Three-dimensional digital acquisition device for micro space

Abstract

The utility model relates to a three-dimensional digital acquisition device for a micro space, and the device comprises a telescopic rod which is provided with a threaded column at one end part; the acquisition module comprises a lens module, an LED light module, a gooseneck pipe and a threaded socket; the LED light module is installed at one end of the lens module, the gooseneck pipe is installed at the other end of the lens module, and the threaded socket is connected with the end of the gooseneck pipe and is in threaded connection with the threaded column. The handle module is mounted at one end, away from the threaded column, of the telescopic rod; the handle module comprises a handle shell and an integrated circuit board arranged in the handle shell; one surface of the integrated circuit board is provided with a battery module, and the other surface is provided with an integrated control module; one end of the data line is connected with the acquisition module, and the other end is connected with the handle module. According to the utility model, three-dimensional digital acquisition can be carried out on a tiny space, the acquisition quality is improved, and the use is labor-saving.

Description

Technical Field

[0001] This application relates to the field of image acquisition equipment technology, and in particular to a three-dimensional digital acquisition device for micro-spaces. Background Technology

[0002] Common 3D digital acquisition devices are typically integrated into a host computer, such as drones, scanners, and panoramic cameras. These are usually quite large and only suitable for data acquisition in large, open spaces, making it difficult to access small, narrow, or semi-concealed spaces. Examples include the corners of buildings, the overlapping areas of eaves or pipes, details under the eaves and beams of ancient buildings, the interior of ceilings, gaps in brick and tile joints, and the recesses of caves, small artifact pits, or the inner walls of foundation pits at archaeological excavation sites. These areas are not only difficult to access but also suffer from insufficient lighting, resulting in a lack of detailed information in the final 3D models and other digital products. These details are precisely crucial for research in fields such as architectural surveying, historical site research, and archaeological excavation. Utility Model Content

[0003] Therefore, it is necessary to provide a three-dimensional digital acquisition device for micro-spaces, and its specific technical solution is as follows.

[0004] A three-dimensional digital acquisition device for micro-spaces, comprising:

[0005] The telescopic rod has a threaded post at one end;

[0006] The acquisition module includes a lens module, an LED light module, a gooseneck tube, and a threaded connector; the LED light module is installed at one end of the lens module, the gooseneck tube is installed at the other end of the lens module, and the threaded connector is connected to the end of the gooseneck tube and threadedly connected to the threaded post.

[0007] A handle module is installed at the end of the telescopic rod away from the threaded post; the handle module includes a handle housing and an integrated circuit board disposed inside the handle housing; a battery module is installed on one side of the integrated circuit board, and an integrated control module is installed on the other side;

[0008] The data cable connects to the acquisition module at one end and to the handle module at the other end.

[0009] Furthermore, two single rubber rings are connected to one side of the handle housing, and the single rubber rings are fitted onto the telescopic rod.

[0010] Furthermore, the data cable is fixed to the side of the telescopic rod by a double-ring rubber band; the double-ring rubber band includes a small ring and a large ring that are connected to each other, the small ring is fitted onto the data cable, and the large ring is fitted onto the telescopic rod.

[0011] Furthermore, it includes at least two double-ring rubber bands, one double-ring rubber band near the acquisition module and the other double-ring rubber band near the handle module.

[0012] Furthermore, the integrated circuit board has a second Type C interface at the end furthest from the first Type C interface.

[0013] Furthermore, a light dial is installed on the handle housing, and the light dial is connected to the integrated circuit board to control the brightness of the LED light module.

[0014] Furthermore, the handle housing surface is provided with control buttons; the control buttons are connected to the integrated circuit board and are used to control the lens module for shooting.

[0015] Furthermore, the surface of the handle housing is provided with an indicator light; the indicator light is connected to an integrated circuit board and is used to display the shooting status and remaining battery level.

[0016] Optionally, the lens module includes:

[0017] First lens housing;

[0018] The combined lens cap is installed on the end of the first lens housing away from the gooseneck tube;

[0019] The first central control circuit board is installed inside the first lens housing;

[0020] The first CMOS image sensor module is mounted on the first central control circuit board and is equipped with a visible light lens group;

[0021] A back-illuminated CMOS module is mounted on the first central control circuit board and equipped with a ToF lens group;

[0022] A VCSEL (Vertical Cavity Surface Emitting Laser) is mounted on the first central control circuit board and equipped with a laser lens assembly.

[0023] The first bottom housing is installed at the end of the first lens housing that is away from the top cover of the combined lens;

[0024] The third Type-C interface is connected to the first centralized control circuit board.

[0025] Optionally, the lens module includes:

[0026] Second lens housing;

[0027] The fisheye lens cap is installed on the end of the second lens housing away from the gooseneck tube;

[0028] The second central control circuit board is installed inside the second lens housing;

[0029] The second CMOS image sensor module is mounted on the second central control circuit board and is equipped with a fisheye lens assembly;

[0030] The second bottom housing is installed on the end of the second lens housing that is furthest from the fisheye lens cover;

[0031] The fourth Type-C interface connects to the second centralized control circuit board.

[0032] This invention provides a three-dimensional digital acquisition device for micro-spaces. The acquisition module is installed at the end of a telescopic rod. By adjusting the angle of the gooseneck tube and the length of the telescopic rod, the acquisition module can be extended into tiny, narrow, and semi-concealed spaces for acquisition. The angle of the acquisition module can be adjusted according to the specific spatial structure. An LED lighting module provides supplementary lighting in these spaces, enabling three-dimensional digital acquisition of minute spaces and improving the quality of details captured, thus filling the gaps in micro-space acquisition technology. By installing a handle module at the end of the telescopic rod away from the threaded post and connecting the handle module and the acquisition module with a data cable, a large counterweight is concentrated at the grip position of the telescopic rod, reducing the size and weight of the acquisition end. This not only facilitates entry into minute spaces but also makes it easier to hold and saves effort. Attached Figure Description

[0033] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0034] Figure 1 This is a schematic diagram of the data acquisition device;

[0035] Figure 2 This is an exploded view of the data acquisition device;

[0036] Figure 3 This is a front view of the integrated circuit board;

[0037] Figure 4 This is a schematic diagram of the back of the integrated circuit board;

[0038] Figure 5 This is a schematic diagram of a combined lens module.

[0039] Figure 6 A schematic diagram of a fisheye lens module;

[0040] Figure 7 This is one of the illustrations illustrating the usage scenarios for data collection.

[0041] Figure 8 This is one of the illustrations illustrating the usage scenarios for data collection.

[0042] Figure 9 This is a schematic diagram of a two-dimensional imaging method using a fisheye lens module;

[0043] Figure 10 This is a schematic diagram of a 3D imaging method using a combined lens module.

[0044] Explanation of reference numerals in the attached diagram: 1. Telescopic rod; 2. Acquisition module; 3. Handle module; 4. Data cable; 5. Combined lens module; 6. Fisheye lens module; 7. LED light module; 8. Gooseneck tube; 9. Threaded connector;

[0045] 11. Threaded column;

[0046] 31. Handle shell; 32. Integrated circuit board; 33. Battery module; 34. Integrated control module; 35. First Type-C interface; 36. Second Type-C interface; 37. Single rubber ring; 38. Light dial; 39. Control button; 301. Indicator light; 302. Wi-Fi module;

[0047] 41. Double-ring rubber band;

[0048] 51. First lens housing; 52. Combined lens top cover; 53. First central control circuit board; 54. First CMOS image sensor module; 55. Back-illuminated CMOS module; 56. VCSEL vertical cavity surface emitting laser; 57. First bottom housing; 58. Third Type-C interface;

[0049] 501. Visible light lens group; 502. ToF lens group; 503. Laser lens group;

[0050] 61. Second lens housing; 62. Fisheye lens top cover; 63. Second central control circuit board; 64. Second CMOS image sensor module; 65. Second bottom housing; 66. Fourth Type C interface; 67. Fisheye lens assembly. Detailed Implementation

[0051] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0052] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0053] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0054] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0055] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0056] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0057] Example

[0058] Reference Figure 1-2 As shown, this embodiment provides a three-dimensional digital acquisition device for micro-spaces, including a telescopic rod 1, an acquisition module 2, a handle module 3, and a data cable 4. One end of the telescopic rod 1 is provided with a threaded post 11, allowing for length adjustment via telescopic extension and retraction. The acquisition module 2 includes a lens module, an LED light module 7, a gooseneck tube 8, and a threaded connector 9. The LED light module 7 is mounted at one end of the lens module, and the gooseneck tube 8 is mounted at the other end. The threaded connector 9 connects to the end of the gooseneck tube 8 and is threadedly connected to the threaded post 11, allowing for the replacement of different lens modules as needed. By adjusting the bending angle of the gooseneck tube 8, the position and angle of the lens module can be adjusted, facilitating entry of the lens module into micro-spaces and adjusting the acquisition angle. The threaded connector 9, connected to the threaded post 11, allows for the disassembly of the acquisition module 2, enabling replacement with acquisition modules 2 equipped with different types of lens modules. It should be noted that in this embodiment, the telescopic rod 1 can be a commercially available finished product, and the threaded connector 9 can be a 1 / 4-inch standard interface for compatibility with existing finished accessories.

[0059] Specifically Figure 1 and Figure 2 As shown, the handle module 3 is installed at the end of the telescopic rod 1 away from the threaded post 11. The handle module 3 includes a handle housing 31 and an integrated circuit board 32 disposed within the handle housing 31; see reference... Figure 3-4 As shown, the integrated circuit board 32 has a battery module 33 mounted on one side and an integrated control module 34 mounted on the other side. The battery module 33 powers the LED light module 7 and lens module, while the integrated control module provides radial control over the lens module's shooting capabilities and the LED light module 7's brightness and on / off status. The handle module 3 is mounted on the end of the telescopic rod 1 furthest from the threaded post 11, reducing the weight and size of the acquisition module 2 and facilitating its entry into confined spaces. Concentrating the main counterweight on the end of the telescopic rod 1 furthest from the threaded post 11 makes it easier for the user to hold, reducing effort during operation.

[0060] Specifically, one end of the data cable 4 is connected to the acquisition module 2, and the other end is connected to the handle module 3. Data, signals, and energy are transmitted between the acquisition module 2 and the handle module 3 via the data cable 4. The data cable 4 can be connected to the acquisition module 2 or the handle module 3 using a Type-C interface or other types of interfaces.

[0061] This embodiment provides a three-dimensional digital acquisition device for micro-spaces. The acquisition module 2 is installed at the end of the telescopic rod 1. By adjusting the angle of the gooseneck tube 8 and the length of the telescopic rod 1, the acquisition module 2 can be extended into tiny, narrow, and semi-concealed spaces for acquisition. The angle of the acquisition module 2 can be adjusted according to the specific spatial structure. An LED light module 7 provides supplementary lighting in these spaces, enabling three-dimensional digital acquisition of micro-spaces and improving the quality of details acquired, thus filling the blind spots in micro-space acquisition technology. By installing the handle module 3 at the end of the telescopic rod 1 away from the threaded post 11 and connecting the handle module 3 and the acquisition module 2 with a data cable 4, a large counterweight is concentrated at the gripping position of the telescopic rod 1, reducing the size and weight of the acquisition end. This not only facilitates entry into micro-spaces but also makes it easier to hold and saves effort.

[0062] Specifically, two single rubber rings 37 are connected to one side of the handle housing 31, and the single rubber rings 37 are fitted onto the telescopic rod 1. The single rubber rings 37 are used to install the handle housing 31 onto the telescopic rod 1, which facilitates the assembly and disassembly of the telescopic rod 1 and the handle module 3.

[0063] Specifically, the data cable 4 is fixed to the side of the telescopic rod 1 by a double-ring rubber band 41. The double-ring rubber band 41 includes a small ring and a large ring connected to each other. The small ring is fitted onto the data cable 4, and the large ring is fitted onto the telescopic rod 1. During passage, the double rubber bands fix the data cable 4 to the side of the telescopic rod 1, facilitating the assembly and disassembly of the data cable 4 and the telescopic rod 1.

[0064] Specifically, it includes at least two double-ring rubber bands 41. One double-ring rubber band 41 is close to the acquisition module 2, and the other double-ring rubber band 41 is close to the handle module 3. When the telescopic rod 1 extends a long distance, one or more double-ring rubber bands 41 can be added in the middle section. The double rubber band fixing method ensures the stability of the data cable 4, and the data cable 4 can also bend and extend accordingly when the telescopic rod 1 extends and retracts.

[0065] Specifically, the integrated circuit board 32 is connected to a first Type C interface 35 at one end and a second Type C interface 36 at the other end; it can transmit data and control signals through a data cable via the first Type C interface 35, and can be charged by an external charger via the second Type C interface 36.

[0066] Specifically, a light dial 38 is installed on the handle housing. The light dial 38 is connected to the integrated circuit board 32 and is used to control the brightness of the LED light module 7. By turning the light dial 38, the brightness of the LED light module 7 can be adjusted to adapt to the lighting conditions of the actual shooting environment and improve the quality of the shooting results.

[0067] Specifically, the surface of the handle housing is provided with a control button 39; the control button 39 is connected to the integrated circuit board 32 and is used to control the lens module for shooting. The control button 39 can control the lens module for shooting and control the switch of the handle module 3.

[0068] Specifically, the surface of the handle housing is provided with an indicator light 301; the indicator light 301 is connected to the integrated circuit board 32 and is used to display the shooting status and battery level.

[0069] Specifically, a Wi-Fi module 302 is also installed on the integrated circuit board 32. This Wi-Fi module 302 facilitates data transmission with an external receiver. For example, the handle module 3 can send data such as light signals collected by the lens module to the receiver, and receive command data from the receiver's application. The external receiver can be a mobile phone, tablet computer, or other similar device.

[0070] Reference Figure 2 As shown, in this embodiment, the lens module is divided into two types: a combined lens module 5 and a fisheye lens module 6. The two lenses can be replaced according to actual acquisition needs through the detachable connection between the threaded post 11 and the threaded socket 9.

[0071] Specifically, refer to Figure 5 As shown, the combined lens module 5 includes:

[0072] First lens housing 51;

[0073] The combined lens top cover 52 is installed on the end of the first lens housing 51 away from the gooseneck tube 8;

[0074] The first centralized control circuit board 53 is installed inside the first lens housing 51;

[0075] The first CMOS image sensor module 54 is mounted on the first central control circuit board 53 and is equipped with a visible light lens group 501.

[0076] A back-illuminated CMOS module 55 is mounted on the first central control circuit board 53 and equipped with a ToF lens group 502;

[0077] A VCSEL (Vertical Cavity Surface Emitting Laser) 56 is mounted on the first central control circuit board 53 and equipped with a laser lens group 503.

[0078] The first bottom housing 57 is installed on the end of the first lens housing 51 that is away from the combined lens top cover 52;

[0079] The third Type-C interface 58 is connected to the first centralized control circuit board 53.

[0080] Three staggered lenses are provided on the top cover 52 of the combined lens. The three lenses correspond to the first CMOS image sensor module 54, the back-illuminated CMOS module 55, and the VCSEL vertical cavity surface emitting laser 56, respectively.

[0081] Specifically, refer to Figure 6 As shown, the fisheye lens module 6 includes:

[0082] Second lens housing 61;

[0083] The fisheye lens cap 62 is installed on the end of the second lens housing 61 away from the gooseneck tube 8;

[0084] The second central control circuit board 63 is installed inside the second lens housing 61;

[0085] The second CMOS image sensor module 64 is mounted on the second central control circuit board 63 and is equipped with a fisheye lens group 67;

[0086] The second bottom housing 65 is installed on the end of the second lens housing 61 that is away from the fisheye lens cover;

[0087] The fourth Type-C interface 66 is connected to the second centralized control circuit board 63.

[0088] Instructions for use: Adjust the telescopic rod 1 to a suitable length according to the usage scenario, bend the gooseneck tube 8 to a suitable angle, and hold the telescopic rod 1 to extend the acquisition module 2 into the small space where data needs to be collected, for example... Figure 7-8 The ancient buildings shown are located between overlapping eaves, between upper and lower beams, and at corners, etc.

[0089] Imaging methods after acquisition are divided into two-dimensional imaging and three-dimensional imaging. Both the fisheye lens module 6 and the combined lens module 5 can achieve two-dimensional imaging. The two-dimensional imaging process is illustrated below using the fisheye lens module 6 as an example:

[0090] S101. Collect visible light information reflected by the object to be acquired through the fisheye lens module 6;

[0091] S102. The collected optical signal is transmitted to the control handle module 3 via the data cable 4;

[0092] S103. The collected optical signal is sent to an external receiver via the Wi-Fi module 302;

[0093] S104. The receiving application generates an image of the acquired object based on the received optical signal.

[0094] Three-dimensional imaging is acquired using the combined lens module 5, and the process is as follows:

[0095] S201: The VCSEL vertical cavity surface-emitting laser 56 emits a laser towards the object to be acquired.

[0096] S202: Collect the laser signal reflected by the object to be acquired through the ToF lens group 502.

[0097] S203: While acquiring laser signals, the visible light signals reflected by the object to be acquired are collected through a visible light lens.

[0098] S204: The light signals collected by the two camera units are transmitted to the handle module 3 via the data cable 4.

[0099] S205: The two sets of optical signals collected are sent to the receiving end via the WiFi module 302.

[0100] S206: The receiving application extracts depth information based on the received laser signal and generates a local three-dimensional spatial model of the object being acquired.

[0101] S207: The receiving application generates image information based on the received visible light signal and colors the generated three-dimensional spatial model of the acquired object.

[0102] S208: The receiving application generates a local three-dimensional model of the acquired object based on the two continuously received optical signals.

[0103] In this embodiment, when collecting data inside the building ceiling, the acquisition module 2 can be inserted into the ceiling through the gap on the side of the ceiling. A fisheye lens module 6 is used to take wide-angle photos or videos, and a combined lens module 5 is used to collect three-dimensional data.

[0104] When collecting data on the details of ancient buildings, the collection module 2 can be inserted between overlapping eaves to collect appearance data of the underside of the upper eaves and the upper side of the lower eaves. Alternatively, the collection module 2 can be inserted between the top surfaces of the beams and columns of the roof frame to collect appearance data of the underside of the upper beam, the upper side of the lower beam, and the small triangular area of ​​the beam-column roof.

[0105] When collecting data at an archaeological site, the collection module 2 can be inserted into small pits, such as post pits in house foundations, narrow and deep pits where small artifacts have been unearthed, and narrow and long trenches, where the openings are narrow and the light is insufficient.

[0106] During the data acquisition process in the aforementioned different scenarios, supplementary lighting can be provided by controlling the brightness of the LED light module 7.

[0107] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0108] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A three-dimensional digital acquisition device for micro-spaces, characterized in that, include: The telescopic rod has a threaded post at one end; The acquisition module includes a lens module, an LED light module, a gooseneck tube, and a threaded connector; the LED light module is installed at one end of the lens module, the gooseneck tube is installed at the other end of the lens module, and the threaded connector is connected to the end of the gooseneck tube and threadedly connected to the threaded post. A handle module is installed at the end of the telescopic rod away from the threaded post; the handle module includes a handle housing and an integrated circuit board disposed inside the handle housing; a battery module is installed on one side of the integrated circuit board, and an integrated control module is installed on the other side; The data cable connects to the acquisition module at one end and to the handle module at the other end.

2. The three-dimensional digital acquisition device for micro-spaces according to claim 1, characterized in that, Two single rubber rings are connected to one side of the handle housing, and the single rubber rings are fitted onto the telescopic rod.

3. The three-dimensional digital acquisition device for micro-spaces according to claim 1, characterized in that, The data cable is fixed to the side of the telescopic rod by a double-ring rubber band; the double-ring rubber band includes a small ring and a large ring that are connected to each other, the small ring is fitted onto the data cable, and the large ring is fitted onto the telescopic rod.

4. A three-dimensional digital acquisition device for micro-spaces according to claim 3, characterized in that, It includes at least two double-ring rubber bands, one double-ring rubber band near the acquisition module and the other double-ring rubber band near the handle module.

5. A three-dimensional digital acquisition device for micro-spaces according to claim 1, characterized in that, The integrated circuit board is connected to a first Type-C interface at one end and a second Type-C interface at the other end.

6. A three-dimensional digital acquisition device for micro-spaces according to claim 1, characterized in that, A light dial is installed on the handle housing, and the light dial is connected to the integrated circuit board to control the brightness of the LED light module.

7. A three-dimensional digital acquisition device for micro-spaces according to claim 1, characterized in that, The handle housing has a control button on its surface; the control button is connected to the integrated circuit board and is used to control the lens module for shooting.

8. A three-dimensional digital acquisition device for micro-spaces according to claim 1, characterized in that, The handle housing has an indicator light on its surface; the indicator light is connected to an integrated circuit board and is used to display the shooting status and battery level.

9. A three-dimensional digital acquisition device for micro-spaces according to claim 1, characterized in that, The lens module includes: First lens housing; The combined lens cap is installed on the end of the first lens housing away from the gooseneck tube; The first central control circuit board is installed inside the first lens housing; The first CMOS image sensor module is mounted on the first central control circuit board and is equipped with a visible light lens group; A back-illuminated CMOS module is mounted on the first central control circuit board and equipped with a ToF lens group; A VCSEL (Vertical Cavity Surface Emitting Laser) is mounted on the first central control circuit board and equipped with a laser lens assembly. The first bottom housing is installed at the end of the first lens housing that is away from the top cover of the combined lens; The third Type-C interface is connected to the first centralized control circuit board.

10. A three-dimensional digital acquisition device for micro-spaces according to claim 1, characterized in that, The lens module includes: Second lens housing; The fisheye lens cap is installed on the end of the second lens housing away from the gooseneck tube; The second central control circuit board is installed inside the second lens housing; The second CMOS image sensor module is mounted on the second central control circuit board and is equipped with a fisheye lens assembly; The second bottom housing is installed on the end of the second lens housing that is furthest from the fisheye lens cover; The fourth Type-C interface connects to the second centralized control circuit board.

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