Chip transfer device with shockproof function

Through a multi-layered anti-vibration design that combines internal and external elements, the problem of insufficient protection against multi-directional vibration and impact in traditional chip transfer devices has been solved, achieving comprehensive chip protection and ease of operation.

CN223494524UActive Publication Date: 2025-10-31DALIAN KAITAILONG EQUIP CO LTD
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Patent Information

Application Number
CN202423082298.3
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-13
Publication Date
2025-10-31
Estimated Expiration
2034-12-13

AI Technical Summary

Technical Problem

Traditional chip transfer devices are limited in their effectiveness in mitigating vibration and impact, especially neglecting horizontal protection, which increases the risk of chip damage.

Method used

It adopts a multi-layered shockproof design that combines internal and external components, including an external shockproof assembly consisting of an external universal wheel, a sliding cylinder, a first guide rod, and a first elastic element, and an internal shockproof assembly consisting of an internal damper, a limit rod, and a third elastic element. Combined with a two-way threaded rod and handwheel design, it achieves all-round shock absorption protection.

Benefits of technology

It effectively protects chips from damage by multi-directional vibration and impact, significantly reduces scrap rate, and improves the safety and convenience of operation.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of chip transportation, in particular to a chip transfer device with a shockproof function, which comprises a bearing frame, a push handle, a placement box and a support plate, the push handle is arranged on one side of the bearing frame, the placement box is arranged at the top of the bearing frame, a plurality of independent storage cavities are arranged in the placement box, and the support plate is arranged in the storage cavities. And a supporting plate is arranged in each storage cavity. According to the device, the inside and outside combined multi-layer shockproof design is adopted, when vibration or collision in the vertical direction is encountered, transmission of ground impact force is reduced through cooperation of the universal wheels, the sliding cylinders, the first guide rods and the first elastic pieces, and when vibration or collision in the horizontal direction is encountered, transmission of the ground impact force is reduced through the synergistic effect of the dampers, the limiting rods and the elastic pieces; and vibration and impact force are effectively absorbed and dispersed, so that comprehensive effective protection is provided, chips are prevented from being physically damaged in any direction in the transportation process, the damage risk caused by vibration or impact is reduced, and the rejection rate is remarkably reduced.
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Description

Technical Field

[0001] This utility model relates to the field of chip transportation technology, and in particular to a chip transfer device with shockproof function. Background Technology

[0002] In the field of modern information technology, chips are core components, and their performance and reliability are directly related to the operation of the entire system. Chip manufacturing involves a series of complex processes, including but not limited to photolithography, etching, deposition, doping, and packaging. After each process is completed, the chip or semi-finished product needs to be safely transferred from one workstation to the next. In this process, in order to ensure that the quality of the chip is not affected, reliable transfer devices must be used to protect these highly sensitive electronic components.

[0003] Traditional chip transfer devices typically employ basic shock-absorbing measures such as anti-vibration wheels to mitigate the impact of vibrations and impacts on the chips during transfer. However, in actual operating environments, anti-vibration wheels can only handle minor vibrations and impacts and cannot effectively buffer larger impacts. Furthermore, traditional transfer devices only buffer vibrations and impacts in the vertical direction, neglecting horizontal impacts, which increases the risk of chip damage and thus affects production efficiency and the quality of the final product.

[0004] Therefore, there is an urgent need to provide a chip transport device with shockproof function. Through a multi-layered shockproof design that combines internal and external elements, the device can reduce multi-directional vibrations and impacts encountered during transport, thereby effectively protecting the chip from damage. Utility Model Content

[0005] In order to overcome the shortcomings of traditional chip transfer devices that use shock-absorbing wheels for shock absorption and protection, which have limited effectiveness and lack multi-dimensional protection, this utility model provides a chip transfer device with shock absorption function.

[0006] To address the aforementioned issues, this utility model employs the following technical solution: a chip transfer device with shockproof function, comprising a mounting frame, a push handle, a placement box, a support plate, an observation window, an external shockproof component, and an internal shockproof component. The push handle is located on one side of the mounting frame, and the placement box is located on the top of the mounting frame. The placement box contains multiple independent storage cavities, each containing a support plate with a placement slot. The observation window is embedded on both sides of the placement box. The external shockproof component is located at the bottom of the mounting frame and consists of casters, a sliding cylinder, a first guide rod, and a first elastic element. The sliding cylinder is fixedly connected to the top of the casters. The guide rod is fixed to the bottom of the mounting frame. The caster wheel is slidably mounted on the first guide rod through the sliding cylinder. The first elastic element is sleeved on the first guide rod, and its two ends are respectively connected to the mounting frame and the sliding cylinder. The internal shock-absorbing assembly is set inside the placement box and consists of a damper, a fixing block, a limiting rod and a third elastic element. The damper is set between the support plate and the bottom of the storage cavity. The fixing block is also set in each storage cavity. The limiting rod is rotatably connected to the fixing block. The limiting rod is slidably connected to the adjacent support plate. The third elastic element is sleeved on the limiting rod, and its two ends are respectively connected to the support plate and the fixing block.

[0007] Optionally, it also includes a bidirectional threaded rod, a door, and a handwheel. The bidirectional threaded rod is rotatably provided on the side of the placement box, and the door is symmetrically distributed and slidably provided on the top of the placement box. The door can move horizontally on the placement box and is threadedly connected to the bidirectional threaded rod. The handwheel is provided at one end of the bidirectional threaded rod.

[0008] Optionally, it also includes a clamping plate, a second guide rod, and a second elastic element. The second guide rod is provided on the side of the placement slot of each support plate. The clamping plate is fixed to the second guide rod, and the second elastic element is sleeved on the second guide rod. Its two ends are respectively connected to the clamping plate and the support plate.

[0009] Optionally, it also includes a sponge pad, which is provided on the side of the clamp that contacts the chip.

[0010] Optionally, it also includes a telescopic protective sleeve, which is connected between the caster wheel and the mounting frame.

[0011] Optionally, it also includes an anti-slip sleeve, which is fitted onto the push handle.

[0012] Compared with the prior art, the present invention has the following technical effects: 1. The device adopts a multi-layer shockproof design that combines internal and external components. When encountering vertical vibration or impact, the universal wheel, sliding cylinder, first guide rod and first elastic element work together to reduce the transmission of ground impact force. When encountering horizontal vibration or impact, the damper, limit rod and elastic element work together to effectively absorb and disperse vibration and impact force, thereby providing comprehensive and effective protection, ensuring that the chip is not physically damaged in any direction during transportation, reducing the risk of damage caused by vibration or impact, and thus significantly reducing the scrap rate.

[0013] 2. The combination of a two-way threaded rod and a handwheel allows for easy and quick opening and closing of the cabinet door, ensuring safety and convenience during chip transport. In addition, these designs make the opening and closing of the cabinet door more stable and reliable, avoiding the instability that may be caused by traditional manual push-pull cabinet doors.

[0014] 3. Through the combined design of the clamping plate, the second guide rod, and the second elastic element, the chip is automatically clamped and fixed, making the insertion and removal of the chip more convenient and faster, while significantly improving the safety of the chip during transportation. Attached Figure Description

[0015] Figure 1 This is a three-dimensional structural diagram of the present invention.

[0016] Figure 2 This is a three-dimensional sectional view of the universal wheel, sliding cylinder, and telescopic protective sleeve of this utility model.

[0017] Figure 3 This is a three-dimensional structural diagram of the mounting frame, placement box, and bidirectional threaded rod of this utility model.

[0018] Figure 4 This is a three-dimensional sectional view of the placement box, support plate, and clamping plate of this utility model.

[0019] Figure 5 This is a three-dimensional sectional view of the support plate, damper, and fixing block of this utility model.

[0020] Figure 6 This is a three-dimensional sectional view of the fixing block, limiting rod, and third elastic element of this utility model.

[0021] The meanings of the labels in the attached diagram are as follows: 1: mounting frame, 2: caster wheel, 3: push handle, 4: placement box, 5: observation window, 6: sliding cylinder, 7: first guide rod, 8: first elastic element, 9: double-threaded rod, 10: box door, 11: handwheel, 12: support plate, 13: clamping plate, 14: second guide rod, 15: second elastic element, 16: damper, 17: fixing block, 18: limit rod, 19: third elastic element, 20: sponge pad, 21: telescopic protective sleeve, 22: anti-slip sleeve. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] Example 1: Please refer to Figure 1 and Figure 4 A chip transfer device with shockproof function includes a mounting frame 1, a push handle 3, a placement box 4, a support plate 12, an observation window 5, an anti-slip sleeve 22, an external shockproof component, and an internal shockproof component. The push handle 3 is located on the right side of the mounting frame 1, and the anti-slip sleeve 22 is fitted on the push handle 3. The anti-slip sleeve 22 is usually made of a soft and elastic material, which can provide a better grip and reduce hand fatigue. The placement box 4 is located on the top of the mounting frame 1. The placement box 4 has three independent storage cavities. Each storage cavity has a support plate 12. The support plate 12 has two placement slots for storing chips. Observation windows 5 are embedded on both sides of the placement box 4 so that the operator can check the status of the chips at any time.

[0024] Please see Figure 2 The external shock-absorbing components are located at the bottom of the mounting frame 1 and consist of four casters 2, sliding cylinders 6, four sets of first guide rods 7, first elastic elements 8, and telescopic protective sleeves 21. The top of each of the four casters 2 is fixed with a sliding cylinder 6. The four sets of first guide rods 7 are fixed around the bottom of the mounting frame 1, with four rods in each set. The four casters 2 are slidably mounted on the four sets of first guide rods 7 through the sliding cylinders 6. Each set of first guide rods 7 is fitted with a first elastic element 8, the two ends of which are connected to the mounting frame 1 and the sliding cylinder 6, respectively, to provide a restoring force for the casters 2, thereby buffering and absorbing the impact force from the ground. The telescopic protective sleeve 21 connects the casters 2 and the mounting frame 1. The telescopic protective sleeve 21 can effectively prevent dust, water vapor, and other external pollutants from entering the connection between the casters 2 and the mounting frame 1, extending the service life of the casters 2 and the sliding cylinders 6, and ensuring their long-term stable operation.

[0025] Please see Figures 4-6 The internal shock-absorbing components are located inside the placement box 4 and consist of four dampers 16, three sets of fixing blocks 17, limiting rods 18, and a third elastic element 19. Four dampers 16 are arranged in a circumferential pattern between the support plate 12 and the bottom of the storage cavity. The dampers 16 convert mechanical energy into heat energy or other forms of energy through internal friction, liquid viscosity, or gas resistance, thereby eliminating vibration. Each storage cavity is also equipped with two fixing blocks 17, and each fixing block 17 is rotatably connected to a limiting rod 18. The limiting rod 18 is slidably connected to the adjacent support plate 12. The limiting rod 18 pulls the support plate 12 to cope with the impact in the front and rear directions. A third elastic element 19 is sleeved on the limiting rod 18, and its two ends are connected to the support plate 12 and the fixing blocks 17 respectively, providing additional shock absorption for the support plate 12 and helping it to return to its original position after an impact.

[0026] When the device moves on uneven ground, the casters 2 can rotate freely and adapt to changes in ground. When encountering bumps or irregular terrain, the external shock-absorbing components take effect first. The casters 2 move up and down along the first guide rod 7 via the sliding cylinder 6. At this time, the first elastic element 8 is compressed or stretched, effectively absorbing and mitigating the impact force from the ground and preventing these forces from being directly transmitted to the placement box 4. At the same time, the internal shock-absorbing components further enhance the protective effect. The damper 16 absorbs and consumes the energy generated by external vibration or impact in multiple directions, thereby significantly reducing the impact force acting on the chip. When the device encounters a horizontal impact, the limit rod 18 restricts the forward and backward movement of the support plate 12, while the third elastic element 19 provides a restoring force after the support plate 12 moves, helping it to quickly return to its initial position and further buffering and dispersing the force acting on the support plate 12, ensuring the safety and stability of the chip.

[0027] Example 2

[0028] Based on Example 1, please refer to Figure 3 It also includes a bidirectional threaded rod 9, a door 10, and a handwheel 11. The bidirectional threaded rod 9 is rotatably mounted on the right side of the placement box 4. The two ends of the bidirectional threaded rod 9 have opposite thread directions. The top of the placement box 4 is slidably mounted with symmetrically distributed doors 10. The two doors 10 can move horizontally on the placement box 4 and are threadedly connected to the bidirectional threaded rod 9. When the bidirectional threaded rod 9 rotates, the two doors 10 will move synchronously towards or away from each other because the thread directions at both ends are opposite, thereby realizing the function of opening or closing the placement box 4 at the same time. The front end of the bidirectional threaded rod 9 is provided with a handwheel 11, which can easily control the rotation of the bidirectional threaded rod 9 by rotating the handwheel 11.

[0029] When it is necessary to open the placement box 4, turn the handwheel 11 to rotate the bidirectional threaded rod 9 clockwise. Since the threads at both ends of the bidirectional threaded rod 9 are in opposite directions, the two boxes 10 will move outward along the placement box 4, gradually opening the placement box 4. When it is necessary to close the placement box 4, turn the handwheel 11 in the opposite direction to rotate the bidirectional threaded rod 9 counterclockwise. The two boxes 10 will move inward along the placement box 4, gradually closing the placement box 4. Through the combined design of the bidirectional threaded rod 9 and the handwheel 11, the operator can easily and quickly complete the opening and closing of the boxes 10, ensuring the safety and convenience of the chip transfer process. In addition, it makes the opening and closing of the boxes 10 more stable and reliable, avoiding the instability that may be caused by the traditional manual push-pull boxes 10.

[0030] Please see Figure 4 It also includes a clamping plate 13, a second guide rod 14, a second elastic element 15, and a sponge pad 20. Each support plate 12 has two parallel second guide rods slidably arranged on the side of the placement slot. The second guide rods 14 can move back and forth. Each pair of adjacent second guide rods 14 are fixedly connected to the clamping plate 13 for holding the chip. Each second guide rod 14 is fitted with a second elastic element 15, whose two ends are connected to the clamping plate 13 and the support plate 12 respectively, providing appropriate clamping force for the clamping plate 13. The side of the clamping plate 13 that contacts the chip is provided with a sponge pad 20. The sponge pad 20 is soft and has a certain cushioning, which can provide additional protection when the clamping plate 13 holds the chip, preventing the clamping plate 13 from causing scratches or indentations on the chip surface.

[0031] When placing the chip, the operator places the chip between the clamping plate 13 and the placement slot of the support plate 12. As the chip is placed in, the clamping plate 13 moves outward under the pressure of the chip. The second guide rod 14 also moves to guide the clamping plate 13 and compresses the second elastic member 15 during this process. When the chip is fully placed in the placement slot, the restoring force generated by the second elastic member 15 causes the clamping plate 13 to move inward to clamp the chip, ensuring that the chip will not move due to vibration or impact during transportation, thus further protecting the safety of the chip.

[0032] The above embodiments are provided for those skilled in the art to implement or use the present invention. Those skilled in the art can make various modifications or changes to the above embodiments without departing from the inventive concept of the present invention. Therefore, the protection scope of the present invention is not limited to the above embodiments, but should be the maximum scope that conforms to the innovative features mentioned in the claims.

Claims

1. A chip transfer device with shockproof function, comprising a mounting frame (1), a push handle (3), a placement box (4), a support plate (12), and an observation window (5), wherein the push handle (3) is provided on one side of the mounting frame (1), the placement box (4) is provided on the top of the mounting frame (1), the placement box (4) has multiple independent storage cavities inside, each storage cavity is provided with the support plate (12), the support plate (12) is provided with a placement groove, and the observation window (5) is embedded on both sides of the placement box (4), characterized in that: It also includes an external shock-absorbing component and an internal shock-absorbing component. The external shock-absorbing component is located at the bottom of the mounting frame (1) and consists of a caster wheel (2), a sliding cylinder (6), a first guide rod (7), and a first elastic element (8). The top of the caster wheel (2) is fixed to the sliding cylinder (6). The first guide rod (7) is fixed to the bottom of the mounting frame (1). The caster wheel (2) is slidably mounted on the first guide rod (7) through the sliding cylinder (6). The first elastic element (8) is sleeved on the first guide rod (7), and its two ends are respectively connected to the mounting frame (1) and the sliding cylinder (6). The internal shock-absorbing component... The shock-absorbing component is installed inside the placement box (4) and consists of a damper (16), a fixing block (17), a limiting rod (18), and a third elastic element (19). The damper (16) is provided between the support plate (12) and the bottom of the storage cavity. The fixing block (17) is also provided in each storage cavity. The limiting rod (18) is rotatably connected to the fixing block (17). The limiting rod (18) is slidably connected to the adjacent support plate (12). The third elastic element (19) is sleeved on the limiting rod (18), and its two ends are respectively connected to the support plate (12) and the fixing block (17).

2. A chip transfer device with shockproof function according to claim 1, characterized in that: It also includes a bidirectional threaded rod (9), a box door (10) and a handwheel (11). The bidirectional threaded rod (9) is rotatably arranged on the side of the placement box (4), and the box doors (10) are symmetrically distributed and slidably arranged on the top of the placement box (4). The box doors (10) can move horizontally on the placement box (4) and are threadedly connected to the bidirectional threaded rod (9). The handwheel (11) is provided at one end of the bidirectional threaded rod (9).

3. A chip transfer device with shockproof function according to claim 2, characterized in that: It also includes a clamping plate (13), a second guide rod (14), and a second elastic element (15). The second guide rod (14) is provided on the side of the placement groove of each support plate (12). The clamping plate (13) is fixedly connected to the second guide rod (14). The second elastic element (15) is sleeved on the second guide rod (14), and its two ends are respectively connected to the clamping plate (13) and the support plate (12).

4. A chip transfer device with shockproof function according to claim 3, characterized in that: It also includes a sponge pad (20), which is provided on the side of the clamp (13) that contacts the chip.

5. A chip transfer device with shockproof function according to claim 4, characterized in that: It also includes a telescopic protective sleeve (21), and the telescopic protective sleeve (21) is connected between the caster wheel (2) and the mounting frame (1).

6. A chip transfer device with shockproof function according to claim 5, characterized in that: It also includes an anti-slip sleeve (22), which is fitted onto the push handle (3).