MEMS inertial measurement unit batch test calibration device and system

Abstract

The utility model discloses an MEMS inertial measurement unit batch test calibration device and system, the device comprises a data acquisition circuit board and at least one interface board electrically connected with the data acquisition circuit board, the data acquisition circuit board is provided with a processing module, a first connecting piece and a communication module, the first connecting piece is electrically connected with the processing module, the processing module is electrically connected with the communication module, the interface board is provided with a second connecting piece and a plurality of measurement unit interfaces used for being connected with MEMS inertial measurement units, and the second connecting piece is electrically connected with a plurality of interface level conversion modules. And the plurality of interface level conversion modules are electrically connected with the plurality of measuring unit interfaces in a one-to-one correspondence manner. According to the utility model, the problem that the MEMS inertial measurement units cannot be tested and calibrated on a large scale in the prior art can be solved.

Description

Technical Field

[0001] This utility model relates to the field of inertial sensor measurement technology, specifically to a batch testing and calibration device and system for MEMS inertial measurement units. Background Technology

[0002] An Inertial Measurement Unit (IMU) is a multi-axis device that integrates gyroscopes and accelerometers to measure an object's three-axis attitude angles (or angular rates) and acceleration. MEMS inertial measurement units have advantages such as good stability, strong resistance to external interference, and small size, and are widely used in aerospace, marine, navigation, autonomous driving, and unmanned aerial vehicle (UAV) fields.

[0003] Due to factors such as materials and manufacturing processes involved in the production and assembly of MEMS inertial measurement units, calibration and compensation for temperature zero-point, linearity, and cross-coupling are necessary to improve the measurement accuracy of MEMS inertial measurement units. Testing and verification of MEMS inertial measurement units is time-consuming, involves numerous test items, and results in low utilization of experimental equipment. Therefore, achieving efficient and low-cost testing, data acquisition, and data processing remains a challenge.

[0004] MEMS inertial measurement units typically communicate with computers via RS422 / RS232, with the computer acquiring data from the MEMS inertial measurement units through the serial port. However, due to the limitations of the serial port, computers cannot directly acquire MEMS inertial measurement unit data in batches or perform large-scale testing and calibration of MEMS inertial measurement units. Furthermore, MEMS inertial measurement units generally broadcast data externally, with a data update frequency as high as 2kHz and each data frame containing up to 100 bytes. While computers acquire data in batches and at high speed through extended serial ports, the more inertial measurement units acquired, the higher the data error rate will be. Moreover, high-speed sampling is generally not achievable when using extended serial ports. Utility Model Content

[0005] This invention aims to solve at least one of the technical problems existing in the prior art, and proposes a batch testing and calibration device and system for MEMS inertial measurement units. This invention can solve the problem that the prior art cannot test and calibrate MEMS inertial measurement units in large quantities.

[0006] The technical solution of this utility model is implemented as follows: This utility model discloses a batch testing and calibration device for MEMS inertial measurement units, including a data acquisition circuit board and at least one interface board electrically connected to the data acquisition circuit board. The data acquisition circuit board is provided with a processing module, a first connector, and a communication module. The first connector is electrically connected to the processing module, and the processing module is electrically connected to the communication module. The interface board is provided with a second connector and multiple measurement unit interfaces for connecting to MEMS inertial measurement units. The second connector is electrically connected to multiple interface level conversion modules, and the multiple interface level conversion modules are electrically connected to the multiple measurement unit interfaces one-to-one.

[0007] Furthermore, at least one of the interface boards has a different protocol type and is electrically connected to a MEMS inertial measurement unit of the corresponding protocol type.

[0008] Furthermore, interface boards of different protocol types have measurement unit interfaces and interface level conversion modules of different protocol types, and the protocol types of the MEMS inertial measurement unit, measurement unit interface, and interface level conversion module are compatible.

[0009] Furthermore, the processing module includes an ARM processor and an FPGA module, the FPGA module being electrically connected to the ARM processor, the FPGA module being electrically connected to the first connector, and the ARM processor being electrically connected to the communication module.

[0010] Furthermore, the communication module adopts a gigabit network communication module.

[0011] Furthermore, the data acquisition circuit board is also equipped with a FIFO module, which is electrically connected to the processing module.

[0012] Furthermore, the interface board is also provided with a power socket, a first DC / DC power module, and a first LDO power module. The input terminal of the first DC / DC power module is electrically connected to the power socket. The first DC / DC power module is used to convert the input voltage of the power socket into a first voltage to power the data acquisition circuit board. The output terminal of the first DC / DC power module is electrically connected to the input terminal of the first LDO power module and a second connector. The first LDO power module is used to convert the first voltage into a second voltage to power the interface board.

[0013] Furthermore, the data acquisition circuit board is provided with a second DC / DC power module and a second LDO power module. The input terminal of the second DC / DC power module is electrically connected to the output terminal of the first DC / DC power module via a first connector and a second connector. The second DC / DC power module is used to convert the first voltage into a third voltage. The output terminal of the second DC / DC power module is electrically connected to the input terminal of the second LDO power module. The second LDO power module is used to convert the third voltage into a fourth voltage to power the data acquisition circuit board.

[0014] Furthermore, the interface board is also provided with a power management module that corresponds one-to-one with the measurement unit interface. The input terminal of the power management module is connected to the output terminal of the first LDO power module, and the output terminal of the power management module is electrically connected to the measurement unit interface.

[0015] The power management module is used to receive the second voltage output from the first LDO power module and power the MEMS inertial measurement unit under test connected to the corresponding measurement unit interface.

[0016] Furthermore, the first connector is electrically connected to at least one of the second connectors.

[0017] Furthermore, the first connector and the second connector are plugged in to form an electrical connection.

[0018] This utility model also discloses a batch testing and calibration system for MEMS inertial measurement units, including a host computer and the batch testing and calibration device for MEMS inertial measurement units as described above. The data acquisition circuit board of the batch testing and calibration device for MEMS inertial measurement units communicates with the host computer through a communication module.

[0019] Compared with the prior art, the present invention has the following beneficial effects:

[0020] The MEMS inertial measurement unit batch testing and calibration device of this utility model includes a data acquisition circuit board and at least one type of interface board. Different types of interface boards correspond to MEMS inertial measurement units with different communication interfaces. The data acquisition circuit board and the interface board are detachably electrically connected. The interface board can realize the level conversion of the communication interface of the MEMS inertial measurement unit. When it is necessary to test and calibrate MEMS inertial measurement units with different communication interfaces, only the corresponding interface board needs to be replaced. This reduces the secondary production of some circuits, improves the utilization rate of the testing device, reduces the production cost and carbon emissions of the testing device, and enables this device to test and calibrate MEMS inertial measurement units in large quantities.

[0021] The processing module of the data acquisition circuit board of this utility model adopts an FPGA and ARM processor architecture. Each type of interface board of this utility model is provided with a second connector, multiple interface level conversion modules, and multiple measurement unit interfaces for connecting to MEMS inertial measurement units. The multiple interface level conversion modules are electrically connected to the multiple measurement unit interfaces one by one. Each interface level conversion module is electrically connected to the second connector. The second connector is detachably electrically connected to the first connector, so that the interface level conversion module is electrically connected to the FPGA of the processing module. Multiple MEMS inertial measurement units are directly installed on the corresponding interfaces of the interface board, which can realize the mass testing and calibration of MEMS inertial measurement units and significantly improve the efficiency of MEMS inertial measurement unit testing and calibration. Attached Figure Description

[0022] Figure 1 A schematic diagram of a batch testing and calibration system for MEMS inertial measurement units provided in one embodiment of this utility model;

[0023] Figure 2 A schematic diagram of the interface board provided in an embodiment of this utility model;

[0024] Figure 3 This is a schematic diagram of a batch testing and calibration system for MEMS inertial measurement units provided in another embodiment of the present invention. Detailed Implementation

[0025] To enable those skilled in the art to better understand the technical solution of this utility model, the present utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0026] Unless otherwise defined, the technical or scientific terms used in this invention shall have the ordinary meaning understood by one of ordinary skill in the art to which this invention pertains. The terms "first," "second," and similar terms used in this invention do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms "an," "a," or "the" do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms "comprising" or "including" mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. The terms "connected" or "linked" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up," "down," "left," "right," etc., are used only to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0027] In the various figures, the same elements are represented by similar reference numerals. For clarity, not all parts in the figures are drawn to scale. Furthermore, some well-known parts may not be shown in the figures.

[0028] Many specific details of this invention, such as the structure, materials, dimensions, processing techniques, and methods of the components, are described below to provide a clearer understanding of the invention. However, as those skilled in the art will understand, the invention may be implemented without following these specific details.

[0029] See Figures 1 to 3 This utility model discloses a batch testing and calibration device for MEMS inertial measurement units, including at least one interface board electrically connected to a data acquisition circuit board. The data acquisition circuit board is provided with a processing module, a first connector, and a communication module. The first connector is electrically connected to the processing module, and the processing module is electrically connected to the communication module. The interface board is provided with a second connector and multiple measurement unit interfaces for connecting to MEMS inertial measurement units. The second connector is electrically connected to multiple interface level conversion modules, and each interface level conversion module is electrically connected to one of the multiple measurement unit interfaces. In this utility model, "multiple" refers to two or more. The interface level conversion modules are used to convert the level signals output by the corresponding MEMS inertial measurement units into level signals that can be recognized by the processing module (such as an FPGA).

[0030] In some embodiments, at least one of the interface boards has different protocol types and is electrically connected to a MEMS inertial measurement unit of the corresponding protocol type.

[0031] In some embodiments, interface boards of different protocol types have measurement unit interfaces and interface level conversion modules of different protocol types, and the protocol types of the MEMS inertial measurement unit, the measurement unit interface, and the interface level conversion module are compatible.

[0032] In some embodiments, the first connector is electrically connected to at least one of the second connectors.

[0033] In some embodiments, the second connector is detachably electrically connected to the first connector, thereby electrically connecting the interface level conversion module and the processing module. Preferably, the first connector and the second connector are plugged in to form an electrical connection. Further, when the first connector is a socket, the second connector is a plug that mates with the first connector. When the second connector is a socket, the first connector is a plug that mates with the second connector. The socket can be a double-row socket.

[0034] Furthermore, the MEMS inertial measurement unit batch testing and calibration device of this utility model can be equipped with various types of interface boards. Different types of interface boards correspond to MEMS inertial measurement units with different communication interfaces. The data acquisition circuit board is one, and there is at least one interface board of each type. The first connector and the second connector are plugged in to form an electrical connection.

[0035] MEMS inertial measurement units (IMUs) offer a variety of communication interface types to meet the needs of different application scenarios. The interface board's protocol type includes at least one of the following: SPI, I2C, UART, RS-232 / RS-422 / RS-485 serial interfaces, and CAN. Of course, the interface board's protocol type is not limited to these. This invention selects a suitable interface level conversion module (an existing interface level conversion module can be selected) based on the MEMS inertial measurement unit's (IMU) communication interface type. For the SPI interface, if the IMU and FPGA's level standards are incompatible (e.g., IMU is 3.3V LVTTL, FPGA is 5V TTL), a level conversion module is required. Common level conversion modules include MAX3323E and SN74LVC4245, which can convert LVTTL levels to TTL levels or vice versa. For I2C interfaces, if there is a level mismatch, an I2C level converter such as the PCA9306 can be used. This device can convert signals on the I2C bus from one level to another while maintaining the integrity and stability of I2C communication. For RS-232, RS-422, and RS-485 interfaces, an interface converter or module is required when connecting to an FPGA. For example, RS-232 to TTL level conversion can use the MAX232 chip; RS-422 / RS-485 to TTL level conversion may require a differential signal receiver / driver such as the MAX485 or MAX490.

[0036] The MEMS inertial measurement unit batch testing and calibration device of this invention can be used to test and calibrate MEMS inertial measurement units with various communication interfaces.

[0037] In some embodiments, the processing module includes an ARM processor and an FPGA module, the FPGA module being electrically connected to the ARM processor, the FPGA module being electrically connected to a first connector, and the ARM processor being electrically connected to a communication module.

[0038] Furthermore, the data acquisition circuit board is also equipped with a FIFO module, which is electrically connected to the processing module. For example, the FIFO module is electrically connected to the FPGA module. This invention uses a high-speed, high-capacity FIFO, which can ensure the complete reception of all raw data from each MEMS inertial measurement unit, and can meet the requirements of high-speed, large-volume data acquisition.

[0039] Furthermore, the communication module adopts a gigabit network communication module. Of course, the communication module of this utility model is not limited to a gigabit network communication module.

[0040] Furthermore, the measurement unit interface uses a socket that matches the MEMS inertial measurement unit.

[0041] Furthermore, the interface board is also provided with a power socket and a first power module. The input terminal of the first power module is electrically connected to the power socket, and the first output terminal of the first power module is electrically connected to the second connector. The first output terminal of the first power module is used to output a first voltage to power the data acquisition circuit board, and the second output terminal of the first power module is used to output a second voltage to power the interface board.

[0042] In some embodiments, the first power module includes a first DC / DC power module and a first LDO power module. The input terminal of the first DC / DC power module is electrically connected to a power socket and is used to convert the input voltage of the power socket into a first voltage. The output terminal of the first DC / DC power module is electrically connected to the input terminal of the first LDO power module and a second connector and is used to convert the first voltage into a second voltage.

[0043] Furthermore, the data acquisition circuit board is provided with a second power module. The input terminal of the second power module is electrically connected to the first connector, and the output terminal of the second power module is electrically connected to the power supply terminals of the processing module and the communication module.

[0044] In some embodiments, the second power module includes a second DC / DC power module and a second LDO power module. The input terminal of the second DC / DC power module is electrically connected to the first connector. The second DC / DC power module is used to convert the first voltage into a third voltage. The output terminal of the second DC / DC power module is electrically connected to the input terminal of the second LDO power module. The second LDO power module is used to convert the third voltage into a fourth voltage to power the processing module and the communication module.

[0045] In some embodiments, the interface board is further provided with a power management module corresponding to the measurement unit interface. The input terminal of the power management module is connected to the second output terminal of the first power module (i.e., the output terminal of the first LDO power module) for receiving the second voltage. The output terminal of the power management module is electrically connected to the measurement unit interface for supplying power to the MEMS inertial measurement unit under test connected to the measurement unit interface.

[0046] The power supply management module of this utility model has a power supply detection function, which can individually power off MEMS inertial measurement units with electrical abnormalities. It will not affect the calibration and testing of other MEMS inertial measurement units due to the failure of one MEMS inertial measurement unit. Furthermore, the abnormal MEMS inertial measurement units are displayed and recorded on the host computer, which facilitates accurate troubleshooting and repair of MEMS inertial measurement units in the future.

[0047] The power supply management module of this invention also has a power regulation function, that is, it can precisely adjust the output voltage according to actual needs. Each power supply management module controls the power supply and power-off of each MEMS inertial measurement unit.

[0048] The input and output signals of all measurement unit interfaces in this invention are converted to level and then connected to the IO interface of the processing module on the data acquisition circuit board (i.e., the IO interface of the FPGA of the processing module) through the first connector and the second connector (double row socket) on the interface board; the power module on the interface board is used to transform the input voltage and power the data acquisition circuit board and multiple MEMS inertial measurement units under test; the processing module (the ARM of the processing module) is bidirectionally connected to the gigabit network communication module through IO and is used to control the gigabit network communication module to communicate with the host computer. The first and second connectors (double-row sockets) are used to achieve a detachable electrical connection between the data acquisition circuit board and the interface board; the interface board is used for signal level conversion and power supply to the MEMS inertial measurement unit and the data acquisition circuit board; the ARM & FPGA processing module is used to acquire data from the MEMS inertial measurement unit under test in real time, parse, store and process the acquired data (e.g., the FPGA module is used to acquire data from the MEMS inertial measurement unit under test in real time, parse and store the acquired data; the ARM processor is used to read the data stored in the FPGA and process it, and send the processed data to the host computer through the communication module), and send the processed data to the host computer through the communication module (e.g., gigabit network communication module); the host computer is used to receive, send, display, process and store data, and send the calculated different calibration parameters to each corresponding MEMS inertial measurement unit for calibration writing.

[0049] See Figure 1This utility model also discloses a batch testing and calibration system for MEMS inertial measurement units, including a host computer and the batch testing and calibration device for MEMS inertial measurement units as described above. The data acquisition circuit board of the batch testing and calibration device communicates with the host computer through a communication module. Multiple MEMS inertial measurement units to be tested are plugged into the interface board of the batch testing and calibration device.

[0050] This invention employs a hardware detection method to determine whether each MEMS inertial measurement unit mounting position, i.e., the measurement unit interface, has a unit under test installed, and displays and identifies this information in the host computer.

[0051] In this invention, the data acquisition circuit board adopts an FPGA and ARM processor architecture. Multiple MEMS inertial measurement units are directly installed on the corresponding interfaces of the interface board. They communicate with the ARM & FPGA processing module of the data acquisition circuit board through the second connector and the first connector (double row socket). The ARM & FPGA processing module acquires and processes the data of the MEMS inertial measurement units in real time, and then sends the processed data to the host computer through the communication module (gigabit network communication module). The host computer processes and calculates the compensation parameters of the corresponding MEMS inertial measurement units and downloads the parameters to the corresponding MEMS inertial measurement units. In this way, all calibration tests can be completed with a single installation of the MEMS inertial measurement units, thereby solving the problem of large-scale testing and calibration of MEMS inertial measurement units and greatly improving the efficiency of MEMS inertial measurement unit testing and calibration.

[0052] This utility model relates to a batch testing and calibration device for MEMS gyroscopes, MEMS accelerometers, and MEMS inertial measurement units, which can be widely used for batch data acquisition, testing, and calibration of MEMS gyroscopes, MEMS accelerometers, and MEMS inertial measurement units.

[0053] It is understood that the above embodiments are merely exemplary implementations used to illustrate the principles of this utility model, and the utility model is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of this utility model, and these modifications and improvements are also considered to be within the protection scope of this utility model.

Claims

1. A batch testing and calibration device for MEMS inertial measurement units, characterized in that: The device includes a data acquisition circuit board and at least one interface board electrically connected to the data acquisition circuit board. The data acquisition circuit board is provided with a processing module, a first connector, and a communication module. The first connector is electrically connected to the processing module, and the processing module is electrically connected to the communication module. The interface board is provided with a second connector and multiple measurement unit interfaces for connecting to a MEMS inertial measurement unit. The second connector is electrically connected to multiple interface level conversion modules, and the multiple interface level conversion modules are electrically connected to the multiple measurement unit interfaces in a one-to-one correspondence.

2. The MEMS inertial measurement unit batch testing and calibration device as described in claim 1, characterized in that: At least one of the interface boards has a different protocol type and is electrically connected to a MEMS inertial measurement unit of the corresponding protocol type.

3. The MEMS inertial measurement unit batch testing and calibration device as described in claim 2, characterized in that: Interface boards of different protocol types have different protocol type measurement unit interfaces and interface level conversion modules, and the protocol types of MEMS inertial measurement units, measurement unit interfaces, and interface level conversion modules are compatible.

4. The MEMS inertial measurement unit batch testing and calibration device as described in claim 1, characterized in that: The processing module includes an ARM processor and an FPGA module. The FPGA module is electrically connected to the ARM processor and to a first connector. The ARM processor is electrically connected to a communication module.

5. The MEMS inertial measurement unit batch testing and calibration device as described in claim 1 or 3, characterized in that: The data acquisition circuit board is also equipped with a FIFO module, which is electrically connected to the processing module.

6. The MEMS inertial measurement unit batch testing and calibration device as described in claim 1, characterized in that: The interface board is also provided with a power socket, a first DC / DC power module, and a first LDO power module. The input terminal of the first DC / DC power module is electrically connected to the power socket. The first DC / DC power module is used to convert the input voltage of the power socket into a first voltage to power the data acquisition circuit board. The output terminal of the first DC / DC power module is electrically connected to the input terminal of the first LDO power module and a second connector. The first LDO power module is used to convert the first voltage into a second voltage to power the interface board.

7. The MEMS inertial measurement unit batch testing and calibration device as described in claim 6, characterized in that: The interface board is also equipped with a power management module that corresponds one-to-one with the measurement unit interface. The input terminal of the power management module is connected to the output terminal of the first LDO power module, and the output terminal of the power management module is electrically connected to the measurement unit interface.

8. The MEMS inertial measurement unit batch testing and calibration device as described in claim 1, characterized in that: The first connector is electrically connected to at least one of the second connectors.

9. The MEMS inertial measurement unit batch testing and calibration device as described in claim 1 or 8, characterized in that: The first connector and the second connector are plugged in to form an electrical connection.

10. A batch testing and calibration system for MEMS inertial measurement units, characterized in that: It includes a host computer and a MEMS inertial measurement unit batch testing and calibration device as described in any one of claims 1 to 9, wherein the data acquisition circuit board of the MEMS inertial measurement unit batch testing and calibration device communicates with the host computer through a communication module.

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