Silicon wafer bearing device and solar cell production system

Abstract

The utility model relates to a silicon wafer bearing device and a solar cell production system. The silicon wafer bearing device comprises a carrier plate main body and a bearing piece, a plurality of concave parts which are arranged at intervals are constructed on the carrier plate main body, and the adjacent concave parts are separated from each other by virtue of a dike part; the bearing piece is detachably arranged on at least part of the embankment part; wherein the embankment part corresponding to each concave part is provided with a first bearing part, the bearing piece comprises extension parts which respectively extend into two adjacent concave parts defined by the corresponding embankment part, and the extension parts are provided with second bearing parts. According to the silicon wafer bearing device, the second bearing part on the bearing piece is used for bearing the silicon wafer, and the second bearing part is arranged on the extension part extending into the concave part, so that the silicon wafer bearing device and the first bearing part can bear silicon wafers with different sizes. Moreover, the bearing part is detachably arranged on the carrier plate main body, so that the bearing parts with various sizes can be flexibly replaced, and the silicon wafer bearing device can compatibly bear silicon wafers with various sizes.

Description

Technical Field

[0001] This application relates to the field of solar cell technology, and in particular to silicon wafer carrier devices and solar cell production systems. Background Technology

[0002] Solar energy, as a widely distributed, inexhaustible, and green energy source, is one of the important energy sources for the sustainable development of human society. Currently, the main form of solar energy utilization is photovoltaic power generation. Solar cells can convert solar energy into electrical energy, which is easy to store and transport, and can thus be applied to various fields.

[0003] Silicon wafers are a crucial component of solar cells, and they require a support device for transport and processing. Generally, this is achieved by placing the silicon wafer within a receiving groove on the support device for positioning. However, the size of the receiving groove cannot be adjusted, limiting it to only one size of silicon wafer. Different sizes of silicon wafers require custom-made support devices.

[0004] In some related technologies, multiple steps are set in the receiving tank to accommodate and support silicon wafers of different sizes. However, due to the limited size of the receiving tank, the size of the silicon wafers that can be accommodated is relatively limited, and different sizes of silicon wafers still require different specifications of support devices. At the same time, the more steps are set in the receiving tank, the thicker the support device needs to be to ensure its strength, which increases the manufacturing difficulty and cost of the support device. Utility Model Content

[0005] Therefore, it is necessary to provide a silicon wafer support device and a solar cell production system that can support silicon wafers of various sizes while taking into account the strength of the support device and without increasing the thickness of the support device.

[0006] In a first aspect, this application provides a silicon wafer carrier device, comprising:

[0007] A carrier plate body having a plurality of spaced-apart recesses, adjacent recesses being spaced apart by means of embankments; and

[0008] A support member is detachably mounted on at least a portion of the embankment.

[0009] Each of the recesses is provided with a first bearing portion in the corresponding embankment. The bearing member includes an extension portion that extends into two adjacent recesses defined by the corresponding embankment, and the extension portion is provided with a second bearing portion.

[0010] In some embodiments, the carrier includes a main body and extensions located on both sides of the main body;

[0011] The main body is detachably mounted on the embankment.

[0012] In some embodiments, the extension is located on both sides of the main body along a first direction;

[0013] Wherein, the first direction intersects with the extension direction of the extension portion.

[0014] In some embodiments, the main body has a positioning part adapted to the embankment on the side facing the carrier plate body, so as to position the carrier on the embankment.

[0015] In some embodiments, the orthographic projection of the positioning part on the carrier plate body covers the orthographic projection of the embankment part on the carrier plate body.

[0016] In some embodiments, the positioning part is configured as a positioning groove;

[0017] The positioning groove engages with the embankment.

[0018] In some embodiments, the second support portion is disposed on the side of the extension portion away from the main body portion.

[0019] In some embodiments, at least a portion of the extension abuts against the bottom wall of the recess.

[0020] In some embodiments, an axis passing through the geometric center of the recess and parallel to the depth direction of the recess is defined as a reference axis;

[0021] The first support portion corresponding to each of the recesses is configured to be arranged at least partially around the reference axis.

[0022] In some embodiments, the first support portion corresponding to each of the recesses is configured as a continuous structure surrounding the reference axis.

[0023] In some embodiments, the second support portion of the carrier corresponding to each of the recesses is configured to be disposed at least partially around the reference axis.

[0024] In some embodiments, the first bearing portion has a first bearing surface, and the second bearing portion has a second bearing surface;

[0025] The extension is provided with a plurality of second bearing portions, and the plurality of second bearing surfaces on the same extension are staggered in the direction from the embankment toward the geometric center of the recess.

[0026] The plurality of second bearing surfaces on the same extension are staggered in the depth direction of the recess.

[0027] In some embodiments, one of the plurality of second bearing surfaces on the same extension is located in the same plane as the first bearing surface of the corresponding first bearing portion.

[0028] In some embodiments, the first support portion is configured as a first stepped portion; and / or

[0029] The second supporting part is constructed as a second stepped part.

[0030] In some embodiments, the two extensions extending into the adjacent recesses defined by the corresponding embankment are symmetrically arranged about the embankment.

[0031] In some embodiments, the silicon wafer carrier includes carriers of various specifications;

[0032] The second carrier portion has a second stop surface for stopping the side of the silicon wafer. The second stop surface of the carrier portion closest to the embankment of different specifications is not equidistant from the embankment in the direction from the geometric center of the embankment to the recess.

[0033] Secondly, this application also provides a solar cell production system, including a conveying device, a silicon wafer processing device, and a silicon wafer carrying device as described in the above embodiment;

[0034] The conveying device is used to convey the silicon wafer carrier carrying the silicon wafer to the silicon wafer processing device, and the silicon wafer processing device is used to process the conveyed silicon wafer.

[0035] The aforementioned silicon wafer carrier device, by providing a first support portion on the embankment of the carrier body, allows the first support portion to carry silicon wafers of at least one size. By detachably providing a support on the embankment, a second support portion on the support member carries the silicon wafer. Since the second support portion is located on an extension extending into a recess, it is closer to the geometric center of the recess than the first support portion, thus enabling the second and first support portions to carry silicon wafers of different sizes. Furthermore, because the support member is detachably provided on the carrier body, various sizes of support members can be flexibly replaced, allowing the silicon wafer carrier device to be compatible with carrying silicon wafers of multiple sizes. This silicon wafer carrier device meets the carrying requirements of various sizes of silicon wafers by replacing the support member, eliminating the need for multiple first support portions on the carrier body. Therefore, it does not increase the thickness of the carrier body, which helps reduce the manufacturing difficulty and cost of the silicon wafer carrier device. Attached Figure Description

[0036] Figure 1 A top view of the carrier plate body provided in an embodiment of this application;

[0037] Figure 2This is a schematic diagram of the assembly structure of the carrier and the main body of the carrier plate provided in an embodiment of this application;

[0038] Figure 3 A partial cross-sectional view of the carrier plate body provided in an embodiment of this application;

[0039] Figure 4 for Figure 3 Enlarged structural diagram at point A in the middle;

[0040] Figure 5 A partial cross-sectional view of a carrier substrate carrying a silicon wafer, provided in an embodiment of this application;

[0041] Figure 6 A partial top view of the carrier plate body provided in an embodiment of this application;

[0042] Figure 7 This is a schematic cross-sectional view of a carrier provided in an embodiment of this application;

[0043] Figure 8 This is a partial structural diagram of a silicon wafer carrier device provided in an embodiment of this application when it carries a silicon wafer.

[0044] Explanation of reference numerals in the attached figures:

[0045] 100. Silicon wafers;

[0046] 1. Carrier plate body; 11. Recess; 12. Embankment; 121. First bearing part; 1211. First bearing surface; 1212. First stop surface; 14. Bottom plate; 141. Air hole;

[0047] 2. Bearing member; 21. Extension; 211. Second bearing part; 2111. Second bearing surface; 2112. Second stop surface; 22. Main body; 221. Positioning part. Detailed Implementation

[0048] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0049] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0050] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0051] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0052] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0053] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0054] like Figure 1 and Figure 2 As shown, at least one embodiment of this application provides a silicon wafer carrier for supporting a silicon wafer 100 (see...). Figure 5 It is used to carry the silicon wafer 100 to facilitate its transfer or processing.

[0055] The silicon wafer carrier includes a carrier body 1 and a carrier member 2. The carrier body 1 has a plurality of spaced-apart recesses 11, with adjacent recesses 11 spaced apart by means of embankments 12. The carrier member 2 is detachably mounted on at least a portion of the embankments 12. In some embodiments, the embankments 12 are disposed on one side surface of the carrier body 1 to define the plurality of spaced-apart recesses 11. Of course, in other embodiments, a plurality of recesses 11 may also be constructed on the carrier body 1, with the embankments 12 described above forming between the recesses 11, which is not limited here.

[0056] For example, such as Figure 1 As shown, the substrate body 1 is provided with five rows and nine columns of embankments 12 in a crisscross pattern, dividing the substrate body 1 into sixty recesses 11. Of course, this application does not limit the number and shape of the recesses 11. In some other embodiments, the substrate body 1 and the recesses 11 can be specifically designed according to the structural parameters of the silicon wafer 100 (such as length and width).

[0057] In the embodiments of this application, such as Figures 2-4 As shown, each recess 11 has a first bearing portion 121 corresponding to the embankment 12. The bearing member 2 includes an extension portion 21 that extends into two adjacent recesses 11 defined by the corresponding embankment 12. The extension portion 21 is provided with a second bearing portion 211 (see Figure 7 Both the first carrier portion 121 and the second carrier portion 211 are used to support the silicon wafer 100.

[0058] Thus, by providing a first support portion 121 on the embankment 12 of the carrier plate body 1, the first support portion 121 carries silicon wafers 100 of at least one size. By detachably providing a support member 2 on the embankment 12, and using a second support portion 211 on the support member 2 to carry the silicon wafers 100, since the second support portion 211 is provided on the extension portion 21 extending into the recess 11, the second support portion 211 is closer to the geometric center of the recess 11 than the first support portion 121, thereby enabling the second support portion 211 and the first support portion 121 to carry silicon wafers 100 of different sizes. Moreover, since the support member 2 is detachably provided on the carrier plate body 1, support members 2 of various sizes can be flexibly replaced, thereby enabling the silicon wafer carrying device to be compatible with carrying silicon wafers 100 of various sizes. This silicon wafer carrier device meets the carrying requirements of silicon wafers 100 of various sizes by replacing the carrier component 2. It does not require setting multiple first carrier parts 121 on the carrier body 1. Therefore, it does not cause an increase in the thickness of the carrier body 1, which helps to reduce the manufacturing difficulty and manufacturing cost of the silicon wafer carrier device.

[0059] It is understood that the silicon wafer 100 is typically rectangular. In some embodiments, the recess 11 can be rectangular, and the first support portion 121 and the second support portion 211 can support the four side edges of the silicon wafer 100, thereby providing stable support and positioning for the silicon wafer 100. In other embodiments, the silicon wafer 100 can also be circular, and the recess 11 can be circular accordingly, with the first support portion 121 and the second support portion 211 supporting the circumferential edge of the silicon wafer 100.

[0060] For a rectangular recess 11, the support member 2 can be installed only on the transverse or longitudinal embankment 12, thus changing only the width or length of the bearing area. In some other embodiments, the support member 2 can be installed on both the transverse and longitudinal embankment 12, thereby enabling simultaneous changes in the width and length of the bearing area. One recess 11 corresponds to four embankments 12, the four embankments 12 enclosing the rectangular recess 11, with support members 2 provided at adjacent embankment 12 to simultaneously change the length and width of the bearing area.

[0061] In some embodiments, the first supporting portion 121 is constructed as a first stepped portion. For example... Figures 3-5 As shown, the first step portion has a first bearing surface 1211 for supporting the lower surface of the silicon wafer 100, and a first stop surface 1212 for stopping and limiting the side of the silicon wafer 100. In this way, the first bearing surface 1211 of the first bearing portion 121 is kept at a distance from the bottom surface of the recess 11, avoiding damage caused by a large contact area between the silicon wafer 100 and the carrier plate body 1, which is beneficial for protecting the silicon wafer 100 and facilitating the placement and removal of the silicon wafer 100.

[0062] In some embodiments, each recess 11 is provided with a plurality of first support portions 121 corresponding to a embankment 12. Each first support portion 121 has a first support surface 1211. The plurality of first support surfaces 1211 are staggered in the direction from the embankment 12 toward the geometric center of the recess 11, and are also staggered in the depth direction of the recess 11. This arrangement results in different distances from the geometric center of the recess 11 to the plurality of first support surfaces 1211, thereby enabling the first support portion 121 to support silicon wafers 100 of different sizes.

[0063] It is worth noting that the inventors of this application discovered that when the silicon wafer 100 is placed in the first support portion 121, the lower surface of the silicon wafer 100 contacts the first support surface 1211, and the side edge of the silicon wafer 100 contacts the first stop surface 1212, thereby forming a sealed space between the silicon wafer 100 and the recess 11. During the process of removing the silicon wafer 100 along the depth direction of the recess 11, the volume of the sealed space gradually increases, resulting in a decrease in pressure within the sealed space, creating a negative pressure suction force on the silicon wafer 100, and increasing the difficulty of removing the silicon wafer 100. To solve this problem, in some embodiments, such as... Figure 6 As shown, the bottom surface of the recess 11 is provided with a plurality of air holes 141 that communicate with the outside, so that external air can enter the sealed space formed by the silicon wafer 100 and the recess 11, thereby maintaining the pressure of the sealed space stable during the removal of the silicon wafer 100, so as to avoid forming a negative pressure suction force on the silicon wafer 100, and thus making it easier to remove the silicon wafer 100 from the first support part 121.

[0064] It is understandable that the second supporting part 211 can also be constructed as a second stepped part. For example... Figure 7 and Figure 8 As shown, the second step portion has a second bearing surface 2111 for supporting the lower surface of the silicon wafer 100, and a second stop surface 2112 for stopping and limiting the side of the silicon wafer 100. In this way, the silicon wafer 100 can be supported and positioned.

[0065] In some embodiments, the support member 2 includes a main body 22 and extensions 21 located on both sides of the main body 22. The main body 22 is detachably disposed on the embankment 12. The two extensions 21 are connected by the main body 22, and the support member 2 is detachably disposed on the embankment 12 by the main body 22. The main body 22 and the extensions 21 can be configured as an integral structure, which is easy to process and has good structural strength.

[0066] Optionally, two extensions 21 extending into the two adjacent recesses 11 defined by the corresponding embankment 12 are symmetrically arranged about the embankment 12.

[0067] Specifically, the extension 21 is located on both sides of the main body 22 along the first direction; wherein the first direction intersects the extension direction of the extension 21. Thus, when the support member 2 is assembled into the recess 11, the main body 22 is mounted on the embankment 12, and the extensions 21 on both sides of the main body 22 extend into the recesses 11 on both sides of the embankment 12.

[0068] Please continue reading. Figure 7 and Figure 8 The main body 22 has a positioning part 221 on the side facing the carrier body 1 that is adapted to the embankment 12 to position the carrier 2 on the embankment 12. By cooperating with the embankment 12, the positioning part 2 is positioned and thus the carrier 2 is positioned on the embankment 12, preventing the carrier 2 from shaking randomly, thereby ensuring stable support for the silicon wafer 100.

[0069] In some embodiments, the orthographic projection of the positioning part 221 on the carrier plate body 1 covers the orthographic projection of the embankment part 12 on the carrier plate body 1, so as to ensure that there is a large matching range between the positioning part 221 and the embankment part 12, thereby ensuring the reliability of positioning of the carrier 2.

[0070] For example, the positioning part 221 is constructed as a positioning groove, which engages with the embankment 12. This engagement ensures a secure connection between the bearing member 2 and the embankment 12, and allows for quick assembly and disassembly.

[0071] The orthographic projection of the positioning groove on the carrier plate body 1 covers the orthographic projection of the embankment 12 on the carrier plate body 1, allowing the embankment 12 to be engaged in the positioning groove. Optionally, the positioning groove is configured as a stepped groove, and the embankment 12 is correspondingly configured as a stepped type. The outer diameter of the top end of the bottom wall of the embankment 12 away from the recess 11 is smaller than the outer diameter of the bottom end of the embankment 12 near the recess 11. The larger bottom end of the embankment 12 can also be engaged in the positioning groove to ensure the firmness of the engagement between the carrier 2 and the embankment 12.

[0072] In some embodiments, the second support portion 211 is disposed on the side of the extension portion 21 away from the main body portion 22, that is, the second support portion 211 is disposed toward the geometric center of the recess 11, so that the second support portion 211 can support the silicon wafer 100 in the recess 11.

[0073] In some embodiments, at least a portion of the extension 21 abuts against the bottom wall of the recess 11. The bottom wall of the recess 11 supports the carrier 2, thereby securing the carrier 2 firmly onto the embankment 12 and stably supporting the silicon wafer 100.

[0074] Optionally, the bottom side of the extension 21 can be fully fitted with the bottom wall of the recess 11 to ensure a large support area for the extension 21 by the bottom wall of the recess 11, thereby further improving the firmness of the bearing member 2 installed on the embankment 12.

[0075] In some embodiments, an axis passing through the geometric center of the recess 11 and parallel to the depth direction of the recess 11 is defined as a reference axis, and the first support portion 121 corresponding to each recess 11 is configured to at least partially surround the reference axis. By arranging the first support portion 121 around the reference axis, the first support portion 121 provides support for the silicon wafer 100 at least around a portion of the edge of the silicon wafer 100, which helps to improve the stability of the support provided by the first support portion 121 to the silicon wafer 100. Taking a rectangular silicon wafer 100 as an example, the first support portion 121 can provide support for all four sides of the silicon wafer 100, or it can provide support for two opposite sides or three sides of the silicon wafer 100.

[0076] Furthermore, in one embodiment, the first support portion 121 corresponding to each recess 11 is constructed as a continuous structure surrounding the reference axis. This allows the first support portion 121 to provide continuous support for the silicon wafer 100, which helps to increase the contact area between the first support portion 121 and the silicon wafer 100, thereby preventing the first support portion 121 from damaging the silicon wafer 100.

[0077] It should be emphasized that, in some other embodiments, the first support portion 121 corresponding to each recess 11 can also be constructed as a discrete structure surrounding the reference axis, which can also provide support for the silicon wafer 100. For example, the first support portion 121 includes a plurality of spaced-apart first sub-support portions, which are arranged around the aforementioned reference axis.

[0078] In some embodiments, combined with Figure 4 , Figure 7 and Figure 8 As shown, the first support portion 121 has a first support surface 1211, and the second support portion 211 has a second support surface 2111. Multiple second support portions 211 are provided on the extension portion 21, and the multiple second support surfaces 2111 on the same extension portion 21 are staggered in the direction from the embankment 12 to the geometric center of the recess 11; the multiple second support surfaces 2111 on the same extension portion 21 are staggered in the depth direction of the recess 11. This arrangement causes the multiple second support portions 211 on the support member 2 to be arranged in a stepped manner, achieving the support and positioning of silicon wafers 100 of various sizes.

[0079] Specifically, the multiple second bearing surfaces 2111 on the same extension 21 gradually move away from the bottom wall of the recess 11 from the geometric center of the recess 11 to the geometric center of the recess 11, so as to avoid the second bearing portion 211 near the geometric center of the recess 11 interfering with the silicon wafer 100 on the second bearing portion 211 far from the geometric center of the recess 11.

[0080] In some embodiments, one of the plurality of second bearing surfaces 2111 on the same extension 21 is located in the same plane as the first bearing surface 1211 of the corresponding first bearing portion 121, so as to facilitate the positioning of the second bearing portion 211 and to position other second bearing portions 211 with reference to the second bearing portion 211, thereby positioning the silicon wafer 100 on the second bearing portion 211, so as to facilitate the picking and placing of the silicon wafer 100 by a robot or other automated equipment.

[0081] In some embodiments, combined with Figure 7 and Figure 8 As shown, the first bearing surface 1211 and the second bearing surface 2111 are staggered in the direction from the embankment 12 to the geometric center of the recess 11. This arrangement makes the distances from the first bearing surface 1211 and the second bearing surface 2111 to the geometric center of the recess 11 different, thereby enabling the first bearing portion 121 and the second bearing portion 211 to support silicon wafers 100 of different sizes.

[0082] In some embodiments, the first bearing surface 1211 and the second bearing surface 2111 are arranged parallel to each other, so that the silicon wafer 100 supported by the first bearing surface 1211 and the silicon wafer 100 supported by the second bearing surface 2111 are parallel, which facilitates the positioning of the silicon wafer 100 and facilitates the picking and placing of the silicon wafer 100 by a robotic arm or other automated equipment. Specifically, in some embodiments, both the first bearing surface 1211 and the second bearing surface 2111 are parallel to the bottom wall of the recess 11. On the one hand, when the silicon wafer supporting device is placed horizontally, the first bearing surface 1211 and the second bearing surface 2111 can remain horizontal, which is conducive to the stable placement of the silicon wafer 100 on the first bearing surface 1211 and the second bearing surface 2111; on the other hand, it can maintain a uniform interval between the silicon wafer 100 and the bottom wall of the recess 11. When the silicon wafer 100 and the recess 11 form a closed space with negative pressure to adsorb the silicon wafer 100, negative pressure is generated by drawing air through the vents 141 on the base plate 14. Maintaining a uniform gap between the silicon wafer 100 and the bottom surface of the recess 11 is beneficial for providing a uniform adsorption force to the silicon wafer 100. When the silicon wafer 100 is removed from the support 2, the negative pressure environment of the closed space formed by the silicon wafer 100 and the recess 11 needs to be broken. At this time, maintaining a uniform gap between the silicon wafer 100 and the bottom surface of the recess 11 is beneficial for the uniformity of air intake in the closed space and is more conducive to maintaining the pressure stability within the closed space.

[0083] In some embodiments, the second support portion 211 of the support member 2 corresponding to each recess 11 is configured to at least partially surround the reference axis. By arranging the second support portion 211 around the reference axis, the second support portion 211 provides support to the silicon wafer 100 at least around a portion of the edge of the silicon wafer 100, which helps to improve the support stability of the second support portion 211 on the silicon wafer 100. The first support portion 121 can be a first support portion 121 on a support member 2 on a single embankment 12, or it can be a first support portion 121 on multiple support members 2 on multiple embankments 12 surrounding a recess 11.

[0084] In one embodiment, the second support portion 211 corresponding to each recess 11 is constructed as a continuous structure around the reference axis, so that the second support portion 211 provides continuous support for the silicon wafer 100, which is beneficial to increase the contact area between the second support portion 211 and the silicon wafer 100, thereby preventing the second support portion 211 from damaging the silicon wafer 100.

[0085] In another embodiment, the second support portion 211 corresponding to each recess 11 is constructed as a discrete structure surrounding the reference axis, which can also provide support for the silicon wafer 100. For example, a plurality of second support portions 211 are arranged at intervals around the aforementioned reference axis.

[0086] In some embodiments, combined with Figure 7 and Figure 8 As shown, the silicon wafer support device includes support members 2 of various specifications, so that the support member 2 of the appropriate specification is selected and installed in the recess 11 according to the actual size of the silicon wafer 100 to be supported.

[0087] The second support portion 211 has a second stop surface 2112 for stopping the side of the silicon wafer 100. The second stop surface 2112 closest to the embankment 12 of different specifications of the support member 2 is not equidistant from the embankment 12 in the direction pointing from the geometric center of the recess 11. By setting the second stop surface 2112 to stop the side of the silicon wafer 100, the size of the silicon wafer 100 that the second support portion 211 can support is limited, and at the same time, it prevents the silicon wafer 100 from moving freely on the second support portion 211.

[0088] For example, in Figure 4 and Figure 7In the illustrated embodiment, the first support portion 121 has a first stop surface 1212, and the second support portion 211 has a second stop surface 2112. The first stop surface 1212 and the second stop surface 2112 are not equidistant from the embankment 12 in the direction pointing from the geometric center of the recess 11 to the embankment 12, thus allowing the support of silicon wafers 100 of different specifications. Similarly, the multiple second stop surfaces 2112 of multiple second support portions 211 are not equidistant from the embankment 12 in the direction pointing from the geometric center of the recess 11, also allowing the support of silicon wafers 100 of various specifications. When multiple second support portions 211 are provided on the extension portion 21, the side of the second support portion 211 that is far from the geometric center of the recess 11 among two adjacent second support portions 211 can serve as the second stop surface 2112 of the second support portion 211 that is close to the geometric center of the recess 11.

[0089] This application also provides a solar cell production system, including a conveying device, a silicon wafer processing device, and a silicon wafer carrier device as described in any of the above embodiments. The conveying device is used to convey the silicon wafer carrier device carrying the silicon wafer 100 to the silicon wafer processing device, and the silicon wafer processing device is used to process the conveyed silicon wafer 100.

[0090] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0091] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A silicon wafer carrier device, characterized in that, include: The carrier plate body has a plurality of recesses spaced apart, and adjacent recesses are spaced apart from each other by means of embankments. as well as A support member is detachably mounted on at least a portion of the embankment. Each of the recesses is provided with a first bearing portion in the corresponding embankment. The bearing member includes an extension portion that extends into two adjacent recesses defined by the corresponding embankment, and the extension portion is provided with a second bearing portion.

2. The silicon wafer carrier device according to claim 1, characterized in that, The support member includes a main body and extensions located on both sides of the main body; The main body is detachably mounted on the embankment.

3. The silicon wafer carrier device according to claim 2, characterized in that, The extension is located on both sides of the main body along the first direction; Wherein, the first direction intersects with the extension direction of the extension portion.

4. The silicon wafer carrier device according to claim 2, characterized in that, The main body has a positioning part on the side facing the carrier plate body that is adapted to the embankment to position the carrier on the embankment.

5. The silicon wafer support device according to claim 4, characterized in that, The orthographic projection of the positioning part on the carrier plate body covers the orthographic projection of the embankment part on the carrier plate body.

6. The silicon wafer carrier device according to claim 4, characterized in that, The positioning part is constructed as a positioning groove; The positioning groove engages with the embankment.

7. The silicon wafer support device according to claim 2, characterized in that, The second support portion is disposed on the side of the extension portion away from the main body portion.

8. The silicon wafer carrier device according to any one of claims 1-7, characterized in that, At least a portion of the extension abuts against the bottom wall of the recess.

9. The silicon wafer carrier device according to any one of claims 1-7, characterized in that, The axis passing through the geometric center of the recess and parallel to the depth direction of the recess is defined as the reference axis; The first support portion corresponding to each of the recesses is configured to be arranged at least partially around the reference axis.

10. The silicon wafer carrier device according to claim 9, characterized in that, The first bearing portion corresponding to each of the recesses is constructed as a continuous structure surrounding the reference axis.

11. The silicon wafer carrier device according to claim 9, characterized in that, The second support portion of the support member corresponding to each of the recesses is configured to be arranged at least partially around the reference axis.

12. The silicon wafer carrier device according to any one of claims 1-7, characterized in that, The first bearing portion has a first bearing surface, and the second bearing portion has a second bearing surface; The extension is provided with a plurality of second bearing portions, and the plurality of second bearing surfaces on the same extension are staggered in the direction from the embankment toward the geometric center of the recess. The plurality of second bearing surfaces on the same extension are staggered in the depth direction of the recess.

13. The silicon wafer support device according to claim 12, characterized in that, One of the plurality of second bearing surfaces on the same extension is located in the same plane as the first bearing surface of the corresponding first bearing portion.

14. The silicon wafer carrier device according to any one of claims 1-7, characterized in that, The first supporting part is constructed as a first stepped part; and / or The second bearing part is constructed as a second stepped part.

15. The silicon wafer carrier device according to any one of claims 1-7, characterized in that, The two extensions that extend into the two adjacent recesses defined by the corresponding embankment are symmetrically arranged about the embankment.

16. The silicon wafer carrier device according to any one of claims 1-7, characterized in that, The silicon wafer carrier device includes carrier components of various specifications; The second carrier portion has a second stop surface for stopping the side of the silicon wafer. The second stop surface of the carrier portion closest to the embankment of different specifications is not equidistant from the embankment in the direction from the geometric center of the embankment to the recess.

17. A solar cell production system, characterized in that, Includes a conveying device, a silicon wafer processing device, and a silicon wafer carrier as described in any one of claims 1-16; The conveying device is used to convey the silicon wafer carrier carrying the silicon wafer to the silicon wafer processing device, and the silicon wafer processing device is used to process the conveyed silicon wafer.

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