Magnetron sputtering coating equipment

Abstract

The embodiment of the utility model provides magnetron sputtering coating equipment which comprises a driving part, a magnetic control part and a transmission assembly, the transmission assembly comprises a driving wheel, the driving wheel is arranged outside a driving shaft of the driving part in a sleeving mode, and the driving wheel and the driving shaft are kept static relatively; the driven wheel is arranged outside a rotating shaft of the magnetic control piece in a sleeving mode, the driven wheel and the rotating shaft are kept static relatively, and the rotating shaft of the magnetic control piece and a main body of the magnetic control piece are kept static relatively; and the driving belt is wound outside the driving wheel and the driven wheel, and the driving belt is suitable for driving the driven wheel to rotate under the driving of the driving wheel. By adopting the technical scheme, the uniformity of the film deposition thickness can be improved.

Description

Technical Field

[0001] This disclosure relates to the field of semiconductor technology, and more particularly to a magnetron sputtering coating apparatus. Background Technology

[0002] Vacuum deposition is a widely used surface treatment technology in the semiconductor field. Specifically, it is a technology that uses magnetron sputtering, electron beam evaporation, plasma ionization and other technologies to sputter or evaporate a target material under vacuum conditions, and then deposits a thin film of metal, alloy, oxide or other compound on the material surface by means of electric field or magnetic field control.

[0003] Currently, the uniformity of film thickness formed by magnetron sputtering deposition is poor. Utility Model Content

[0004] In view of this, embodiments of the present disclosure provide a magnetron sputtering coating apparatus that can improve the uniformity of thin film deposition thickness.

[0005] This disclosure provides a magnetron sputtering coating apparatus. The magnetron sputtering coating apparatus includes:

[0006] The drive component, magnetic control unit, and transmission assembly, wherein the transmission assembly includes:

[0007] The driving wheel is sleeved on the drive shaft of the driving component and remains relatively stationary with respect to the drive shaft.

[0008] The driven wheel is sleeved outside the rotating shaft of the magnetic control and remains relatively stationary with respect to the rotating shaft. The rotating shaft of the magnetic control remains relatively stationary with respect to the main body of the magnetic control.

[0009] A drive belt is provided around the driving wheel and the driven wheel, and the drive belt is adapted to drive the driven wheel to rotate under the drive of the driving wheel.

[0010] Optionally, the transmission assembly further includes:

[0011] A main limiting member, one end of which passes radially through the driving wheel and the drive shaft;

[0012] Alternatively, one end of the main limiting member passes radially through the driving wheel and abuts against the shaft, so that the driving wheel and the drive shaft remain relatively stationary.

[0013] Optionally, the transmission assembly further includes:

[0014] The limiting member has one end that passes radially through the driven wheel and the rotating shaft;

[0015] Alternatively, one end of the limiting member passes radially through the driven wheel and then abuts against the rotating shaft, so that the driving wheel and the drive shaft remain relatively stationary.

[0016] Optionally, the sidewall of the drive pulley engages with the inner sidewall of the drive belt for transmission.

[0017] Optionally, the sidewall of the driven pulley engages with the inner sidewall of the drive belt for transmission.

[0018] Optionally, the magnetron sputtering coating equipment further includes:

[0019] First platform;

[0020] The cathode and the first stage form a first chamber, and the main body of the magnetic control unit is located in the first chamber;

[0021] The anode, together with the cathode, forms a second chamber.

[0022] Optionally, the magnetron sputtering coating equipment further includes:

[0023] An isolation section is sandwiched between the cathode and the anode, and the isolation section is a ring-shaped structure made of insulating material.

[0024] Optionally, the first platform is a dome-shaped structure, and the first platform has:

[0025] The first bearing portion, wherein the transmission assembly is disposed on the first bearing portion;

[0026] The side portion is adjacent to the end face of the first bearing portion away from the transmission assembly;

[0027] The inner wall of the side portion has a receiving groove, which is located on the end face of the side portion away from the first bearing portion, and the receiving groove is adapted to receive the cathode.

[0028] Optionally, the end of the side portion away from the first support portion abuts against the end of the isolation portion adjacent to the first support portion.

[0029] Optionally, the magnetron sputtering coating equipment further includes:

[0030] A housing adapted to house the drive unit, magnetic control unit, and transmission components, and to provide a vacuum environment.

[0031] Compared with the prior art, the technical solutions of the embodiments of this disclosure have the following beneficial effects:

[0032] The driving wheel and the drive shaft remain relatively stationary, as do the driven wheel and the drive shaft. The rotating shaft of the magnetic control unit and the main body of the magnetic control unit remain relatively stationary. The drive belt is wrapped around the driving wheel and the driven wheel. Rotating the drive shaft will synchronously drive the driving wheel, the drive belt, the driven wheel, and the magnetic control unit to rotate in sequence. The magnetic field generated by the corresponding magnetic control unit also rotates around the rotating shaft. This can improve the magnetic field distribution deviation generated by the magnetic control unit and enhance the uniformity of magnetic flux in the circumferential region around the rotating shaft. It can be understood that in specific applications, the above technical solution can improve the thin film deposition deviation caused by the magnetic field distribution deviation on the workpiece to be coated and enhance the uniformity of the thickness of the surface thin film deposited in the circumferential region around the rotating shaft on the substrate surface. Attached Figure Description

[0033] To more clearly illustrate the technical solutions of the embodiments of this disclosure, the drawings used in the description of the embodiments of this disclosure or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this specification. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0034] Figure 1 This is a partial cross-sectional structural diagram of a magnetron sputtering coating apparatus according to an embodiment of this disclosure.

[0035] Explanation of reference numerals in the attached figures:

[0036] Drive component 100, drive shaft 110;

[0037] Drive wheel 210, drive belt 220, driven wheel 230, main limit member 240, driven limit member 250, main limit part 260, driven limit part 270;

[0038] Magnetic control unit 300, rotating shaft 310;

[0039] First platform 400, first support part 410, side 420;

[0040] Cathode 500;

[0041] Anode 600;

[0042] Second platform 700, second bearing part 710, support part 720;

[0043] Isolation Department 800;

[0044] Casing 900;

[0045] First chamber A, second chamber B, third chamber C;

[0046] Target material a1, part to be coated a2. Detailed Implementation

[0047] As is known from the background technology, in the process of semiconductor device fabrication, vacuum deposition technology can be used to deposit thin film materials on semiconductor devices, among which sputtering deposition is one of the vacuum deposition processes.

[0048] In a specific application scenario, a magnetron sputtering coating equipment has a magnetron control unit, a cathode, and an anode. In actual use, the cathode is located between the magnetron control unit and the anode. A target material is set on the side of the cathode adjacent to the anode, and the part to be coated is set on the side of the anode adjacent to the cathode. A high voltage is applied between the cathode and the anode. Electrons collide with the surface of the target material adjacent to the anode under the action of the magnetic field and electric field. Atoms on the surface of the target material are ejected by the collision, and the ejected atoms are deposited on the surface of the part to be coated adjacent to the cathode to form a film.

[0049] However, the uneven magnetic field generated by the magnetic control can cause thin film deposition deviations on the workpiece to be coated.

[0050] Therefore, how to improve the uniformity of the film deposition thickness on the part to be coated has become an urgent technical problem to be solved.

[0051] To address the aforementioned technical problems, this disclosure provides a magnetron sputtering coating apparatus. The driving wheel and drive shaft remain relatively stationary, as do the driven wheel and drive shaft. The rotating shaft of the magnetic control unit and its main body remain relatively stationary. A drive belt is wound around the driving and driven wheels. Rotating the drive shaft synchronously and sequentially drives the driving wheel, drive belt, driven wheel, and magnetic control unit to rotate. The magnetic field generated by the corresponding magnetic control unit also rotates around the rotating shaft. This improves the magnetic field distribution deviation generated by the magnetic control unit and enhances the uniformity of magnetic flux in the circumferential region around the rotating shaft. It is understood that in specific applications, the above technical solution can improve the thin film deposition deviation caused by magnetic field distribution deviation on the workpiece, and enhance the uniformity of the thin film thickness deposited on the substrate surface in the circumferential region around the rotating shaft.

[0052] To make the above-mentioned objects, features and advantages of the embodiments of this disclosure more apparent and understandable, the specific embodiments of this disclosure will be described in detail below with reference to the accompanying drawings.

[0053] Figure 1 This is a partial cross-sectional structural diagram of a magnetron sputtering coating apparatus according to an embodiment of this disclosure.

[0054] Reference Figure 1 The magnetron sputtering coating equipment may include: a drive unit 100, a magnetizer 300, and a transmission assembly.

[0055] One end of the transmission component is connected to the drive component 100, and the other end is connected to the magnetic control component 300. The drive component 100 is adapted to drive the magnetic control component 300 to rotate through the transmission component, so as to improve the magnetic field distribution deviation generated by the magnetic control component 300.

[0056] Specifically, the driving component 100 may have a driving shaft 110, the magnetic control component 300 may have a rotating shaft 310, and the transmission assembly may include a driving wheel 210, a driven wheel 230, and a driving belt 220. The driving wheel 210 is sleeved on the driving shaft 110 of the driving component 100 and remains relatively stationary with respect to the driving shaft 110. The driven wheel 230 is sleeved on the rotating shaft 310 of the magnetic control component 300 and remains relatively stationary with respect to the rotating shaft 310. The rotating shaft 310 of the magnetic control component 300 remains relatively stationary with respect to the main body of the magnetic control component 300. The driving belt 220 is wound around the driving wheel 210 and the driven wheel 230 and is adapted to drive the driven wheel 230 to rotate under the drive of the driving wheel 210.

[0057] Specifically, the driving wheel 210 and the drive shaft 110 remain relatively stationary, the driven wheel 230 and the drive shaft 110 remain relatively stationary, the rotating shaft 310 of the magnetic control 300 and the main body of the magnetic control 300 remain relatively stationary, and the drive belt 220 is wrapped around the driving wheel 210 and the driven wheel 230. When the drive shaft 110 is rotated, the driving wheel 210, the drive belt 220, the driven wheel 230 and the magnetic control 300 will be rotated in sequence. The magnetic field generated by the magnetic control 300 will also rotate around the rotating shaft 310. This can improve the magnetic field distribution deviation generated by the magnetic control 300 and improve the uniformity of the magnetic flux in the circumferential region around the rotating shaft 310.

[0058] In some embodiments, the drive unit 100 may be a DC motor or an AC motor.

[0059] In some embodiments, the drive wheel 210 and the drive shaft 110 can remain relatively stationary in a variety of ways.

[0060] For example, the drive wheel 210 may have a radially extending main through hole (not shown), and the transmission assembly may also include a main limiting member 240, which is threadedly engaged with the main through hole of the drive wheel 210. One end of the main limiting member 240 passes through the main through hole and abuts against the outer surface of the drive shaft 110, thereby maintaining relative stillness between the two through the friction between them and reducing the probability of relative rotation between them.

[0061] Furthermore, the surface of the drive shaft 110 may also have a main limiting hole (not shown), which corresponds to the main through hole. One end of the main limiting member 240 passes through the main through hole and enters the limiting hole on the surface of the drive shaft 110. The outer diameter of this end is matched with the inner diameter of the limiting hole, thus preventing relative rotation between the drive wheel 210 and the drive shaft 110.

[0062] It should be noted that the main limiting hole can be a through hole structure or a non-through hole structure (such as a groove structure).

[0063] It should be noted that the number of main limiting holes can be at least one. For example, the number of main limiting holes can be one. For example, the number of secondary limiting holes can be three, and the three secondary limiting holes can be distributed in a circumferential array on the side wall of the drive wheel 210.

[0064] In some embodiments, the drive wheel 210 is provided with main limiting portions 260 coaxially at both ends along its axial direction. The outer diameter of the main limiting portions 260 is larger than the outer diameter of the drive wheel 210. The drive belt 220 is located between the two main limiting portions 260. The main limiting portions 260 are used to reduce the probability of the drive belt 220 disengaging from the drive wheel 210.

[0065] In some embodiments, the drive wheel 210 and the main limiting part 260 can be integrally formed; or, the drive wheel 210 and the main limiting part 260 can be separately provided, and the main limiting part 260 is fixed to the end face of the drive wheel 210 by bolts.

[0066] In some embodiments, there can be various methods for keeping the driven wheel 230 and the axis 310 of the magnetic control 300 relatively stationary.

[0067] For example, the driven wheel 230 may have a radially extending through hole (not shown), and the transmission assembly may also include a retainer 250, which is threaded into the through hole of the driven wheel 230. One end of the retainer 250 passes through the driven wheel 230 and abuts against the outer surface of the rotating shaft 310 of the magnetic control 300, thereby maintaining relative stillness between the two through friction and reducing the probability of relative rotation between them.

[0068] Furthermore, the surface of the rotating shaft 310 of the magnetic control 300 may also have a limiting hole (not shown), which corresponds to the through hole. One end of the limiting member 250 passes through the driven wheel 230 and enters the limiting hole on the surface of the rotating shaft 310 of the magnetic control 300. The outer diameter of this end is adapted to the inner diameter of the limiting hole, thus preventing relative rotation between the driven wheel 230 and the rotating shaft 310 of the magnetic control 300.

[0069] It should be noted that the limiting hole can be a through hole structure or a non-through hole structure (such as a groove structure).

[0070] It should be noted that the number of limiting holes can be at least one. For example, the number of limiting holes can be one. For example, the number of limiting holes can be three, and the three limiting holes can be distributed in a circumferential array on the side wall of the drive wheel 210.

[0071] In some embodiments, the driven wheel 230 may have a limiting portion 270 at both ends along its axial direction. The limiting portion 270 is coaxially arranged with the driven wheel 230. The outer diameter of the limiting portion 270 is larger than the outer diameter of the driven wheel 230. The drive belt 220 is located between the two limiting portions 270. The limiting portion 270 is used to reduce the probability of the drive belt 220 disengaging from the driven wheel 230.

[0072] In some embodiments, the driven wheel 230 and the driven limiting portion 270 may be integrally formed; or, the driven wheel 230 and the driven limiting portion 270 may be separately provided, and the driven limiting portion 270 may be fixed to the end face of the driven wheel 230 by bolts.

[0073] In some embodiments, the sidewall of the drive pulley 210 can engage with the inner sidewall of the drive belt 220 for transmission.

[0074] Specifically, this reduces the chance of slippage between the drive pulley 210 and the drive belt 220.

[0075] Specifically, the drive pulley 210 has a main drive groove (not shown) on its side wall. The main drive groove extends along the axial direction of the drive pulley 210. There are multiple main drive grooves, which are distributed in a circumferential array on the side wall of the drive pulley 210. Correspondingly, the inner side of the drive belt 220 has a drive protrusion (not shown). The shape of the drive protrusion is adapted to the main drive groove, and the size of the drive protrusion is adapted to the direction of the main drive groove. There are multiple drive protrusions, which are adapted to be embedded in the main drive groove so that the side wall of the drive pulley 210 and the inner side of the drive belt 220 can engage and transmit power.

[0076] In some embodiments, the sidewall of the driven wheel 230 can engage with the inner sidewall of the drive belt 220 for transmission.

[0077] Specifically, this reduces the chance of slippage between the driven pulley 230 and the drive belt 220.

[0078] Specifically, the driven wheel 230 has a drive groove (not shown) on its side wall. The drive groove extends along the axial direction of the driving wheel 210. There are multiple drive grooves, which are circumferentially arrayed on the side wall of the driving wheel 210. Correspondingly, the shape of the drive protrusion on the inner side of the drive belt 220 is adapted to the drive groove, and the size of the drive protrusion is adapted to the drive groove. The drive protrusion is adapted to be embedded in the drive groove so that the side wall of the driven wheel 230 and the inner side of the drive belt 220 can engage and transmit power.

[0079] In some embodiments, the magnetron sputtering coating apparatus may further include: a first stage 400, a cathode 500, and an anode 600.

[0080] The cathode 500 is located between the first stage 400 and the anode 600, forming a first chamber A with the first stage 400. The main body of the magnetic control unit 300 is located in the first chamber A. The cathode 500 and the anode 600 form a second chamber B, which is used to provide an inert gas environment.

[0081] In a specific application scenario, the target a1 is fixed on the side of the cathode 500 adjacent to the anode 600, and the part to be coated a2 (e.g., a substrate) is placed between the target a1 and the cathode 500. The part to be coated a2 is coaxial with the rotation shaft 310 of the magnetic control 300. There is a preset distance between the part to be coated a2 and the target a1. The preset distance is a distance pre-adjusted by the operator and is used as a movement space for electrons and sputtered atoms.

[0082] In practical use, the magnetic control unit 300 is activated and a high voltage is applied between the cathode 500 and the anode 600. Electrons collide with the surface of the target material a1 adjacent to the anode 600 under the action of the electric field and magnetic field. The magnetic control unit 300 is driven to rotate at a constant speed by the driving component 100, which can improve the uniformity of magnetic flux in the circumferential region between the workpiece a2 to be coated and the target material a1 with the rotation axis 310 as the axis. Therefore, it can improve the thin film deposition deviation caused by the magnetic field distribution deviation on the workpiece a2 to be coated, and improve the uniformity of the thickness of the thin film deposited on the circumferential region of the substrate surface with the rotation axis 310 as the axis.

[0083] In some embodiments, the target material a1 can be made of one of titanium, copper, tantalum, or aluminum.

[0084] It should be noted that the cathode 500 and the target a1 mentioned above are two independent structures, but this description does not constitute a limitation on the relationship between the cathode 500 and the target a1. For example, the cathode 500 and the target a1 can be different names for the same structure.

[0085] In some embodiments, the magnetron sputtering coating apparatus may further include a second stage 700.

[0086] Specifically, the second stage 700 is disposed on the side of the anode 600 facing the cathode 500. The second stage 700 is coaxially disposed with the rotating shaft 310 of the magnetic control 300. The second stage 700 is used to support the part a2 to be coated.

[0087] In some embodiments, the second platform 700 may be a stool-shaped structure made of insulating material.

[0088] Specifically, the second stage 700 may include a second support portion 710 and at least one support portion 720, with one end of the support portion 720 connected to the second support portion 710 and the other end connected to the anode 600.

[0089] Specifically, the insulating material of the second stage 700 can achieve electrical isolation between the part to be coated a2 and the anode 600, and the support part 720 is used to reduce the area of ​​direct contact between the second stage 700 and the anode 600.

[0090] In some embodiments, the magnetron sputtering coating apparatus may further include: an isolation section 800, which is sandwiched between the cathode 500 and the anode 600 to prevent the cathode 500 from contacting the anode 600.

[0091] Furthermore, the isolation portion 800 can be made of an insulating material. For example, the isolation portion 800 can be made of ceramic. This can further improve the electrical isolation effect between the cathode 500 and the anode 600.

[0092] Furthermore, the isolation section 800 can be configured as a ring structure. This avoids the outer edge of the cathode 500 directly facing the outer edge of the anode 600, further improving the electrical isolation effect between the cathode 500 and the anode 600.

[0093] In some embodiments, the first stage 400 may be a dome-shaped structure to form a first chamber A with the cathode 500 to accommodate the body of the magnetic control 300.

[0094] Specifically, the first platform 400 may have a first support portion 410 and a side portion 420, wherein the main body of the drive member 100 is fixed on the end face of the first support portion 410 away from the side portion 420, and the rotating shaft 310 of the magnetic control unit 300 passes through the first support portion 410; the side portion 420 has an annular structure and is adjacent to the end face of the first support portion 410 away from the transmission component.

[0095] In some embodiments, a receiving groove may be formed in the inner wall of the side portion 420, and the receiving groove is located on the end face of the side portion 420 away from the first support portion 410.

[0096] Specifically, the outer diameter of the receiving groove is adapted to the size of the outer edge of the cathode 500 to receive the cathode 500, which means that the cathode 500 is located inside the side portion 420, that is, the cathode 500 is isolated from the outside of the side portion 420 in the radial direction along the cathode 500 through the side portion 420.

[0097] In some embodiments, the end of the side portion 420 away from the first support portion 410 abuts against the end of the isolation portion 800 adjacent to the first support portion 410.

[0098] Specifically, the end of the isolation portion 800 adjacent to the first support portion 410 is adapted to block the opening of the receiving groove, which is the opening of the receiving groove along the rotation axis 310 of the magnetic control component 300. The cathode 500 is sandwiched between the end face of the isolation portion 800 adjacent to the first support portion 410 and the bottom surface of the receiving groove of the side portion 420. Therefore, the end of the isolation portion 800 adjacent to the first support portion 410 can limit the cathode 500 along the rotation axis 310 of the magnetic control component 300.

[0099] In some embodiments, the magnetron sputtering coating apparatus may further include a housing 900 having a third chamber C for providing a vacuum environment, wherein the drive 100, the magnetic control 300, the transmission assembly, the first stage 400, the cathode 500, the isolation section 800, the anode 600, and the second stage 700 are all located within the third chamber C.

[0100] In a specific application scenario, the anode 600 is located at the bottom of the third chamber C, and the external shape of the anode 600 is adapted to the inner wall shape of the bottom of the third chamber C, and the external dimensions of the anode 600 are adapted to the inner wall dimensions of the bottom of the third chamber C; the isolation part 800 is located on the top surface of the anode 600, and the external shape of the isolation part 800 is adapted to the inner wall dimensions of the third chamber C.

[0101] It is understood that "multiple" in this document refers to two or more. The descriptions of "first," "second," "third," etc., appearing in the embodiments of this application are for illustrative purposes and to distinguish the objects being described, and have no order, nor do they indicate a special limitation on the number of devices in the embodiments of this application, and cannot constitute any limitation on the embodiments of this application.

[0102] It is understood that the above embodiments provide multiple implementation schemes, and these implementation schemes can be combined and cross-referenced with each other without conflict, thereby extending to multiple possible implementation schemes. These can all be considered as the implementation schemes disclosed and made public in this application.

[0103] It should be noted that the "example" or "implementation" referred to in this specification means a specific feature, structure or characteristic that may be included in at least one implementation of the embodiments of this disclosure.

[0104] While the embodiments disclosed herein are as described above, this disclosure is not limited thereto. Any person skilled in the art can make various alterations and modifications without departing from the spirit and scope of this disclosure; therefore, the scope of protection of this specification should be determined by the scope defined in the claims.

Claims

1. A magnetron sputtering coating apparatus, characterized in that, include: The drive component, magnetic control unit, and transmission assembly, wherein the transmission assembly includes: The driving wheel is sleeved on the drive shaft of the driving component and remains relatively stationary with respect to the drive shaft. The driven wheel is sleeved outside the rotating shaft of the magnetic control and remains relatively stationary with respect to the rotating shaft. The rotating shaft of the magnetic control remains relatively stationary with respect to the main body of the magnetic control. A drive belt is provided around the driving wheel and the driven wheel, and the drive belt is adapted to drive the driven wheel to rotate under the drive of the driving wheel.

2. The magnetron sputtering coating equipment according to claim 1, characterized in that, The transmission assembly also includes: A main limiting member, one end of which passes radially through the driving wheel and the drive shaft; Alternatively, one end of the main limiting member passes radially through the driving wheel and abuts against the shaft, so that the driving wheel and the drive shaft remain relatively stationary.

3. The magnetron sputtering coating equipment according to claim 1, characterized in that, The transmission assembly also includes: The limiting member has one end that passes radially through the driven wheel and the rotating shaft; Alternatively, one end of the limiting member passes radially through the driven wheel and then abuts against the rotating shaft, so that the driving wheel and the drive shaft remain relatively stationary.

4. The magnetron sputtering coating equipment according to claim 1, characterized in that, The side wall of the drive pulley engages with the inner side of the drive belt for transmission.

5. The magnetron sputtering coating equipment according to claim 1, characterized in that, The driven pulley's sidewall engages with the inner sidewall of the drive belt for transmission.

6. The magnetron sputtering coating equipment according to claim 1, characterized in that, Also includes: First platform; The cathode and the first stage form a first chamber, and the main body of the magnetic control unit is located in the first chamber; The anode, together with the cathode, forms a second chamber.

7. The magnetron sputtering coating equipment according to claim 6, characterized in that, Also includes: An isolation section is sandwiched between the cathode and the anode, and the isolation section is a ring-shaped structure made of insulating material.

8. The magnetron sputtering coating equipment according to claim 7, characterized in that, The first platform is a cover-shaped structure, and the first platform has: The first bearing portion, wherein the transmission assembly is disposed on the first bearing portion; The side portion is adjacent to the end face of the first bearing portion away from the transmission assembly; The inner wall of the side portion has a receiving groove, which is located on the end face of the side portion away from the first bearing portion, and the receiving groove is adapted to receive the cathode.

9. The magnetron sputtering coating equipment according to claim 8, characterized in that, The end of the side portion away from the first bearing portion abuts against the end of the isolation portion adjacent to the first bearing portion.

10. The magnetron sputtering coating apparatus according to any one of claims 1 to 9, characterized in that, Also includes: A housing adapted to house the drive unit, magnetic control unit, and transmission components, and to provide a vacuum environment.

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