Embedded fanless industrial computer

Abstract

The utility model provides an embedded fanless industrial computer. The embedded fanless industrial computer comprises a circuit board and a cooling system. The cooling system comprises a liquid pump, a heat exchange assembly and a heat dissipation module, the heat exchange assembly and the heat dissipation module are arranged on the circuit board side by side and provided with storage cavities, and the storage cavities are filled with cooling liquid. The liquid pump is connected with the heat exchange assembly and the storage cavity of the heat dissipation module and drives cooling liquid to circulate between the heat exchange assembly and the heat dissipation module. By means of continuous circulation of the liquid pump, the cooling liquid is introduced into the storage cavity, it is ensured that heat of electronic elements is effectively taken away, the risk of impurity deposition of the cooling liquid is reduced, and pipelines or assemblies are prevented from being blocked. The heat exchange assembly and the heat dissipation module are arranged in parallel and directly act on a high heating element of the circuit board, the heat dissipation path is optimized, the cooling efficiency is improved, and stable operation of the fanless industrial computer is guaranteed.

Description

Technical Field

[0001] This application relates to the field of industrial computers, and more particularly to a fanless industrial computer. Background Technology

[0002] Traditional industrial computers are usually equipped with fans as the main cooling solution. These fans remove the heat generated inside by forcing airflow to ensure stable system operation. However, fans may generate noise during long-term operation and are prone to dust accumulation, which leads to a decrease in cooling efficiency. In addition, the presence of fans will also increase the mechanical wear of the system and reduce the reliability of the system. Especially in some harsh environments, such as industrial sites with high dust or high humidity, the performance of fans will be severely affected.

[0003] To address the noise and maintenance issues caused by fans, the industry has developed various fanless cooling solutions for industrial computers. Common fanless cooling solutions include: using heat sinks and heat pipes to conduct heat from the heat source to the heat sink, and then dissipating the heat into the environment through natural convection. In addition, there are solutions that use heat pipe technology to conduct heat from the heat source to a heat dissipation area away from the heat source. These solutions typically rely on passive cooling technology to reduce noise and maintenance requirements.

[0004] While the aforementioned fanless cooling solutions have mitigated some of the problems caused by fans, they still have certain shortcomings. Passive cooling solutions have limited heat dissipation capacity. For high-performance industrial computers or under high loads, they may not be able to effectively dissipate the generated heat quickly enough, leading to excessively high system temperatures and affecting equipment stability and lifespan. Furthermore, these solutions typically require a large heat dissipation area and specific installation environments, limiting the flexibility and application range of industrial computers. Therefore, for industrial computers where installing cooling fans is inconvenient, such as in some industrial applications like highly vibrating machinery, the mechanical components of fans may be affected, leading to vibration-induced noise and equipment malfunctions. Thus, in these environments, cooling solutions without moving parts are preferred to improve equipment reliability and durability. Achieving embedded fanless cooling remains a pressing technical challenge. Utility Model Content

[0005] In view of this, it is necessary to provide an embedded fanless industrial computer with efficient heat dissipation to solve the above problems.

[0006] Embodiments of this application provide an embedded fanless industrial computer, comprising:

[0007] Circuit board;

[0008] A cooling system includes a liquid pump, a heat exchange component, and a heat dissipation module. The heat exchange component and the heat dissipation module are arranged side by side and are both mounted on the circuit board. Both the heat exchange component and the heat dissipation module have storage chambers. The storage chambers of the heat exchange component and the heat dissipation module are filled with coolant. The liquid pump is mounted on the heat exchange component and connects the storage chambers of the heat exchange component and the heat dissipation module.

[0009] The liquid pump drives the coolant to circulate in the heat exchange assembly and the heat dissipation module.

[0010] In at least one embodiment of this application, the heat exchange assembly includes a first heat exchanger and a second heat exchanger arranged in parallel. Both the first heat exchanger and the second heat exchanger have an inner cavity and are connected to the liquid pump. Both the first heat exchanger and the second heat exchanger have heat dissipation fins on their outer peripheral surfaces.

[0011] In at least one embodiment of this application, the circuit board is provided with a heating element, the heat dissipation module includes a heat-absorbing element and an infusion tube, the heat-absorbing element abuts against the heating element, the heat-absorbing element has an inner cavity, one end of the infusion tube is connected to the inner cavity of the heat-absorbing element, and the other end is connected to the liquid pump.

[0012] In at least one embodiment of this application, the heat-generating element includes a CPU, a memory card, and a graphics card, and the heat dissipation module includes a CPU heat-absorbing element, a memory card heat-absorbing element, and a graphics card heat-absorbing element. The CPU heat-absorbing element is disposed on the CPU, the memory card heat-absorbing element is disposed on the memory card, and the graphics card heat-absorbing element is disposed on the graphics card. Each of the CPU heat-absorbing element, the memory card heat-absorbing element, and the graphics card heat-absorbing element has an internal cavity.

[0013] In at least one embodiment of this application, the heat dissipation module further includes a CPU infusion tube, a memory card infusion tube, and a graphics card infusion tube. One end of the memory card infusion tube is connected to the inner cavity of the CPU heat-absorbing element, and the other end is connected to the inner cavity of the memory card heat-absorbing element. One end of the CPU infusion tube is connected to the inner cavity of the CPU heat-absorbing element, and the other end is connected to the inner cavity of the graphics card heat-absorbing element. One end of the graphics card infusion tube is connected to the inner cavity of the graphics card heat-absorbing element, and the other end is connected to the liquid pump.

[0014] In at least one embodiment of this application, the embedded fanless industrial computer includes a fixing member, one end of which is fixedly connected to the cooling system and the other end of which is fixedly connected to the circuit board.

[0015] In at least one embodiment of this application, the liquid pump includes a first pump body and a second pump body, the first pump body being located at the upper end of the first heat exchanger, the second pump body being located at the upper end of the second heat exchanger, the first pump body being connected to the first heat exchanger, and the second pump body being connected to the second heat exchanger.

[0016] In at least one embodiment of this application, the liquid pump includes an infusion tube disposed between the first pump body and the second pump body, and the infusion tube connects the first pump body and the second pump body.

[0017] In at least one embodiment of this application, the first pump body has an infusion hole facing away from the direction of the second pump body, and the graphics card infusion tube is inserted into the infusion hole and communicates with the first pump body.

[0018] In at least one embodiment of this application, the coolant is water.

[0019] The aforementioned embedded fanless industrial computer connects to the storage chambers of the heat exchange components and heat sink via a liquid pump, driving the coolant to circulate between them. This design, by introducing coolant into the storage chambers of the heat exchange components and heat sink, and through continuous circulation by the liquid pump, ensures that the coolant can effectively remove heat from the electronic components, preventing localized overheating and reducing the risk of impurities accumulating in the coolant within the system. This structural design helps prevent blockages in coolant pipes or components because the continuous flow of coolant avoids the accumulation of impurities in specific areas. Furthermore, the parallel arrangement of the heat exchange components and heat sink directly acts on the high-heat-generating components on the circuit board, further optimizing the heat dissipation path and improving overall cooling efficiency, thereby ensuring the stable operation of the embedded fanless industrial computer under fanless conditions. Attached Figure Description

[0020] Figure 1 This is a structural diagram of an embedded fanless industrial computer.

[0021] Figure 2 This is a structural diagram of the cooling system;

[0022] Figure 3 This is a structural diagram of the circuit board;

[0023] Figure 4 This is a disassembled diagram of the cooling system.

[0024] Explanation of main component symbols

[0025] 1. Circuit board; 2. Cooling system; 3. Liquid pump; 4. Heat exchange component; 5. Heat dissipation module; 8. First heat exchange component; 9. Second heat exchange component; 11. Heat dissipation fins; 12. Heating element; 13. Heat absorption element; 15. CPU; 16. Memory card; 17. Graphics card; 18. CPU heat absorption element; 19. Memory card heat absorption element; 20. Graphics card heat absorption element; 21. CPU infusion tube; 22. Memory card infusion tube; 23. Graphics card infusion tube; 24. Fixing component; 25. First pump body; 26. Second pump body; 27. Infusion tube; 100. An embedded fanless industrial computer. Detailed Implementation

[0026] The embodiments of this application will now be described with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0027] It should be noted that when a component is considered to be "connected" to another component, it can be directly connected to the other component or may also have an intervening component. When a component is considered to be "placed" on another component, it can be directly placed on the other component or may also have an intervening component. The terms "top," "bottom," "upper," "lower," "left," "right," "front," "back," and similar expressions used in this article are for illustrative purposes only.

[0028] Embodiments of this application provide an embedded fanless industrial computer, comprising:

[0029] Circuit board;

[0030] A cooling system includes a liquid pump, a heat exchange component, and a heat dissipation module. The heat exchange component and the heat dissipation module are arranged side by side and are both mounted on the circuit board. Both the heat exchange component and the heat dissipation module have storage cavities. The storage cavities of the heat exchange component and the heat dissipation module are filled with coolant. The liquid pump is mounted on the heat exchange component and connects the storage cavities of the heat exchange component and the heat dissipation module.

[0031] The liquid pump drives the coolant to circulate in the heat exchange assembly and the heat dissipation module.

[0032] The aforementioned embedded fanless industrial computer connects to the storage chambers of the heat exchange components and heat sink via a liquid pump, driving the coolant to circulate between them. This design, by introducing coolant into the storage chambers of the heat exchange components and heat sink, and through continuous circulation by the liquid pump, ensures that the coolant can effectively remove heat from the electronic components, preventing localized overheating and reducing the risk of impurities accumulating in the coolant within the system. This structural design helps prevent blockages in coolant pipes or components because the continuous flow of coolant avoids the accumulation of impurities in specific areas. Furthermore, the parallel arrangement of the heat exchange components and heat sink directly acts on the high-heat-generating components on the circuit board, further optimizing the heat dissipation path and improving overall cooling efficiency, thereby ensuring the stable operation of the embedded fanless industrial computer under fanless conditions.

[0033] The following is in conjunction with the appendix Figure 1-4 The following describes some embodiments of this application in detail. Unless otherwise specified, the embodiments and features described below can be combined with each other.

[0034] Embodiments of this application provide an embedded fanless industrial computer 100, comprising:

[0035] Circuit board 1;

[0036] Cooling system 2 includes liquid pump 3, heat exchange component 4 and heat dissipation module 5. The heat exchange component 4 and the heat dissipation module 5 are arranged side by side and are both mounted on the circuit board 1. Both the heat exchange component 4 and the heat dissipation module 5 have storage cavities. The storage cavities of the heat exchange component 4 and the heat dissipation module 5 are filled with coolant. The liquid pump 3 is mounted on the heat exchange component 4 and is connected to the storage cavities of the heat exchange component 4 and the heat dissipation module 5.

[0037] The liquid pump 3 drives the coolant to circulate in the heat exchange assembly 4 and the heat dissipation module 5.

[0038] Specifically, the system includes a liquid pump 3, a heat exchange component 4, and a heat dissipation module 5. The liquid pump 3 drives the coolant to circulate between the heat exchange component 4 and the heat dissipation module 5, carrying away the heat generated by the heating element 12. The storage chambers of the heat exchange component 4 and the heat dissipation module 5 are filled with coolant, thereby improving heat dissipation efficiency. The coolant flows between the two storage chambers through the liquid pump 3, and the coolant circulation process avoids heat accumulation inside the equipment. The heat exchange component 4 and the heat dissipation module 5 are arranged in parallel, which reduces the system space occupation and ensures that the liquid can flow efficiently. The liquid pump 3 achieves efficient circulation heat dissipation by connecting the storage chambers. In industrial applications, such as embedded systems in high-temperature environments, this system can maintain the long-term stable operation of the equipment. Its operation process is as follows: when the industrial computer starts running, the internal heating elements 12, such as the CPU 15 and the graphics card 17, generate a lot of heat. The coolant is driven by the liquid pump 3 to circulate between the heat exchange component 4 and the heat dissipation module 5, carrying away the heat in time, thereby ensuring that the equipment continues to work stably under high load conditions. This system is particularly suitable for industrial scenarios with limited space and requiring efficient heat dissipation, such as industrial control systems embedded in vibrating equipment or high-temperature operating platforms.

[0039] In a specific example, the heat exchange component 4 includes a first heat exchange element 8 and a second heat exchange element 9 arranged in parallel. Both the first heat exchange element 8 and the second heat exchange element 9 have internal cavities and are connected to the liquid pump 3. Both the first heat exchange element 8 and the second heat exchange element 9 have heat dissipation fins 11 on their outer peripheral surfaces.

[0040] Specifically, the heat exchange assembly 4 includes first and second heat exchange elements 9 arranged in parallel, both with internal cavities. A liquid pump 3 communicates with these two cavities and has heat dissipation fins 11 on its outer peripheral surface. The heat dissipation fins 11 increase the surface area and dissipate heat through natural convection. The parallel arrangement of the first and second heat exchange elements 9 allows the coolant to be distributed more evenly between them, thus avoiding heat concentration in one area and improving overall heat dissipation efficiency. Furthermore, the parallel layout saves internal space, and the interconnected design of the liquid pump 3 ensures smoother coolant circulation. This design is suitable for industrial applications requiring large-area heat dissipation and high heat dissipation efficiency, such as embedded systems with high-load computing.

[0041] In a specific example, the circuit board 1 is provided with a heating element 12, and the heat dissipation module 5 includes a heat-absorbing element 13 and an infusion tube 27. The heat-absorbing element 13 abuts against the heating element 12 and has an inner cavity. One end of the infusion tube 27 is connected to the inner cavity of the heat-absorbing element 13 and the other end is connected to the liquid pump 3.

[0042] Specifically, the heat-generating element 12 is directly connected to the heat dissipation module 5. The heat dissipation module 5 includes a heat-absorbing element 13 and a liquid inlet pipe 27. The heat-absorbing element 13 is in close contact with the heat-generating element 12, absorbing the heat generated by it. The liquid inlet pipe 27 connects the coolant inside the heat-absorbing element 13 to the liquid pump 3, ensuring that the heat from the heat-absorbing element 13 can be conducted away in a timely manner. The design of the heat-absorbing element 13 enhances the heat dissipation effect. By being in close contact with the heat-generating element 12, it ensures that heat is quickly transferred to the coolant, preventing heat from accumulating on the heat-generating element 12. The connection of the liquid inlet pipe 27 ensures stable circulation of the coolant, enabling efficient transfer of coolant from the heat source to the heat dissipation module 5 for cooling. This design is particularly suitable for electronic components that require direct heat dissipation, such as a high-power CPU 15 or a graphics card 17, allowing the system to maintain low-temperature operation even under high computational loads.

[0043] In a specific example, the heat-generating element 12 includes a CPU, a memory card 16, and a graphics card 17. The heat dissipation module 5 includes a CPU heat-absorbing element 13, a memory card heat-absorbing element 19, and a graphics card heat-absorbing element 20. The CPU heat-absorbing element 13 is disposed on the CPU, the memory card heat-absorbing element 19 is disposed on the memory card 16, and the graphics card heat-absorbing element 20 is disposed on the graphics card 17. All three elements—CPU heat-absorbing element 13, memory card heat-absorbing element 19, and graphics card heat-absorbing element 20—have internal cavities.

[0044] Specifically, the structure of the heat dissipation module 5 was refined, and corresponding heat-absorbing elements 13 were designed for different heat-generating components 12: CPU 15, memory card, and graphics card 17. Each heat-absorbing element 13 has an internal cavity that communicates with the coolant. This design allows each heat-generating component 12 to dissipate heat independently, avoiding localized overheating caused by concentrated heat. The independent design of the CPU heat-absorbing element 18, memory card heat-absorbing element 13, and graphics card heat-absorbing element 20 not only improves the overall heat dissipation performance but also allows for optimized allocation according to the heat dissipation requirements of different components. Through independent heat dissipation paths and modular design, the cooling system 2 becomes more scalable, making it particularly suitable for industrial scenarios where multiple heat-generating components 12 operate simultaneously with different heat dissipation requirements.

[0045] In a specific example, the heat dissipation module 5 includes a CPU infusion tube 27, a memory card infusion tube 22, and a graphics card infusion tube 23. One end of the memory card infusion tube 22 is connected to the inner cavity of the CPU heat-absorbing element 13, and the other end is connected to the inner cavity of the memory card heat-absorbing element 19. One end of the CPU infusion tube 27 is connected to the inner cavity of the CPU heat-absorbing element 13, and the other end is connected to the inner cavity of the graphics card heat-absorbing element 20. One end of the graphics card infusion tube 23 is connected to the inner cavity of the graphics card heat-absorbing element 20, and the other end is connected to the liquid pump 3.

[0046] Specifically, a liquid circulation path is defined between different heat-generating components 12. Each heat-absorbing component 13 is connected via a CPU coolant pipe 21, a memory card coolant pipe 27, and a graphics card coolant pipe 23, ensuring smooth flow of coolant between these components and forming a closed-loop circulation system. The design of each coolant pipe 27 ensures that the coolant can transfer heat between components as needed, avoiding localized overheating and ensuring a balanced overall system temperature. This solution is suitable for high-performance industrial systems with multiple heat sources, ensuring that the heat dissipation requirements of different components are met.

[0047] In one specific example, the embedded fanless industrial computer 100 includes a fixing member 24, one end of which is fixedly connected to the cooling system 2 and the other end of which is fixedly connected to the circuit board 1.

[0048] Specifically, one end of the fixing component 24 is connected to the cooling system 2, and the other end is connected to the circuit board 1, ensuring that the cooling system 2 remains stable and does not shift during use. The function of the fixing component 24 is to firmly install the entire heat dissipation system onto the circuit board 1, preventing the cooling system 2 from shifting due to external vibration or movement, thus affecting the heat dissipation effect. This solution is particularly suitable for industrial applications in harsh environments or where equipment vibration is frequent, such as workshop machine controllers.

[0049] In one specific example, the liquid pump 3 includes a first pump body 25 and a second pump body 26. The first pump body is located at the upper end of the first heat exchanger 8, and the second pump body 26 is located at the upper end of the second heat exchanger 9. The first pump body 25 is connected to the first heat exchanger 8, and the second pump body 26 is connected to the second heat exchanger 9.

[0050] Specifically, the liquid pump 3 consists of a first pump body 25 and a second pump body 26, which are respectively mounted on the first heat exchanger 8 and the second heat exchanger 9, and are connected to their respective heat exchangers. The two independent pump bodies enable independent control of the two heat exchangers, allowing the coolant flow rate to be adjusted according to their respective heat dissipation needs, ensuring maximum heat dissipation efficiency. This design increases the flexibility of the heat dissipation system and is suitable for systems where the heat-generating elements 12 are unevenly distributed.

[0051] In one specific example, the liquid pump 3 includes an infusion tube 27, which is disposed between the first pump body 25 and the second pump body 26, and the infusion tube 27 connects the first pump body 25 and the second pump body 26.

[0052] Specifically, the first pump body and the second pump body 26 are connected by a liquid inlet pipe 27 to ensure that the coolant can flow smoothly between the two pump bodies, forming a complete cooling circuit. The liquid inlet pipe 27 avoids uneven flow between the two pump bodies, ensuring the uniformity of coolant flow throughout the system, thereby improving the overall heat dissipation effect.

[0053] In one specific example, the first pump body 25 has an infusion hole facing away from the second pump body 26, and the graphics card infusion tube 23 is inserted into the infusion hole and communicates with the first pump body 25.

[0054] Specifically, the structure of the first pump body 25 is described in detail. A coolant inlet is opened facing away from the second pump body 26, and the graphics card coolant inlet tube 23 is inserted into this inlet and connected to the first pump body 25, ensuring that the coolant of the graphics card 17 can be efficiently transferred through the first pump body 25. Through this structural design, the heat dissipation of the graphics card 17 is further optimized, ensuring that the graphics card 17 can dissipate heat in a timely manner even under high load.

[0055] In one specific instance, the coolant is water.

[0056] Specifically, water is used as the coolant. Water has excellent thermal conductivity and is cost-effective, making it suitable for the cooling needs of industrial computers. Water's high specific heat capacity and good fluidity ensure that it can efficiently absorb and transfer heat throughout the cooling system, thereby further improving the overall efficiency of the cooling system.

[0057] The above description is merely an embodiment of this application. It should be noted that those skilled in the art can make improvements without departing from the inventive concept of this application, but these improvements all fall within the protection scope of this application.

Claims

1. An embedded fanless industrial computer, characterized in that, include: Circuit board; A cooling system includes a liquid pump, a heat exchange component, and a heat dissipation module. The heat exchange component and the heat dissipation module are arranged side by side and are both mounted on the circuit board. Both the heat exchange component and the heat dissipation module have storage chambers. The storage chambers of the heat exchange component and the heat dissipation module are filled with coolant. The liquid pump is mounted on the heat exchange component and connects the storage chambers of the heat exchange component and the heat dissipation module. The liquid pump drives the coolant to circulate in the heat exchange assembly and the heat dissipation module.

2. The embedded fanless industrial computer according to claim 1, characterized in that, The heat exchange assembly includes a first heat exchanger and a second heat exchanger arranged in parallel. Both the first heat exchanger and the second heat exchanger have an inner cavity and are connected to the liquid pump. Both the first heat exchanger and the second heat exchanger have heat dissipation fins on their outer peripheral surfaces.

3. The embedded fanless industrial computer according to claim 2, characterized in that, The circuit board is equipped with a heating element, and the heat dissipation module includes a heat-absorbing element and an infusion tube. The heat-absorbing element abuts against the heating element and has an inner cavity. One end of the infusion tube is connected to the inner cavity of the heat-absorbing element, and the other end is connected to the liquid pump.

4. The embedded fanless industrial computer according to claim 3, characterized in that, The heat-generating components include a CPU, a memory card, and a graphics card. The heat dissipation module includes a CPU heat-absorbing element, a memory card heat-absorbing element, and a graphics card heat-absorbing element. The CPU heat-absorbing element is located on the CPU, the memory card heat-absorbing element is located on the memory card, and the graphics card heat-absorbing element is located on the graphics card. Each of the CPU heat-absorbing element, the memory card heat-absorbing element, and the graphics card heat-absorbing element has an internal cavity.

5. The embedded fanless industrial computer according to claim 4, characterized in that, The heat dissipation module also includes a CPU infusion tube, a memory card infusion tube, and a graphics card infusion tube. One end of the memory card infusion tube is connected to the inner cavity of the CPU heat-absorbing element, and the other end is connected to the inner cavity of the memory card heat-absorbing element. One end of the CPU infusion tube is connected to the inner cavity of the CPU heat-absorbing element, and the other end is connected to the inner cavity of the graphics card heat-absorbing element. One end of the graphics card infusion tube is connected to the inner cavity of the graphics card heat-absorbing element, and the other end is connected to the liquid pump.

6. The embedded fanless industrial computer according to claim 1, characterized in that, The embedded fanless industrial computer includes a fixing component, one end of which is fixedly connected to the cooling system and the other end of which is fixedly connected to the circuit board.

7. The embedded fanless industrial computer according to claim 5, characterized in that, The liquid pump includes a first pump body and a second pump body. The first pump body is located at the upper end of the first heat exchanger, and the second pump body is located at the upper end of the second heat exchanger. The first pump body is connected to the first heat exchanger, and the second pump body is connected to the second heat exchanger.

8. The embedded fanless industrial computer according to claim 7, characterized in that, The liquid pump includes an infusion tube disposed between the first pump body and the second pump body, and the infusion tube connects the first pump body and the second pump body.

9. The embedded fanless industrial computer according to claim 7, characterized in that, The first pump body has an infusion hole facing away from the second pump body, and the graphics card infusion tube is inserted into the infusion hole and communicates with the first pump body.

10. The embedded fanless industrial computer according to claim 1, characterized in that, The coolant is water.

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