Tool for planting high-lead solder balls in CBGA device

Abstract

The utility model belongs to the technical field of high-lead solder ball implanting equipment, and particularly relates to a tool for implanting a high-lead solder ball into a CBGA device. Comprising a CBGA supporting base, a solder paste printing screen plate and a solder ball positioning leakage ball screen plate. The solder ball positioning and leaking net plate is provided with high shot ball leaking array holes, and after the solder ball positioning and leaking net plate and the supporting base are oppositely positioned, one sides of the high shot ball leaking array holes and the welding face are oppositely arranged in parallel at intervals. And the high shot leaking array holes are used for arranging high shots on the welding surface from one side far away from the welding surface in an array manner. According to the utility model, the purpose of accurate positioning of solder balls during CBGA ball mounting can be achieved, the welding quality problem caused by ball mounting deviation is eliminated, the material of the composite stone base and the stainless steel positioning sheet is simple in structure, convenient to design and manufacture and low in cost.

Description

Technical Field

[0001] This utility model belongs to the technical field of high-lead solder ball implantation equipment, specifically relating to a tooling for implanting high-lead solder balls into CBGA devices. Background Technology

[0002] When resoldering CBGA (Ceramic Ball Grid Array) packaged devices, and re-planting high-lead Sn10Pn90 solder balls, the high-lead solder balls may misalign due to oxidation issues on the surface of the high-lead balls. This means that the high-lead solder balls are poorly aligned with the CBGA device pads, leading to short-term solder joint cracking and failure after soldering to the printed circuit board. Utility Model Content

[0003] In view of this, the present invention provides a tooling for implanting high-lead solder balls in CBGA devices, which can achieve the purpose of precise positioning of solder balls during CBGA implantation, and eliminate the welding quality problems caused by implantation ball misalignment. Its material is a synthetic stone base and a stainless steel positioning plate, and its structure is simple, easy to design and manufacture, and low in cost.

[0004] The technical solution of this utility model:

[0005] A tooling for implanting high-lead solder balls into CBGA devices includes a CBGA support base, a solder paste printing stencil, and a solder ball positioning stencil.

[0006] The support base is provided with a support surface, and the support surface is provided with a positioning groove. The positioning groove is used to place the CBGA device. When the CBGA device is placed in the positioning groove, the soldering surface of the CBGA device is exposed to the positioning groove.

[0007] The solder paste printing stencil is provided with an array of solder paste stencil holes. After the solder paste printing stencil is positioned relative to the support base, one side of the array of solder paste stencil holes is attached to the soldering surface. The array of solder paste stencil holes is used to brush solder paste array onto the soldering surface from the side away from the soldering surface.

[0008] The welding ball positioning mesh plate is provided with high lead ball leakage array holes. After the welding ball positioning mesh plate is positioned relative to the support base, one side of the high lead ball leakage array holes is arranged parallel to the welding surface at intervals. The high lead ball leakage array holes are used to arrange high lead balls in an array on the welding surface from the side away from the welding surface.

[0009] Furthermore, placement and retrieval slots are provided on opposite sides of the positioning groove; the placement and retrieval slots facilitate manual placement and removal of the CBGA device from the positioning groove.

[0010] Furthermore, the thickness of the solder paste printing stencil is 0.1-0.2mm; the solder paste printing stencil is fixed on the first frame, and the solder paste printing stencil is positioned and installed on the support base based on the first frame.

[0011] Furthermore, when each high lead ball is arranged on the welding surface based on the welding ball positioning mesh plate array, the horizontal position of each high lead ball is limited based on the holes of the high lead ball mesh plate array.

[0012] Furthermore, the ball positioning mesh plate is provided with an annular protrusion; the annular protrusion is provided on the outer periphery of the high lead ball leakage array hole.

[0013] Furthermore, the ball positioning mesh plate is positioned and installed on the support base based on the annular convex edge.

[0014] The beneficial effects of this utility model are:

[0015] This invention enables CBGA device fixation, solder paste printing on pads, high-lead solder ball printing, and solder ball positioning and anti-displacement functions during the solder ball placement process. It effectively improves the pass rate and consistency of CBGA solder ball placement, significantly enhancing the quality of CBGA device rework. Furthermore, the fixture's structural components are made of synthetic stone and stainless steel, which not only fixes the solder balls and prevents displacement but also ensures that the heat from the solder joints is not affected by the fixture, guaranteeing solder joint reliability. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of this disclosure, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the CBGA support base of this utility model;

[0018] Figure 2 This is a schematic diagram of the solder paste printing stencil of this utility model;

[0019] Figure 3 This is a schematic diagram of the welding ball positioning mesh plate of this utility model;

[0020] The components include: 1. CBGA support base; 2. Positioning groove; 3. Solder paste printing stencil; 4. Solder ball positioning stencil; and 5. Solder paste stencil array. Detailed Implementation

[0021] The embodiments of this disclosure will now be described in detail with reference to the accompanying drawings.

[0022] The following specific examples illustrate the implementation of this disclosure. Those skilled in the art can easily understand other advantages and effects of this disclosure from the content disclosed in this specification. Obviously, the described embodiments are only a part of the embodiments of this disclosure, and not all of them. This disclosure can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this disclosure. It should be noted that, in the absence of conflict, the following embodiments and features in the embodiments can be combined with each other. Based on the embodiments in this disclosure, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this disclosure.

[0023] It should be noted that various aspects of embodiments within the scope of the appended claims are described below. It will be apparent that the aspects described herein can be embodied in a wide variety of forms, and any particular structure and / or function described herein is merely illustrative. Based on this disclosure, those skilled in the art will understand that one aspect described herein can be implemented independently of any other aspect, and two or more of these aspects can be combined in various ways. For example, any number of aspects set forth herein can be used to implement the device and / or practice the method. Additionally, this device and / or method can be implemented using other structures and / or functionalities besides one or more of the aspects set forth herein.

[0024] It should also be noted that the illustrations provided in the following embodiments are only schematic representations of the basic concept of this disclosure. The illustrations only show the components related to this disclosure and are not drawn according to the number, shape and size of the components in actual implementation. In actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0025] Furthermore, specific details are provided in the following description to facilitate a thorough understanding of the examples. However, those skilled in the art will understand that the described aspects can be practiced without these specific details.

[0026] In one embodiment of this utility model, a tooling for attaching high-lead solder balls to CBGA devices is provided, see reference. Figures 1-3 It includes a CBGA support base 1, a solder paste printing stencil 3, and a solder ball positioning stencil 3;

[0027] The support base is provided with a support surface, and the support surface is provided with a positioning groove 2. The positioning groove 2 is used to place the CBGA device. When the CBGA device is placed in the positioning groove 2, the soldering surface of the CBGA device is exposed to the positioning groove 2.

[0028] The solder paste printing stencil 3 is provided with an array of solder paste stencil holes. After the solder paste printing stencil 3 is positioned relative to the support base, one side of the array of solder paste stencil holes is attached to the soldering surface. The array of solder paste stencil holes is used to brush solder paste array onto the soldering surface from the side away from the soldering surface.

[0029] The welding ball positioning mesh plate is provided with high lead ball leakage array holes. After the welding ball positioning mesh plate is positioned relative to the support base, one side of the high lead ball leakage array holes is arranged parallel to the welding surface at intervals. The high lead ball leakage array holes are used to arrange high lead balls in an array on the welding surface from the side away from the welding surface.

[0030] In this embodiment, placement and retrieval slots are provided on opposite sides of the positioning groove 2; the placement and retrieval slots facilitate the manual placement and removal of the CBGA device from the positioning groove 2.

[0031] In this embodiment, the thickness of the solder paste printing stencil 3 is 0.1-0.2 mm; the solder paste printing stencil 3 is fixed on the first frame, and the solder paste printing stencil 3 is positioned and installed on the support base based on the first frame.

[0032] In this embodiment, when each high lead ball is arranged on the welding surface based on the welding ball positioning mesh array, the horizontal position of each high lead ball is limited based on the holes of the high lead ball mesh array.

[0033] In this embodiment, the ball positioning mesh plate is provided with an annular protrusion; the annular protrusion is provided on the outer periphery of the high lead ball leakage array hole.

[0034] In this embodiment, the ball positioning mesh plate is positioned and installed on the support base based on the annular convex edge.

[0035] The usage process of this embodiment is as follows:

[0036] a. According to the schematic diagram of the CBGA device ball-mounting fixture, the CBAG is installed on the CBGA device support base;

[0037] b. After the solder paste has been completely printed on the components, remove the solder paste printing stencil 3;

[0038] c. Install the solder ball positioning stencil and stencil to print high-lead solder balls;

[0039] d. Assemble the CBGA support base 1, CBGA device, and solder ball positioning mesh board into one unit;

[0040] e. They are then reflow welded together in a reflow oven.

[0041] In this embodiment, the CBGA support base 1 is made of synthetic stone material with a concave groove cut into its center according to the external dimensions (length, width, and thickness) of the CBGA device. The tolerance of the groove is controlled within ±0.5mm. At the same time, positioning pins are installed on both sides of the support base. The alignment deviation of the pins is ±0.1mm, the thickness can be selected from 2mm to 5mm, and the flatness is ±1mm / 100mm.

[0042] In this embodiment, a steel mesh reinforcement frame made of synthetic stone is used to match the shape of the support base. The frame is 20cm wide and has pin positioning holes on both sides. The alignment deviation with the support base is ±0.1mm. Solder paste printing stencil is made: a 0.15mm thick stainless steel sheet is used, and holes are made according to the CBGA solder ball layout. The hole diameter is 1:1 with the solder ball diameter, that is, the hole size is φ0.89mm. The solder paste printing stencil is screwed to the steel mesh reinforcement frame to form the solder paste printing stencil 3.

[0043] In this embodiment, a steel mesh firing frame made of synthetic stone is used to match the shape of the support base. The frame is 20cm wide and has pin positioning holes on both sides. The alignment deviation with the support base is ±0.1mm. Solder ball printing stencil is made: 0.15mm thick stainless steel sheet is used to make holes according to the CBGA solder ball layout. The hole diameter is 1:1 with the solder ball diameter, that is, the hole size is φ0.92mm. The solder paste printing stencil is screwed to the steel mesh reinforcement frame to form the solder paste printing stencil 3.

[0044] In this embodiment, the solder ball positioning mesh plate needs to be put into the reflow oven together with the CBGA device to complete the ball planting process of high lead solder balls Sn10Pn90, and a synthetic stone material with strong heat deformation resistance is required.

[0045] In this embodiment, the CBGA support base 1, solder paste printing stencil 3, and solder ball positioning stencil all adopt a pin positioning structure, which can achieve quick disassembly.

[0046] The above description is merely a specific embodiment of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. A tooling for attaching high-lead solder balls to CBGA devices, characterized in that, This includes the CBGA support base, solder paste printing stencil, and solder ball positioning stencil; The support base is provided with a support surface, and the support surface is provided with a positioning groove. The positioning groove is used to place the CBGA device. When the CBGA device is placed in the positioning groove, the soldering surface of the CBGA device is exposed to the positioning groove. The solder paste printing stencil is provided with an array of solder paste stencil holes. After the solder paste printing stencil is positioned relative to the support base, one side of the array of solder paste stencil holes is attached to the soldering surface. The array of solder paste stencil holes is used to brush solder paste array onto the soldering surface from the side away from the soldering surface. The welding ball positioning mesh plate is provided with high lead ball leakage array holes. After the welding ball positioning mesh plate is positioned relative to the support base, one side of the high lead ball leakage array holes is arranged parallel to the welding surface at intervals. The high lead ball leakage array holes are used to arrange high lead balls in an array on the welding surface from the side away from the welding surface.

2. The tooling for attaching high-lead solder balls to CBGA devices according to claim 1, characterized in that, Placement slots are provided on opposite sides of the positioning groove; the placement slots facilitate the manual placement and removal of the CBGA device from the positioning groove.

3. The tooling for attaching high-lead solder balls to CBGA devices according to claim 2, characterized in that, The thickness of the solder paste printing stencil is 0.1-0.2mm; the solder paste printing stencil is fixed on the first frame, and the solder paste printing stencil is positioned and installed on the support base based on the first frame.

4. The tooling for attaching high-lead solder balls to CBGA devices according to claim 3, characterized in that, When each high lead ball is arranged on the welding surface based on the ball positioning mesh array, the horizontal position of each high lead ball is limited based on the holes of the high lead ball mesh array.

5. The tooling for attaching high-lead solder balls to CBGA devices according to claim 4, characterized in that, The ball positioning mesh plate is provided with an annular protrusion; the annular protrusion is provided on the outer periphery of the high lead ball leakage array hole.

6. The tooling for attaching high-lead solder balls to CBGA devices according to claim 5, characterized in that, The ball positioning mesh plate is positioned and installed on the support base based on the annular convex edge.

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