Packaging structure and electronic equipment
By setting high-strength reinforcement structures in the chip layer and redistribution layer, the warping problem caused by the mismatch of thermal expansion coefficients in the package structure is solved, thereby improving the stability and reliability of the package structure.
Patent Information
- Application Number
- CN202423046049.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-10
- Publication Date
- 2025-10-31
- Estimated Expiration
- 2034-12-10
AI Technical Summary
During the molding process, the mismatch in thermal expansion coefficients between the packaging carrier and the molding layer can lead to warping, affecting the stability and reliability of the packaging structure and potentially damaging the chip.
Reinforcing structures are incorporated into the chip layer and redistribution layer. These reinforcing structures are made of materials with higher strength than the chip layer and redistribution layer. Their shapes include longitudinally and transversely arranged reinforcing strips or an integrated reinforcing mesh structure, to provide additional physical support and reduce warping.
By enhancing the structure, warping caused by thermal expansion coefficient mismatch and internal stress is effectively reduced, thus improving the stability and reliability of the packaging structure.
Smart Images
Figure CN223501866U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of semiconductor technology, and more specifically, to a packaging structure and an electronic device. Background Technology
[0002] Packaging is a crucial step in the manufacturing process of semiconductor integrated circuit chips. It not only houses, secures, seals, and protects the chip, but also enhances its electrothermal performance and enables the transmission of data and signals between the chip's internal and external circuits. Specifically, packaging refers to the process of processing tested chips into individual chips according to product model and functional requirements.
[0003] However, during the molding process, because the coefficient of thermal expansion (CTE) of the packaging carrier is different from that of the molding layer, the packaging carrier and the molding layer may expand or contract differently with temperature changes. This can cause the packaging carrier to warp due to stress, affecting the accuracy of subsequent processes. Simultaneously, the warped carrier applies a bending moment to the chip on it. If this bending moment is too large, it may damage the chip, affecting product performance and reliability. Utility Model Content
[0004] In order to at least overcome the above-mentioned shortcomings in the prior art, the purpose of this application is to provide a packaging structure and an electronic device.
[0005] In a first aspect, embodiments of this application provide a packaging structure, the packaging structure including a stacked chip layer and a redistribution layer;
[0006] The packaging structure further includes a reinforcement structure disposed in the chip layer and / or the redistribution layer, wherein the material strength of the reinforcement structure is greater than the material strength of the chip layer and / or the redistribution layer.
[0007] In one possible implementation, the chip layer further includes at least one chip and a molding compound layer located around the chip, wherein the height of the reinforcement structure is less than or equal to the height of the chip in a direction perpendicular to the plane of the redistribution layer.
[0008] The reinforcing structure is located within the molding layer, and the material strength of the reinforcing structure is greater than that of the molding layer.
[0009] In one possible implementation, the redistribution layer includes conductive traces and an insulating material layer located around the conductive traces, wherein the reinforcing structure is located within the insulating material layer, and the material strength of the reinforcing structure is greater than the material strength of the insulating material layer.
[0010] In one possible implementation, the shape of the reinforcing structure includes a longitudinally and transversely arranged reinforcing strip structure, or an integrated reinforcing mesh structure.
[0011] In one possible implementation, the reinforcing structure includes spaced reinforcing strips that are equally spaced and extend in the same direction.
[0012] In one possible implementation, the molding layer includes a first molding layer and a second molding layer, and the reinforcing structure includes a first reinforcing structure and a second reinforcing structure;
[0013] In a direction perpendicular to the redistribution layer, the first molding layer, the first reinforcement structure, the second molding layer, and the second reinforcement structure are stacked.
[0014] The first reinforcement structure and the second reinforcement structure include a reinforcement strip structure or a reinforcement mesh structure.
[0015] In one possible implementation, the first reinforcing structure includes a reinforcing strip structure extending along a first direction, and the second reinforcing structure includes a reinforcing strip structure extending along a second direction, wherein the first direction is perpendicular to the second direction.
[0016] In one possible implementation, the first reinforcing structure and the second reinforcing structure include reinforcing strip structures extending in the same direction; wherein,
[0017] The orthographic projection of the first reinforcing structure onto the first molding layer coincides with the orthographic projection of the second reinforcing structure onto the first molding layer, or the orthographic projection of the first reinforcing structure onto the first molding layer does not coincide with the orthographic projection of the second reinforcing structure onto the first molding layer.
[0018] In one possible implementation, the material of the reinforcing structure includes metallic materials, synthetic materials, and composite materials.
[0019] Secondly, embodiments of this application also provide an electronic component, the electronic component comprising the packaging structure described in any one of the first aspects.
[0020] Based on any of the above aspects, the packaging structure and electronic device provided in this application include a stacked chip layer and a redistribution layer, and a reinforcement structure disposed in the chip layer and / or the redistribution layer, wherein the material strength of the reinforcement structure is greater than the material strength of the chip layer and / or the redistribution layer. In the above structure, the reinforcement structure can provide additional physical support for the chip layer and / or the redistribution layer, which can effectively reduce warping caused by mismatch in thermal expansion coefficients and internal stress, thereby improving the stability and reliability of the packaging structure. Attached Figure Description
[0021] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings required in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.
[0022] Figure 1 This is a schematic diagram illustrating the potential warping of packaging structures in existing technologies.
[0023] Figure 2 A possible structural diagram of the packaging structure provided in this application Figure 1 ;
[0024] Figure 3 A possible structural diagram of the packaging structure provided in this application Figure 2 ;
[0025] Figure 4 A schematic diagram of a possible structure for the reinforcement structure provided in this application;
[0026] Figure 5 A schematic diagram of another possible structure for the reinforcement structure provided in this application;
[0027] Figure 6 A possible structural diagram of the packaging structure provided in this application Figure 3 . Detailed Implementation
[0028] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.
[0029] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.
[0030] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.
[0031] In the description of this application, it should be noted that the terms "upper," "lower," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. In addition, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.
[0032] In the description of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "set up," "connected," "linked," and "connected" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.
[0033] It should be noted that, where there is no conflict, different features in the embodiments of this application can be combined with each other.
[0034] To address the problems in the existing technology, please refer to... Figure 2 This application provides a packaging structure 10, which may include a stacked chip layer 110 and a redistribution layer 120, wherein the redistribution layer 120 may be electrically connected to the chip in the chip layer 110.
[0035] The packaging structure 10 further includes a reinforcement structure 130 disposed in the chip layer 110 and / or the redistribution layer 120, wherein the material strength of the reinforcement structure 130 is greater than the material strength of the chip layer 110 and / or the redistribution layer 120.
[0036] In the above structure, the reinforcement structure 130 can provide additional physical support for the chip layer 110 and / or the redistribution layer 120, which can effectively reduce warping caused by thermal expansion coefficient mismatch and internal stress, and improve the stability and reliability of the package structure 10.
[0037] In some possible embodiments, the chip layer 110 further includes at least one chip 111 and a molding compound 112 located around the chip 111, wherein the height of the reinforcement structure 130 is less than or equal to the height of the chip 111 in a direction perpendicular to the plane of the redistribution layer 120.
[0038] The reinforcing structure 130 may be located within the molding compound 112, and the material strength of the reinforcing structure 130 is greater than the material strength of the molding compound 112. Exemplarily, the material of the reinforcing structure 130 includes metallic materials, synthetic materials, and composite materials.
[0039] The redistribution layer 120 includes conductive traces and an insulating material layer located around the conductive traces. The reinforcing structure 130 is located within the insulating material layer, and the material strength of the reinforcing structure 130 is greater than the material strength of the insulating material layer. Exemplarily, the material of the reinforcing structure 130 includes metallic materials, synthetic materials, and composite materials.
[0040] Furthermore, the shape of the reinforcing structure 130 may include, for example, Figure 4 The reinforcing strips arranged in a longitudinal and transverse pattern, or as shown... Figure 5 The integrated reinforced mesh structure is shown. Furthermore, the reinforced structure 130 also includes spaced-apart reinforcing strips, which can be arranged at equal or unequal intervals. Preferably, the reinforcing strips are arranged at equal intervals and extend in the same direction.
[0041] It should be noted that, based on the simulation analysis results of warpage, reinforcement structures 130 can be selectively provided within chip layer 110 and / or redistribution layer 120. Specifically, reinforcement structures 130 can be laid within the insulating material layer of redistribution layer 120 and / or the encapsulation layer of chip layer 110, or they can be partially disposed within the insulating material layer of redistribution layer 120 and / or the encapsulation layer of chip layer 110. Preferably, reinforcement structures 130 can be laid within or partially disposed within the encapsulation layer of chip layer 110, wherein the shape of reinforcement structures 130 can be selected based on the simulation analysis results of warpage and the internal structure of the layer. Furthermore, depending on the specific process requirements, reinforcement structures 130 can also be provided in the carrier board to reduce warpage during the manufacturing process.
[0042] In other embodiments, please refer to Figure 6 The molding layer 112 may include a first molding layer 1121 and a second molding layer 1122, and the reinforcement structure 130 includes a first reinforcement structure 131 and a second reinforcement structure 132. In a direction perpendicular to the redistribution layer 120, the first molding layer 1121, the first reinforcement structure 131, the second molding layer 1122, and the second reinforcement structure 132 are stacked to provide a more complex stress distribution and better structural stability for the encapsulation structure 10. The first reinforcement structure 131 and the second reinforcement structure 132 may include reinforcement strip structures or reinforcement mesh structures; the reinforcement strip structures may be arranged at intervals or in a longitudinal and transverse arrangement.
[0043] It should be noted that the chip layer 110 may include multiple stacked molding layers 112 and reinforcement structures 130, and the height and shape of each reinforcement structure 130 can be adjusted according to the simulation results of warping.
[0044] In this embodiment, the first molding layer 1121, the first reinforcing structure 131, the second molding layer 1122, and the second reinforcing structure 132 are stacked. The first reinforcing structure 131 and the second reinforcing structure 132 can better distribute the thermal stress on the first molding layer 1121 and the second molding layer 1122, effectively reducing warping caused by mismatch in thermal expansion coefficients and internal stress, and improving the stability and reliability of the encapsulation structure 10.
[0045] Further, the first reinforcing structure 131 may include a reinforcing strip structure extending along a first direction, and the second reinforcing structure 132 may include a reinforcing strip structure extending along a second direction, wherein the first direction is perpendicular to the second direction. Alternatively, the first reinforcing structure 131 and the second reinforcing structure 132 may be reinforcing strip structures extending in the same direction, wherein the orthographic projection of the first reinforcing structure 131 on the first molding layer 1121 coincides with the orthographic projection of the second reinforcing structure 132 on the first molding layer 1121, or the orthographic projection of the first reinforcing structure 131 on the first molding layer 1121 does not coincide with the orthographic projection of the second reinforcing structure 132 on the first molding layer 1121.
[0046] In addition, this application also provides an electronic component, which includes any of the packaging structures 10 in the above embodiments.
[0047] In summary, embodiments of this application provide a packaging structure and an electronic device. The packaging structure includes a stacked chip layer and a redistribution layer. The packaging structure also includes a reinforcement structure disposed in the chip layer and / or the redistribution layer, wherein the material strength of the reinforcement structure is greater than the material strength of the chip layer and / or the redistribution layer. In the above structure, the reinforcement structure can provide additional physical support for the chip layer and / or the redistribution layer, effectively reducing warpage caused by mismatched coefficients of thermal expansion and internal stress, thereby improving the stability and reliability of the packaging structure.
[0048] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.
Claims
1. A packaging structure, characterized in that, This includes the stacked chip layers and redistribution layers; The packaging structure further includes a reinforcement structure disposed in the chip layer and / or the redistribution layer, wherein the material strength of the reinforcement structure is greater than the material strength of the chip layer and / or the redistribution layer.
2. The packaging structure according to claim 1, characterized in that, The chip layer further includes at least one chip and a molding compound layer located around the chip, wherein, in a direction perpendicular to the plane of the redistribution layer, the height of the reinforcement structure is less than or equal to the height of the chip; The reinforcing structure is located within the molding layer, and the material strength of the reinforcing structure is greater than that of the molding layer.
3. The packaging structure according to claim 2, characterized in that, The redistribution layer includes conductive traces and an insulating material layer located around the conductive traces, wherein the reinforcing structure is located within the insulating material layer, and the material strength of the reinforcing structure is greater than the material strength of the insulating material layer.
4. The packaging structure according to claim 1, characterized in that, The shape of the reinforcing structure includes a longitudinally and transversely arranged reinforcing strip structure, or an integrated reinforcing mesh structure.
5. The packaging structure according to claim 1, characterized in that, The reinforcing structure includes reinforcing strips arranged at intervals, wherein the reinforcing strips are arranged at equal intervals and extend in the same direction.
6. The packaging structure according to claim 2, characterized in that, The molding layer includes a first molding layer and a second molding layer, and the reinforcing structure includes a first reinforcing structure and a second reinforcing structure; In a direction perpendicular to the redistribution layer, the first molding layer, the first reinforcement structure, the second molding layer, and the second reinforcement structure are stacked. The first reinforcement structure and the second reinforcement structure include a reinforcement strip structure or a reinforcement mesh structure.
7. The packaging structure according to claim 6, characterized in that, The first reinforcing structure includes a reinforcing strip structure extending along a first direction, and the second reinforcing structure includes a reinforcing strip structure extending along a second direction, wherein the first direction is perpendicular to the second direction.
8. The packaging structure according to claim 6, characterized in that, The first reinforcing structure and the second reinforcing structure both include reinforcing strip structures extending in the same direction; wherein, The orthographic projection of the first reinforcing structure onto the first molding layer coincides with the orthographic projection of the second reinforcing structure onto the first molding layer, or the orthographic projection of the first reinforcing structure onto the first molding layer does not coincide with the orthographic projection of the second reinforcing structure onto the first molding layer.
9. The packaging structure according to claim 1, characterized in that, The materials used to reinforce the structure include metallic materials, synthetic materials, and composite materials.
10. An electronic component, characterized in that, The electronic components include the packaging structure described in any one of claims 1-9.