Ball grid array packaging chip with reinforcing solder balls, electric device and movable platform

Abstract

The utility model relates to a ball grid array packaging chip with reinforcing solder balls, an electric device and a movable platform, and the packaging chip comprises a substrate with a ball mounting surface; the plurality of conventional solder balls are arranged on the ball mounting surface and can be electrically connected with a printed circuit board, and the plurality of conventional solder balls are distributed in a rectangular array in a preset area; and a plurality of reinforcing solder balls arranged on the ball mounting surface, the plurality of reinforcing solder balls are located at the periphery of the corners of the rectangular array, but do not exist on the diagonal lines of the rectangular array, and the plurality of reinforcing solder balls can be physically connected with the printed circuit board and do not provide electrical connection. According to the packaging chip, the electric device and the movable platform provided by the invention, the reinforcing solder balls are arranged at the peripheries of the corners (but not on the diagonal lines of the rectangular array) of the rectangular array, so that high stress at the corners can be absorbed, and the strain resistance of the whole chip is improved.

Description

Technical Field

[0001] This utility model relates to the field of ball grid array packaged chips, and more particularly to a ball grid array packaged chip with reinforcing solder balls, as well as electrical devices and mobile platforms using the chip. Background Technology

[0002] Currently, Ball Grid Array (BGA) packaged chips are more widely used. These packages can be chips with independent functional modules or system-in-a-package (SIP) chips that package multiple functional modules together. As packaged chips become increasingly miniaturized, the size of the solder balls also decreases. Under thermal cycling loads, the packaged chip or the printed circuit board (PCB) electrically connected to it is subjected to stress bending, and the connection between the solder balls and the pads is prone to breakage and failure.

[0003] Existing technologies avoid the above problems in the following ways:

[0004] 1. A common approach is to solder the solder balls to the pads, then use underfill or sidefill to support the chip substrate, reinforcing the solder joint and meeting the reliability requirements of the packaged chip. However, this technique requires additional adhesive and production line equipment, increasing production resources and introducing other failure risks to the packaged chip.

[0005] 2. In the patent with authorization announcement number CN108235596B and titled "A method for reducing BGA chip solder joint defects and a PCB board with BGA chips soldered on", adhesion is enhanced by adding through holes and pins without any electrical connection at the edge of the PCB board where the BGA chip is placed. However, this technical solution also introduces additional production line equipment for setting and soldering through holes and pins.

[0006] 3. In the patent application CN109309069A entitled "Solder Ball Array Packaged Chip and Soldering Method Thereof", a first solder ball with a larger diameter is provided at the top corner of the printed circuit board to make the soldering between the first pad and the first solder ball stronger and enhance the stability of the packaged chip. However, the solder ball at the top corner itself bears greater stress. Even if the solder ball at this location is enlarged, its soldering strength is likely to be only comparable to that of other solder balls. Furthermore, given the trend of miniaturization of packaged chips, it is impossible to increase the size of the solder ball indefinitely. Utility Model Content

[0007] In view of the problems existing in the background art, one aspect of the present invention provides a ball grid array packaged chip with reinforcing solder balls, comprising:

[0008] A substrate with a spherical surface;

[0009] Multiple conventional solder balls, electrically connectable to a printed circuit board, are disposed on the surface of the solder ball assembly; the multiple conventional solder balls are arranged in a rectangular array within a predetermined area; and

[0010] Multiple reinforcing solder balls are disposed on the surface of the ball, and the multiple reinforcing solder balls are located on the periphery of the corners of the rectangular array, but not on the diagonal of the rectangular array. The multiple reinforcing solder balls can be physically connected to the printed circuit board but do not provide electrical connection.

[0011] In some embodiments of this utility model, the preset area is multiple and spaced apart from each other, and each preset area is provided with multiple conventional solder balls distributed in a rectangular array, with the multiple reinforcing solder balls located on the periphery of each rectangular array corner.

[0012] In some embodiments of this utility model, the conventional solder balls and the reinforcing solder balls are implanted in one go using the same ball-planting process.

[0013] In some embodiments of this invention, the conventional solder ball and the reinforcing solder ball are the same size.

[0014] In some embodiments of this utility model, on the periphery of one corner of the rectangular array, reinforcing solder balls distributed along the length direction of the rectangular array account for 10% of the total length of the rectangular array, and reinforcing solder balls distributed along the width direction of the rectangular array account for 10% of the total width of the rectangular array (obtained from simulation experiments).

[0015] In some embodiments of this invention, the number of reinforcing solder balls distributed along the length and width directions of the rectangular array are equal at one corner of the rectangular array.

[0016] In some embodiments of this utility model, five reinforcing solder balls are distributed along both the length and width directions of the rectangular array on the periphery of one corner of the rectangular array.

[0017] Another aspect of this utility model provides an electrical device, comprising:

[0018] Printed circuit boards; and

[0019] As described above, in any of the ball grid array packaged chips with reinforcing solder balls, a plurality of the conventional solder balls are electrically connected to the printed circuit board, and a plurality of the reinforcing solder balls are physically connected to the printed circuit board but do not provide electrical connection.

[0020] In some embodiments of this utility model, the electrical device includes: a metal foil covered on the printed circuit board, the metal foil being located in an "L" shape at the periphery of the corner of the rectangular array, and the reinforcing solder ball being soldered to the metal foil.

[0021] In some embodiments of this utility model, an electrical device includes: a plurality of pads for electrical connection disposed on the printed circuit board, wherein conventional solder balls are soldered to the pads; a metal foil covered on the printed circuit board, wherein the metal foil covers other areas outside the area where the pads are located, and the metal foil does not contact the pads, wherein all the reinforcing solder balls are soldered to the metal foil.

[0022] Another aspect of this invention provides a mobile platform comprising: the electrical components as described above.

[0023] The ball grid array packaged chip and electrical device with reinforcing solder balls provided by this utility model absorbs high stress at the corners (but not on the diagonals) of the rectangular array by placing multiple reinforcing solder balls on the periphery of these corners. Since the reinforcing solder balls do not contain any electrical connections, the stress applied to them will not cause sensitive electrical connections to break. Furthermore, if the reinforcing solder balls are placed on the diagonals of the rectangular array, they will break and fail first. After removing them, the stress they originally borne is distributed to the other reinforcing solder balls, thereby increasing the overall strain resistance of the chip. Attached Figure Description

[0024] Figure 1 A schematic diagram of the ball grid array packaged chip substrate with reinforcing solder balls provided in an embodiment of the present invention;

[0025] Figure 2 To and Figure 1 The diagram shows a printed circuit board in which packaged chips are soldered to form an electrical device.

[0026] Figure 3a The simulation results show the analysis of applying multiple thermal shock loads to a ball grid array (BGA) packaged chip.

[0027] Figure 3b for Figure 3a Force analysis diagram of ball grid array (BGA) after removing system-in-package (SIP) chip and printed circuit board (PCB);

[0028] Figure 4a A schematic diagram showing the addition of reinforcing solder balls to a plurality of peripheral ball grid arrays;

[0029] Figure 4b A schematic diagram showing the addition of reinforcing solder balls to a plurality of staggered ball grid arrays;

[0030] Figure 4c A schematic diagram showing the addition of reinforcing solder balls to a plurality of fully arrayed ball grid arrays;

[0031] Figure 5a This is a schematic diagram showing a comparison without reinforcing solder balls.

[0032] Figure 5b A schematic diagram of Experiment 1 with 44 reinforcing solder balls;

[0033] Figure 5c A schematic diagram of Experiment Example 2 with 40 reinforcing solder balls;

[0034] Figure 5d A schematic diagram of Experiment 3 with 84 reinforcing solder balls;

[0035] Figure 5e A schematic diagram of Experiment 4 with 80 reinforcing solder balls;

[0036] Figure 5f A schematic diagram of Experiment 5 with 176 reinforcing solder balls;

[0037] Figure 6a The experimental data for the maximum equivalent plastic strain simulation of the global ball grid array in comparative examples and experimental examples 1-5 are provided.

[0038] Figure 6b The maximum equivalent plastic strain simulation experimental data for the functional ball grid arrays in comparative examples and experimental examples 1-5 are provided.

[0039] Figure 6c The experimental data for simulating the maximum shear stress of the global ball grid array are for comparative examples and experimental examples 1-5;

[0040] Figure 6d The maximum shear stress simulation experimental data for the functional ball grid arrays in comparative examples and experimental examples 1-5 are provided.

[0041] Figure 6e The maximum equivalent stress simulation experimental data for the global ball grid array is provided for the comparative examples and experimental examples 1-5.

[0042] Figure 6f This provides simulation experimental data for the maximum equivalent stress of the functional ball grid arrays in comparative examples and experimental examples 1-5;

[0043] Figure 7 A diagram showing the state of a printed circuit board of an electrical device after temperature shock, according to an embodiment of this utility model.

[0044] Figure 8 A schematic diagram of an electrical device with a cross-sectional line CC marked on one side of a ball grid array packaged chip;

[0045] Figure 9 For electrical components along Figure 8 A cross-sectional view of the CC section line.

[0046] Explanation of reference numerals in the attached figures:

[0047] Ball grid array packaged chip 100: substrate 10; conventional solder balls 20; multiple reinforcing solder balls 30; printed circuit board 200; metal foil 300. Detailed Implementation

[0048] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0049] like Figure 1 and 2 As shown, this embodiment provides a ball grid array packaged chip 100 with reinforcing solder balls, including a substrate 10, a plurality of conventional solder balls 20, and a plurality of reinforcing solder balls 30. The substrate 10 has a ball-mounting surface, on which the plurality of conventional solder balls 20, capable of being electrically connected to a printed circuit board 200, are disposed. The plurality of conventional solder balls 20 are distributed in a rectangular array within a preset area. The plurality of reinforcing solder balls 30 are disposed on the ball-mounting surface, located on the periphery of corner A of the rectangular array, but not on the diagonal B of the rectangular array. The plurality of reinforcing solder balls 30 are physically connected to the printed circuit board 200 but do not provide electrical connection.

[0050] For example, the printed circuit board 200 can be a blank board or a blank PCB board that has been mounted by SMT (Surface Mount Technology) or DIP (Dual In-line Package) (Printed Circuit Board Assembly, abbreviated as PCBA).

[0051] For example, the conventional solder ball 20 and the reinforcing solder ball 30 can be balled by any one or more of the following methods: manual balling (e.g., using a balling plate, BGA balling station, or other fixtures), automatic balling machine, laser balling, etc.

[0052] For example, the standard solder ball 20 is laser-mounted, while the reinforcing solder ball 30 is manually mounted. Alternatively, both the standard solder ball 20 and the reinforcing solder ball 30 can be laser-mounted.

[0053] like Figure 3a and 3b As shown, a ball grid array (BGA) packaged chip was subjected to thermal shock through modeling and temperature shock environment simulation. The experimental structure shows that the packaged chip warped after multiple thermal shock loading (PCBA result in Warpage multiple thermal shock loading). After removing the system-in-package (SIP) and printed circuit board (PCB) from the BGA packaged chip, a simulated stress analysis of the BGA shows that the BGA bears stress from the SIP and PCB, and also applies stress to the SIP and PCB. From the magnified view, the top of the reinforcing solder ball 30 at the far corner (on the diagonal B of the rectangular array) experiences stress from the SIP towards the lower left (indicated by the green arrow in the figure), and also applies stress to the SIP towards the upper right (indicated by the red arrow in the figure). The bottom of the reinforcing solder ball 30 is subjected to stress from the printed circuit board (PCB) towards the lower left (indicated by the red arrow in the figure), and to stress towards the upper right (indicated by the green arrow in the figure) on the PCB. The reinforcing solder ball 30 at the outermost corner (on the diagonal B of the rectangular array) experiences significantly greater stress than the reinforcing solder balls at other locations (shown in red in the stress analysis diagram). Therefore, the reinforcing solder ball 30 at the outermost corner is more prone to failure, and placing the reinforcing solder ball 30 at this location does not better distribute the stress, making its placement meaningless.

[0054] Those skilled in the art will understand that by placing multiple reinforcing solder balls 30 around the periphery of corner A of the rectangular array (but not on the diagonal B of the rectangular array), the high stress at these corners is absorbed. Since the reinforcing solder balls 30 do not contain any electrical connections, the stress applied to the reinforcing solder balls 30 will not cause sensitive electrical connections to break. Furthermore, if the reinforcing solder balls 30 are placed on the diagonal B of the rectangular array, the reinforcing solder balls 30 will break and fail first. After removing the reinforcing solder balls 30, the stress they originally borne is distributed to the other reinforcing solder balls 30, thereby increasing the overall strain resistance of the chip.

[0055] Furthermore, there are multiple preset regions that are spaced apart from each other, and each preset region is provided with multiple conventional solder balls 20 distributed in a rectangular array, and multiple reinforcing solder balls 30 are located on the periphery of each rectangular array corner A (but not on the diagonal B of the rectangular array).

[0056] like Figure 4aAs shown, a plurality of (2×2) preset regions are arranged at intervals on the substrate 10. The rectangular array in the preset region is a peripheral ball grid array. Multiple reinforcing solder balls 30 are disposed on the periphery of corner A of the rectangular array, but not on the diagonal B of the rectangular array. Multiple reinforcing solder balls 30 are disposed on the periphery of corner A of each rectangular array, thereby absorbing the high stress in each preset region.

[0057] like Figure 4b As shown, a plurality of (2×2) preset regions are arranged at intervals on the substrate 10. The rectangular array in the preset region is an interleaved ball grid array. Multiple reinforcing solder balls 30 are disposed on the periphery of corner A of the rectangular array, but not on the diagonal B of the rectangular array. Multiple reinforcing solder balls 30 are disposed on the periphery of corner A of each rectangular array, thereby absorbing the high stress in each preset region.

[0058] like Figure 4c As shown, a plurality of (2×2) preset regions are arranged at intervals on the substrate 10. The rectangular array in the preset region is a full-array ball grid array. Multiple reinforcing solder balls 30 are disposed around the periphery of the corner A of the rectangular array, but not on the diagonal B of the rectangular array. Multiple reinforcing solder balls 30 are disposed around the periphery of each corner A of the rectangular array, thereby absorbing the high stress in each preset region.

[0059] Those skilled in the art should be able to understand that, according to Figures 4a-4c The revealed patterns, for Figure 1 The applicant's self-developed system-in-package (SIP) chip with a slightly more complex structure, as shown, can also be processed in the same way: multiple preset regions are set; conventional solder balls 20 and reinforcing solder balls 30 are implanted in the preset regions to form a ball grid array (BGA), with multiple ball grid arrays (BGAs) regularly arranged on a larger substrate 10; after other necessary packaging processes, the preset regions are cut (e.g., along...). Figures 4a-4c (as shown by the dashed line), thus obtaining multiple independent packaged chips.

[0060] Furthermore, the conventional solder ball 20 and the reinforcing solder ball 30 are implanted in one step using the same ball-planting process.

[0061] Furthermore, the regular solder ball 20 and the reinforcing solder ball 30 are the same size.

[0062] For example, both the conventional solder ball 20 and the reinforcing solder ball 30 can be formed into balls of the same size in one go using a laser ball-planting process.

[0063] Those skilled in the art should understand that in the prior art, whether it is to form support for the chip substrate through underfill or sidefill to provide reinforcement for soldering, or to add vias and pins without any electrical connection to the edge of the BGA chip on the PCB to enhance adhesion, or to set a first solder ball with a larger diameter at the top corner of the printed circuit board, all of these introduce different processes or related production line equipment. This application, however, can form conventional solder balls 20 and reinforcing solder balls 30 of the same size in one step using the same ball-planting process, avoiding the introduction of related production line equipment, not increasing production resources, and not introducing other failure risks. Moreover, this packaged chip 100 still possesses the aforementioned advantage of "absorbing the high stress at the corner A of the rectangular array".

[0064] Furthermore, the number of reinforcing solder balls 30 is positively correlated with the total length of the rectangular array (the number of regular solder balls 20 on each side).

[0065] Furthermore, on the periphery of one corner of the rectangular array, reinforcing solder balls 30 distributed along the length direction of the rectangular array account for 10% of the total length of the rectangular array, and reinforcing solder balls distributed along the width direction of the rectangular array account for 10% of the total width of the rectangular array (obtained from simulation experiments).

[0066] exist Figure 1 In the image, viewed from corner A, there are five horizontally arranged reinforcing solder balls 30, and approximately fifty regular solder balls 20 along the length of the rectangular array. The reinforcing solder balls 30 account for 10% of the total length of the rectangular array. Similarly, there are five vertically arranged reinforcing solder balls 30, and approximately fifty regular solder balls 20 along the width of the rectangular array. The reinforcing solder balls 30 account for 10% of the total width of the rectangular array.

[0067] Furthermore, on the periphery of one corner of the rectangular array, the number of reinforcing solder balls 30 distributed along the length and width directions of the rectangular array are equal.

[0068] Furthermore, on the periphery of one corner of the rectangular array, there are 5 reinforcing solder balls 30 distributed along both the length and width directions of the rectangular array.

[0069] like Figure 5a The comparative example shown illustrates a scheme in which no reinforcing solder balls 30 are placed around corner A of the rectangular array.

[0070] like Figure 5b Experimental Example 1 shows a scheme in which 44 reinforcing solder balls 30 are arranged around corner A of a rectangular array. The number of reinforcing solder balls 30 in corner A is 11 (including 1 on the diagonal B of the rectangular array), and the reinforcing solder balls 30 are arranged in a single layer.

[0071] like Figure 5cExperimental Example 2 shows a scheme in which 40 reinforcing solder balls 30 are placed around corner A of a rectangular array. The number of reinforcing solder balls 30 in one corner A is 10 (not present on the diagonal B of the rectangular array), and the reinforcing solder balls 30 are arranged in a single layer.

[0072] like Figure 5d Experimental Example 3 shows a scheme in which 84 reinforcing solder balls 30 are set around the perimeter of corner A of a rectangular array. The number of reinforcing solder balls 30 in one corner A is 21 (including 1 that exists on the diagonal B of the rectangular array), and the reinforcing solder balls 30 are arranged in a single layer.

[0073] like Figure 5e Experimental Example 4 shows a scheme in which 80 reinforcing solder balls 30 are set around the perimeter of corner A of a rectangular array. The number of reinforcing solder balls 30 in one corner A is 20. The reinforcing solder balls 30 are arranged in two layers: 9 in the inner layer (including 1 on the diagonal B of the rectangular array) and 11 in the outer layer (including 1 on the diagonal B of the rectangular array).

[0074] like Figure 5f Experimental Example 5 shows a scheme in which 176 reinforcing solder balls 30 are set around the perimeter of corner A of a rectangular array. The number of reinforcing solder balls 30 in one corner A is 44. The reinforcing solder balls 30 are arranged in two layers: 21 in the inner layer (including 1 on the diagonal B of the rectangular array) and 23 in the outer layer (including 1 on the diagonal B of the rectangular array).

[0075] Combination Figures 6a-6f The simulated experimental data shown in Comparative Example 1 and Experimental Examples 1-5 do not show that the more reinforcing solder balls 30 there are, the better, nor is a multi-layer arrangement superior to a single-layer arrangement.

[0076] In Experiments 1-5, by adding reinforcing solder balls 30, the maximum equivalent plastic strain and maximum equivalent von-Misesstress of the conventional solder balls 20 can be significantly reduced, while the effect on the maximum shear stress is slightly smaller. With the increase in the number and layers of reinforcing solder balls 30, the above effects do not continue to increase; instead, the plastic strain and equivalent stress borne by the reinforcing solder balls 30 themselves increase. Furthermore, as... Figure 6c As shown, with the increase of reinforcing solder balls 30, the maximum shear stress even appears in the conventional solder balls 20 (functional BGA).

[0077] Of the 1-5 experiments, Experiment 2 is particularly noteworthy. The equivalent plastic strain, equivalent stress, and shear stress values ​​obtained on the global ball grid array (including conventional solder balls 20 and reinforcing solder balls 30) and the functional ball grid array (including conventional solder balls 20) are similar and lower. This indicates that the reinforcing solder balls 30 help the conventional solder balls 20 to share the stress, and the stress borne by the reinforcing solder balls 30 themselves is not unreasonably increased significantly.

[0078] Furthermore, on the periphery of one corner of the rectangular array, a single layer of reinforcing tin balls 30 is distributed along the length and width directions of the rectangular array.

[0079] Those skilled in the art should understand that the single-layer distributed reinforcing solder balls 30 are easier to align with the conventional solder balls 20 in the array during ball placement, which is more conducive to sharing the stress borne by the conventional solder balls 20, and will not occupy too much space in the substrate 10, which is also conducive to chip miniaturization.

[0080] like Figure 1 and 2 As shown, another aspect of this application provides an electrical device including a printed circuit board 200 and a ball grid array package chip 100 with reinforcing solder balls as described above. A plurality of conventional solder balls 20 are electrically connected to the printed circuit board 200, while a plurality of reinforcing solder balls 30 are physically connected to the printed circuit board 200 but do not provide electrical connection.

[0081] That is, electrical components include those soldered together, such as... Figure 1 The ball grid array packaged chip 100 shown and as shown Figure 2 The circuit board 200 shown.

[0082] For example, the printed circuit board 200 can be a blank board, or it can be a blank PCB board that has undergone SMT assembly or DIP insertion (Printed Circuit Board Assembly, abbreviated as PCBA). Figure 3a and 3bAs shown, multiple thermal shock loads were applied to a ball grid array (BGA) packaged chip through modeling and temperature shock environment simulation. The experimental structure showed that the packaged chip warped. After removing the system-in-package (SIP) and printed circuit board (PCB) from the BGA packaged chip, stress analysis was performed on the BGA. It can be seen that the BGA bears stress from the SIP and PCB, and also applies stress to the SIP and PCB. The reinforcing solder ball 30 at the outermost corner (on the diagonal B of the rectangular array) experiences significantly greater stress from the SIP than reinforcing solder balls at other locations (shown in red in the stress analysis diagram). Therefore, the reinforcing solder balls 30 at the far corners are more prone to failure. Setting up reinforcing solder balls 30 at this location does not effectively distribute stress, and their placement is of little significance.

[0083] Those skilled in the art will understand that by placing multiple reinforcing solder balls 30 around the periphery of corner A of the rectangular array (but not on the diagonal B of the rectangular array), the high stress at these corners is absorbed. Since the reinforcing solder balls 30 do not contain any electrical connections, the stress applied to the reinforcing solder balls 30 will not cause sensitive electrical connections to break. Furthermore, if the reinforcing solder balls 30 are placed on the diagonal B of the rectangular array, the reinforcing solder balls 30 will break and fail first. After removing the reinforcing solder balls 30, the stress they originally borne is distributed to the other reinforcing solder balls 30, thereby increasing the overall strain resistance of the electrical device.

[0084] Furthermore, the electrical components include a metal foil 300 covered on the printed circuit board 200, the metal foil 300 being located in an "L" shape at the periphery of the corner of the rectangular array, and reinforcing solder balls 30 being soldered to the metal foil 300.

[0085] Furthermore, all the reinforcing solder balls 30 are soldered to the metal foil 300.

[0086] For example, the metal foil can be gold, silver, copper or their alloys, with copper foil being more preferred due to its low cost.

[0087] For example, the metal foil can be fixed to the printed circuit board 200 by adhesive. The adhesive can be acrylic glue, epoxy resin glue, etc.

[0088] Those skilled in the art should understand that if the strength of the reinforcing solder ball 30 is greater than that of the printed circuit board 200 after the reinforcing solder ball 30 is provided, cracks may appear in the printed circuit board 200 after temperature shock cycles. In order to reduce local stress concentration, metal foil 300 (copper foil) is provided on the printed circuit board 200 at the corresponding position of the reinforcing solder ball 30, and the reinforcing solder ball 30 is soldered to the metal foil 300 (copper foil), which can avoid stress concentration causing pitting cracks in the printed circuit board 200.

[0089] like Figure 7 As shown, after 600 temperature shock cycles, the printed circuit board 200 did not develop pits or cracks under the protection of the copper foil.

[0090] along Figure 8 The CC profile shown is used to obtain the following: Figure 9 The cross-sectional view of the electrical components shown shows that the printed circuit board 200 has no pits or cracks, and there is no breakage at the regular solder ball 20 and the reinforcing solder ball 30 (the positions numbered 1 and 49 in the figure are reinforcing solder balls, and the rest are regular solder balls).

[0091] Alternatively, the electrical components include multiple pads for electrical connection disposed on the printed circuit board 200, with conventional solder balls 20 soldered to the pads; and a metal foil 300 covering the printed circuit board 200, the metal foil 300 covering other areas outside the area where the pads are located, and the metal foil 300 not contacting the pads, with all reinforcing solder balls 30 soldered to the metal foil 300.

[0092] Those skilled in the art should understand that, in order to reduce local stress concentration, by placing metal foil 300 at the position corresponding to the reinforcing solder ball 30 on the printed circuit board, and soldering the reinforcing solder ball 30 to the metal foil 300, stress concentration can be avoided from causing pitting and cracking of the board. Furthermore, the remaining portion of the metal foil 300 without the reinforcing solder ball 30 soldered on it can also enhance the mechanical strength of the entire printed circuit board 200 (which can also be regarded as the entire electrical device).

[0093] Furthermore, the aforementioned electrical components can also be used in a mobile platform. The mobile platform can be a car, unmanned aerial vehicle (UAV), remote-controlled car, unmanned boat, or robot. The car can be a driverless vehicle or a manned vehicle, and the UAV can be a drone or other unmanned aerial vehicle. Of course, the mobile platform is not limited to the mobile platforms listed above and can also be other types of mobile platforms.

[0094] Those skilled in the art will understand that, because the mobile platform employs the aforementioned electrical components, it possesses all the technical effects brought about by those components. For example, the design of reinforcing solder balls 30 increases the overall strain resistance of the electrical components. Furthermore, by placing metal foil 300 on the printed circuit board 200, stress concentration that could cause pitting and cracking of the printed circuit board 200 can be avoided. Based on this, those skilled in the art will also undoubtedly recognize that the mobile platform can withstand more complex working environments, can respond accurately and promptly to operator commands, and is more reliable.

[0095] In the description of this specification, the references to terms such as "certain embodiments," "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in a suitable manner in any one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0096] In this utility model, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance; the term "multiple" refers to two or more unless otherwise explicitly defined. The terms "install," "connect," "join," and "fix" should be interpreted broadly. For example, "connect" can be a fixed connection, a detachable connection, or an integral connection; "join" can be a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0097] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of this utility model and are not restrictive. Although this utility model has been described in detail with reference to the embodiments, those skilled in the art should understand that modifications or equivalent substitutions to the technical solution of this utility model do not depart from the spirit and scope of the technical solution of this utility model, and all such modifications or substitutions should be covered within the scope of the claims of this utility model.

Claims

1. A ball grid array packaged chip with reinforcing solder balls, characterized in that, include: A substrate with a spherical surface; Multiple conventional solder balls, electrically connectable to a printed circuit board, are disposed on the surface of the solder ball assembly; the multiple conventional solder balls are arranged in a rectangular array within a predetermined area; and Multiple reinforcing solder balls are disposed on the surface of the ball, and the multiple reinforcing solder balls are located on the periphery of the corners of the rectangular array, but not on the diagonal of the rectangular array. The multiple reinforcing solder balls can be physically connected to the printed circuit board but do not provide electrical connection.

2. The ball grid array packaged chip with reinforcing solder balls according to claim 1, characterized in that: The preset regions are multiple and spaced apart from each other. Each preset region is provided with multiple conventional solder balls arranged in a rectangular array. The multiple reinforcing solder balls are located on the periphery of the corner of each rectangular array.

3. The ball grid array packaged chip with reinforcing solder balls according to claim 1, characterized in that: The conventional solder balls and the reinforcing solder balls are implanted in one go using the same ball-planting process.

4. The ball grid array packaged chip with reinforcing solder balls according to claim 1, characterized in that: The standard solder ball is the same size as the reinforcing solder ball.

5. The ball grid array packaged chip with reinforcing solder balls according to claim 1, characterized in that: At one corner of the rectangular array, reinforcing solder balls distributed along the length of the rectangular array account for 10% of the total length of the rectangular array, and reinforcing solder balls distributed along the width of the rectangular array account for 10% of the total width of the rectangular array.

6. The ball grid array packaged chip with reinforcing solder balls according to claim 1, characterized in that: The number of reinforcing solder balls distributed along the length and width directions of the rectangular array is equal at one corner of the outer perimeter.

7. The ball grid array packaged chip with reinforcing solder balls according to claim 5, characterized in that: Five reinforcing solder balls are distributed along both the length and width of the rectangular array on the periphery of one corner of the array.

8. An electrical device, characterized in that, include: Printed circuit boards; as well as The ball grid array packaged chip with reinforcing solder balls according to any one of claims 1-7, wherein the plurality of conventional solder balls are electrically connected to the printed circuit board, and the plurality of reinforcing solder balls are physically connected to the printed circuit board but do not provide electrical connection.

9. An electrical device according to claim 8, characterized in that, include: A metal foil is applied to the printed circuit board, the metal foil being positioned in an "L" shape around the corner of the rectangular array, and the reinforcing solder balls are soldered to the metal foil.

10. A mobile platform, characterized in that, include: The electrical device according to claim 8 or 9.

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