Jet flow liquid cooling radiator

Abstract

The utility model provides a jet liquid cooling radiator, relates to the technical field of cooling of electronic components, and is used for realizing good isolation of a liquid working medium and an electronic element while realizing cooling of a chip by the liquid working medium, simplifying a complex assembly process of a jet module and improving usability. According to the scheme, the device comprises an injection module which is provided with a cooling working medium inlet and is used for injecting a liquid cooling working medium towards the surface of an electronic component; the side, facing the self-locking mechanism, of the RING ring is provided with a first open groove, and the first open groove is used for containing a self-locking piece of the self-locking mechanism; the printed circuit board is used for mounting electronic components; and the self-locking mechanism is used for pushing the self-locking piece to be embedded into the first open groove of the RING ring and the second open groove of the injection module at the same time, so that axial locking of the injection module and the RING ring is achieved, and / or axial unlocking of the injection module and the RING ring is achieved through the self-locking piece.

Description

Technical Field

[0001] This application relates to the field of cooling technology for electronic components, and more particularly to a jet liquid-cooled heat sink. Background Technology

[0002] like Figure 1 As shown, with the continuous increase in chip power consumption and power density, such as Figure 2 As shown, if the chip uses Lidded packaging, the thermal resistance of the heat dissipation medium material (also known as thermal interface material, TIM)1 and TIM2 is superimposed. The thermal resistance of TIM1 & TIM2 accounts for 30-40% of the system thermal resistance. Reducing the thermal resistance of TIM can directly improve the system heat dissipation capacity. By eliminating TIM1 and TIM2 and using water jets directly to the surface of the chip die, computing performance and density can be improved, and energy consumption can be reduced. It can also solve the problem of TIM delamination caused by the difference in the coefficient of thermal expansion (CTE) of various packaged components and the bending of electronic component packages due to temperature changes.

[0003] Therefore, jet cooling can be used to improve heat dissipation. Jet cooling utilizes a high-speed jet of liquid working fluid to cool the electronic chip. The high flow rate of the jet impacting the heat source results in excellent heat exchange, and the evaporation of the liquid on the heat source surface also carries away a significant amount of heat. Since the liquid working fluid is directly sprayed onto the chip surface for heat dissipation, good isolation between the jet module and the electronic components is necessary.

[0004] For jet cooling sealing scenarios, existing technical solutions achieve cavity sealing by welding the jet heat sink to a ring or by using a compression sealing ring with the heat sink and substrate. Heat is then carried away by the flow of liquid jet within the sealed space. However, sealing by compressing the sealing ring with the heat sink and substrate requires multiple screws for fixation, making maintenance cumbersome. Furthermore, sealing by welding the heat sink to a ring is not easy to assemble and disassemble. Summary of the Invention

[0005] This application provides a jet liquid cooling heat sink, which can achieve good isolation between the liquid working medium and electronic components while cooling the chip with liquid working medium, and simplify the complex assembly process of the jet module and improve ease of use.

[0006] To achieve the above objectives, the embodiments of this application provide the following technical solutions:

[0007] In a first aspect, embodiments of this application provide a jet liquid-cooled heat sink for fluid cooling of electronic components mounted on a printed circuit board, comprising: a jet module having a cooling medium inlet, the jet module being used to jet a liquid cooling medium toward the surface of the electronic component; a printed circuit board for mounting the electronic component; and a ring ring surrounding the electronic component, the ring ring having one or more first slots for accommodating a self-locking member of a self-locking mechanism; the jet module having one or more second slots opposite to the first slots on the ring ring, the second slots being used to accommodate the self-locking member of the self-locking mechanism; and the self-locking mechanism being used to embed a portion of the self-locking member within the first slot of the ring ring and another portion of the self-locking member within the second slot of the jet module, and / or to disengage the self-locking member from the first slot or the second slot.

[0008] The jet liquid cooling radiator provided in this application employs a self-locking mechanism between the jet module and the ring. This mechanism can push a self-locking component inward to embed a portion of the self-locking component into a first slot of the ring and another portion into a second slot of the jet module, thereby axially locking the jet module and the ring, and / or axially unlocking the jet module and the ring by disengaging the self-locking component from either the first or second slot. This design facilitates disassembly; during use, the jet module can be disassembled when the self-locking component is in an unlocked state. In operational scenarios, after installing the jet module, the self-locking component, under spring action, can self-lock the module, simplifying the installation and disassembly of the jet liquid cooling radiator. Furthermore, the jet module sprays liquid cooling fluid towards the surface of the electronic components; therefore, this design simplifies the complex assembly process of the jet module while simultaneously achieving liquid cooling of the chip, improving usability.

[0009] In one possible implementation of this application, the self-locking mechanism is used to apply a first force to the self-locking member so that the self-locking member moves from the second slot toward the first slot, such that a portion of the self-locking member is embedded in the first slot of the RING ring and another portion is embedded in the second slot of the injection module.

[0010] When a portion of the self-locking member is embedded in the first slot of the RING ring and another portion is embedded in the second slot of the injection module, the self-locking mechanism is used to release the first force applied to the self-locking member, so that the self-locking member disengages from the first slot and is located in the second slot.

[0011] In one possible implementation of this application, the self-locking mechanism includes a sleeve, an elastic element, and a self-locking element located within a second slot of the spray module. The second slot is positioned on the spray module and corresponds to the position of the first slot on the ring. The self-locking element can move within the second slot under the action of an external force. One end of the elastic element is connected to the spray module, and the other end is connected to the sleeve. The sleeve can move up and down along the height direction of the jet liquid cooler under the action of the elastic element, such that a portion of the self-locking element is embedded in the first slot of the ring and another portion is embedded in the second slot of the spray module, thus being locked; and / or, causing the self-locking element to move outward from the first slot, disengaging from the first slot.

[0012] In one possible implementation of this application, the elastic element is a spring or a compression spring, the self-locking element is a ball, and the cross-sectional shape of the slot of the RING ring is determined by the shape of the self-locking element.

[0013] In one possible implementation of this application, the sleeve has a pushing component disposed on the side of the sleeve facing the RING ring, the pushing component being used to apply a force to the self-locking member so that the self-locking member is embedded in a first slot of the RING ring.

[0014] In one possible implementation of this application, the self-locking mechanism includes: a swing arm, an elastic element, and a self-locking member. The self-locking member passes through a second slot in the spray module, and its first end corresponds to the position of the first slot in the ring. The swing arm is fixed to the spray module by the elastic element. The swing arm can swing towards or away from the second end of the self-locking member under the action of the elastic element, thereby moving the self-locking member toward the first slot so that its first end is embedded inward into the first slot of the ring; and / or, thereby moving the self-locking member away from the first slot so that its first end is located outside the slot of the ring.

[0015] In one possible implementation of this application, the elastic element is a torsion spring.

[0016] In one possible implementation of this application, the electronic device is a chip, and the spraying module has one or more nozzles facing the chip die surface, with the position of any nozzle on the spraying module corresponding to a hot spot on the chip die surface.

[0017] In one possible implementation of this application, a printed circuit board has a substrate on which electronic components are located.

[0018] In one possible implementation of this application, the jet liquid cooling radiator further includes a sealing ring disposed between the RING ring and the jet module, the sealing ring being embedded in the jet module and in contact with the RING ring. Attached Figure Description

[0019] Figure 1 This is a schematic diagram illustrating the changes in chip power consumption and power density;

[0020] Figure 2 This is a schematic diagram of Lidded and Lidless package structures;

[0021] Figure 3 This is a schematic diagram of the structure of a jet liquid-cooled heat sink provided in an embodiment of this application;

[0022] Figure 4 A schematic diagram showing the self-locking mechanism in the unlocked state of the jet liquid cooling radiator provided in the embodiments of this application;

[0023] Figure 5 A schematic diagram showing the self-locking mechanism in the locked state of the jet liquid cooling radiator provided in the embodiments of this application;

[0024] Figure 6 This is a schematic diagram of another jet liquid-cooled heat sink provided in an embodiment of this application. Detailed Implementation

[0025] The technical solutions of the embodiments of this application are described below with reference to the accompanying drawings. In the description of the embodiments of this application, the terminology used in the following embodiments is for the purpose of describing specific embodiments only and is not intended to limit the application. As used in the specification and appended claims of this application, the singular expressions "a," "the," "the," "the," and "this" are intended to also include expressions such as "one or more," unless the context clearly indicates otherwise. It should also be understood that in the following embodiments of this application, "at least one" and "one or more" refer to one or more (including two). The term "and / or" is used to describe the relationship between related objects, indicating that three relationships can exist; for example, A and / or B can represent: A alone, A and B simultaneously, or B alone, where A and B can be singular or plural. The character " / " generally indicates that the preceding and following related objects are in an "or" relationship.

[0026] References to "one embodiment" or "some embodiments" in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized. The term "connection" includes direct connections and indirect connections, unless otherwise stated. "First" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated.

[0027] In the embodiments of this application, the words "exemplarily" or "for example" are used to indicate examples, illustrations, or explanations. Any embodiment or design described as "exemplarily" or "for example" in the embodiments of this application should not be construed as being more preferred or advantageous than other embodiments or design solutions. Specifically, the use of the words "exemplarily" or "for example" is intended to present the relevant concepts in a specific manner.

[0028] like Figure 1 It can be seen that as chip power consumption and power density continue to increase, if the chip adopts such... Figure 2 The chip lidded package structure shown in (a) or using a method such as Figure 2 The chip lidless package structure shown in (b) has its heat dissipation occurring through TIM material and a heat sink cover, with thermal resistance accounting for more than 30% of the overall link thermal resistance. To improve heat dissipation, jet cooling is employed. Since the liquid working fluid is directly sprayed onto the chip surface for heat dissipation, good isolation between the jet module and the electronic components is required.

[0029] Existing technical solutions achieve cavity sealing by welding a jet heat sink to a ring or by using a compression sealing ring with the heat sink and substrate, with heat being carried away by the flow of liquid jets within the sealed space. However, sealing via a compression sealing ring with the heat sink and substrate requires multiple screws for fixation, making maintenance cumbersome; furthermore, sealing via welding the heat sink to a ring is not easy to assemble and disassemble.

[0030] like Figure 3 As shown, Figure 3 This application provides a structure for a jet liquid cooling heat sink, which is used for fluid cooling of electronic components (such as chips) mounted on a printed circuit board, including:

[0031] The injection module 301 has a cooling medium inlet 3011 and is used to spray liquid cooling medium toward the surface of the electronic component (such as the die side of a chip).

[0032] A printed circuit board (PCB) 303 is provided for mounting electronic components and a ring ring arranged around the electronic components. The ring ring has one or more first slots for accommodating the self-locking element of the self-locking mechanism. The injection module has one or more second slots arranged opposite to the first slots on the ring ring 302 for accommodating the self-locking element 3043 of the self-locking mechanism.

[0033] Self-locking mechanism 304 is used to axially lock or unlock the injection module 301 and the ring ring 302 through self-locking component 3043.

[0034] Specifically, the self-locking mechanism 304 is used to embed a portion of the self-locking member 3043 into the first slot of the RING ring and another portion of the self-locking member into the second slot of the spray module 301 to axially lock the spray module 301 and the RING ring 302, and / or to disengage the self-locking member 3043 from the first slot or the second slot, thereby axially unlocking the spray module 301 and the RING ring 302.

[0035] For example, liquid cooling media mainly include water, mineral oil, and fluorinated liquids.

[0036] It is understood that the spraying module 301 is also located on the printed circuit board 303. The spraying module 301 has a cavity, and the ring 302 is located within the cavity of the spraying module 301, and the ring 302 is arranged around the electronic components. The ring 302 is pressed onto the printed circuit board 303. It is understood that the ring 302 and the electronic components are mounted on the substrate located on the printed circuit board 303.

[0037] Specifically, when a portion of the self-locking member 3043 is embedded in the first slot 3021 and another portion is embedded in the second slot on the injection module 301, the injection module 301 and the ring ring 302 are axially locked. When the self-locking member 3043 is not located in the first slot 3021, for example, when the self-locking member 3043 is only embedded in the second slot on the injection module 301, the injection module 301 and the ring ring 302 are axially unlocked. Alternatively, when the self-locking member 3043 is not located in the second slot 30121 but not in the first slot 3021, for example, when the self-locking member 3043 is only embedded in the first slot 3021 on the ring ring, the injection module 301 and the ring ring 302 are axially unlocked.

[0038] The self-locking mechanism 304 provided in this embodiment is used to apply a force to the self-locking member 3043 located in the second slot after the spray module 301 and the RING ring 302 are installed. This causes the self-locking member 3043 to move from the second slot 30121 to the first slot 3021 until a part of the self-locking member 3043 is embedded in the first slot 3021 and another part is embedded in the second slot 30121 on the spray module 301. This allows the self-locking member 3043 to connect the spray module 301 and the RING ring as a connector, thereby achieving axial locking of the spray module 301 and the RING ring. In the scenario of dismantling the spray module 301, the self-locking mechanism 304 can cancel the force applied to the self-locking member 3043. Since the force applied to the self-locking member 3043 is gone, the self-locking member 3043 can move from the first slot 3021 to the second slot 30121 until the self-locking member is completely disengaged from the first slot 3021, thereby realizing the axial unlocking of the spray module 301 and the RING ring 302.

[0039] In another possible implementation of this application, a force is applied to the self-locking member 3043 located in the first slot 3021 by the self-locking mechanism 304, so that the self-locking member 3043 moves from the first slot 3021 to the second slot 30121 until a part of the self-locking member 3043 is embedded in the first slot 3021 and the other part is embedded in the second slot 30121 on the spray module 301. Thus, the self-locking member 3043 can connect the spray module 301 and the RING ring as a connector to achieve axial locking of the spray module 301 and the RING ring. In the scenario of dismantling the spray module 301, the self-locking mechanism 304 can cancel the force applied to the self-locking member 3043. Since the force applied to the self-locking member 3043 is gone, the self-locking member 3043 can move from the second slot 30121 into the first slot 3021 until the self-locking member is completely disengaged from the second slot and located in the first slot, or the self-locking member 3043 is disengaged from both the first slot 3021 and the second slot 30121, thereby realizing the axial unlocking of the spray module 301 and the RING ring.

[0040] Understandably, the cooling medium inlet 3011 is used for the liquid cooling medium to flow into the injection module 301. Optionally, the injection module 301 also includes a cooling medium outlet 3012. The cooling medium can flow out of the injection module 301 through the cooling medium outlet 3012.

[0041] It is understandable that both the ring 302 and the injection module 301 are mounted on the printed circuit board 303, and the ring 302 is located inside the injection module 301. For example... Figures 3-6 As shown, the injection module 301 includes a top module 3011, a first support portion 3012, and a second support portion. The top module 3011, the first support portion 3012, and the second support portion form a receiving cavity for accommodating the ring.

[0042] The top module 3011 is located above and connected to the first support portion 3012 and the second support portion. The top module 3011 has a cooling medium inlet 3011 and a cooling medium outlet 3012. One or more nozzles are located on the side of the top module 3011 facing the PCB board. A gap exists between the ring ring 302 and the first and second support portions. A first slot is formed on the side of the ring ring closest to the first and second support portions, and a second slot is formed on the first and second support portions at positions corresponding to the first slots. The second slot is used to accommodate a self-locking component 3043. It is understood that when the self-locking component is located in the second slot and not in the first slot, the spray module 301 and the ring ring 302 are axially unlocked.

[0043] The jet liquid cooling radiator provided in this application employs a self-locking mechanism between the jet module and the ring. This mechanism can push a self-locking component inward to embed a portion of the self-locking component into a first slot of the ring and another portion into a second slot of the jet module, thereby axially locking the jet module and the ring, and / or axially unlocking the jet module and the ring by disengaging the self-locking component from either the first or second slot. This design facilitates disassembly; during use, the jet module can be disassembled when the self-locking component is in an unlocked state. In operational scenarios, after installing the jet module, the self-locking component, under spring action, can self-lock the module, simplifying the installation and disassembly of the jet liquid cooling radiator. Furthermore, the jet module sprays liquid cooling fluid towards the surface of the electronic components; therefore, this design simplifies the complex assembly process of the jet module while simultaneously achieving liquid cooling of the chip, improving usability.

[0044] In one possible implementation of this application, the jet liquid cooling radiator further includes a sealing ring 306, which is embedded in the jet module. The sealing ring 306 is disposed between the jet module 301 and the ring 302. For example, the jet module 301 also has a third slot for accommodating the sealing ring 306. Because the jet module 301 and the ring 302 are close together, the sealing ring is compressed by the jet module 301 and the ring 302 to ensure reliable sealing of the system. The radial reaction force due to the compression of the sealing ring 306 ensures automatic centering of the jet module 301 relative to the ring. Combined with the radial sealing ring, assembly stress and external impact loads are isolated to achieve reliable sealing. For example, the sealing ring can be an O-ring, which is a rubber sealing ring with a circular cross-section.

[0045] In one possible implementation of this application, the self-locking mechanism 304 is used to apply a first force to the self-locking member 3043 so that the self-locking member 3043 moves from the second slot toward the first slot, such that a portion of the self-locking member 3043 is embedded in the first slot of the RING ring 302 and another portion is embedded in the second slot of the spray module 301.

[0046] When a portion of the self-locking member 3043 is embedded in the first slot of the RING ring 302 and another portion is embedded in the second slot of the spray module 301, the self-locking mechanism 304 is used to release the first force applied to the self-locking member 3043 so that the self-locking member 3043 disengages from the first slot and is located in the second slot.

[0047] In one possible implementation of this application, such as Figure 4 and Figure 5 As shown, the self-locking mechanism 304 includes a sleeve 3041, an elastic element 3044, and a self-locking element 3043. As an example, the self-locking element 3043 is located within the second slot 30121 of the injection module 301 and corresponds to the position of the first slot 3021 on the ring 302. It is understood that the second slot 30121 can be a slot penetrating the first support portion / second support portion. The cross-sectional shape of the second slot 30121 is determined by the shape of the self-locking element 3043. For example, if the self-locking element 3043 is a steel column, then the cross-sectional shape of the second slot 30121 is circular and precisely accommodates the self-locking element, making it difficult for the self-locking element 3043 to detach from the second slot 3021. Optionally, a limiting portion is provided on the side of the second slot 30121 away from the ring 302 to prevent the self-locking element 3043 from detaching from the second slot 3021. Optionally, the first slot 3021 can be a slot that does not penetrate the ring 302.

[0048] One end of the elastic element is connected to the injection module 302, and the other end of the elastic element is connected to the sleeve. The sleeve 3041 can move up and down along the height direction of the jet liquid cooling radiator under the action of the elastic element, so that a part of the self-locking member is embedded in the first slot of the RING ring and the other part is embedded in the second slot of the injection module in a locked state, thereby realizing the axial locking of the injection module 301 and the RING ring 302; and / or, so that the self-locking member moves outward from the first slot of the RING ring until it disengages from the first slot. At this time, the self-locking member 3043 can be considered to be in an unlocked state, thereby making the axial unlocking of the injection module 301 and the RING ring 302. Alternatively, if the self-locking member 3043 is initially located entirely within the first slot but within the second slot, in order to achieve axial locking of the injection module 301 and the RING ring 302, a sleeve 3041 can be used to apply a pulling force to the self-locking member 3043 so that the self-locking member 3043 moves from the first slot to the second slot, such that a portion of the self-locking member is embedded in the first slot of the RING ring and the other portion is embedded in the second slot of the injection module, thus being in a locked state.

[0049] Specifically, such as Figure 4 As shown, Figure 4In the jet liquid cooling radiator shown, the self-locking component 3043 is in the unlocked state, i.e., the unlocked state. When it is necessary to use the self-locking component 3043 to achieve axial locking of the jet module 301 and the RING ring, the sleeve can be pressed down towards the printed circuit board to the design limit. When the sleeve 3041 moves to the design limit, the sleeve 3041 can apply a force to the self-locking component 3043 so that the self-locking component 3043 moves from the second slot towards the first slot until the self-locking component 3043 is embedded in the first slot of the RING ring and the second slot of the jet module and is in a locked state. After the jet module is installed in the assembly scenario, the self-locking component can achieve self-locking of the module under the action of the spring.

[0050] In disassembly scenarios, such as Figure 4 As shown, the sleeve 3041 can be lifted upwards so that the sleeve 3041 moves upwards under the action of the elastic member 3044. In this scenario, since the sleeve 3041 can no longer apply force to the self-locking member 3043, the self-locking member 3043 will move outwards from the first slot of the RING ring until it disengages from the first slot and is located in the second slot. Thus, when the self-locking member is in an unlocked state, the spray module can be disassembled.

[0051] In the embodiments of this application, the elastic element is a spring or a compression spring.

[0052] For example, such as Figure 4 or Figure 5 As shown, the self-locking element 3043 is a ball bearing, and the cross-sectional shape of the first slot of the ring is determined by the shape of the self-locking element 3043. For example, the shape of a ball bearing is usually circular, so the cross-sectional shape of the first slot of the ring can also be circular.

[0053] In one possible implementation of this application, the sleeve 3041 has a pushing component 3042. Specifically, the pushing component 3042 is disposed on the side of the sleeve 3041 facing the ring, and the pushing component 3042 is used to apply a force to the self-locking member 3043 so that the self-locking member 3043 is embedded in the first slot of the ring. Specifically, when the sleeve 3041 moves downward, the pushing component 3042 also moves downward along with the sleeve 3041. At this time, the distance between the pushing component 3042 and the self-locking component 3043 becomes smaller and smaller. As the pushing component 3042 gradually contacts the self-locking component 3043, as the pushing component 3042 continues to move downward, the pushing component can apply a force to the self-locking component 3043 to move into the slot, so that the self-locking component 3043 gradually moves from the initial position into the first slot 3021. When the sleeve 3041 moves to the design limit, the pushing component 3041 is now opposite to the self-locking component 3043. At this time, under the force applied by the pushing component 3042, the self-locking component 3043 is partially embedded in the first slot 3021 of the RING ring 302, thereby realizing the axial locking of the injection module 301 and the RING ring 302.

[0054] It is understandable that, such as Figure 5 As shown, when the sleeve 3041 moves upward, the pushing component 3044 also moves upward with the sleeve 3041. Therefore, the pushing component 3044 cannot continue to apply a force to the self-locking member 3043 to move into the slot. Thus, the self-locking member 3043 can move outward from the first slot 3021 to the second slot 30121, that is, it is located in the spray module 301. When the self-locking member 3043 disengages from the first slot 321 and is located in the second slot 30121, the self-locking member 3043 is in the unlocked state. At this time, the spray module 301 and the RING ring 302 are axially unlocked.

[0055] As an example, the pusher component 3044 may be a protrusion provided on the sleeve 3041.

[0056] As an example, the limiting protrusion 3044 can be integrally formed with the sleeve 3041, but this application embodiment does not limit this.

[0057] In one possible implementation of this application, such as Figure 6 As shown, the self-locking mechanism 304 includes a swing arm, an elastic element, and a self-locking element 3043. The self-locking element 3043 passes through the second slot 30121 of the spray module 301, and the first end of the self-locking element 3043 corresponds to the position of the first slot 3021 of the RING ring 302. The swing arm is fixed to the spray module 301 by the elastic element.

[0058] The swing arm can swing along the direction of approaching or moving away from the second end of the self-locking member 3043 under the action of the elastic member, so as to drive the self-locking member to move toward the first slot, so that the first end is embedded in the first slot of the RING ring and is in a locked state, thereby realizing the axial locking of the injection module 301 and the RING ring 302; and / or, to drive the self-locking member 3043 to move away from the first slot, so that the first end of the self-locking member 3043 is located outside the first slot of the RING ring 302 and is in an unlocked state, thereby realizing the axial unlocking of the injection module 301 and the RING ring 302.

[0059] exist Figure 6 In the structure shown, the self-locking member 3043 can be a component that passes through the second slot 30121 of the spray module 301, and can be cylindrical or rectangular. This application embodiment does not limit this.

[0060] Specifically, in the assembly scenario, the swing arm can be pushed toward the second end of the self-locking member 3043. At this time, the swing arm moves under the action of the elastic member so that the swing arm contacts the second end of the self-locking member 3043 and applies a force to the second end of the self-locking member. This force causes the self-locking member to move inward, thereby causing the first end of the self-locking member 3043 to move from the first slot to the first slot of the RING ring. In this scenario, since the self-locking member 3043 is simultaneously embedded in the second slot and the first slot on the injection module 301, axial locking of the injection module 301 and the RING ring 302 can be achieved. In the disassembly scenario, the swing arm is pulled up toward the second end away from the self-locking member 3043. At this time, the swing arm moves outward under the action of the elastic member so that the first end of the self-locking member is brought out of the first slot along with the movement of the swing arm until the first end is completely separated from the first slot. Since the self-locking member 3043 is only embedded in the second slot on the injection module 301, the axial unlocking of the injection module 301 and the RING ring 302 can be realized.

[0061] In one possible implementation of this application, the elastic element is a torsion spring.

[0062] In one possible implementation of this application, the spray module 3043 has one or more nozzles facing the chip die surface. It is understood that the liquid cooling medium is sprayed onto the chip die surface through the one or more nozzles.

[0063] In one possible implementation of this application, the position of any nozzle on the injection module 301 corresponds to a hot spot on the surface of the chip die.

[0064] Due to the differences in the tiny components inside the chip, the heat generation on the die surface is uneven. As a result, the temperature on the chip die surface is inconsistent, with some areas having high temperatures and others having low temperatures. Therefore, the locations on the chip die surface with temperatures exceeding a certain value can be called hot spots.

[0065] Understandably, after the liquid cooling medium flows in through the working medium inlet of the spray module 301, it can be sprayed onto the chip die surface through one or more nozzles on the spray module 3043, thereby cooling the chip. Since the nozzle positions correspond to the hot spots on the chip die surface, the temperature difference is larger when the liquid cooling medium is sprayed from the nozzle onto the hot spots on the chip die surface, resulting in better heat dissipation.

[0066] In one possible implementation of this application, the printed circuit board 303 has a substrate on which electronic components are located.

[0067] The structure provided in this application embodiment utilizes radial O-ring to achieve jet cavity isolation, decoupling the sealing compression direction and assembly direction, thereby achieving isolation of assembly stress.

[0068] Although this application has been described herein in conjunction with various embodiments, those skilled in the art, by reviewing the accompanying drawings, the disclosure, and the appended claims, will understand and implement other variations of the disclosed embodiments in carrying out the claimed application. In the claims, the word "comprising" does not exclude other components or steps, and "a" or "an" does not exclude multiple instances. A single processor or other unit can implement several functions listed in the claims. While different dependent claims may recite certain measures, this does not mean that these measures cannot be combined to produce good results.

[0069] Although this application has been described in conjunction with specific features and embodiments, it is obvious that various modifications and combinations can be made thereto without departing from the spirit and scope of this application. Accordingly, this specification and drawings are merely exemplary illustrations of this application as defined by the appended claims, and are considered to cover any and all modifications, variations, combinations, or equivalents within the scope of this application. Clearly, those skilled in the art can make various alterations and modifications to this application without departing from the spirit and scope of this application. Thus, if such modifications and modifications of this application fall within the scope of the claims of this application and their equivalents, this application is also intended to include such modifications and modifications.

Claims

1. A jet liquid-cooled heat sink, characterized in that, Electronic components mounted on printed circuit boards for fluid cooling include: A spraying module having a cooling fluid inlet, the spraying module being used to spray liquid cooling fluid toward the surface of the electronic component; A printed circuit board, wherein electronic components are mounted on the printed circuit board, and a ring is disposed around the electronic components, the ring having one or more first slots for receiving a self-locking element of the self-locking mechanism, and the injection module having one or more second slots disposed opposite to the first slots on the ring, the second slots for receiving the self-locking element of the self-locking mechanism; The self-locking mechanism is used to embed a portion of the self-locking member into a first slot of the RING ring and another portion of the self-locking member into a second slot of the injection module, and / or to disengage the self-locking member from the first slot or the second slot.

2. The jet liquid-cooled heat sink according to claim 1, characterized in that, The self-locking mechanism is used to apply a first force to the self-locking member so that the self-locking member moves from the second slot toward the first slot, such that a portion of the self-locking member is embedded in the first slot of the RING ring and another portion is embedded in the second slot of the injection module. When a portion of the self-locking member is embedded in the first slot of the RING ring and another portion is embedded in the second slot of the injection module, the self-locking mechanism is used to release the first force applied to the self-locking member, so that the self-locking member disengages from the first slot and is located in the second slot.

3. The jet liquid-cooled heat sink according to claim 1 or 2, characterized in that, The self-locking mechanism includes a sleeve, an elastic element, and a self-locking component, wherein the self-locking component is located within the second slot of the spray module. One end of the elastic element is connected to the spray module, and the other end of the elastic element is connected to the sleeve. The sleeve can move up and down along the height direction of the jet liquid cooling radiator under the action of the elastic element, so that a part of the self-locking element is embedded in the first slot of the RING ring and the other part is embedded in the second slot of the spray module in a locked state; and / or, so that the self-locking element moves outward from the first slot and disengages from the first slot.

4. The jet liquid-cooled heat sink according to claim 3, characterized in that, The elastic element is a spring or a compression spring, the self-locking element is a ball bearing, and the cross-sectional shape of the groove of the ring is determined by the shape of the self-locking element.

5. The jet liquid-cooled heat sink according to claim 3 or 4, characterized in that, The sleeve has a pushing component disposed on the side of the sleeve facing the RING ring. The pushing component is used to apply a force to the self-locking member so that a portion of the self-locking member is embedded in the first slot of the RING ring.

6. The jet liquid-cooled heat sink according to any one of claims 1 to 5, characterized in that, The self-locking mechanism includes: a swing arm, an elastic element, and a self-locking element. The self-locking component passes through the second slot of the injection module, and the first end of the self-locking component corresponds to the position of the first slot of the ring. The swing arm is fixed to the injection module by the elastic element. The swing arm can swing in a direction close to or away from the second end of the self-locking member under the action of the elastic member, so as to drive the self-locking member to move toward the first slot, so that the first end is embedded inward into the first slot of the RING ring; and / or, so as to drive the self-locking member to move away from the first slot, so that the first end of the self-locking member is located outside the first slot of the RING ring.

7. The jet liquid-cooled heat sink according to claim 6, characterized in that, The elastic element is a torsion spring.

8. The jet liquid-cooled heat sink according to any one of claims 1 to 7, characterized in that, The electronic device is a chip, and the spraying module has one or more nozzles facing the die surface of the chip. The position of any of the nozzles on the spraying module corresponds to a hot spot on the die surface of the chip.

9. The jet liquid-cooled heat sink according to any one of claims 1 to 8, characterized in that, The printed circuit board has a substrate, and the electronic components are located on the substrate.

10. The jet liquid-cooled heat sink according to any one of claims 1 to 8, characterized in that, The jet liquid cooling radiator also includes a sealing ring disposed between the jet module and the RING ring, the sealing ring being embedded in the jet module.

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