Carrier tape for loading chips

Abstract

The utility model provides a carrier tape for loading chips, which comprises a carrier tape provided with a plurality of concave accommodating parts arranged along the length direction of the carrier tape, the plurality of concave accommodating parts are used for accommodating the chips; the carrier tape comprises a plurality of concave containing parts, the carrier tape is provided with a plurality of concave containing parts, the cover tape covers the carrier tape, the carrier tape further comprises one or more dissociable bonding parts, and the dissociable bonding parts are attached to the surfaces, facing the plurality of concave containing parts of the carrier tape, of the cover tape. The dissociable adhesive part is configured to adhere the chip accommodated in the concave accommodating part, and the adhesive force is reduced to release the chip when the dissociable adhesive part is heated or irradiated by ultraviolet light. According to the technical scheme of the utility model, the dissociable bonding part is arranged on the cover tape, and the chip is bonded and fixed by the dissociable bonding part, so that the chip is suspended and fixed in the concave accommodating part, and the chip, especially the micro convex points on the chip, is prevented from being in direct contact with the concave accommodating part of the carrier tape in the transportation and treatment process; therefore, the risk of damage is reduced.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor packaging and electronic manufacturing technology. Specifically, this utility model provides a carrier tape for loading chips. Background Technology

[0002] With the miniaturization of electronic devices becoming a significant trend in the global market, the development of modern technologies such as high-performance computing, 5G communications, and artificial intelligence has driven the continued growth in demand for semiconductor devices. Among various electronic architectures, 3D ICs (three-dimensional integrated circuits) and 2.5D ICs (two-point-five-dimensional integrated circuits) have become the most advanced electronic circuit solutions due to their advantages in performance and integration. Among these advanced IC packaging technologies, micro-bumps are highly favored for their superior reliability offered in 3D IC designs.

[0003] However, damage to microbumps and / or chip edges and corners can directly affect the final IC assembly yield. During chip packaging and transportation, contact between microbumps and the carrier tape can pose a potential risk of damage. Furthermore, chips are easily moved or bumped within the concave housing of the carrier tape, causing damage to chip edges and corners. Therefore, effectively protecting chips, especially their microbumps, during packaging and transportation to prevent damage during transport and assembly has become a pressing issue for the industry.

[0004] Traditional protection methods involve providing additional support features within the concave receptacle of the carrier tape to prevent microbumps from contacting the bottom of the carrier tape. However, this design is limited by chip size and microbump layout, and has limitations in practical operation. Furthermore, existing solutions propose using adhesives to secure the chip to the bottom of the pocket to prevent chip movement and impact. While this method offers some protection, adding adhesive to the bottom of the concave receptacle of the carrier tape is technically complex.

[0005] In summary, existing technologies present numerous challenges in protecting chips during packaging and transportation. Developing a carrier tape that can effectively prevent damage to chips, especially their microbumps, during transportation and handling is of great significance. Utility Model Content

[0006] Based on the technical problems described above, the purpose of this utility model is to provide a carrier tape for loading chips. The carrier tape achieves the suspension and fixation of the chip in the concave receiving part by providing a specific design of a detachable adhesive part on the cover tape, thereby avoiding direct contact between the chip, especially the microbumps on it, and the carrier tape during transportation and handling, thus reducing the risk of damage to the chip, especially the microbumps on it.

[0007] The inventor of this utility model completed this utility model after in-depth and meticulous research.

[0008] Specifically, this utility model provides a carrier strip for loading chips, the carrier strip comprising:

[0009] A carrier tape having a plurality of concave receptacles disposed along its length for accommodating a chip; and

[0010] Cover tape covering the carrier tape,

[0011] The feature is that the carrier tape further includes one or more removable adhesive portions, which are attached to the surfaces of the cover tape facing the plurality of concave receptacles of the carrier tape, the removable adhesive portions being configured to adhere the chip receptacle within the concave receptacles and to release the chip by reducing the adhesive force when heated or irradiated with ultraviolet light. Attached Figure Description

[0012] The accompanying drawings, which are incorporated herein and form part of this specification, illustrate exemplary embodiments of the present invention and, together with the general description provided above and the detailed description provided below, serve to explain the features of the present invention.

[0013] Figure 1 Showing a top perspective view of a carrier strip for loading chips according to a specific embodiment of the present invention;

[0014] Figure 2 Display along Figure 1 A schematic cross-sectional view of the carrier strip for loading the chip shown in the diagram;

[0015] Figure 3 Display when Figure 2 A schematic cross-sectional view of the carrier tape containing the chip;

[0016] Figure 4 This diagram shows a detachable adhesive portion of a carrier tape for loading chips according to one embodiment of the present invention;

[0017] Figure 5 This diagram shows a detachable adhesive portion of a carrier tape for loading chips according to another embodiment of the present invention;

[0018] Figure 6 This diagram shows a detachable adhesive portion of a carrier strip for loading chips according to another embodiment of the present invention.

[0019] Figure 7 This diagram shows a cover strip for loading a chip according to one embodiment of the present invention;

[0020] Figure 8 A schematic diagram of a cover strip for loading a chip, according to another embodiment of the present invention, is shown; and

[0021] Figure 9 Showing a top perspective view of a carrier strip for loading chips according to another specific embodiment of the present invention. Detailed Implementation

[0022] It should be understood that, without departing from the scope or spirit of this disclosure, those skilled in the art can conceive of various other embodiments and can modify them based on the teachings of this specification. Therefore, the following specific embodiments are not intended to be limiting.

[0023] Unless otherwise specified, all figures used in this specification and claims to indicate feature dimensions, quantities, and physical properties should be understood to be modified by the term "about" in all cases. Therefore, unless stated to the contrary, the numerical parameters listed in the foregoing specification and appended claims are approximations, and those skilled in the art can appropriately modify these approximations to obtain the desired characteristics using the teachings disclosed herein. The use of numerical ranges indicated by endpoints includes all numbers within that range and any range within that range; for example, 1 to 5 includes 1, 1.1, 1.3, 1.5, 2, 2.75, 3, 3.80, 4, and 5, etc.

[0024] As mentioned earlier, while microbumps offer good reliability in advanced IC packaging (such as 3D ICs and 2.5D ICs), contact between microbumps and carrier tape during chip transport and assembly (T&R) can easily cause damage, directly or indirectly affecting the final IC assembly yield. According to the technical solution of this invention, a detachable adhesive portion is provided in the middle part of the cover tape of the carrier tape used to load the chip, near the chip side. This detachable adhesive portion has sufficient adhesive strength to adhere and adsorb the chip in the concave receiving portion of the carrier tape onto the cover tape, suspending the chip and preventing damage to its microstructure due to movement or shaking within the concave receiving portion. This effectively prevents contact between the microbumps and the carrier tape, thereby reducing the risk of damage.

[0025] Specifically, this utility model provides a carrier strip for loading chips, the carrier strip comprising:

[0026] A carrier tape having a plurality of concave receptacles disposed along its length for accommodating a chip; and

[0027] Cover tape covering the carrier tape,

[0028] The feature is that the carrier tape further includes one or more removable adhesive portions, which are attached to the surfaces of the cover tape facing the plurality of concave receptacles of the carrier tape, the removable adhesive portions being configured to adhere the chip receptacle within the concave receptacles and to release the chip by reducing the adhesive force when heated or irradiated with ultraviolet light.

[0029] According to a preferred embodiment of the present invention, the removable adhesive portion is a removable pressure-sensitive adhesive layer.

[0030] According to another preferred embodiment of the present invention, the removable adhesive portion comprises a backing layer and a removable pressure-sensitive adhesive layer in sequence, wherein the backing layer is attached to the cover strip.

[0031] According to another preferred embodiment of the present invention, the removable adhesive portion sequentially includes a backing layer, a primer layer and a removable pressure-sensitive adhesive layer, wherein the backing layer is attached to the cover strip.

[0032] Figure 1 A top perspective view of a carrier strip 1 for loading chips according to a specific embodiment of the present invention is shown. Furthermore, Figure 2 Showing along Figure 1 The diagram shows a cross-sectional view of the carrier strip 1 used to load the chip, represented by line L. Figure 1 and Figure 2 As shown, the carrier tape 1 includes: a carrier tape 2 having a plurality of concave receiving portions 3 arranged along its length direction a, the plurality of concave receiving portions 3 for receiving a chip; a cover tape 4 covering the carrier tape 2; and one or more removable adhesive portions 5, the removable adhesive portions 5 being attached to the surface of the cover tape 4 facing the concave receiving portions 3 of the carrier tape 2, the removable adhesive portions 5 being configured to adhere the chip received within the concave receiving portions 3 and to release the chip by reducing the adhesive force when heated or irradiated with ultraviolet light. The plurality of concave receiving portions 3 are equidistantly arranged along the length direction a of the carrier tape 1 in the middle portion of the carrier tape 1. In addition, the carrier tape 1 also includes a plurality of positioning holes 7, the plurality of positioning holes 7 being equidistantly arranged along the length direction a of the carrier tape 1 at the edge portions of the carrier tape 1.

[0033] Figure 3 Showing when Figure 2 The diagram shows a cross-sectional view of the carrier strip containing chip 6. Figure 3As shown, the chip 6 with microbumps is attached to the removable adhesive portion 5, achieving suspension and fixation of the chip 6 within the concave receiving portion 3. This prevents the microbumps on the chip 6 from directly contacting the carrier tape 2 during transportation and handling, thereby reducing the risk of damage to the microbumps. Of course, it is understood that the chip 6 can also be a chip without microbumps. Attaching the chip 6 to the removable adhesive portion 5 reduces the probability of movement and collision within the concave receiving portion 3, thus protecting the chip's edges and other shapes from damage.

[0034] According to the technical solution of this utility model, the main function of the removable adhesive part is to temporarily fix the chip, preventing it from directly contacting the carrier tape during transportation and handling, thereby protecting the microbumps and chip shape from damage. When needed, the stickiness of the removable adhesive part can be significantly reduced or eliminated through specific heat treatment or ultraviolet irradiation, allowing the chip to be easily separated from the cover tape, facilitating subsequent mounting processes.

[0035] The detachable adhesive portion is located in the middle of the cover tape, facing the carrier tape side. This design allows the detachable adhesive portion to directly contact the chip and provide the necessary adhesion.

[0036] According to some preferred embodiments of the present invention, the removable adhesive portion is a removable pressure-sensitive adhesive layer.

[0037] According to some preferred embodiments of the present invention, the removable adhesive portion sequentially includes a backing layer and a removable pressure-sensitive adhesive layer, wherein the backing layer is attached to the cover strip.

[0038] According to certain preferred embodiments of the present invention, the removable adhesive portion sequentially includes a backing layer, a primer layer, and a removable pressure-sensitive adhesive layer, wherein the backing layer is attached to the cover strip.

[0039] The thickness of the dissociable pressure-sensitive adhesive layer described above ranges from 10 to 100 μm, preferably 20 to 40 μm. This provides sufficient adhesion for the dissociable pressure-sensitive adhesive layer while ensuring reliability during the debonding process. Furthermore, before heating or UV irradiation, the dissociable pressure-sensitive adhesive layer has an initial tack (adhesive force) of 1.0 to 12 N / cm, preferably 3.0 to 8.0 N / cm, at room temperature, to firmly adhere the chip to the cover tape. Moreover, when the dissociable pressure-sensitive adhesive layer is heated to 80 to 190°C, preferably 100 to 125°C, preferably for 3 to 5 minutes, the adhesive force decreases to less than or equal to 0.20 N / cm, preferably less than or equal to 0.1 N / cm, and more preferably to the range of 0.03 to 0.05 N / cm. Furthermore, when the dissociable pressure-sensitive adhesive layer is subjected to ultraviolet light with a power of 400 mJ or higher, the adhesive strength decreases to less than or equal to 0.20 N / cm, preferably less than or equal to 0.1 N / cm, and more preferably to the range of 0.03-0.05 N / cm. This adhesive strength was measured at 23 degrees Celsius, a peel angle of 180 degrees, and a peel speed of 300 mm / min.

[0040] The dissociable pressure-sensitive adhesive layer that can be used in this invention can be composed of dissociable pressure-sensitive adhesives known in the art. These dissociable pressure-sensitive adhesives are commercially available or can be synthesized by known methods. Specific examples of dissociable pressure-sensitive adhesives that can be used in this invention include "Revalpha" and "Revaclean" dissociable tapes manufactured by Nitto Denko Corporation. Alternatively, the dissociable pressure-sensitive adhesive that can be used in this invention can also be synthesized according to the method described in Japanese Patent Application Publication No. 56-61468 (JPS5661468 A).

[0041] According to certain preferred embodiments of the present invention, preferably, the projected area of ​​the detachable adhesive portion on the cover tape is less than or equal to the projected area of ​​the opening of the concave receiving portion on the cover tape. By limiting the projected area of ​​the detachable adhesive portion, the adhesive area between the chip and the cover tape can be precisely controlled, ensuring that the chip is fixed in the necessary locations while avoiding unnecessary adhesion and improving the accuracy of the assembly process. Furthermore, limiting the adhesive area can prevent the cover tape from being over-adheded to the chip, reducing the risk of damage to the chip during the debonding process, especially in sensitive areas of the chip. When debonding is required, a smaller adhesive area allows for more concentrated heating or ultraviolet irradiation, thereby improving debonding efficiency and reducing the time and energy consumption required for debonding. In addition, controlling the adhesive area helps optimize the chip's positioning in the carrier tape, ensuring that the chip maintains the correct position during transportation and handling, reducing the risk of damage due to improper positioning. More preferably, the projected area of ​​the detachable adhesive portion on the cover tape is 70%-96% of the projected area of ​​the opening of the concave receiving portion on the cover tape.

[0042] Figure 4 A schematic diagram of a removable adhesive portion 5 of a carrier strip for loading a chip, according to one embodiment of the present invention, is shown. Figure 4 As shown, the removable adhesive portion 5 is a separate removable pressure-sensitive adhesive layer 6. The removable pressure-sensitive adhesive layer is directly adhered to the cover tape 4.

[0043] Figure 5 A schematic diagram of a removable adhesive portion 5 of a carrier strip for loading chips, according to another embodiment of the present invention, is shown. Figure 5 As shown, the removable adhesive portion 5 includes a removable pressure-sensitive adhesive layer 6 and a primer layer 7 that are bonded to each other, the primer layer 7 being bonded to the cover strip 4.

[0044] According to the technical solution of this utility model, the primer layer 7 can be composed of materials known in the art. Preferably, the primer layer can be composed of acrylic polymers (e.g., polyacrylamide, amination-modified acrylic polymers). These materials are commercially available.

[0045] Figure 6 A schematic diagram of a removable adhesive portion 5 of a carrier tape for loading a chip, according to one embodiment of the present invention, is shown. Figure 6 As shown, the removable adhesive portion 5 includes a removable pressure-sensitive adhesive layer 6, a primer layer 7, and a backing layer 8 that are bonded to each other in sequence, with the backing layer 8 bonded to the cover strip 4.

[0046] According to the technical solution of this utility model, the backing layer 8 can be made of materials known in the art. Preferably, the backing layer 8 can be made of polyethylene terephthalate (PET), polyester copolymers, or polyolefins (such as polyethylene and polyethylene copolymers, polypropylene and polyolefin copolymers). These materials are commercially available.

[0047] Figure 7 A schematic diagram of a cover strip 4 for a carrier strip 1 used to load a chip, according to one embodiment of the present invention, is shown. Figure 7 As shown, the cover tape 4 sequentially includes: a low-adhesion backing layer (LAB layer) 9; a backing layer 10; a primer layer 11; and a pressure-sensitive adhesive layer 12, wherein the low-adhesion backing layer 9 is the outermost layer of the cover tape 4, and the pressure-sensitive adhesive layer 12 is bonded to the removable adhesive portion 5.

[0048] According to the technical solution of this utility model, the low-tack backing layer (LAB layer) 9 can be made of materials known in the art. Preferably, the low-tack backing layer (LAB layer) 9 can be made of the following materials: polyvinyl-N-alkyl urethane (polyurethane) as described in US Patent 2532011; or organopolysiloxane copolymers as described in US Patent 5290615. The low-tack backing layer (LAB layer) is also commercially available.

[0049] Figure 8 A schematic diagram of a cover strip 4 for a carrier strip 1 for loading a chip, according to another embodiment of the present invention, is shown. Figure 8 As shown, the cover tape 4 sequentially includes: a low-tack backing layer (LAB layer) 9; a backing layer 13; an intermediate layer 14; and a heat-activated adhesive layer 15, wherein the backing layer 13 is the outermost layer of the cover tape 4, and the heat-activated adhesive layer 15 is bonded to the removable adhesive portion 5.

[0050] Figure 9 A top perspective view of a carrier strip 1 for loading chips according to another specific embodiment of the present invention is shown. Furthermore, along... Figure 9 The schematic diagram of the cross-section of the carrier strip 1 for loading the chip shown in the figure is also as follows. Figure 2 As shown. Figure 9 and Figure 2As shown, the carrier tape 1 includes: a carrier tape 2 having a plurality of concave receiving portions 3 arranged along its length direction a, the plurality of concave receiving portions 2 for accommodating a chip; a cover tape 4 covering the carrier tape 2; and a removable adhesive portion 5, the removable adhesive portion 5 being a continuous strip in the length direction a of the carrier tape 1 and attached to the surface of the cover tape 4 facing the carrier tape 2, the removable adhesive portion 5 being configured to adhere the chip accommodated in the concave receiving portions 3 and to release the chip by reducing the adhesive force when heated or irradiated with ultraviolet light. The plurality of concave receiving portions 3 are equidistantly arranged along the length direction a of the carrier tape 1 in the middle portion of the carrier tape 1. In addition, the carrier tape 1 also includes a plurality of positioning holes 7, the plurality of positioning holes 7 being equidistantly arranged along the length direction a of the carrier tape 1 at the edge portions of the carrier tape 1.

[0051] The carrier tape according to this utility model can be effectively used for chip storage and transportation, avoiding direct contact between the chip's microbumps and chip shape and the carrier tape during transportation and handling, thereby reducing the risk of chip damage, especially to microbumps.

[0052] Specifically, in chip packaging operations, following the conventional carrier tape packaging process, the chip (such as an HBM chip) is placed in the concave receiving portion of the carrier tape. At this point, the removable adhesive portion attached to the cover tape uses its adhesive force to adhere and absorb the chip onto the cover tape, suspending the chip in the concave receiving portion. This prevents the microbumps from contacting the carrier tape and also avoids contact between the chip's outline and the wall of the concave receiving portion, effectively preventing damage caused by shaking or collisions during transportation.

[0053] The cover tape provides excellent protection for the chip during transportation. The removable pressure-sensitive adhesive layer of the removable adhesive portion has sufficient adhesion to ensure that the chip is stably attached to the cover tape even under vibration and bumps that may be encountered during transportation, preventing the chip from moving within the concave receiving portion and preventing damage to tiny solder balls or the device itself due to impact.

[0054] When performing a placement operation, the carrier tape is placed in the appropriate equipment, and a specific heating temperature (80-190°C, preferably 100-125°C, for 3-5 minutes) or UV irradiation is applied to the removable adhesive portion of the carrier tape. (The removable adhesive portion of the carrier tape can be accurately and efficiently irradiated by a conventional 365nm UV light-emitting diode (LED) system, such as an LED head including a power / control unit, an LED driver module, and a focusing lens, which can be mounted on an SMT machine).

[0055] After the aforementioned heating or UV irradiation, the adhesiveness of the detachable pressure-sensitive adhesive layer in the detachable bonding section rapidly decreases to near zero. At this point, the chip no longer adheres to the cover tape but returns to the bottom of the concave receiving portion of the carrier tape. Subsequently, the nozzle of the device can easily pick up the chip from the concave receiving portion for subsequent placement operations, accurately mounting the chip onto the target location such as the circuit board. Throughout the process, the chip is effectively protected during transportation and can smoothly detach from the cover tape during placement, ensuring chip integrity and the high efficiency of the placement operation.

[0056] The following list of embodiments further illustrates various exemplary embodiments of the present invention, which should not be construed as unduly limiting the present invention:

[0057] Specific implementation scheme 1 is a carrier strip for loading chips, the carrier strip comprising:

[0058] A carrier tape having a plurality of concave receptacles disposed along its length for accommodating a chip; and

[0059] Cover tape covering the carrier tape,

[0060] The feature is that the carrier tape further includes one or more removable adhesive portions, which are attached to the surfaces of the cover tape facing the plurality of concave receptacles of the carrier tape, the removable adhesive portions being configured to adhere the chip receptacle within the concave receptacles and to release the chip by reducing the adhesive force when heated or irradiated with ultraviolet light.

[0061] Specific implementation scheme 2 is a carrier strip for loading chips according to specific implementation scheme 1, characterized in that the detachable adhesive part is a detachable pressure-sensitive adhesive layer.

[0062] Specific implementation scheme 3 is a carrier tape for loading chips according to specific implementation scheme 1, characterized in that the removable adhesive portion sequentially includes a backing layer and a removable pressure-sensitive adhesive layer, wherein the backing layer is attached to the cover tape.

[0063] Specific implementation scheme 4 is a carrier strip for loading chips according to specific implementation scheme 1, characterized in that the removable adhesive portion sequentially includes a backing layer, a primer layer and a removable pressure-sensitive adhesive layer, wherein the backing layer is attached to the cover strip.

[0064] Specific implementation scheme 5 is a carrier tape for loading chips according to any one of specific implementation schemes 2-4, characterized in that the adhesive force of the dissociable pressure-sensitive adhesive layer at room temperature is in the range of 1.0 to 12 N / cm.

[0065] Specific implementation scheme 6 is a carrier tape for loading chips according to any one of specific implementation schemes 2-4, characterized in that the adhesive force of the dissociable pressure-sensitive adhesive layer is in the range of 3.0 to 8.0 Newtons / cm at room temperature.

[0066] Specific implementation scheme 7 is a carrier tape for loading chips according to any one of specific implementation schemes 2-4, characterized in that the adhesive force of the dissociable pressure-sensitive adhesive layer decreases to less than or equal to 0.1 Newtons / cm when heated to 80-190°C.

[0067] Specific implementation scheme 8 is a carrier tape for loading chips according to any one of specific implementation schemes 2-4, characterized in that the adhesive force of the dissociable pressure-sensitive adhesive layer is reduced to less than or equal to 0.1 Newtons / cm when subjected to ultraviolet light of 400 millijoules or more.

[0068] Specific implementation scheme 9 is a carrier tape for loading chips according to any one of specific implementation schemes 2-4, characterized in that the thickness of the dissociable pressure-sensitive adhesive layer is in the range of 10 μm to 100 μm.

[0069] Specific embodiment 10 is a carrier tape for loading chips according to any one of specific embodiments 1-4, characterized in that the projected area of ​​the detachable adhesive portion on the cover tape is less than or equal to the projected area of ​​the opening of the concave receiving portion on the cover tape.

[0070] Specific implementation scheme 11 is a carrier strip for loading chips according to any one of specific implementation schemes 1-4, characterized in that the projected area of ​​the detachable adhesive portion on the cover strip is 70%-96% of the projected area of ​​the opening of the concave receiving portion on the cover strip.

[0071] Specific implementation scheme 12 is a carrier strip for loading chips according to any one of specific implementation schemes 1-4, characterized in that the cover strip comprises, in sequence:

[0072] Low-viscosity backing layer;

[0073] Backing layer;

[0074] Primer layer; and

[0075] Pressure-sensitive adhesive layer,

[0076] The low-adhesion backing layer is the outermost layer of the cover strip, and the pressure-sensitive adhesive layer is bonded to the removable adhesive portion.

[0077] Specific implementation scheme 13 is a carrier strip for loading chips according to any one of specific implementation schemes 1-4, characterized in that the cover strip comprises, in sequence:

[0078] Low-viscosity backing layer;

[0079] Backing layer;

[0080] Intermediate layer; and

[0081] Thermally activated adhesive layer

[0082] The backing layer is the outermost layer of the cover strip, and the heat-activated adhesive layer is bonded to the removable adhesive portion.

[0083] Specific implementation scheme 14 is a carrier strip for loading chips according to any one of specific implementation schemes 1-4, characterized in that the cover strip is a transparent cover strip.

[0084] Specific implementation scheme 15 is a carrier strip for loading chips according to any one of specific implementation schemes 1-4, characterized in that the plurality of concave receiving portions are equidistantly arranged in the middle of the carrier strip along the length direction of the carrier strip.

[0085] Specific implementation scheme 16 is a carrier strip for loading chips according to any one of specific implementation schemes 1-4, characterized in that the carrier strip further includes a plurality of positioning holes, the plurality of positioning holes being equidistantly arranged along the length direction of the carrier strip at the edge portion of the carrier strip.

[0086] Specific implementation scheme 17 is a carrier strip for loading chips according to specific implementation scheme 1, characterized in that the detachable adhesive portion is a continuous strip in the length direction of the carrier strip.

[0087] Compared with the prior art in this field, the advantages of this utility model are as follows:

[0088] 1. Protection of chips, especially microbumps: This utility model provides a detachable adhesive part on the cover tape, which fixes the chip to the cover tape during loading. This achieves the suspension and fixation of the chip in the concave receiving part, effectively avoiding direct contact between the microbumps and edges of the chip and the wall of the concave receiving part of the carrier tape during transportation and handling, thus reducing the risk of damage to the chip, especially the microbumps.

[0089] 2. Ease of Operation: By easily setting a removable adhesive portion for chip fixation on the cover tape during the cover tape manufacturing process, the complex operation of applying adhesive to the bottom of the concave receiving portion in the prior art can be avoided, thus improving the simplicity of the process. Furthermore, utilizing the reversible adhesive properties of the removable pressure-sensitive adhesive layer, the chip can be released by heating or ultraviolet irradiation, simplifying the steps that traditionally require complex separation processes and further improving ease of operation.

[0090] 3. Enhanced Protection: The adhesive strength of the dissociable pressure-sensitive adhesive layer ranges from 1.0 to 12 N / cm at room temperature, providing sufficient adhesion to ensure chip stability during transportation. Furthermore, the adhesive strength decreases to less than or equal to 0.1 N / cm when heated to 80-190°C, or when subjected to ultraviolet light above 400 mJ, allowing for rapid loss of tack when needed, facilitating chip handling. This controllable adhesion mechanism enhances chip protection.

[0091] 4. Improved production efficiency: Since the chip can quickly lose its stickiness when needed, it can be easily separated from the cover tape, which helps to improve the efficiency of the mounting process and reduce production time and costs.

[0092] 5. Flexible structural design: The detachable adhesive part can be designed into different shapes and areas as needed to adapt to chips of different sizes and shapes, providing flexibility in structural design.

[0093] 6. Transparent Cover Tape Design: The cover tape can be transparent, which allows for the use of ultraviolet light to de-adhere, facilitating automation and precise control of the de-adhesion process.

[0094] 7. Reduced risk of chip damage: During the use of the carrier tape according to this utility model, the microbumps do not come into direct contact with the carrier tape, which reduces the risk of chip damage caused by collision or friction during transportation and handling.

[0095] Although specific embodiments have been shown and described in this invention, those skilled in the art will understand that various alternative and / or equivalent embodiments can be used instead of the shown and described specific embodiments without departing from the scope of this invention. This application is intended to include any improvements or modifications to the specific embodiments discussed in this invention. Therefore, this invention is limited only to the claims and their equivalents.

[0096] Those skilled in the art will understand that various modifications and alterations can be made without departing from the scope of this utility model. Such modifications and alterations are intended to fall within the scope of this utility model as defined in the appended claims.

Claims

1. A carrier tape for loading a chip, the carrier tape comprising: A carrier tape having a plurality of concave receptacles arranged along its length, the plurality of concave receptacles being used to accommodate a chip; and Cover tape covering the carrier tape, The feature is that the carrier tape further includes one or more removable adhesive portions, which are attached to the surfaces of the cover tape facing the plurality of concave receptacles of the carrier tape, the removable adhesive portions being configured to adhere the chip receptacle within the concave receptacles and to release the chip by reducing the adhesive force when heated or irradiated with ultraviolet light.

2. The carrier tape for loading chips according to claim 1, characterized in that, The detachable adhesive portion is a detachable pressure-sensitive adhesive layer.

3. The carrier tape for loading chips according to claim 1, characterized in that, The removable adhesive portion comprises a backing layer and a removable pressure-sensitive adhesive layer, wherein the backing layer is attached to the cover strip.

4. The carrier tape for loading chips according to claim 1, characterized in that, The removable adhesive portion comprises, in sequence, a backing layer, a primer layer, and a removable pressure-sensitive adhesive layer, wherein the backing layer is attached to the cover strip.

5. The carrier tape for loading chips according to any one of claims 2-4, characterized in that, The adhesive force of the dissociable pressure-sensitive adhesive layer at room temperature is in the range of 1.0 to 12 N / cm.

6. The carrier tape for loading chips according to any one of claims 2-4, characterized in that, The adhesive force of the dissociable pressure-sensitive adhesive layer at room temperature is in the range of 3.0 to 8.0 N / cm.

7. The carrier tape for loading chips according to any one of claims 2-4, characterized in that, The adhesive strength of the dissociable pressure-sensitive adhesive layer decreases to less than or equal to 0.1 Newtons / cm when heated to 80-190°C.

8. The carrier tape for loading chips according to any one of claims 2-4, characterized in that, When the dissociable pressure-sensitive adhesive layer is subjected to ultraviolet light of 400 millijoules or higher, the adhesive strength decreases to less than or equal to 0.1 Newtons / cm.

9. The carrier tape for loading chips according to any one of claims 2-4, characterized in that, The thickness of the dissociable pressure-sensitive adhesive layer is in the range of 10 μm to 100 μm.

10. The carrier tape for loading chips according to any one of claims 1-4, characterized in that, The projected area of ​​the detachable adhesive portion on the cover strip is less than or equal to the projected area of ​​the opening of the concave receiving portion on the cover strip.

11. The carrier tape for loading chips according to any one of claims 1-4, characterized in that, The projected area of ​​the detachable adhesive portion on the cover strip is 70%-96% of the projected area of ​​the opening of the concave receiving portion on the cover strip.

12. The carrier tape for loading chips according to any one of claims 1-4, characterized in that, The cover strip is a transparent cover strip.

13. The carrier tape for loading chips according to claim 1, characterized in that, The detachable adhesive portion is a continuous strip along the length of the carrier belt.

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