Circuit board
By integrating cooling channels within the circuit board, the problems of long heat dissipation paths and high thermal resistance on the PCB substrate are solved, achieving efficient heat dissipation and space saving, and extending the service life of electronic devices.
Patent Information
- Application Number
- CN202422480219.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-14
- Publication Date
- 2025-10-31
- Estimated Expiration
- 2034-10-14
AI Technical Summary
The heat transfer path between the heat sink and electronic components on existing PCB substrates is relatively long, resulting in high thermal resistance, which leads to unsatisfactory heat dissipation and a large space occupation.
Cooling channels are integrated within the circuit board. The cooling channels are formed by stacking a first substrate and a second substrate. The cooling medium circulates within the channels to dissipate heat, shortening the heat dissipation path and reducing thermal resistance.
It improves the heat dissipation of electronic devices, reduces space occupation, extends the service life of electronic devices, and reduces material costs.
Smart Images
Figure CN223503082U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of circuit board technology, and in particular to a circuit board. Background Technology
[0002] A PCB substrate is a plate-like structure based on insulating material, covered with conductive paths and connection points for connecting electronic devices. High-power electronic devices, such as chips, are prone to generating heat during operation. Maintaining high temperatures for these devices can severely impact their lifespan. Therefore, PCB substrates are typically equipped with heat sinks to dissipate heat and ensure that the electronic devices on them operate at suitable temperatures.
[0003] However, for PCB substrates with high heat dissipation requirements, the heat dissipation area of the heat sink needs to be increased, which makes the heat sink occupy a large space. Furthermore, since the heat sink and PCB are separate structures, the heat transfer path between the electronic components and the heat sink is long and the thermal resistance is large, resulting in unsatisfactory heat dissipation effect.
[0004] Therefore, there is an urgent need to propose a circuit board to solve the above-mentioned technical problems. Utility Model Content
[0005] This invention provides a circuit board that integrates cooling channels, shortens the heat dissipation path, reduces thermal resistance, thereby improving the heat dissipation effect of electronic devices on the circuit board and reducing the space occupied.
[0006] To achieve this objective, the present invention adopts the following technical solution:
[0007] Circuit board, including:
[0008] A first substrate, wherein a first flow channel groove is provided on the first substrate;
[0009] The second substrate is stacked on the side of the first substrate where the first flow channel groove is provided, and forms a cooling flow channel with the first flow channel groove;
[0010] The flow channel inlet and the flow channel outlet are provided on the first substrate or the second substrate.
[0011] Optionally, the second substrate is made of ceramic, and electronic devices are disposed on the second substrate.
[0012] Optionally, the first substrate has a conductive path, the second substrate has a conductive hole electrically connected to the conductive path, a conductive connector is provided in the conductive hole, and the end of the conductive connector is connected to an electronic device arranged on the second substrate.
[0013] Optionally, the second substrate has a connection hole, and a metal layer is plated on the outside of the second substrate, the metal layer causing the connection hole to form the conductive hole.
[0014] Optionally, the circuit board further includes a sandwich substrate, which is stacked between the first substrate and the second substrate;
[0015] The first surface of the sandwich substrate forms a first cooling channel with the first flow channel groove. The second surface of the sandwich substrate is provided with a second flow channel groove, which forms a second cooling channel with the second substrate. The sandwich substrate is also provided with a through flow channel via, which connects the first cooling channel and the second cooling channel.
[0016] Optionally, a plurality of flow channel vias are provided on both opposite sides of the sandwich substrate, and the plurality of flow channel vias on each side of the sandwich substrate are spaced apart.
[0017] Optionally, the sandwich substrate is provided in multiple layers, and the multiple sandwich substrates are stacked sequentially between the first substrate and the second substrate. In two adjacent sandwich substrates, the second flow channel groove on one sandwich substrate and the first plate surface of the other sandwich substrate form a third layer of cooling flow channel.
[0018] Optionally, the first substrate and the sandwich substrate, as well as the sandwich substrate and the second substrate, are connected by brazing.
[0019] Optionally, the cooling channel contains a cooling medium, which is an insulating cooling medium.
[0020] Optionally, the circuit board is provided with a heat insulation layer.
[0021] The beneficial effects of this utility model are:
[0022] This invention provides a circuit board including a first substrate, a second substrate, a flow channel inlet, and a flow channel outlet. By providing a first flow channel groove on the first substrate, a second substrate is stacked on top of the first substrate, forming a cooling flow channel with the first flow channel groove. Cooling medium can flow into the cooling flow channel from the flow channel inlet and exit from the flow channel outlet, achieving circulation of the cooling medium. This circuit board integrates a cooling flow channel, enabling it to perform heat dissipation without the need for an additional heat sink to cool the electronic components, thus reducing space requirements. Furthermore, compared to existing technologies that use heat sinks to cool electronic components, the heat dissipation path of the electronic components is significantly shortened, reducing thermal resistance and effectively improving the heat dissipation effect, thereby extending the service life of the electronic components.
[0023] Furthermore, the first flow channel groove is set on the first substrate, and the cooling flow channel is formed by stacking the second substrate and the first substrate. The structure is simple and has fewer parts, which reduces the space occupied and the material cost. Attached Figure Description
[0024] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments of this utility model will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the content of the embodiments of this utility model and these drawings without creative effort.
[0025] Figure 1 This is a top view of the circuit board provided in an embodiment of the present utility model;
[0026] Figure 2 yes Figure 1 A partial view of the cross-section at point AA;
[0027] Figure 3 yes Figure 1 Cross-sectional view at point BB;
[0028] Figure 4 yes Figure 3 A magnified view of point C in the middle.
[0029] In the picture:
[0030] 10. Electronic components; 20. Conductive connectors;
[0031] 100, First substrate; 110, First flow channel groove; 120, Conductive path; 200, Second substrate; 210, Flow channel inlet; 220, Flow channel outlet; 300, Sandwich substrate; 310, Second flow channel groove; 320, Flow channel via. Detailed Implementation
[0032] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, not the entire structure.
[0033] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.
[0034] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.
[0035] In the description of this embodiment, the terms "upper," "lower," "left," and "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.
[0036] Example 1
[0037] This embodiment provides a circuit board that integrates cooling channels, shortens the heat dissipation path, reduces thermal resistance, thereby improving the heat dissipation effect of electronic devices on the circuit board and reducing the space occupied.
[0038] Specifically, such as Figures 1-4 As shown, the circuit board includes a first substrate 100, a second substrate 200, a flow channel inlet 210, and a flow channel outlet 220.
[0039] The first substrate 100 has a first flow channel groove 110. The second substrate 200 is stacked on the side of the first substrate 100 where the first flow channel groove 110 is located and forms a cooling flow channel with the first flow channel groove 110. A flow channel inlet 210 is provided on the first substrate 100 or the second substrate 200, and a flow channel outlet 220 is provided on the first substrate 100 or the second substrate 200.
[0040] It is understood that the flow channel inlet 210 and the flow channel outlet 220 can be simultaneously disposed on the first substrate 100, or simultaneously disposed on the second substrate 200, or one can be disposed on the first substrate 100 and the other on the second substrate 200, depending on actual needs, and this application does not make specific limitations.
[0041] When the circuit board is in use, electronic devices 10 are arranged on the first substrate 100 or the second substrate 200. The cooling medium can flow into the cooling channel from the channel inlet 210 and be discharged from the channel outlet 220 to realize the circulation of the cooling medium. The cooling medium circulating in the cooling channel will exchange heat with the electronic devices 10 to cool the electronic devices 10.
[0042] That is, the circuit board provided in this embodiment has its own heat dissipation function by integrating cooling channels. When using the circuit board, there is no need to equip it with an additional heat sink to dissipate heat from the electronic device 10, thereby reducing the space occupied. Moreover, compared with the prior art solution of dissipating heat from the electronic device 10 by using a heat sink, the heat dissipation path of the electronic device 10 is significantly shortened, the thermal resistance is reduced, the heat dissipation effect of the electronic device 10 is effectively improved, and the service life of the electronic device 10 is extended.
[0043] By setting the first flow channel groove 110 on the first substrate 100 and forming the cooling flow channel by stacking the second substrate 200 and the first substrate 100, fewer parts are required, which reduces space occupation and material costs.
[0044] Optionally, the cooling medium delivery pipeline can be connected to the flow channel inlet 210 and the flow channel outlet 220 by means of threaded connection, or it can be connected by other means, such as by means of pagoda joint. It can be set according to actual needs, and this application does not make specific limitations.
[0045] Optionally, in this embodiment, the cooling medium flowing within the cooling channel is an insulating cooling medium to prevent short circuits in the electronic components 10 on the circuit board due to cooling medium leakage, thereby improving the safety of the circuit board. For example, the insulating cooling medium can be a fluoride, silicone oil, etc.
[0046] Optionally, a heat insulation layer can be provided on the outside of the circuit board to isolate the heat exchange between the circuit board and the air. This can reduce the risk of poor soldering caused by heat dissipating too quickly in the air when soldering electronic components 10 on the circuit board.
[0047] Furthermore, the heat insulation material can be brushed onto the outer surface of the circuit board after its fabrication. The heat insulation material can be either resin or plastic, depending on the specific needs; this application does not impose any particular limitation.
[0048] Furthermore, the electronic device 10 can be arranged on the second substrate 200, and ceramic can be selected as the material of the second substrate 200. Ceramic materials have good thermal conductivity and insulation, which can reduce the thermal resistance between the electronic device 10 and the cooling medium in the cooling channel, thereby improving the heat dissipation effect of the electronic device 10.
[0049] Optionally, when the second substrate 200 is made of ceramic material, it can be formed by computer-controlled precision machining (CNC machining).
[0050] Optionally, see [link to relevant documentation] Figure 1 and Figure 4 A conductive path 120 can be provided on the first substrate 100, and a conductive hole electrically connected to the conductive path 120 can be provided on the second substrate 200. A conductive connector 20 is provided in the conductive hole, and the end of the conductive connector 20 is connected to the electronic device 10 arranged on the second substrate 200. That is, the electronic device 10 is electrically connected to the corresponding conductive path 120 through the conductive hole and the conductive connector 20. The structure is simple and easy to install.
[0051] Furthermore, connection holes can be processed on the second substrate 200, and then a metal layer can be plated on the outside of the second substrate 200. After the metal layer is plated, the connection holes have conductive properties, forming the aforementioned conductive holes. This configuration is easier to process and has a simpler structure compared to the prior art method of forming conductive holes by filling the connection holes with conductive material. Optionally, the metal layer can be a nickel layer, a copper layer, etc., depending on actual needs, and this application does not impose specific limitations.
[0052] Alternatively, a conductive path 120 and a first conductive hole electrically connected to the conductive path 120 can be provided on the first substrate 100, and a second conductive hole opposite to the first conductive hole can be provided on the second substrate 200. The conductive connector 20 passes through the first conductive hole and the second conductive hole and is connected to the electronic device 10 arranged on the second substrate 200.
[0053] Of course, the conductive path 120 can also be arranged on the second substrate 200, and the electronic device 10 can also be arranged on the second substrate 200. The arrangement can be made according to actual needs, and this application does not make specific limitations.
[0054] Understandably, the specific arrangement of the conductive path 120 can be set according to actual needs.
[0055] Optionally, when fabricating the first substrate 100, the conductive path 120 can be first formed by film development, and then etched with a chemical solution to complete the processing of the conductive path 120.
[0056] Example 2
[0057] This embodiment provides a circuit board, which has a largely the same structure as that of Embodiment 1, with improvements only. Therefore, only the differences between the two will be described here, and the structures identical to those in Embodiment 1 will not be repeated.
[0058] See also Figure 2 and Figure 4 In this embodiment, the circuit board further includes a sandwich substrate 300, which is stacked between the first substrate 100 and the second substrate 200. The first surface of the sandwich substrate 300 forms a first cooling channel with a first channel groove 110, and the second surface of the sandwich substrate 300 has a second channel groove 310, which forms a second cooling channel with the second substrate 200. The sandwich substrate 300 also has a through-hole 320, which connects the first and second cooling channels.
[0059] By providing a sandwich substrate 300, the circuit board has two layers of cooling channels, which improves the heat dissipation effect and heat dissipation capacity of the circuit board. Furthermore, by providing channel vias 320 on the sandwich substrate 300, the first layer of cooling channels and the second layer of cooling channels are interconnected, simplifying the flow of the cooling medium.
[0060] It is worth noting that conductive paths 120 can also be provided on the sandwich substrate 300. In this arrangement, corresponding conductive holes can be arranged on the sandwich substrate 300 as needed. The arrangement can be made according to actual needs, and this application does not impose specific limitations. Optionally, when providing conductive paths 120 on the sandwich substrate 300, they can also be processed by etching.
[0061] Optionally, see [link to relevant documentation] Figure 2 Multiple flow channel vias 320 can be provided on both opposite sides of the sandwich substrate 300, with the multiple flow channel vias 320 on each side of the sandwich substrate 300 spaced apart. By providing multiple flow channel vias 320, the flow smoothness of the cooling medium between the first layer cooling channel and the second layer cooling channel can be improved, thereby improving the cooling efficiency.
[0062] It is worth noting that the arrangement of the flow channel through-holes 320 can also be other, in order to control the flow rate of the cooling medium in each layer of cooling channel.
[0063] Optionally, in this embodiment, the first substrate 100 and the sandwich substrate 300, as well as the sandwich substrate 300 and the second substrate 200, are connected by brazing. This configuration provides higher sealing performance, lower risk of cooling medium leakage, and thus improves the reliability of the circuit board operation.
[0064] Further, see also Figure 2 and Figure 4 Multiple sandwich substrates 300 can be provided. Specifically, multiple sandwich substrates 300 are stacked sequentially between the first substrate 100 and the second substrate 200. In two adjacent sandwich substrates 300, the second flow channel groove 310 on one sandwich substrate 300 and the first plate surface of the other sandwich substrate 300 form a third layer of cooling flow channel.
[0065] Taking a two-layer sandwich substrate 300 as an example, the sandwich substrate 300 closer to the first substrate 100 forms a first cooling channel with the first substrate 100, the two adjacent sandwich substrates 300 form a third cooling channel, and the sandwich substrate 300 closer to the second substrate 200 forms a second cooling channel with the second substrate 200. With this configuration, the circuit board has three cooling channels, resulting in better cooling performance.
[0066] By setting multiple sandwich substrates 300, the heat dissipation capacity of the circuit board is improved, enabling the placement of electronic devices 10 with high power consumption and high heat generation on the circuit board, thereby improving the versatility of the circuit board.
[0067] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. Those skilled in the art can make various obvious changes, readjustments, and substitutions without departing from the protection scope of this utility model. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.
Claims
1. A circuit board, characterized in that, include: A first substrate (100) is provided with a first flow channel groove (110); The second substrate (200) is stacked on the side of the first substrate (100) where the first flow channel groove (110) is provided, and forms a cooling flow channel with the first flow channel groove (110); A flow channel inlet (210) and a flow channel outlet (220) are provided, wherein the flow channel inlet (210) is disposed on the first substrate (100) or the second substrate (200), and the flow channel outlet (220) is disposed on the first substrate (100) or the second substrate (200).
2. The circuit board according to claim 1, characterized in that, The second substrate (200) is made of ceramic, and electronic devices (10) are disposed on the second substrate (200).
3. The circuit board according to claim 1, characterized in that, The first substrate (100) has a conductive path (120), and the second substrate (200) has a conductive hole that is electrically connected to the conductive path (120). A conductive connector (20) is provided in the conductive hole, and the end of the conductive connector (20) is connected to an electronic device (10) arranged on the second substrate (200).
4. The circuit board according to claim 3, characterized in that, The second substrate (200) has a connection hole, and a metal layer is plated on the outside of the second substrate (200), the metal layer causing the connection hole to form the conductive hole.
5. The circuit board according to claim 1, characterized in that, The circuit board further includes a sandwich substrate (300) which is stacked between the first substrate (100) and the second substrate (200); The first plate surface of the sandwich substrate (300) forms a first cooling channel with the first flow channel groove (110). The second plate surface of the sandwich substrate (300) is provided with a second flow channel groove (310). The second flow channel groove (310) and the second substrate (200) form a second cooling channel. The sandwich substrate (300) is also provided with a through flow channel via (320). The through flow channel via (320) connects the first cooling channel and the second cooling channel.
6. The circuit board according to claim 5, characterized in that, The sandwich substrate (300) has a plurality of flow channel vias (320) on both sides of the sandwich substrate (300), and the plurality of flow channel vias (320) on each side of the sandwich substrate (300) are spaced apart.
7. The circuit board according to claim 5, characterized in that, The sandwich substrate (300) is provided in multiple ways. The multiple sandwich substrates (300) are stacked sequentially between the first substrate (100) and the second substrate (200). In two adjacent sandwich substrates (300), the second flow channel groove (310) on one sandwich substrate (300) and the first plate surface of the other sandwich substrate (300) form a third layer of cooling flow channel.
8. The circuit board according to claim 5, characterized in that, The first substrate (100) and the sandwich substrate (300), as well as the sandwich substrate (300) and the second substrate (200), are connected by brazing.
9. The circuit board according to claim 1, characterized in that, The cooling channel contains a cooling medium, which is an insulating cooling medium.
10. The circuit board according to any one of claims 1-9, characterized in that, The circuit board is provided with a heat insulation layer.