Cooling fin for heat dissipation module

Abstract

The utility model discloses a radiating fin for a radiating module, which comprises a mounting base layer which is of a rectangular plate structure, a copper foil layer is adhered to the bottom end of the mounting base layer, an aluminum foil layer is adhered to the bottom end of the copper foil layer, connecting layers are symmetrically arranged on two sides of the aluminum foil layer and two sides of the copper foil layer, and the connecting layers are symmetrically mounted on two sides of the bottom end of the mounting base layer; the graphite heat conduction layer is installed in the groove in the upper end of the installation base layer, a breathable layer is arranged at the upper end of the graphite heat conduction layer, and the circle center of the breathable layer is aligned with the circle center of the circular groove in the installation base layer. When the cooling fin for the heat dissipation module is used, the cooling fin is combined with fan heat dissipation equipment to conduct heat dissipation work on an automobile head lamp, the overall occupied area is reduced through high-heat-conduction carbon fibers of the installation base layer and a resin-based composite material, and the installation base layer is combined with a copper foil layer, an aluminum foil layer and a metal heat dissipation layer for use; while the weight of the heat dissipation equipment structure is reduced, heat transfer and dispersion are facilitated.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology for automotive headlights, specifically a heat sink for a heat dissipation module. Background Technology

[0002] With the development of the automotive industry, its integration level is constantly increasing. Inside the headlights, the installation positions of various components are relatively concentrated. This high integration makes it easy for the components inside the headlights to generate a lot of heat during continuous and intensive operation. Due to the relatively limited space inside the headlights, the heat is difficult to dissipate quickly, resulting in heat accumulation. The accumulated heat will have an adverse effect on other components. With the continuous accumulation of high temperature, the operational stability of internal equipment and operating devices will be significantly reduced, thereby affecting the overall performance and service life of the headlights. This places higher demands on the heat dissipation technology of automotive headlights.

[0003] The heat dissipation inside car headlights is handled by traditional fan radiators. Because the internal space of the headlight is relatively small and enclosed, heat is difficult to dissipate naturally and quickly, so it accumulates around the circuit board and components, resulting in poor fan cooling performance. Furthermore, due to the limited internal space of car headlights, it is difficult to stack them on a large scale or lay them flat around the headlights, which reduces the cooling effect. Utility Model Content

[0004] The purpose of this utility model is to provide a heat sink for a heat dissipation module, in order to solve the problem mentioned in the background art that, due to the relatively small and enclosed internal space of the headlamp, heat is difficult to dissipate naturally and quickly, and thus accumulates in large quantities around the circuit board and components, reducing the heat dissipation effect.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a heat sink for a heat dissipation module, comprising a mounting base layer configured as a rectangular plate structure, wherein a copper foil layer is adhered to the bottom end of the mounting base layer, and an aluminum foil layer is adhered to the bottom end of the copper foil layer, wherein connecting layers are symmetrically arranged on both sides of the aluminum foil layer and the copper foil layer, and the connecting layers are symmetrically installed on both sides of the bottom end of the mounting base layer.

[0006] A graphite thermal conductive layer is installed in the groove at the upper end of the mounting base. A breathable layer is provided at the upper end of the graphite thermal conductive layer, and the center of the breathable layer is aligned with the center of the circular groove inside the mounting base. The bottom two sides of the mounting base are respectively bonded to the top of an adhesive layer, and one side of the adhesive layer is bonded to the bottom of the connecting layer.

[0007] Side plates are symmetrically arranged on both sides of the mounting base. The side wall of the side plate abuts against one end of the metal heat dissipation layer, and the two ends of the metal heat dissipation layer abut against the surface of one side plate respectively. The metal heat dissipation layer penetrates the interior of the diffusion copper strip layer, and the diffusion copper strip layer is vertically arranged above the graphite heat-conducting layer.

[0008] By adopting the above technical solution, it is easy to provide a corresponding composite heat dissipation structure inside the device, which facilitates the operation of auxiliary electronic equipment.

[0009] Preferably, the mounting base has a through circular groove inside, and the circular groove of the mounting base is in contact with the graphite thermal conductive layer, and the mounting base is made of a composite material of high thermal conductivity carbon fiber and resin.

[0010] By adopting the above technical solution, the circular groove of the installation base facilitates rapid heat transfer and dissipation between the graphite heat-conducting layer and the bottom copper foil layer.

[0011] Preferably, the connecting layer is configured as a strip-shaped frame structure, and the bottom end of the connecting layer is provided with a trapezoidal groove for adhesion to the adhesive layer, and the connecting layer is perpendicular to the mounting base.

[0012] By adopting the above technical solution, the connecting layer provides adhesion for the installation position of the adhesive layer, which facilitates the adhesive layer to be attached to the surface of the electronic device for heat dissipation.

[0013] Preferably, the top end of the breathable layer is engaged with the bottom end of the diffuser copper strip layer, and the bottom ends of the breathable layer and the diffuser copper strip layer are vertically connected, and the diffuser copper strip layer is equidistantly installed on the upper surface of the graphite thermal conductive layer.

[0014] By adopting the above technical solution, the heat dissipation area is increased by increasing the gap between the internal pores of the breathable layer and the diffusion copper strip layer, thus effectively improving the overall heat dissipation effect of the heat sink.

[0015] Preferably, the sidewall surface of the side plate in contact with the diffused copper strip layer is set as an inclined structure, and the interior of the diffused copper strip layer is penetrated by the mounting strip auxiliary layer, and the mounting strip auxiliary layer is symmetrically arranged on both sides of the metal heat dissipation layer.

[0016] By adopting the above technical solution, the side plate provides a limit for the auxiliary layer of the mounting strip, so that the diffusion copper strip layer and the graphite plate are installed in a perpendicular state, which facilitates heat dissipation.

[0017] Preferably, the top end of the metal heat dissipation layer is adhered to the bottom end of the anti-adhesive layer, and both ends of the anti-adhesive layer are adhered to the top end of the side plate, and the metal heat dissipation layer and the mounting strip auxiliary layer are arranged perpendicularly.

[0018] By adopting the above technical solution, the metal heat dissipation layer and the anti-stick layer work together to prevent contact with other heat dissipation pads of electrical components, which could lead to metal corrosion and affect the heat dissipation effect.

[0019] Compared with the prior art, the beneficial effects of this utility model are: the heat sink for the heat dissipation module:

[0020] 1. When using this device, it is installed in conjunction with a fan cooling device to cool the car headlights. The high thermal conductivity carbon fiber and resin-based composite material of the mounting base reduces the overall area occupied. By combining the mounting base with copper foil layer, aluminum foil layer and metal heat dissipation layer, the weight of the heat dissipation device structure is reduced, while facilitating heat transfer and dispersion. This makes the internal structure of the patch installation stable, and the gaps between the metal heat dissipation layers facilitate the expansion of heat dissipation, making it easier to assist the car headlights in operation.

[0021] 2. The graphite thermal conductive layer, copper foil layer, and aluminum foil layer are tightly attached to the working area of ​​the fan cooling device in an adhesive tape-like manner. The adhesive layer is directly bonded to the surface of the electronic component. In conjunction with the metal heat dissipation layer, the breathable layer, and the internal holes of the mounting bracket, the collected heat is quickly dissipated, the heat dissipation area is expanded, the heat dissipation effect is accelerated, and the heat dissipation effect of the patch is increased. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the overall internal side section of the present invention.

[0023] Figure 2 This is a three-dimensional structural diagram of the mounting base and graphite heat-conducting layer of this utility model in their installation and use state;

[0024] Figure 3 This is a three-dimensional structural diagram of the entire disassembled state of this utility model;

[0025] Figure 4 This is a three-dimensional side-section diagram of the installation base layer and connecting layer of this utility model.

[0026] In the diagram: 1. Mounting base layer; 2. Copper foil layer; 3. Aluminum foil layer; 4. Connecting layer; 5. Breathable layer; 6. Graphite thermal conductive layer; 7. Adhesive layer; 8. Side plate; 9. Metal heat dissipation layer; 10. Diffusion copper strip layer; 11. Mounting strip auxiliary layer; 12. Anti-stick layer. Detailed Implementation

[0027] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0028] Please see Figure 1-4This utility model provides a technical solution: a heat sink for a heat dissipation module, comprising a mounting base layer 1, a copper foil layer 2, an aluminum foil layer 3, a connecting layer 4, a breathable layer 5, a graphite thermal conductive layer 6, an adhesive layer 7, a side plate 8, a metal heat dissipation layer 9, a diffused copper strip layer 10, a mounting strip auxiliary layer 11, and an anti-sticking layer 12.

[0029] The mounting base 1 is a rectangular plate structure. A copper foil layer 2 is adhered to the bottom of the mounting base 1, and an aluminum foil layer 3 is adhered to the bottom of the copper foil layer 2. Connecting layers 4 are symmetrically arranged on both sides of the aluminum foil layer 3 and the copper foil layer 2. The connecting layers 4 are symmetrically installed on both sides of the bottom of the mounting base 1. A through circular groove is provided inside the mounting base 1, and the circular groove of the mounting base 1 is attached to the graphite thermal conductive layer 6. The mounting base 1 is made of a composite material of high thermal conductivity carbon fiber and resin. The connecting layer 4 is a strip-shaped frame structure, and a trapezoidal groove is provided at the bottom of the connecting layer 4 to be adhered to the adhesive layer 7. The connecting layer 4 is perpendicular to the mounting base 1.

[0030] The groove at the upper end of the mounting base 1 provides a limiting position for the adhesion of the graphite heat-conducting layer 6. Simultaneously, the mounting base 1 supports the copper foil layer 2 and aluminum foil layer 3, keeping them flat. This allows the copper foil layer 2 and aluminum foil layer 3 to adhere smoothly to the surface of the automotive headlight through adhesive bonding, facilitating rapid heat dissipation from the headlight. Furthermore, the mounting base 1 is a composite material of highly thermally conductive carbon fiber and resin, which facilitates the rapid transfer of heat absorbed by the copper foil layer 2 and aluminum foil layer 3 to the graphite heat-conducting layer 6. Figure 1 and Figure 2 As shown, to accelerate the heat dissipation of the car headlights, the connecting layer 4 located at the bottom of the mounting base 1 limits the installation position of the copper foil layer 2 and the aluminum foil layer 3, preventing the copper foil layer 2 and the aluminum foil layer 3 from wrinkling and causing wear on the surface of the fan cooling equipment or adjacent components, while also assisting in the adhesion of the adhesive layer 7.

[0031] A graphite heat-conducting layer 6 is installed in the groove at the upper end of the mounting base 1. A breathable layer 5 is provided at the upper end of the graphite heat-conducting layer 6, and the center of the breathable layer 5 is aligned with the center of the circular groove inside the mounting base 1. The bottom two sides of the mounting base 1 are respectively bonded to the top of an adhesive layer 7, and one side of the adhesive layer 7 is bonded to the bottom of the connecting layer 4. The top of the breathable layer 5 is engaged with the bottom of the diffusion copper strip layer 10, and the breathable layer 5 and the bottom of the diffusion copper strip layer 10 are perpendicularly connected. The diffusion copper strip layer 10 is equidistantly installed on the upper surface of the graphite heat-conducting layer 6. The side wall surface of the side plate 8 that contacts the diffusion copper strip layer 10 is set as a slope structure, and the interior of the diffusion copper strip layer 10 is penetrated by the mounting strip auxiliary layer 11, and the mounting strip auxiliary layer 11 is symmetrically arranged on both sides of the metal heat dissipation layer 9.

[0032] The graphite thermally conductive layer 6, in a sheet-like form, is located inside the mounting base layer 1, providing a heat dissipation environment for the vertically mounted diffused copper strip layer 10 on the surface of the graphite thermally conductive layer 6. Figure 2 As shown, the graphite thermally conductive layer 6 and the diffused copper strip layer 10 are perpendicular to each other, as... Figure 2 As shown, the heat dissipation area is expanded by vertically installed diffusion copper strip layers 10, and the gaps between the diffusion copper strip layers 10 facilitate rapid heat flow, accelerating the heat dissipation process. During use, the interior of the diffusion copper strip layers 10 is maintained by a metal heat dissipation layer 9, ensuring stable installation and positioning. Figure 1 and Figure 3 as well as Figure 2 As shown, the metal heat dissipation layer 9 is tightly engaged with the side plate 8, so that the mounting base 1 and the side plate 8 are stably connected. At the same time, the metal heat dissipation layer 9 further increases the heat flow direction for the diffusion copper strip layer 10, accelerates the heat dissipation process and improves the heat dissipation effect, while maintaining the stability of the internal structure.

[0033] Side plates 8 are symmetrically arranged on both sides of the mounting base 1. The side wall of the side plate 8 abuts against one end of the metal heat dissipation layer 9, and the two ends of the metal heat dissipation layer 9 abut against the surface of one side plate 8 respectively. The metal heat dissipation layer 9 penetrates the interior of the diffusion copper strip layer 10, and the diffusion copper strip layer 10 is vertically arranged above the graphite heat conduction layer 6. The top end of the metal heat dissipation layer 9 is adhered to the bottom end of the anti-adhesion layer 12, and the two ends of the anti-adhesion layer 12 are adhered to the top end of the side plate 8. The metal heat dissipation layer 9 is vertically arranged with the mounting strip auxiliary layer 11.

[0034] Side panel 8 limits the position of the mounting base 1 and adhesive layer 7, such as Figure 1 As shown, during use, the adhesive layer 7 is directly adhered to the surface of the car headlight. At the same time, the adhesive layer 7 is also adhered to the side plate 8 and the mounting base 1, so that the side plate 8 and the mounting base 1 remain stable. The mounting strip auxiliary layer 11, which runs through the interior of the diffuser copper strip layer 10, is used to keep the diffuser copper strip layer 10 stable during the engagement and connection with the breathable layer 5. The breathable layer 5 provides assistance for the installation of the diffuser copper strip layer 10 by working in conjunction with the graphite heat-conducting layer 6. The anti-stick layer 12, located at the top of the diffuser copper strip layer 10, provides protection for the top end, preventing it from sticking to other heat dissipation patches during use, which would cause the diffuser copper strip layer 10 to be pulled out, affecting the heat dissipation inside the patch, and causing the graphite heat-conducting layer 6 to deform and be damaged. The anti-stick layer 12 provides protection for this.

[0035] Working principle: When using this heat sink for the heat dissipation module, the adhesive layer 7 provides an adhesive effect for the entire patch to adhere to the surface of the fan device. With the connecting layer 4, the copper foil layer 2 and aluminum foil layer 3 are stretched. Under the pressure of the mounting base 1, the copper foil layer 2 and aluminum foil layer 3 are tightly attached to the heat dissipation position of the car headlight, which accelerates heat transfer. With the help of the internal holes of the mounting base 1, the heat is sent into the interior of the graphite heat-conducting layer 6, so that the graphite heat-conducting layer 6 and the diffuser copper strip layer 10 work together to expand the heat dissipation area and further accelerate the heat dissipation effect. The diffuser copper strip layer 10 is penetrated by the mounting strip auxiliary layer 11 and the metal heat dissipation layer 9. In order to maintain the gap between the diffuser copper strip layers 10 to facilitate airflow and heat removal, the anti-stick layer 12 at the top of the diffuser copper strip layer 10 provides protection for the whole. With the side plate 8 limiting the position, it provides protection for the side wall of the diffuser copper strip layer 10, preventing the diffuser copper strip layer 10 from being pushed and damaged by external forces, increasing the overall practicality.

[0036] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A heat sink for a heat dissipation module, comprising a mounting base (1), a graphite thermally conductive layer (6), and a side plate (8), characterized in that: The mounting base (1) is configured as a rectangular plate structure. A copper foil layer (2) is glued to the bottom of the mounting base (1), and an aluminum foil layer (3) is glued to the bottom of the copper foil layer (2). A connecting layer (4) is symmetrically arranged on both sides of the aluminum foil layer (3) and the copper foil layer (2), and the connecting layer (4) is symmetrically installed on both sides of the bottom of the mounting base (1). A graphite thermal conductive layer (6) is installed in the groove at the upper end of the mounting base (1). A breathable layer (5) is provided at the upper end of the graphite thermal conductive layer (6), and the center of the breathable layer (5) is aligned with the center of the circular groove inside the mounting base (1). The bottom two sides of the mounting base (1) are respectively bonded to the top of an adhesive layer (7), and one side of the adhesive layer (7) is bonded to the bottom of the connecting layer (4). Side plates (8) are symmetrically arranged on both sides of the mounting base (1). The side wall of the side plate (8) abuts against one end of the metal heat dissipation layer (9), and the two ends of the metal heat dissipation layer (9) abut against the surface of one side plate (8) respectively. The metal heat dissipation layer (9) penetrates the interior of the diffusion copper strip layer (10), and the diffusion copper strip layer (10) is vertically arranged at the upper end of the graphite heat-conducting layer (6).

2. A heat sink for a heat dissipation module according to claim 1, characterized in that: The mounting base (1) has a through circular groove inside, and the circular groove of the mounting base (1) is in contact with the graphite heat-conducting layer (6).

3. A heat sink for a heat dissipation module according to claim 1, characterized in that: The connecting layer (4) is configured as a strip frame structure, and the bottom end of the connecting layer (4) is provided with a trapezoidal groove for bonding with the adhesive layer (7). The connecting layer (4) is perpendicular to the mounting base layer (1).

4. A heat sink for a heat dissipation module according to claim 1, characterized in that: The top end of the breathable layer (5) is engaged with the bottom end of the diffused copper strip layer (10), and the breathable layer (5) and the bottom end of the diffused copper strip layer (10) are vertically connected. The diffused copper strip layer (10) is equidistantly installed on the upper surface of the graphite heat-conducting layer (6).

5. A heat sink for a heat dissipation module according to claim 1, characterized in that: The side wall surface of the side plate (8) that contacts the diffused copper strip layer (10) is set as a slope structure, and the interior of the diffused copper strip layer (10) is penetrated by the mounting strip auxiliary layer (11), and the mounting strip auxiliary layer (11) is symmetrically arranged on both sides of the metal heat dissipation layer (9).

6. A heat sink for a heat dissipation module according to claim 1, characterized in that: The top of the metal heat dissipation layer (9) is bonded to the bottom of the anti-adhesive layer (12), and both ends of the anti-adhesive layer (12) are bonded to the top of the side plate (8). The metal heat dissipation layer (9) and the mounting strip auxiliary layer (11) are arranged perpendicularly.

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