Cavity filter and mounting structure

By setting multiple solder feet and tuning mechanisms on the side plate of the cavity filter, the problem of weak connection between the cavity filter and the PCB board is solved, achieving a more reliable connection and a simplified installation process, and improving structural durability and signal transmission stability.

CN223502167UActive Publication Date: 2025-10-31UNI TREND TECH (CHINA) CO LTD
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Patent Information

Application Number
CN202423045463.8
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-10
Publication Date
2025-10-31
Estimated Expiration
2034-12-10

AI Technical Summary

Technical Problem

Existing cavity filters, which are fixed to the PCB board with screws, are prone to damaging the integrity of the PCB board's circuit layout. The connection is not firm and maintenance is complicated, affecting signal transmission stability and maintenance costs.

Method used

Multiple solder feet are set on the side plate facing away from the resonant body and arranged at intervals along the length of the resonant body to increase contact points and fixing points. Reliable connection is achieved by welding. At the same time, a tuning mechanism is used to adjust the frequency to improve the filter response curve.

Benefits of technology

It improves the connection reliability between the cavity filter and the PCB board, reduces local stress damage, enhances structural durability, simplifies the installation and maintenance process, and reduces maintenance costs.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model belongs to the technical field of printed circuit board production, and particularly relates to a cavity filter and a mounting structure, and the cavity filter comprises a resonance main body which is provided with a first surface and a second surface which are oppositely arranged; the two side plates are connected to the first surface and the second surface of the resonance main body respectively, a plurality of weld legs are arranged on the surfaces, back to the resonance main body, of the side plates, and the weld legs are arranged at intervals in the length direction of the resonance main body. According to the cavity filter, the plurality of welding pins are arranged on the surfaces, back to the resonance main body, of the side plates, so that contact points and fixing points of the side plates and the PCB are increased, and the connection reliability is improved; the plurality of welding pins are arranged at intervals along the length direction of the resonance main body, so that the welding stress is uniformly distributed, the damage of local concentrated stress to the structure is reduced, and the durability of the whole structure is enhanced.
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Description

Technical Field

[0001] This application relates to the field of printed circuit board manufacturing technology, and in particular to a cavity filter and its mounting structure. Background Technology

[0002] In today's highly developed communications field, cavity filters play a crucial role in optimizing signal transmission quality.

[0003] Existing cavity filters are generally mounted and fixed to the PCB board using screws. However, this method has many limitations. Screw fixing requires drilling holes in both the cavity filter and the PCB board, which not only increases the processing complexity of the PCB board but may also compromise the integrity of the PCB board's circuit layout and the structural stability of the cavity filter, affecting the stability of signal transmission.

[0004] During installation, tightening each screw individually is tedious, inefficient, and requires a high level of skill from the operator, easily leading to insecure fixing due to inconsistent tightening force. Over long-term use, screws may loosen due to vibration, temperature changes, and other factors, affecting the reliability of the connection between the cavity filter and the PCB board, thus reducing filter performance. Furthermore, when repairing or replacing the cavity filter, the screw removal process is complex and can easily damage the PCB board and filter, increasing maintenance costs and time.

[0005] It should be noted that the information disclosed in the background section above is only used to enhance the understanding of the background of this disclosure, and therefore may include information that does not constitute prior art known to those skilled in the art. Summary of the Invention

[0006] In view of at least one of the above technical problems, this application provides a cavity filter and mounting structure, which solves the problem that existing cavity filters are generally fixed to the PCB board with screws, which easily damages the integrity of the PCB board's circuit layout.

[0007] In a first aspect, a cavity filter is provided, comprising:

[0008] The resonant body has a first surface and a second surface that are arranged opposite to each other;

[0009] The side plate has two plates, which are respectively connected to the first surface and the second surface of the resonant body. The side plate has multiple welding feet on the surface facing away from the resonant body. The welding feet are arranged at intervals along the length of the resonant body and are in the shape of a cuboid.

[0010] One of the above technical solutions has at least one of the following advantages or beneficial effects: This cavity filter increases the contact points and fixing points between the side plate and the PCB board by setting multiple solder feet on the surface of the side plate facing away from the resonant body, thereby improving the reliability of the connection; by arranging multiple solder feet at intervals along the length of the resonant body, the welding stress is evenly distributed, reducing the damage to the structure caused by local concentrated stress and enhancing the durability of the overall structure.

[0011] In some possible implementations, the resonant body is square.

[0012] In some possible implementations, the weld feet and side plates are integrally formed.

[0013] In some possible implementations, multiple first mounting holes are provided on the side plate, and multiple second mounting holes are provided on the resonant body. Both the first and second mounting holes extend along the width direction of the resonant body, and the first and second mounting holes correspond one-to-one. A mounting screw passes through the first and second mounting holes.

[0014] In some possible implementations, the resonant body has a resonant cavity that penetrates the first surface and the second surface. Multiple tuning mechanisms are installed on the resonant body, extending along the height direction of the resonant body. The resonant body also has an input mechanism and an output mechanism. The input mechanism is connected to one tuning mechanism, and the output mechanism is connected to another tuning mechanism. Both the input mechanism and the output mechanism extend along the length direction of the resonant body.

[0015] In some possible implementations, the tuning mechanism includes: resonant pillars and tuning screws, wherein there are multiple resonant pillars arranged in a comb-like manner in the resonant cavity, and multiple tuning screws passing through the resonant body, wherein the tuning screws correspond one-to-one with the resonant pillars, the input mechanism is connected to one resonant pillar, and the output mechanism is connected to another resonant pillar.

[0016] In some possible implementations, the resonant post includes a connecting part and a head connected together, the connecting part being connected to the inner surface of the resonant cavity, and the head forming a tuning space with the tuning screw.

[0017] In some possible implementations, the resonant body has a through hole communicating with the resonant cavity, and the tuning screw passes through the through hole.

[0018] Secondly, an installation structure is provided, including:

[0019] PCB board, with multiple solder pads;

[0020] Cavity filters are soldered to pads via solder feet.

[0021] The present application will be further described below with reference to the accompanying drawings and embodiments. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 An exploded view of the cavity filter provided in the embodiments of this application;

[0024] Figure 2 A front view of the resonant body provided in an embodiment of this application;

[0025] Figure 3 This is a schematic diagram of the installation structure provided in the embodiments of this application;

[0026] In the diagram: 100, PCB board; 110, mounting slot;

[0027] 200. Cavity filter; 210. Resonant body; 220. Side plate;

[0028] 211. First surface; 212. Second surface; 213. Second mounting hole; 214. Resonant cavity; 215. Tuning mechanism; 216. Input mechanism; 217. Output mechanism;

[0029] 2151. Resonant post; 2152. Tuning screw; 2153. Connecting part; 2154. Head;

[0030] 221. Weld leg; 222. First mounting hole; Detailed Implementation

[0031] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0032] In the description of this application, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0033] In the description of this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0034] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0035] In the description of this application, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0036] In the embodiments of this application, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in the embodiments of this application can be understood according to the specific circumstances.

[0037] like Figure 1 and Figure 2 As shown, this application embodiment provides a cavity filter 200, including: a resonant body 210 and a side plate 220.

[0038] The resonant body 210 has a first surface 211 and a second surface 212 that are arranged opposite to each other; the side plate 220 has two first surfaces 211 and second surfaces 212 that are respectively connected to the resonant body 210. The side plate 220 has a plurality of solder feet 221 on the surface facing away from the resonant body 210. The plurality of solder feet 221 are arranged at intervals along the length direction of the resonant body 210. The solder feet are in the shape of a cuboid.

[0039] It is understandable that the length direction of the resonant body 210 corresponds to the L-axis of the spatial coordinate system, the width direction of the resonant body 210 corresponds to the W-axis of the spatial coordinate system, and the height direction of the resonant body 210 corresponds to the H-axis of the spatial coordinate system.

[0040] In this embodiment, the length of the solder foot 221 is 2 mm, the width of the solder foot 221 is 0.5 mm, and the height of the solder foot 221 is 0.5 mm.

[0041] This cavity filter 200 increases the contact points and fixing points between the side plate 220 and the PCB board 100 by setting multiple solder feet 221 on the surface of the side plate 220 facing away from the resonant body 210, thereby improving the reliability of the connection. By arranging the multiple solder feet 221 at intervals along the length direction of the resonant body 210, the welding stress is evenly distributed, reducing the damage to the structure caused by localized stress concentration and enhancing the durability of the overall structure.

[0042] like Figure 1 and Figure 2 As shown, in some embodiments, the resonant body is square.

[0043] like Figure 1 and Figure 2 As shown, in some embodiments, the solder foot 221 and the side plate 220 are integrally formed. This can improve the connection stability between the solder foot 221 and the side plate 220.

[0044] like Figure 1 and Figure 2As shown, in some embodiments, the side plate 220 has multiple first mounting holes 222, and the resonant body 210 has multiple second mounting holes 213. Both the first mounting holes 222 and the second mounting holes 213 extend along the width direction of the resonant body 210, with each first mounting hole 222 corresponding to one of the second mounting holes 213. A mounting screw passes through each of the first mounting holes 222 and the second mounting holes 213. Thus, on the one hand, the mounting screw enables a detachable connection between the side plate 220 and the resonant body 210, facilitating assembly and use; on the other hand, after the side plate 220 and the resonant body 210 are fastened, the resonant cavity 214 can be properly grounded, ensuring the electrical integrity of the resonant cavity 214.

[0045] like Figure 1 and Figure 2 As shown, in some embodiments, the resonant body 210 has a resonant cavity 214 that penetrates the first surface 211 and the second surface 212. Multiple tuning mechanisms 215 extend through the resonant body 210 along its height. The resonant body 210 also has an input mechanism 216 and an output mechanism 217. The input mechanism 216 is connected to one tuning mechanism 215, and the output mechanism 217 is connected to another tuning mechanism 215. Both the input mechanism 216 and the output mechanism 217 extend along the length of the resonant body 210. Thus, the resonant cavity 214 can be adjusted via the tuning mechanism 215, thereby changing the output filter response curve. The input mechanism 216 and the output mechanism 217 are used for soldering to the PCB board 100 to realize signal input and output.

[0046] Specifically, the tuning mechanism 215 may include: resonant pillars 2151 and tuning screws 2152. Multiple resonant pillars 2151 are arranged in a comb-like pattern within the resonant cavity 214. Multiple tuning screws 2152 are inserted through the resonant body 210. Each tuning screw 2152 corresponds one-to-one with a resonant pillar 2151. The input mechanism 216 is connected to one resonant pillar 2151, and the output mechanism 217 is connected to another resonant pillar 2151. Thus, by turning the tuning screws 2152, the depth at which the tuning screws 2152 are embedded in the resonant cavity 214 is adjusted, thereby fine-tuning the frequency of the resonant cavity 214 to achieve frequency selection of the filter, thereby changing the output filter response curve.

[0047] In this embodiment, there are seven resonant pillars 2151, and two adjacent resonant pillars 2151 are respectively disposed on two opposite inner surfaces of the resonant cavity 214.

[0048] The resonant post 2151 includes a connecting portion 2153 and a head 2154 connected together. The connecting portion 2153 is connected to the inner surface of the resonant cavity 214, and a tuning space is formed between the head and the tuning screw. For example, turning the tuning screw 2152 can adjust the gap between the tuning screw and the head.

[0049] Specifically, the input mechanism 216 may include a first glass insulator, one end of which is connected to the PCB board 100 and the other end of which is connected to a resonant post 2151 for receiving radio frequency signals. A first receiving hole is provided on the resonant post 2151 near the first glass insulator, and one end of the first glass insulator extends into the first receiving hole and is connected to the resonant post 2151.

[0050] Specifically, the output mechanism 217 may include a second glass insulator, one end of which is connected to the PCB board 100 and the other end of which is connected to a resonant post 2151 for outputting processed radio frequency signals. A second receiving hole is provided on the resonant post 2151 near the second glass insulator, and one end of the second glass insulator extends into the second receiving hole and is connected to the resonant post 2151.

[0051] like Figure 1 and Figure 2 As shown, in some embodiments, the resonant body 210 has a through hole communicating with the resonant cavity 214, and the tuning screw 2152 passes through the through hole. In this way, the tuning screw 2152 passes through the resonant body 210 through the through hole, so that the tuning screw 2152 can enter the resonant cavity 214 and finally selectively connect with the resonant post 2151.

[0052] like Figure 2 As shown in the embodiment of this application, an installation structure is also provided, including: a PCB board 100 and a cavity filter 200.

[0053] PCB board 100 has multiple pads; cavity filter 200 is soldered to the pads via solder feet 221.

[0054] The PCB board may or may not have mounting slots; there is no limitation on the PCB board.

[0055] When mounting slots can be provided on the PCB board, the assembly method of the above mounting structure may include: applying solder paste to the pads of the PCB board 100; placing the cavity filter 200 in the mounting slot 110 so that the solder feet 221 contact the solder paste on the pads, and bonding the four corners of the cavity filter 200 to the PCB board 100; placing the assembled PCB board 100 in a reflow soldering automatic line, and soldering the solder feet 221 to the pads.

[0056] The above description is merely a preferred embodiment of this application and does not constitute any limitation on this application. Any person skilled in the art can make many possible variations and modifications to the technical solution of this application, or modify it into equivalent embodiments, without departing from the scope of the technical solution of this application. Therefore, all equivalent changes made based on the shape, structure, and principle of this application without departing from the content of the technical solution of this application should be covered within the protection scope of this application.

Claims

1. A cavity filter, characterized in that: include: The resonant body has a first surface and a second surface that are arranged opposite to each other; The side plate has two plates, which are respectively connected to the first surface and the second surface of the resonant body. The side plate has a plurality of solder feet on the surface facing away from the resonant body. The plurality of solder feet are arranged at intervals along the length direction of the resonant body. The solder feet are in the shape of cuboids.

2. The cavity filter according to claim 1, characterized in that: The resonant body is square.

3. The cavity filter according to claim 1 or 2, characterized in that: The welding foot and the side plate are integrally formed.

4. The cavity filter according to claim 1, characterized in that: The side plate has a plurality of first mounting holes, and the resonant body has a plurality of second mounting holes. The first mounting holes and the second mounting holes extend along the width direction of the resonant body. The first mounting holes and the second mounting holes correspond one-to-one, and a mounting screw passes through the first mounting hole and the second mounting hole.

5. The cavity filter according to claim 1, characterized in that: The resonant body has a resonant cavity that penetrates the first surface and the second surface. Multiple tuning mechanisms are provided on the resonant body, and the tuning mechanisms extend along the height direction of the resonant body. The resonant body also has an input mechanism and an output mechanism. The input mechanism is connected to one of the tuning mechanisms, and the output mechanism is connected to another of the tuning mechanisms. Both the input mechanism and the output mechanism extend along the length direction of the resonant body.

6. The cavity filter according to claim 5, characterized in that: The tuning mechanism includes: resonant pillars and tuning screws. Multiple resonant pillars are arranged in a comb-like manner in the resonant cavity. Multiple tuning screws are inserted through the resonant body. Each tuning screw corresponds to one of the resonant pillars. The input mechanism is connected to one of the resonant pillars, and the output mechanism is connected to another resonant pillar.

7. The cavity filter according to claim 6, characterized in that: The resonant post includes a connecting part and a head that are connected together. The connecting part is connected to the inner surface of the resonant cavity, and the head forms a tuning space with the tuning screw.

8. The cavity filter according to claim 5, characterized in that: The resonant body has a through hole communicating with the resonant cavity, and the tuning screw passes through the through hole.

9. An installation structure, characterized in that: include: PCB board, with multiple solder pads; The cavity filter of claim 1 is soldered to the pad via the solder feet.