Cleaning and spraying device of wafer spin-drying equipment and spin-drying equipment

Abstract

The cleaning and spraying device comprises an inner rotary drum and an outer drum arranged outside the inner rotary drum, the inner rotary drum is driven by a driving device, the outer drum is provided with an outer spraying and washing device, the outer spraying and washing device comprises at least one fluid loop and a nozzle communicated with the fluid loop, the nozzle corresponds to the side wall of the inner drum, and the nozzle is communicated with the inner rotary drum. The inner rotary drum is provided with a nozzle, cleaning fluid sprayed out of the nozzle cleans the outer wall of the inner rotary drum, the inner rotary drum is provided with an inner spraying device, the inner spraying device is located in an inner cavity of the inner rotary drum and comprises a spraying rod, the spraying rod is arranged on the rotating axis of the inner rotary drum and provided with a spraying opening, and the cleaning fluid sprayed out of the spraying opening cleans the inner cavity of the inner rotary drum. According to the technical scheme, the mode of spraying the cleaning medium replaces the mode of soaking the cleaning medium, so that the consumption of the cleaning medium is reduced; more thorough, effective, direct and efficient self-cleaning operation can be realized, and secondary pollution of the working chamber is avoided.

Description

Technical Field

[0001] This utility model relates to the field of wafer processing equipment technology, and in particular to a cleaning spray device and a spin-drying device for wafer spin-drying equipment. Background Technology

[0002] Currently, the core functional component of known cleaning or spin-drying equipment with inner and outer cylinder rotating structures is the rotary cleaning or spin-drying assembly. This assembly mainly consists of an outer cylinder, an inner rotating cylinder, a rotary power input shaft, and a fluid circuit.

[0003] During the cleaning or spin-drying process, the workpiece or item to be cleaned (hereinafter referred to as the workpiece) is placed inside the inner rotating drum. The inner rotating drum is then driven to rotate via a rotational power input shaft (hereinafter referred to as the input shaft), causing the workpiece to rotate as well. This rotational centrifugal force acts on the workpiece, causing it to move away from the axis of rotation. The workpiece itself is held in place by the inner rotating drum, while dirt or particles within the workpiece (hereinafter referred to as dirt particles) are carried away by the cleaning medium (such as water, cleaning fluid, cleaning gas, etc.) and detach from the workpiece. These particles enter the chamber between the inner and outer drums through the openings in the inner rotating drum's side wall, and are then discharged from the chamber through the outer drum's drain channel, thus achieving the cleaning or spin-drying of the workpiece.

[0004] As described above, after operation, especially prolonged operation, contaminated cleaning media and dirt particles will remain on both the inner and outer walls of the inner drum, particularly near the openings on the outer wall of the inner drum. Since these dirt particles exit the inner drum chamber through these openings, and the outer wall of the inner drum has limited opportunity to be dissolved and washed away by the cleaning media, this phenomenon is particularly severe. Therefore, to ensure the cleanliness of the equipment itself and prevent secondary contamination of new workpieces, the equipment's self-cleaning function becomes a necessary requirement.

[0005] Currently, the self-cleaning measures commonly used in the market are as follows: one is to achieve self-cleaning by immersing the inner drum in cleaning medium, thereby dissolving dirt particles through immersion in cleaning medium to achieve self-cleaning of the inner and outer drums; another is to achieve self-cleaning of the inner or outer drum by impacting or vibrating the inner drum wall or by transmitting vibration to the inner and outer drum walls through cleaning medium; finally, there is a measure that combines the above two measures to achieve self-cleaning of the inner and outer drums.

[0006] However, these measures all have their limitations, such as:

[0007] Soaking and dissolving methods for cleaning cannot guarantee the removal of stubborn stains and will consume a lot of cleaning media, increasing costs (for example, the cleaning media used in the wafer fabrication process is high-purity deionized water, which is a very expensive consumable for wafer fabs).

[0008] Meanwhile, when the cleaning medium soaks both the inner and outer walls of the inner rotating drum together, the dirt particles on the outer wall of the inner rotating drum will be detached and flow into the inner rotating drum through the cleaning medium. After self-cleaning, they will remain on the inner wall of the inner rotating drum, causing secondary pollution.

[0009] In particular, for single-function spin dryers, there may not be a corresponding fluid circuit to deal with the working scenario of immersion (for example, spin dryers in wafer manufacturing generally do not have corresponding valves and pipelines to seal the chamber to deal with the temporary storage of high liquid levels of cleaning media in the chamber; their fluid circuits are only for the discharge of air and the discharge of a small amount of contaminated cleaning media).

[0010] Self-cleaning measures that transmit vibration through impact or vibration of the inner rotating cylinder or through the cleaning medium are generally implemented under the premise of immersion in the cleaning medium. However, the limitations of immersion measures themselves have been described above. In addition, directly applying impact force to the inner rotating cylinder is not allowed in some demanding applications (for example, the corresponding equipment in the wafer fabrication process has very high requirements for the cleanliness of the chamber, and some high-frequency vibrations can tear the weld seams on the inner rotating cylinder, producing fine particles).

[0011] As mentioned above, existing self-cleaning measures all have their limitations: they are either not thorough and effective at cleaning stubborn stains; they require soaking in cleaning media, which consumes a lot of cleaning media; or they are not suitable for some industrial scenarios with strict cleanliness requirements. Utility Model Content

[0012] In order to solve the problems of the prior art, this utility model provides a cleaning spray device and a spin-drying device for wafer spin-drying equipment that can effectively remove stubborn stains on the outer wall of the inner rotating drum, reduce the consumption of expensive cleaning media, and avoid secondary pollution of the cleaning or spin-drying chamber.

[0013] The specific technical solution is as follows: A cleaning spray device for a wafer spin dryer includes an inner rotating drum and an outer drum disposed outside the inner rotating drum. The inner rotating drum is driven by a drive device. The outer drum is provided with an external spray cleaning device, which includes at least one fluid circuit and a nozzle connected to the fluid circuit. The nozzle is correspondingly disposed to the side wall of the inner drum. The cleaning fluid sprayed from the nozzle cleans the outer wall of the inner rotating drum. The inner rotating drum is provided with an internal spray cleaning device, which is located in the inner cavity of the inner rotating drum. The internal spray cleaning device includes a spray rod, which is disposed on the rotation axis of the inner rotating drum. The spray rod is provided with a spray nozzle, and the cleaning fluid sprayed from the spray nozzle cleans the inner cavity of the inner rotating drum.

[0014] In some embodiments, the inner rotating cylinder and the outer cylinder are coaxially arranged, the inner rotating cylinder has an annular wall, and the annular wall is provided with a hollow part, which is located between the inner spray washing device and the outer spray washing device.

[0015] In some embodiments, the outer cylinder sidewall is provided with at least one window, and the external spray washing device includes a nozzle plate, the nozzle plate is disposed at the window position, and the nozzle is disposed on the nozzle plate.

[0016] In some embodiments, the nozzle plate is provided with a plurality of nozzles, and a plurality of fluid circuits are respectively connected to the corresponding nozzles.

[0017] In some embodiments, the spray nozzle is disposed on the outer circumference of the spray bar, and a plurality of spray nozzles are disposed along the axial direction of the spray bar.

[0018] In some embodiments, the spray bar is provided with at least one conveying channel, which extends axially from one end of the spray bar and communicates with the spray nozzle.

[0019] In some embodiments, the spray bar has at least two conveying channels arranged in parallel and communicating with the spray nozzle.

[0020] In some embodiments, the driving device includes an input shaft connected to an inner rotating cylinder, which drives the inner rotating cylinder to rotate. The spray bar passes through the inner rotating cylinder, the outer rotating cylinder, and the input shaft, and a fluid channel is connected to one end of the spray bar outside the input shaft.

[0021] In some embodiments, the inner rotating cylinder and the outer cylinder are connected, and the outer cylinder is provided with a sewage discharge channel.

[0022] A self-cleaning method for a cleaning spray device of a wafer spin dryer, characterized in that the wafer spin dryer is a cleaning spray device for a wafer spin dryer, comprising:

[0023] S100: The equipment enters the self-cleaning working state. The inner drum rotates, and the nozzles of the external spray washing device on the outer drum wall spray cleaning medium to clean the outer wall of the inner drum.

[0024] S200: After the self-cleaning of the outer wall of the inner rotating drum is completed, the inner rotating drum continues to rotate, the nozzle of the outer spray washing device stops spraying, and the spray bar of the inner rotating drum begins to spray the cleaning medium.

[0025] The technical effects of this utility model are as follows: The cleaning spray device and the spin-drying device of the wafer spin-drying equipment of this utility model have the following advantages: (1) The method of spraying cleaning medium is used instead of soaking cleaning medium, which saves the consumption of cleaning medium; (2) The cleaning medium can be sprayed directly to the outer wall of the inner rotating drum, which can achieve more thorough, effective and direct self-cleaning operation; (3) The cleaning medium sprayed through the central spray bar in the center of the inner rotating drum can effectively achieve self-cleaning of the equipment cleaning or spin-drying chamber, avoiding the generation of secondary pollution in its working chamber. Attached Figure Description

[0026] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0027] Figure 1 This is a schematic diagram of the cleaning spray device of the wafer spin dryer according to an embodiment of the present invention.

[0028] Figure 2 This is a schematic diagram of the spray bar according to an embodiment of the present invention.

[0029] Figure 3 This is a cross-sectional view of the spray bar according to an embodiment of the present invention.

[0030] Figure 4 This is a schematic diagram of the spray bar connected to two fluid channels in an embodiment of this utility model.

[0031] Figure 5 This is a schematic diagram of a wafer spin dryer according to an embodiment of the present invention. Detailed Implementation

[0032] The technical solution of this utility model will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0033] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0034] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0035] The specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustration and explanation only and are not intended to limit the scope of this utility model.

[0036] like Figures 1 to 5 As shown, a cleaning spray device for a wafer spin-drying apparatus according to this embodiment includes an inner rotating drum 2 and an outer drum 3 disposed outside the inner rotating drum 2. The inner rotating drum 2 is driven by a drive device to rotate and spin-dry. The outer drum 3 is provided with an external spray cleaning device 10. At least one external spray cleaning device is provided, and two or more can be provided as needed. The external spray cleaning device 10 includes at least one fluid circuit and a nozzle 102 communicating with the fluid circuit. The fluid circuit is connected to an external cleaning fluid supply device for supplying cleaning fluid. The fluid circuit can be an existing device such as a conduit. The nozzle 102 is correspondingly disposed to the side wall of the inner drum 2, and the cleaning fluid sprayed from the nozzle 102 cleans the outer wall of the inner rotating drum 2. The inner rotating drum 2 is provided with an internal spray cleaning device 20, which is located in the inner cavity of the inner rotating drum 2 and cleans the inside of the inner rotating drum 2 through the internal spray cleaning device 20. The internal spray cleaning device 20 includes a spray bar 6, which is mounted on the rotation axis f of the inner rotating drum 2. The spray bar 6 has a spray nozzle 61, from which cleaning fluid is sprayed to clean the inner cavity of the inner rotating drum 2. In the above technical solution, the external spray cleaning device 10 sprays cleaning medium to achieve the self-cleaning function of the outer wall of the inner rotating drum 2, and the central spray bar 6 sprays cleaning medium to achieve the self-cleaning function of the inner wall of the inner rotating drum 2, thereby enabling thorough cleaning of both the inside and outside of the inner rotating drum. Through the above technical solution, the method of spraying cleaning medium replaces the soaking method of cleaning medium, saving the consumption of cleaning medium; the cleaning medium can be sprayed directly to the outer wall of the inner rotating drum, achieving a more thorough, effective, direct, and efficient self-cleaning operation; the cleaning medium sprayed by the central spray bar of the inner rotating drum can effectively achieve self-cleaning of the equipment cleaning or spin-drying chamber, avoiding secondary pollution of its working chamber.

[0037] In this embodiment, the inner rotating cylinder and the outer cylinder are coaxially arranged. The inner rotating cylinder 2 has an annular wall with a perforated portion 21. The perforated portion 21 is located between the inner spray washing device and the outer spray washing device, so that the perforated portion 21 can be cleaned more thoroughly through the combined internal and external spray washing. The outer cylinder 3 has at least one window 31 on its side wall. The outer spray washing device 10 includes a nozzle plate 101, which is located at the window 31. The nozzles 102 are located on the nozzle plate 101, which facilitates the installation of the nozzle plate 101 on the outer cylinder 3. The cleaning medium is sprayed onto the inner cylinder through the nozzles 102. The nozzle plate 101 has a plurality of nozzles 102, and a plurality of fluid circuits are respectively connected to the corresponding nozzles 102. When there are two or more fluid circuits, different cleaning media can be sprayed out through different nozzles 102 by connecting with different nozzles 102. This allows different and mutually interfering cleaning media to flow in different fluid circuits, thereby completely solving the problem of mutual interference between these cleaning media.

[0038] In this embodiment, the spray bar is cylindrical. One end of the spray bar 6 has an interface 63, and the other end is a closed end 64. The interface 63 is used to connect to a fluid channel. The outer circumference of the spray bar 6 has spray nozzles 61, and several spray nozzles 61 are spaced apart along the axial direction of the spray bar 6. At least one conveying channel 62 is provided inside the spray bar 6. The conveying channel 62 communicates with the spray nozzles 61 and is used to convey cleaning medium to the spray nozzles through the fluid channel. The conveying channel 62 extends from the interface 63 to the closed end. In the above technical solution, the fluid channel is connected to an external cleaning medium supply device, distributing the cleaning medium through the conveying channel 62 to different spray nozzles 61 for spraying, so that the cleaning medium is sprayed at different positions on the spray bar 6.

[0039] Specifically, the spray nozzles 61 are located on the outer circumference of the spray bar 6, and several spray nozzles 61 are arranged along the axial direction of the spray bar 6, as shown in Figure (2). When the spray nozzles are connected to a fluid channel C, the fluid channel C delivers the cleaning medium to the spray nozzles 61. The spray nozzles c1 to c6 are arranged axially. Through the spray nozzles 61 at different heights, the inner wall of the inner rotating cylinder 2 can be more thoroughly cleaned. The spray bar 6 is provided with at least one conveying channel 62. The conveying channel 62 extends axially from one end of the spray bar 6 and is connected to the spray nozzles 61. The fluid channel C is connected to the conveying channel 62, and the cleaning medium is delivered to the spray nozzles 61 through the conveying channel 62, so that several spray nozzles 61 can be connected through a conveying channel 62, and the cleaning medium can be quickly distributed to different spray nozzles 61.

[0040] In this embodiment, the spray bar 6 is provided with several sets of spray nozzles 61, each set of spray nozzles is connected to a conveying channel 62, and each set of spray nozzles 61 is provided with several spray nozzles along the axial direction of the spray bar. The spray bar 6 is provided with at least two conveying channels 62, which are arranged in parallel and connected to the spray nozzles 61. As shown in Figure (4), fluid channels A and B are respectively connected to the two conveying channels 62 of the spray bar 6. Fluid channel A is connected to the spray nozzles a1 to a6 through the conveying channel, and fluid channel B is connected to the spray nozzles b1 to b6 through another conveying channel. a1 and b1 are located on the same cross section of the spray bar, and the cleaning media of the two fluid channels can be sprayed out through different conveying channels 62. When the equipment starts a self-cleaning working cycle, cleaning medium A can be sprayed first through the inner hole on the right side, and then cleaning medium B can be sprayed through the inner hole on the left side. Cleaning medium A and cleaning medium B may be used to target different types of dirt particles remaining on the inner wall of the inner rotating cylinder 3, or to deal with different cleaning process steps.

[0041] Furthermore, the same group of spray nozzles is arranged axially along the spray bar 6, with adjacent groups of spray nozzles spaced apart at the cross-sectional position of the spray bar 6. The opening of the spray nozzle 61 is arc-shaped and surrounds the spray bar 6, thereby expanding the spray range of the spray nozzle 61 in the lateral direction, thus achieving a large coverage area in both the lateral and longitudinal directions. The spray bar 6 includes a spray section 65 and a plug-in section 66 connected to one end of the spray section 65. The diameter of the spray section 65 is larger than that of the plug-in section 66, thereby facilitating the positioning and installation of the spray pipe through the stepped portion formed between the plug-in section and the spray section. The interface 63 is located at the end of the plug-in section 66, and the spray nozzle 61 is located in the spray section 65, thus ensuring that the spray bar 6, after installation, does not interfere with the communication with the fluid channel.

[0042] In this embodiment, the driving device includes an input shaft 5 connected to the inner rotating cylinder 2, driving the inner rotating cylinder to rotate. The spray bar 6 passes through the inner rotating cylinder 2, the outer rotating cylinder 3, and the input shaft 5. One end of the spray bar 6 is connected to a fluid channel on the outside of the input shaft 5, so that the rotation of the input shaft 5 will not affect the supply of cleaning medium and the spraying cleaning of the spray bar 6. The inner rotating cylinder 2 and the outer cylinder 3 are connected. The outer cylinder 3 is provided with a drain channel 7. The cleaning liquid in the inner rotating cylinder 2 is discharged through the perforated part 21 on the side wall of the inner rotating cylinder 2. The cleaning medium of the inner rotating cylinder 2 and the outer cylinder 3 and the dirt particles it carries flow out of the working chamber through the drain channel 7 of the outer cylinder.

[0043] A self-cleaning method for a cleaning spray device of a wafer spin dryer includes: S100: The equipment enters the self-cleaning working state, the inner rotating drum 2 rotates, and the nozzle of the external spray washing device 10 on the wall of the outer drum 3 sprays cleaning medium to clean the outer wall of the inner rotating drum 2; S200: After the self-cleaning of the outer wall of the inner rotating drum 2 is completed, the inner rotating drum 2 continues to rotate, the nozzle of the external spray washing device 10 stops spraying, and the spray bar of the inner rotating drum 2 begins to spray cleaning medium.

[0044] The cleaning spray device and spin-drying device of the wafer spin-drying equipment of this embodiment have the following advantages: (1) The method of spraying cleaning medium is used instead of soaking cleaning medium, which saves the consumption of cleaning medium; (2) The cleaning medium can be sprayed directly to the outer wall of the inner rotating drum, which can achieve more thorough, effective and direct self-cleaning operation; (3) The cleaning medium sprayed through the central spray bar in the center of the inner rotating drum can effectively achieve self-cleaning of the equipment cleaning or spin-drying chamber, avoiding the generation of secondary pollution in its working chamber.

[0045] The cleaning spray device and the spin-drying device of the wafer spin-drying equipment of this utility model have been described above. However, this utility model is not limited to the specific embodiments described above. Various modifications or alterations can be made without departing from the scope of the claims. This utility model includes various modifications and alterations within the scope of the claims.

[0046] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and not to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.

Claims

1. A cleaning and spraying device for a wafer spin dryer, comprising an inner rotating drum and an outer drum disposed outside the inner rotating drum, the inner rotating drum being driven by a driving device, characterized in that, The outer cylinder is equipped with an external spray washing device, which includes at least one fluid circuit and a nozzle connected to the fluid circuit. The nozzle is correspondingly arranged with the side wall of the inner cylinder. The cleaning fluid sprayed from the nozzle cleans the outer wall of the inner rotating cylinder. The inner rotating cylinder is equipped with an internal spray washing device, which is located in the inner cavity of the inner rotating cylinder. The internal spray washing device includes a spray rod, which is arranged on the rotation axis of the inner rotating cylinder. The spray rod has a spray nozzle, and the cleaning fluid sprayed from the spray nozzle cleans the inner cavity of the inner rotating cylinder.

2. The cleaning and spraying device of the wafer spin dryer according to claim 1, characterized in that, The inner rotating cylinder is coaxially arranged with the outer cylinder. The inner rotating cylinder has an annular wall with a hollowed-out section located between the inner spray washing device and the outer spray washing device.

3. The cleaning and spraying device of the wafer spin dryer according to claim 2, characterized in that, The outer cylinder sidewall is provided with at least one window, and the external spray washing device includes a nozzle plate, which is located at the window position, and the nozzle is located on the nozzle plate.

4. The cleaning and spraying device of the wafer spin dryer according to claim 3, characterized in that, The nozzle plate is provided with a number of nozzles, and a number of fluid circuits are respectively connected to the corresponding nozzles.

5. The cleaning and spraying device of the wafer spin dryer according to any one of claims 1 to 4, characterized in that, The spray nozzles are located on the outer circumference of the spray bar, and several spray nozzles are arranged along the axial direction of the spray bar.

6. The cleaning and spraying device of the wafer spin dryer according to claim 5, characterized in that, The spray bar is provided with at least one conveying channel, which extends axially from one end of the spray bar and is connected to the spray nozzle.

7. The cleaning and spraying device of the wafer spin dryer according to claim 6, characterized in that, The spray bar has at least two conveying channels, which are arranged in parallel and connected to the spray nozzle.

8. The cleaning and spraying device of the wafer spin dryer according to claim 1, characterized in that, The driving device includes an input shaft connected to an inner rotating cylinder, which drives the inner rotating cylinder to rotate. The spray bar passes through the inner rotating cylinder, the outer rotating cylinder, and the input shaft, and a fluid channel is connected to one end of the spray bar outside the input shaft.

9. The cleaning and spraying device of the wafer spin dryer according to claim 1, characterized in that, The inner rotating cylinder and the outer cylinder are connected, and the outer cylinder is equipped with a sewage discharge channel.

10. A wafer spin-drying device, characterized in that, The wafer spin dryer has the cleaning spray device as described in any one of claims 1 to 9.

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