinder 9 to slide back and forth. The pneumatic clamping cylinder 9 is usually equipped with two grippers. The pneumatic clamping cylinder 9 controls the two grippers to clamp the chips and sort them according to the test results.

[0059] Control and Coordination: The controller 4 is electrically connected to the optical inspection module 1, the performance inspection module 2, and the clamping device 3. It is responsible for coordinating the work of each part and controlling the clamping device 3 to classify the chips according to the inspection results.

[0060] Preferred technical solutions and working principles

[0061] Sliding rail 10 and drive component 3:

[0062] The bottom of the lifting frame 2 6 is provided with a sliding rail 10. The lifting frame 2 6 can slide left and right on the sliding rail 10 through the drive component 3, which increases the working range of the clamping device 3. When performing packaging test and classification work, several classification trays can be provided on the side of the device. After testing, chips with different performance can be clamped by the pneumatic clamping cylinder 9 and then the lifting frame 2 6, the sliding rail and the adjusting frame 2 8 can be used to clamp the chip onto different classification trays for classification processing.

[0063] Image acquisition unit 19 hinges and adjusts motor 20:

[0064] The top of the bracket 17 is provided with a hinge frame 18, and the image acquisition device 19 is hinged to the hinge frame 18. An adjustment motor 20 is installed on the hinge frame 18, which can drive the image acquisition device 19 to rotate so as to adjust the shooting angle and range.

[0065] Unified drive and regulation structure:

[0066] Drive assembly one, drive assembly two, drive assembly three, adjustment assembly, and displacement assembly all adopt the same structure, including a drive motor 21 and a lead screw 22. This design simplifies the device structure and facilitates maintenance and component replacement.

[0067] The lifting frame 5, the lifting frame 6, the adjusting frame 7, the adjusting frame 8, and the sliding rail 10 are all provided with rail grooves. The drive motor 21 is installed at the end of the rail groove, and the threaded screw 22 is rotatably installed in the rail groove and connected to the output end of the drive motor 21.

[0068] Slider and threaded groove set:

[0069] The lifting frame 1 (5), lifting frame 2 (6), adjusting frame 1 (7), adjusting frame 2 (8), and pneumatic clamping cylinder 9 are mounted on the threaded screw 22 via sliders, enabling smooth sliding of each component.

[0070] Arm 11 is fitted onto the threaded screw 22 of the adjusting frame 7 via a threaded groove, which increases the stability and accuracy of the sliding of arm 11.

[0071] Guide groove 16 and guide roller:

[0072] The lifting frame 5, the lifting frame 6, and the sliding rail 10 are provided with guide grooves 16 on their sides. The bottom of the lifting frame 6 is slidably connected to the guide groove 16 of the sliding rail 10 through guide rollers, which increases the smoothness and accuracy of the sliding.

[0073] Adjusting frame 7 and adjusting frame 8 are slidably connected to the guide grooves 16 on lifting frame 5 and lifting frame 6 respectively via guide rollers, which also improves the stability and accuracy of sliding.

[0074] In summary, this chip packaging testing-based classification device achieves efficient and accurate chip classification testing through its basic working principle and several optimized technical solutions. The optimized technical solutions not only improve the device's working efficiency and testing accuracy but also simplify its structure, facilitating maintenance and component replacement.

[0075] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A classification device based on chip packaging testing, characterized in that, The system includes an optical inspection module (1), a performance inspection module (2), a clamping device (3), and a controller (4). The optical inspection module (1), the performance inspection module (2), and the clamping device are electrically connected to the controller (4). The optical inspection module (1) includes a bracket (17) and an image acquisition device (19). The image acquisition device (19) is hinged to the top of the bracket (17). The performance inspection module (2) includes a lifting frame (5), an adjusting frame (7), a robotic arm, an electrical probe (13), and a data probe (14). The lifting frame (5) is equipped with a drive assembly (1). The lifting frame (5) is slidably mounted with the adjusting frame (7) via the drive assembly (1). The adjusting frame (7) is equipped with an adjusting assembly. The robotic arm includes an arm (11) and an arm (12). The first arm (11) is slidably mounted on the first adjustment frame (7) through the adjustment assembly. A rotating motor (15) is fixedly mounted at the front end of the first arm (11). The output end of the rotating motor (15) passes through the first arm (11). The top of the second arm (12) is mounted on the output end of the rotating motor (15). The electrical probe and the data probe (14) are mounted on both sides of the bottom end of the second arm (12). The clamping device (3) includes a second lifting frame (6), a second adjustment frame (8), and a pneumatic clamping cylinder (9). The second lifting frame (6) is provided with a second drive assembly. The second adjustment frame (8) is slidably mounted on the second lifting frame (6) through the second drive assembly. The second adjustment frame (8) is provided with a displacement assembly. The pneumatic clamping cylinder (9) is slidably mounted on the second adjustment frame (8) through the displacement assembly.

2. The classification device based on chip packaging testing according to claim 1, characterized in that, The bottom of the lifting frame 2 (6) is provided with a sliding rail (10), and a driving component 3 is provided on the sliding rail (10). The lifting frame 2 (6) is slidably installed on the sliding rail (10) through the driving component 3.

3. The classification device based on chip packaging testing according to claim 2, characterized in that, The top of the bracket (17) is provided with a hinge frame (18), the image acquisition device (19) is hinged on the hinge frame (18), and an adjustment motor (20) is installed on the hinge frame (18). The output end of the adjustment motor (20) is connected to the image acquisition device (19).

4. The classification device based on chip packaging testing according to claim 3, characterized in that, The drive assembly 1, drive assembly 2, drive assembly 3, adjustment assembly and displacement assembly adopt the same structure, all including a drive motor (21) and a threaded screw (22). The lifting frame 1 (5), lifting frame 2 (6), adjustment frame 1 (7), adjustment frame 2 (8) and sliding rail (10) are all provided with rail grooves. The drive motor (21) is installed at the end of each rail groove. The threaded screw (22) is rotatably installed in each rail groove, and the threaded screw (22) is connected to the output end of the drive motor (21).

5. A classification device based on chip packaging testing according to claim 4, characterized in that, The lifting frame one (5), lifting frame two (6), adjusting frame one (7), adjusting frame two (8) and pneumatic clamping cylinder (9) are mounted on the threaded screw (22) via sliders, and the arm one (11) is mounted on the threaded screw (22) of the adjusting frame one (7) via a threaded groove.

6. The classification device based on chip packaging testing according to claim 5, characterized in that, The lifting frame one (5), lifting frame two (6) and sliding rail (10) are provided with guide grooves (16) on their sides. The bottom of the lifting frame two (6) is slidably connected to the guide groove (16) of the sliding rail (10) through guide rollers. The adjusting frame one (7) and adjusting frame two (8) are slidably connected to the guide grooves (16) on the lifting frame one (5) and lifting frame two (6) respectively through guide rollers.

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