Viscous damper

Abstract

The utility model belongs to the technical field of viscous dampers, and particularly relates to a viscous damper. The device comprises a damper body, a sleeve is arranged on the surface of a cylinder body of the damper body, two semiconductor chilling plates of an arc-shaped structure are arranged on the surface of the sleeve, a plurality of evenly-distributed cooling fins are arranged on the hot end faces of the two semiconductor chilling plates, and fixing plates are arranged on the outer sides of the cooling fins. The fixing plate is connected with the sleeve through two supporting plates, and a storage battery for supplying power to the semiconductor chilling plate is installed on the fixing plate. The damper body can be well cooled, and the service life of the damper body can be prolonged as much as possible.

Description

Technical Field

[0001] This utility model belongs to the technical field of viscous dampers, and in particular relates to a viscous damper. Background Technology

[0002] Viscous dampers, as a high-efficiency seismic damping device, have been widely used in high-rise buildings, bridges, seismic retrofitting of building structures, and seismic resistance of industrial equipment. Its core technology lies in utilizing a special viscous medium to interact with structural components inside the damper, thereby generating a powerful damping force. This damping force can convert the mechanical energy generated by earthquakes or wind-induced vibrations into thermal energy, effectively reducing the dynamic response of the building and improving the seismic performance and stability of the structure. The viscous damper is mainly composed of a piston, cylinder, end cap, damping medium, and connecting pin seat. Its working principle is based on fluid kinematics, specifically the principle that throttling resistance is generated when fluid passes through a throttling orifice. Under external excitation such as earthquakes or wind-induced vibrations, the building structure vibrates, and the piston inside the viscous damper reciprocates, driving the flow of the damping medium. During this process, intense friction occurs between the molecules of the medium and between the medium and the piston. At the same time, a huge throttling damping is formed when the medium passes through the piston orifice. The resultant force of these actions forms the damping force, which converts vibration energy into thermal energy and dissipates it, thereby slowing down the vibration speed of the structure and achieving the purpose of damping and energy dissipation. In bridges and high-rise buildings in earthquake-prone areas, viscous dampers can effectively absorb and dissipate seismic energy, limit inter-story displacement of buildings, and prevent structural damage.

[0003] Currently, in viscous dampers, when the piston moves, the damping fluid flows from the damping orifice, converting the impact force into heat energy. The damping fluid will continuously heat up, and the performance of the viscous damper will decrease under continuous high temperature. At the same time, it will also cause an increase in the internal pressure of the cylinder, which will shorten the life of the sealing system or cause the damper to burst. Utility Model Content

[0004] The purpose of this invention is to provide a viscous damper that can effectively dissipate heat and extend its service life as much as possible.

[0005] The viscous damper includes a damper body, a sleeve on the cylinder surface of the damper body, two arc-shaped semiconductor cooling chips on the sleeve surface, several evenly distributed heat sinks on the hot end face of each of the two semiconductor cooling chips, a fixing plate on the outside of the heat sinks, the fixing plate being connected to the sleeve through two support plates, and a battery for providing power to the semiconductor cooling chips being installed on the fixing plate.

[0006] Furthermore, a temperature sensor is installed on the sleeve, and a controller electrically connected to the temperature sensor is installed on the fixing plate.

[0007] Furthermore, the sleeve is divided into two halves along its length, with each half hinged to one side, and each side is provided with a mounting plate. Each mounting plate has a threaded hole, and a bolt is threaded into each of the two threaded holes.

[0008] Furthermore, the sleeve is provided with several heat dissipation holes.

[0009] Furthermore, the surface of the heat sink is coated with a heat dissipation coating.

[0010] Furthermore, the heat dissipation coating is a graphene heat dissipation coating.

[0011] Compared with the prior art, the present invention has the following beneficial effects:

[0012] This invention uses a semiconductor cooling chip to cool the sleeve, which in turn dissipates heat from the cylinder of the damper body. Several heat sinks further dissipate the heat generated by the semiconductor cooling chip, resulting in better cooling performance and preventing damage to the cylinder of the damper body due to high temperatures. This design effectively dissipates heat from the damper body, extending its service life as much as possible. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the structure of this utility model;

[0014] Figure 2 for Figure 1 Schematic diagram of the cross-sectional structure of AA;

[0015] Figure 3 This is a perspective view of the present utility model;

[0016] Figure 4 This is an exploded view of the present invention;

[0017] The components in the diagram are named as follows: 1. Damper body; 2. Temperature sensor; 3. Battery; 4. Controller; 5. Fixing plate; 6. Support plate; 7. Sleeve; 8. Heat sink; 9. Mounting plate; 10. Heat dissipation hole; 11. Semiconductor cooling chip. Detailed Implementation

[0018] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, but this is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

[0019] Example

[0020] The viscous damper described in this embodiment, such as Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, the device includes a damper body 1. A sleeve 7 is provided on the cylinder surface of the damper body 1. Two arc-shaped semiconductor cooling chips 11 are provided on the surface of the sleeve 7. Several evenly distributed heat sinks 8 are provided on the hot end faces of both semiconductor cooling chips 11. A fixing plate 5 is provided on the outer side of the heat sinks 8. The fixing plate 5 is connected to the sleeve 7 via two support plates 6. A battery 3, which provides power to the semiconductor cooling chips 11, is installed on the fixing plate 5. The damper body 1 comprises a piston, cylinder, end cap, damping medium, and connecting pin seat. The connecting pin seat of the damper body 1 is welded or threaded to the installation location on the building. When the piston of the damper body 1 reciprocates within the cylinder, due to the pressure difference before and after the piston, the viscous fluid damping material is forced to pass through the damping orifice (or gap). During this process, intense friction occurs between fluid molecules and between the fluid and the piston, generating a huge throttling damping force. The generated damping force converts the kinetic energy of earthquakes or wind vibrations into heat energy and dissipates it, thereby reducing the vibration response of the structure. The magnitude of the damping force is related to the piston's movement speed; the faster the speed, the greater the damping force and the more obvious the energy dissipation effect. The operating principle of the damper body 1 is existing technology. This embodiment does not improve its structure and is merely used as existing technology.

[0021] The cylinder surface of the damper body 1 is covered with a sleeve 7. A cold end face of a thermoelectric cooler 11 is adhered to the surface of the sleeve 7. The thermoelectric cooler 11 has an arc-shaped structure and fits snugly against the outer wall of the sleeve 7 for better heat dissipation of the damper body 1. Several heat sinks 8 are adhered to the hot end face of the thermoelectric cooler 11. Two support plates 6 are adhered to or welded onto the sleeve 7. A fixing plate 5 is connected to the top of the two support plates 6. A battery 3 is installed on the fixing plate 5, providing power to the thermoelectric cooler 11. The working principle of the thermoelectric cooler 11 is based on... The Peltier effect refers to the phenomenon where, when a direct current passes through a thermocouple pair composed of N-type and P-type semiconductors, a temperature difference is generated across the two ends of the thermocouple. The junction where the current flows from the N-type element to the P-type element absorbs heat, becoming the cold junction; conversely, the junction where the current flows from the P-type element to the N-type element releases heat, becoming the hot junction. When the cold junction of the semiconductor cooling chip 11 contacts the sleeve 7, it cools the chip, and the sleeve 7 transfers the cool air to the cylinder of the damper body 1 for heat dissipation. During the flow of the damping medium in the damper body 1, intense friction occurs between the medium and the piston. Friction converts kinetic energy into heat, causing the damper temperature to rise. The thermoelectric cooler 11 cools the sleeve 7, which is in contact with the cylinder of the damper body 1, thus dissipating heat from the cylinder. This prevents direct contact between the thermoelectric cooler 11 and the cylinder of the damper body 1, which could lead to overcooling and potentially adversely affect the damper's performance. Dissipating heat from the damper body 1 helps control its operating temperature and prevents performance degradation or damage due to overheating. The heat sink 8 is in close contact with the hot end face of the thermoelectric cooler 11, transferring heat... The heat is conducted from the hot end to the surface of the heat sink 8, and the heat is dissipated through several heat sinks 8 to cool the damper body 1 and prevent it from overheating and affecting its normal use; two support plates 6 are welded or glued to the surface of the sleeve 7, and the bottom of the fixing plate 5 is welded or glued to the top of the two support plates 6. A storage battery 3 is installed on the fixing plate 5. The storage battery 3 provides power to the semiconductor cooling chip 11 so that it can dissipate heat from the damper body 1. A control switch electrically connected to the semiconductor cooling chip 11 is installed on the fixing plate 5 to control the cooling of the semiconductor cooling chip 11.

[0022] like Figure 1 , Figure 2 , Figure 3 and Figure 4As shown, a temperature sensor 2 is installed on the sleeve 7, and a controller 4 electrically connected to the temperature sensor 2 is installed on the fixing plate 5. The controller 4 is electrically connected to the control switch. The battery 3 provides power to the temperature sensor 2 and the controller 4. The temperature sensor 2 installed on the sleeve 7 monitors the cylinder temperature of the damper body 1. When the cylinder temperature of the damper body 1 is too high, the temperature sensor 2 transmits the temperature signal to the controller 4. After receiving the signal transmitted by the temperature sensor 2, the controller 4 controls the control switch to make the semiconductor cooling chip 11 cool the sleeve 7 and dissipate heat from the cylinder of the damper body 1. When the cylinder temperature of the damper body 1 tends to stabilize, the temperature sensor 2 transmits the signal to the controller 4 again. The controller 4 controls the control switch to cut off the power to the semiconductor cooling chip 11, making its use more automated. Only the operator needs to charge the battery 3. Of course, the battery 3 can also be replaced by a connecting wire, which is more convenient to use and install.

[0023] like Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, the sleeve 7 is divided into two halves along its length. The two halves are hinged on one side, and each half is provided with a mounting plate 9 on the other side. The mounting plate 9 has threaded holes, and a bolt is threaded into each of the two threaded holes. The sleeve 7 is divided into two halves, and the two halves are hinged on one side. The mounting plate 9 is welded or glued to the other side of the hinged end. The two mounting plates 9 have threaded holes, and the bolt is threaded into the two threaded holes. The other end of the bolt is threaded with a nut, thereby fixing the two halves of the sleeve 7 to the cylinder of the damper body 1. The bolt can also be loosened to allow the two halves of the sleeve 7 to rotate around the hinge and be removed from the cylinder of the damper body 1. This makes it easier to repair or replace the semiconductor cooling chip 11 and heat sink 8 on the sleeve 7, making it more flexible in use.

[0024] like Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, the sleeve 7 has several heat dissipation holes 10; the several heat dissipation holes 10 on the sleeve 7 facilitate the better transfer of cold air to the cylinder of the damper body 1, so that the cylinder of the damper body 1 has a better heat dissipation effect.

[0025] like Figure 1 , Figure 2 , Figure 3 and Figure 4As shown, the surface of the heat sink 8 is coated with a heat dissipation coating, which is made of graphene. Graphene has high thermal conductivity and high emissivity, which can quickly transfer and dissipate the heat on the surface of the heat sink 8 into the air, significantly improving the heat dissipation efficiency. This results in better cooling effect of the semiconductor cooling chip 11 and better heat dissipation of the damper body 1 cylinder. The graphene coating also has excellent anti-corrosion properties, which can block corrosive media in the environment and extend the service life of the heat sink 8.

[0026] In actual use, when the liquid damping medium inside the damper body 1 flows, the viscous resistance it generates converts vibration into heat energy, causing the cylinder of the damper body 1 to heat up. The sleeve 7 is cooled by the semiconductor cooling chip 11, and the sleeve 7 dissipates heat from the heated cylinder of the damper body 1. Several heat sinks 8 dissipate the heat from the semiconductor cooling chip 11, making the cooling effect of the semiconductor cooling chip 11 better, avoiding excessive temperature from affecting the use of the damper body 1, and extending its service life as much as possible.

Claims

1. A viscous damper, comprising a damper body (1), characterized in that: A sleeve (7) is provided on the cylinder surface of the damper body (1). Two arc-shaped semiconductor cooling chips (11) are provided on the surface of the sleeve (7). Several evenly distributed heat sinks (8) are provided on the hot end face of the two semiconductor cooling chips (11). A fixing plate (5) is provided on the outside of the heat sinks (8). The fixing plate (5) is connected to the sleeve (7) through two support plates (6). A battery (3) that provides power to the semiconductor cooling chips (11) is installed on the fixing plate (5).

2. The viscous damper according to claim 1, characterized in that: A temperature sensor (2) is installed on the sleeve (7), and a controller (4) electrically connected to the temperature sensor (2) is installed on the fixing plate (5).

3. The viscous damper according to claim 1, characterized in that: The sleeve (7) is divided into two halves along its length. The two halves are hinged on one side, and the other side is provided with a mounting plate (9). The mounting plate (9) is provided with threaded holes, and a bolt is threadedly connected to the two threaded holes.

4. The viscous damper according to claim 1, characterized in that: The sleeve (7) has several heat dissipation holes (10).

5. The viscous damper according to claim 1, characterized in that: The surface of the heat sink (8) is coated with a heat dissipation coating.

6. The viscous damper according to claim 5, characterized in that: The heat dissipation coating is a graphene heat dissipation coating.

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