Temperature control heater for silicon carbide deposition

Abstract

When air in a furnace body is exhausted, a vacuum pump is started, the lower section of an air conveying pipe exhausts air in an inner cavity of a box body, a guide piece moves downwards, a blocking block moves from the lower end of an air inlet hole to the upper end of the air inlet hole, and blocking of a through hole is relieved; the cooled gas at the upper end of the first cooling cavity is sucked into the upper cavity of the box body, the cooled gas flows into the cavity of the through hole through the gap between the blocking block and the through hole so as to reach the lower cavity of the box body, the guiding piece moves downwards, the bottom of the upper section of the gas conveying pipe is synchronously away from the hole cavity of the limiting hole, and the sealing gasket relieves blocking of the gas conveying pipe at the upper end. Gas in the furnace body flows to the upper cavity of the box body under the action of the vacuum pump and is mixed with cooled gas entering from the gas inlet II so as to primarily cool the gas, and finally, the gas is conveyed through the lower section of the gas conveying pipe, so that the cooling rate of the gas in the gas conveying pipe is increased through a multi-cooling mode, and the cooling efficiency of the gas in the furnace body is improved. The service life of the vacuum pump is prolonged.

Description

Technical Field

[0001] This utility model relates to the field of temperature-controlled heaters for silicon carbide deposition, and in particular to a temperature-controlled heater for silicon carbide deposition. Background Technology

[0002] Silicon infiltration furnaces are commonly used as temperature-controlled heating devices for silicon carbide deposition. The working principle of a silicon infiltration furnace is based on a high-temperature liquid-phase silicon infiltration process. The workpiece is placed in a silicon-containing medium and heated. The newly generated active silicon infiltrates into the surface layer of the workpiece, giving it heat resistance and acid resistance. During the silicon carbide deposition process, the silicon infiltration furnace precisely controls the temperature to ensure that silicon carbide can be uniformly deposited on the surface of the workpiece under a specific high-temperature environment. This temperature-controlled heating method not only improves the deposition efficiency but also ensures the quality and uniformity of the deposited layer.

[0003] For example, Chinese patent application CN202223452366.1 discloses an environmentally friendly high-temperature vacuum silicon infiltration furnace. The specific details are as follows: Material is placed on top of a flow guide support. A water-cooled induction coil, powered by a medium-frequency power supply, induces electromagnetic induction with the heating element to heat the workpiece. When the reaction temperature is reached, a vacuum pump is activated to extract air, ensuring the pressure inside the furnace is lower than the saturated vapor pressure of silicon, thus achieving boiling evaporation of silicon. This allows for thorough infiltration and improved efficiency. When cooling the high-temperature air inside the extraction pipe is required, the extraction pipe is immersed in cold water in a water tank. The cold water absorbs heat from the extraction pipe, raising its temperature. A water pump is then activated to extract water through a fixed pipe. The water is then transported through a flow guide pipe, where it is cooled by a semiconductor cooling chip, a metal plate, and a metal rod. The water inside the flow guide pipe cools down and enters the fixed plate, where it is sprayed into the water tank through a nozzle, further cooling the extraction pipe and ensuring the cooling effect. However, this method has the following technical problems:

[0004] The gas inside the extraction pipe is cooled only by the water in the water tank on the outer wall of the extraction pipe. However, the gas flow rate inside the extraction pipe is relatively fast, and the water in the water tank alone is insufficient to cool the gas inside the extraction pipe. Ultimately, this causes the high-temperature gas to damage the vacuum pump when it passes through the vacuum pump. Utility Model Content

[0005] To address the problem mentioned in the background art that the water in the tank is insufficient to cool the gas in the extraction pipe, this utility model provides the following technical solution:

[0006] A temperature-controlled heater for silicon carbide deposition, comprising a furnace body;

[0007] The lower end of the furnace body is provided with a first cooling chamber and a second cooling chamber. A vacuum pump for evacuating air from the furnace body is installed at the lower end of the furnace body, and one end of the vacuum pump is connected to a gas supply pipe.

[0008] The lower end of the furnace body is equipped with a first heat dissipation fin to facilitate cooling of the interior of the second cooling chamber, and the lower end of the furnace body is equipped with a second heat dissipation fin to facilitate cooling of the interior of the first cooling chamber.

[0009] One end of the gas pipeline is equipped with an auxiliary heat dissipation component to facilitate cooling of the gas inside the pipeline.

[0010] Furthermore, an air inlet is machined at the lower end of the furnace body, and a water pump for drawing water from the inner cavity of the first cooling cavity is installed in the cavity of the second cooling cavity, with a water pipe installed at one end of the water pump.

[0011] Furthermore, a semiconductor cooling chip is installed at the lower end of the furnace body, and a metal pipe for cooling the water in the water pipe is installed at one end of the semiconductor cooling chip. A spray pipe for spraying water to the upper end of the first cooling chamber is installed at one end of the water pipe.

[0012] Furthermore, the auxiliary heat dissipation assembly includes a housing, a top cover is installed at the upper end of the housing, a guide is installed in the inner cavity of the housing, and a spring for pushing the guide is installed at the lower end of the inner cavity of the housing.

[0013] Furthermore, a lower mounting opening is machined at the center of the bottom end of the housing.

[0014] Furthermore, the top cover has an upper mounting port machined in the middle, and multiple air inlets for supplying gas into the inner cavity of the box are machined in the middle of the top cover. Multiple bolts are installed on the edge of the top cover to facilitate the box body in limiting the position of the top cover. Multiple connecting rods are installed at the lower end of the top cover, and a blocking block is installed at the lower end of the connecting rod.

[0015] Furthermore, a limiting hole is machined in the middle of the guide member, and a sealing gasket for sealing the vacuum pump is installed inside the cavity of the limiting hole. Multiple through holes are machined in the middle of the guide member, and an air inlet is machined at the upper end of the through holes. The air inlet is a funnel-shaped cavity, and a second sealing gasket is installed on the outer wall of the guide member.

[0016] Compared with the prior art, the beneficial effects of this utility model are:

[0017] When evacuating the furnace body, the vacuum pump is activated, and the lower section of the gas delivery pipe evacuates the inner cavity of the chamber, causing the guide to move downwards. This moves the block from the lower end of the air inlet to the upper end of the air inlet, releasing the blockage on the through hole. The gas to be cooled, located at the upper end of the first cooling chamber, is drawn into the upper cavity of the chamber. The cooled gas flows through the gap between the block and the through hole into the cavity of the through hole, reaching the lower cavity of the chamber. The guide moves downwards, and the bottom of the upper section of the gas delivery pipe moves away from the cavity of the limiting hole. The sealing gasket releases the blockage on the upper gas delivery pipe. The gas inside the furnace body flows into the upper cavity of the chamber under the action of the vacuum pump and mixes with the cooled gas entering through the second air inlet to perform preliminary cooling. Finally, it is transported through the lower section of the gas delivery pipe. Through multiple cooling methods, the cooling rate of the gas inside the gas delivery pipe is accelerated, thereby increasing the service life of the vacuum pump. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0019] Figure 2 This is a schematic diagram of the auxiliary heat dissipation component of this utility model;

[0020] Figure 3 This is a schematic diagram of the structure of the top cover of this utility model;

[0021] Figure 4 This is a schematic diagram of the structure of the guide component of this utility model.

[0022] The following is a list of component names represented by the reference numerals in the attached figures:

[0023] 100-Furnace body, 10-First cooling chamber, 20-Second cooling chamber, 110-Vacuum pump, 111-Gas supply pipe, 120-Air inlet 1, 130-First heat dissipation fin, 140-Second heat dissipation fin, 150-Water pump, 151-Water pipe, 160-Semiconductor cooling chip, 161-Metal pipe, 170-Spray pipe;

[0024] 200-Auxiliary heat dissipation component, 210-Casing, 211-Lower mounting port, 220-Top cover, 221-Upper mounting port, 222-Second air inlet, 223-Block, 224-Connecting rod, 225-Bolt, 230-Guide component, 231-Limiting hole, 232-Sealing gasket, 233-Through hole, 234-Air inlet, 235-Second sealing gasket, 240-Spring. Detailed Implementation

[0025] The preferred embodiments of this utility model are described in detail below, and a clear and complete explanation is given in conjunction with the accompanying drawings.

[0026] Please see Figures 1-4This utility model provides a temperature-controlled heater for silicon carbide deposition, including a furnace body 100.

[0027] The lower end of the furnace body 100 is provided with a first cooling chamber 10 and a second cooling chamber 20. A vacuum pump 110 for evacuating air from the furnace body 100 is installed at the lower end of the furnace body 100. One end of the vacuum pump 110 is connected to a gas supply pipe 111, and the middle part of the gas supply pipe 111 is located in the inner cavity of the first cooling chamber 10. The first cooling chamber 10 is a water tank, and the water inside the first cooling chamber 10 is used to cool the gas supply pipe 111. An air inlet 120 is machined at the lower end of the furnace body 100.

[0028] The lower end of the furnace body 100 is equipped with a first heat dissipation fin 130 to facilitate cooling of the interior of the second cooling chamber 20, and a second heat dissipation fin 140 to facilitate cooling of the interior of the first cooling chamber 10. The arrangement of the first and second heat dissipation fins 130 and 140 increases the heat dissipation efficiency of the first and second cooling chambers 10 and 20, facilitating cooling of the gas supply pipe 111. A water pump 150 for drawing water from the interior of the first cooling chamber 10 is installed inside the second cooling chamber 20. One end of the water pump 150 is connected to a water pipe 151, and one end of the water pipe 151 is located inside the second cooling chamber 20.

[0029] A semiconductor cooling chip 160 is installed at the lower end of the furnace body 100. A metal tube 161 for cooling the water in the water pipe 151 is installed at one end of the semiconductor cooling chip 160. The metal tube 161 is spirally sleeved on the outside of the water pipe 151, which can quickly cool the water in the water pipe 151. The cooled water is then transported to the cavity of the first cooling chamber 10 to cool the inner cavity of the first cooling chamber 10, so as to cool the gas supply pipe 111. A spray pipe 170 for spraying water to the upper end of the first cooling chamber 10 is installed at one end of the water pipe 151. The cooled water in the water pipe 151 is sprayed to the upper end of the first cooling chamber 10 through the spray pipe 170 to cool the gas in the upper cavity and the water in the lower cavity of the first cooling chamber 10.

[0030] One end of the gas supply pipe 111 is equipped with an auxiliary heat dissipation component 200 to facilitate cooling of the gas inside the gas supply pipe 111. The auxiliary heat dissipation component 200 is located at the upper end of the first cooling chamber 10 and is not in contact with water. The auxiliary heat dissipation component 200 includes a housing 210. A lower mounting port 211 is machined in the middle of the bottom end of the housing 210. The gas supply pipe 111 is divided into upper and lower sections. One section is connected to the upper end of the auxiliary heat dissipation component 200 through the interior of the furnace body 100, and the other section is fixedly installed in the cavity of the lower mounting port 211 by a vacuum pump 110.

[0031] The upper end of the housing 210 is equipped with a top cover 220 for sealing the inner cavity of the housing 210. The top cover 220 has an upper mounting port 221 machined in the middle, and the upper section of the gas pipe 111 is fixedly installed in the cavity of the upper mounting port 221 and extends into the inner cavity of the housing 210.

[0032] The top cover 220 has multiple air inlets 222 machined in the middle for supplying gas to the inner cavity of the housing 210. The top cover 220 has multiple bolts 225 installed on its edge to facilitate the housing 210 in limiting the position of the top cover 220, so that the housing 210 and the top cover 220 are installed firmly. The lower end of the top cover 220 is equipped with multiple connecting rods 224, and the lower end of the connecting rods 224 is fixedly equipped with a block 223.

[0033] A guide member 230 is installed at the upper end of the inner cavity of the housing 210, dividing the inner cavity of the housing 210 into an upper cavity and a lower cavity. A limiting hole 231 is machined in the middle of the guide member 230, and the upper section of the gas supply pipe 111 extends into the cavity of the limiting hole 231. A sealing gasket 232 for sealing the upper section of the gas supply pipe 111 is installed inside the cavity of the limiting hole 231 to prevent gas leakage when heating the inner cavity of the furnace body 100. A spring 240 for pushing the guide member 230 is installed at the lower end of the inner cavity of the housing 210. When the vacuum pump 110 is turned off, the spring 240 pushes the guide member 230 upward to continue sealing the upper section of the gas supply pipe 111.

[0034] The guide member 230 has multiple through holes 233 machined in the middle, and the block 223 is used to open and close the through holes 233. The upper end of the through holes 233 has an air inlet 234, which is a funnel-shaped cavity. The block 223 moves up and down in the cavity of the air inlet 234. The outer wall of the guide member 230 is fitted with a sealing gasket 235. The sealing gasket 235 is in close contact with the inner wall of the housing 210, so that when the vacuum pump 110 is started, the lower section of the gas supply pipe 111 can draw gas from the inside of the housing 210, drive the guide member 230 to move downward, and squeeze the spring 240.

[0035] When evacuating the interior of the furnace body 100, the vacuum pump 110 is started, and the lower section of the gas supply pipe 111 evacuates the interior of the housing 210, causing the guide 230 to move downwards. This moves the block 223 from the lower end of the air inlet 234 to the upper end of the air inlet 234, releasing the blockage of the through hole 233. The cooled gas located at the upper end of the first cooling chamber 10 is drawn into the upper cavity of the housing 210, and the cooled gas flows through the gap between the block 223 and the through hole 233 to the through hole 233. Inside cavity 33, reaching the lower cavity of housing 210, guide 230 moves downward, and the bottom of the upper section of gas pipe 111 moves away from the cavity of limiting hole 231. Sealing gasket 232 releases the blockage on the upper gas pipe 111. Gas inside furnace 100 flows to the upper cavity of housing 210 under the action of vacuum pump 110, and mixes with the cooled gas entering through inlet 222 to perform preliminary cooling of the gas. Finally, it is transported through the lower section of gas pipe 111.

[0036] The lower section of the gas delivery pipe 111 is submerged in water. During gas delivery, the water is cooled again. The heated water is delivered by the water pump 150 and the water pipe 151, and cooled through the metal pipe 161. Finally, the spray pipe 170 returns to the inner cavity of the first cooling chamber 10 to cool the gas in the upper cavity and the water in the lower cavity of the first cooling chamber 10. Through multiple cooling methods, the cooling rate of the gas inside the gas delivery pipe 111 is accelerated, thereby increasing the service life of the vacuum pump.

[0037] Based on the above description and accompanying drawings, those skilled in the art can understand and implement this utility model. Furthermore, any non-creative modifications made to this utility model by those skilled in the art without inventive effort are still within the protection scope of this utility model.

Claims

1. A temperature-controlled heater for silicon carbide deposition, comprising a furnace body (100), characterized in that: The lower end of the furnace body (100) is provided with a first cooling chamber (10) and a second cooling chamber (20). The lower end of the furnace body (100) is equipped with a vacuum pump (110) for evacuating the inside of the furnace body (100). One end of the vacuum pump (110) is connected to a gas supply pipe (111). The lower end of the furnace body (100) is equipped with a first heat dissipation fin (130) to facilitate cooling of the cavity inside the second cooling chamber (20), and the lower end of the furnace body (100) is equipped with a second heat dissipation fin (140) to facilitate cooling of the cavity inside the first cooling chamber (10). One end of the gas pipe (111) is equipped with an auxiliary heat dissipation component (200) to facilitate cooling of the gas inside the gas pipe (111).

2. The temperature-controlled heater for silicon carbide deposition according to claim 1, characterized in that: The lower end of the furnace body (100) is provided with an air inlet (120), and a water pump (150) for drawing water from the inner cavity of the first cooling cavity (10) is installed in the cavity of the second cooling cavity (20). A water pipe (151) is installed at one end of the water pump (150).

3. A temperature-controlled heater for silicon carbide deposition according to claim 2, characterized in that: A semiconductor cooling chip (160) is installed at the lower end of the furnace body (100). A metal pipe (161) for cooling the water in the water pipe (151) is installed at one end of the semiconductor cooling chip (160). A spray pipe (170) for spraying water to the upper end of the first cooling chamber (10) is installed at one end of the water pipe (151).

4. A temperature-controlled heater for silicon carbide deposition according to claim 1, characterized in that: The auxiliary heat dissipation assembly (200) includes a housing (210), a top cover (220) is installed on the upper end of the housing (210), a guide (230) is installed in the inner cavity of the housing (210), and a spring (240) for pushing the guide (230) is installed at the lower end of the inner cavity of the housing (210).

5. A temperature-controlled heater for silicon carbide deposition according to claim 4, characterized in that: The bottom of the housing (210) has a lower mounting port (211) machined in the middle.

6. A temperature-controlled heater for silicon carbide deposition according to claim 4, characterized in that: The top cover (220) has an upper mounting port (221) machined in the middle, and multiple air inlets (222) machined in the middle for supplying gas to the inner cavity of the housing (210). Multiple bolts (225) are installed on the edge of the top cover (220) to facilitate the housing (210) in limiting the position of the top cover (220). Multiple connecting rods (224) are installed at the lower end of the top cover (220), and a plug (223) is installed at the lower end of the connecting rods (224).

7. A temperature-controlled heater for silicon carbide deposition according to claim 4, characterized in that: The guide member (230) has a limiting hole (231) machined in the middle. A sealing gasket (232) for sealing the vacuum pump (110) is installed inside the cavity of the limiting hole (231). The guide member (230) has multiple through holes (233) machined in the middle. An air inlet (234) is machined at the upper end of the through hole (233), and the air inlet (234) is a funnel-shaped cavity. A second sealing gasket (235) is installed on the outer wall of the guide member (230).

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