WiFi chip structure and FTTR device
By using a heat sink structure and circuit board design, the problems of low heat dissipation efficiency and short circuits in WiFi chips under high-temperature environments were solved, achieving efficient heat dissipation and improved stability.
Patent Information
- Application Number
- CN202521976298.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-15
- Publication Date
- 2025-10-31
- Estimated Expiration
- 2035-09-15
AI Technical Summary
WiFi chips have low heat dissipation efficiency in high-temperature environments, and existing heat dissipation structures are prone to short circuits.
The device employs a heat sink structure, including a base, a first boss, and a second boss. The second boss is attached to the WiFi chip, and heat is transferred to the base and dissipated through the heat sink. The number of through holes on the circuit board is equal to the number of chips to avoid solder leakage. The first boss maintains a gap with the circuit board to prevent short circuits.
This improves the heat dissipation efficiency of the WiFi chip, avoids short circuits and solder leakage on the circuit board, and enhances the stability of the chip structure.
Smart Images
Figure CN223503099U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of chip technology, and in particular to a WiFi chip structure and an FTTR device. Background Technology
[0002] WiFi (Wireless Fidelity) chips are an important component in FTTR (Fiber To The Room) equipment. WiFi chips are characterized by high power, poor high temperature resistance, and low heat dissipation efficiency. WiFi chips are prone to failure when operating in high temperature environments, so WiFi chips need to be equipped with heat dissipation structures.
[0003] In existing technologies, heat sinks are attached to the WiFi chip using thermally conductive adhesive. WiFi chips typically use a QFN (Quad Flat No-leads Package) package. QFN-packaged WiFi chips have lower thermal resistance at the bottom but higher thermal resistance at the top. The heat sink, attached to the top of the WiFi chip with thermally conductive adhesive, suffers from low heat dissipation efficiency due to top-down heat dissipation. Furthermore, existing technologies also incorporate heat dissipation holes on the WiFi chip. However, if the density of these holes is too high, solder can easily drip into and pass through the holes during soldering, adhering to the underlying circuit board and causing a short circuit. Conversely, if the number of heat dissipation holes is too small, the heat dissipation requirements of the WiFi chip are insufficient. Utility Model Content
[0004] This utility model provides a WiFi chip structure and an FTTR device to solve the technical problems of low heat dissipation efficiency in existing WiFi chips.
[0005] An embodiment of the present invention provides a WiFi chip structure, including a heat sink, a heat dissipation block, a circuit board and a WiFi chip. The circuit board is provided with at least two through holes spaced apart. The heat dissipation block includes a base, at least two first protrusions and at least two second protrusions. All the first protrusions are spaced apart on the base. The second protrusions are located at the end of the first protrusions away from the heat dissipation block. The first protrusions and the second protrusions are arranged in a one-to-one correspondence.
[0006] The second protrusion is inserted into the through hole in a one-to-one correspondence, and the second protrusion is attached to the WiFi chip. The side of the circuit board away from the WiFi chip abuts against the end of the first protrusion away from the base. The side of the base away from the first protrusion is attached to the heat sink, and there is a gap between the base and the circuit board.
[0007] Optionally, the circuit board has a first conductive heat dissipation layer on the side facing the WiFi chip; the first conductive heat dissipation layer is disposed around the through hole and abuts against the WiFi chip; the WiFi chip is electrically connected to the ground terminal of the circuit board through the first conductive heat dissipation layer.
[0008] Optionally, the circuit board has a second conductive heat dissipation layer on the side facing the base; the second conductive heat dissipation layer is arranged around the through hole and abuts against the first boss; the heat sink is electrically connected to the ground terminal of the circuit board through the second conductive heat dissipation layer.
[0009] Optionally, a first thermally conductive layer is provided at the end of the second protrusion away from the first protrusion, and the second protrusion is attached to the WiFi chip through the first thermally conductive layer.
[0010] Optionally, a second heat-conducting layer is provided at the end of the base away from the first protrusion, and the base is attached to the heat sink through the second heat-conducting layer.
[0011] Optionally, the first boss is a first cylinder, the second boss is a second cylinder, and the diameter of the first cylinder is larger than the diameter of the second cylinder; the through hole is a circular hole adapted to the second cylinder.
[0012] Optionally, the difference between the diameter of the first cylinder and the inner diameter of the circular hole is 0.5 mm to 1.5 mm.
[0013] Optionally, the height of the second cylinder is less than the depth of the circular hole, and the difference between the depth of the circular hole and the height of the second cylinder is 0.1 mm to 0.2 mm.
[0014] Optionally, two WiFi chips are provided, namely a WiFi baseband chip and a WiFi radio frequency chip;
[0015] The circuit board has two through holes spaced apart; the heat sink includes two first bosses and two second bosses.
[0016] The second protrusion is attached to the WiFi baseband chip, and the other second protrusion is attached to the WiFi radio frequency chip.
[0017] Another embodiment of this utility model also provides an FTTR device, including the WiFi chip structure described above.
[0018] In this invention, the heat sink includes a base, at least two first protrusions, and at least two second protrusions. All first protrusions are spaced apart on the base, and the second protrusions are located at one end of the heat sink on each of the first protrusions. The second protrusions are inserted into the through-holes and abut against the WiFi chip. The side of the base away from the first protrusions is abutted against the heat sink. The WiFi chip is typically a QFN chip with a large exposed copper pad area on its bottom. During operation, the WiFi chip's heat is sequentially transferred to the base via the second and first protrusions. The heat on the base is then dissipated through the heat sink, which can directly contact the bottom of the WiFi chip via the heat sink, improving the heat dissipation efficiency of the WiFi chip. Furthermore, the number of through-holes on the circuit board is equal to the number of WiFi chips. The fewer through-holes on the circuit board avoids solder leakage due to excessive through-holes, preventing short circuits caused by excessive solder leakage. Furthermore, the first protrusion allows for a certain gap between the circuit board and the base. This gap ensures the heat dissipation performance of the circuit board while also preventing the base from contacting other electronic components on the circuit board and causing a short circuit, thus improving the stability of the WiFi chip structure. Attached Figure Description
[0019] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments of this utility model will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0020] Figure 1 This is an exploded view of the WiFi chip structure provided in one embodiment of the present invention;
[0021] Figure 2 This is a cross-sectional view of a WiFi chip structure provided in an embodiment of this utility model;
[0022] Figure 3 yes Figure 2 A magnified view of a section at point A in the middle;
[0023] Figure 4 This is a schematic diagram of the heat sink structure of a WiFi chip structure provided in one embodiment of the present invention.
[0024] The reference numerals in the accompanying drawings are as follows:
[0025] 1. Heat sink; 2. Heat sink block; 21. Base; 22. First boss; 23. Second boss; 231. First thermally conductive layer; 3. Circuit board; 31. Through hole; 4. WiFi chip; 41. WiFi baseband chip; 42. WiFi radio frequency chip; 5. CPU chip; 6. Optical communication device. Detailed Implementation
[0026] To make the technical problems solved, technical solutions, and beneficial effects of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.
[0027] like Figures 1 to 4 As shown, an embodiment of the present invention provides a WiFi chip structure, including a heat sink 1, a heat sink 2, a circuit board 3, and a WiFi chip 4. The circuit board 3 is provided with at least two through holes 31 spaced apart. The heat sink 2 includes a base 21, at least two first protrusions 22, and at least two second protrusions 23. All the first protrusions 22 are spaced apart on the base 21, and the second protrusions 23 are located at the end of the first protrusions 22 away from the heat sink 2. The first protrusions 22 and the second protrusions 23 are arranged in a one-to-one correspondence.
[0028] The second protrusion 23 is inserted into the through hole 31 in a one-to-one correspondence, and the second protrusion 23 is attached to the WiFi chip 4. The side of the circuit board 3 away from the WiFi chip 4 abuts against the end of the first protrusion 22 away from the base 21. The side of the base 21 away from the first protrusion 22 is attached to the heat sink 1, and there is a gap between the base 21 and the circuit board 3.
[0029] The number of WiFi chip 4, through hole 31, first protrusion 22 and second protrusion 23 can be set according to actual needs. The first protrusion 22 is set on the top surface of the base 21, and the second protrusion 23 is set on the top surface of the first protrusion 22. The shapes of the through hole 31 and the second protrusion 23 can be set according to actual needs.
[0030] In this invention, the heat sink 2 includes a base 21, at least two first protrusions 22, and at least two second protrusions 23. All the first protrusions 22 are spaced apart on the base 21, and the second protrusions 23 are located at one end of the first protrusions 22 on the heat sink 2. The second protrusions 23 are inserted into the through holes 31 one-to-one and are in contact with the WiFi chip 4. The side of the base 21 away from the first protrusions 22 is in contact with the heat sink 1. The WiFi chip 4 is generally a QFN chip. The bottom of the WiFi chip 4 has a large exposed copper pad area (higher heat temperature). During the operation of the WiFi chip 4, the heat of the WiFi chip 4 will be transferred sequentially to the base 21 through the second protrusions 23 and the first protrusions 22. The heat on the base 21 is dissipated through the heat sink 1. The heat sink 1 can directly contact the bottom of the WiFi chip 4 through the heat sink 2, which improves the heat dissipation efficiency of the WiFi chip 4. Furthermore, the number of through holes 31 on the circuit board 3 is equal to the number of WiFi chips 4. The fewer through holes 31 on the circuit board 3 avoids the problem of solder leakage caused by too many through holes 31, thus preventing short circuits. In addition, the first boss 22 maintains a certain gap between the circuit board 3 and the base 21. This gap ensures the heat dissipation performance of the circuit board 3 while also preventing the base 21 from contacting other electronic components on the circuit board 3 and causing short circuits, thereby improving the stability of the WiFi chip structure.
[0031] In one embodiment, such as Figure 2 and Figure 3 As shown, the circuit board 3 has a first conductive heat dissipation layer on the side facing the WiFi chip 4; the first conductive heat dissipation layer is arranged around the through hole 31 and abuts against the WiFi chip 4; the WiFi chip 4 is electrically connected to the ground terminal of the circuit board 3 through the first conductive heat dissipation layer.
[0032] The first conductive heat dissipation layer is disposed on the top surface of the circuit board 3. The first conductive heat dissipation layer may be a copper plating layer, that is, the copper plating layer is disposed around the top of the through hole 31.
[0033] In this invention, the WiFi chip 4 can transfer heat to the circuit board 3 through the first conductive heat dissipation layer, thereby increasing the normal thermal conductivity of the WiFi chip 4; and the WiFi chip 4 can be electrically connected to the ground terminal of the circuit board 3 through the first conductive heat dissipation layer, so that the WiFi chip 4 and the circuit board 3 can share a common ground.
[0034] In one embodiment, such as Figure 2 and Figure 3As shown, the circuit board 3 has a second conductive heat dissipation layer on the side facing the base 21; the second conductive heat dissipation layer is arranged around the through hole 31 and abuts against the first boss 22; the heat sink 2 is electrically connected to the ground terminal of the circuit board 3 through the second conductive heat dissipation layer.
[0035] The second conductive heat dissipation layer is disposed on the bottom surface of the circuit board 3. The second conductive heat dissipation layer can be a copper plating layer, that is, the copper plating layer is disposed around the bottom of the through hole 31.
[0036] In this invention, the circuit board 3 can transfer heat to the first protrusion 22 through the second conductive heat dissipation layer, and finally to the heat sink 1 through the base 21, thereby increasing the normal thermal conductivity of the circuit board 3. Furthermore, the WiFi chip 4 can be electrically connected to the ground terminal of the circuit board 3 through the first conductive heat dissipation layer, and the heat sink 2 can be electrically connected to the ground terminal of the circuit board 3 through the second conductive heat dissipation layer. Thus, the WiFi chip 4 and the heat sink 2 can share a common ground, reducing the problem of the WiFi chip 4 and the heat sink 2 not sharing a common ground due to electrical reasons.
[0037] In one embodiment, such as Figures 1 to 3 As shown, the second protrusion 23 has a first heat-conducting layer 231 at the end away from the first protrusion 22, and the second protrusion 23 is attached to the WiFi chip 4 through the first heat-conducting layer 231.
[0038] The first thermally conductive layer 231 includes, but is not limited to, thermally conductive paste, thermally conductive adhesive, thermally conductive pad, etc., and the first thermally conductive layer 231 may be located in the through hole 31.
[0039] In this embodiment, the design of the first thermal conductive layer 231 ensures the stability of the contact between the second protrusion 23 and the WiFi chip 4, and also improves the thermal conductivity between the second protrusion 23 and the WiFi chip 4.
[0040] In one embodiment, a second heat-conducting layer is provided at the end of the base 21 away from the first protrusion 22, and the base 21 is attached to the heat sink 1 through the second heat-conducting layer.
[0041] The second thermally conductive layer includes, but is not limited to, thermally conductive paste, thermally conductive adhesive, thermally conductive pad, etc.
[0042] In this embodiment, the design of the second heat-conducting layer ensures the stability of the contact between the base 21 and the heat sink 1, and also improves the heat conduction efficiency between the base 21 and the heat sink 1.
[0043] In one embodiment, such as Figures 1 to 4As shown, the first boss 22 is a first cylinder, the second boss 23 is a second cylinder, and the diameter of the first cylinder is larger than the diameter of the second cylinder; the through hole 31 is a circular hole adapted to the second cylinder.
[0044] An annular step is provided between the first cylinder and the second cylinder, and the annular step abuts against the bottom surface of the circuit board 3; the diameter of the second cylinder can be equal to or smaller than the inner diameter of the circular hole.
[0045] In this embodiment, the design of the circular hole, the first cylinder, and the second cylinder reduces the manufacturing cost of the WiFi chip structure.
[0046] In one embodiment, the difference between the diameter of the first cylinder and the inner diameter of the circular hole is 0.5 mm to 1.5 mm (e.g., 0.8 mm, 1.0 mm, 1.2 mm, etc.).
[0047] In this embodiment, the diameter of the first cylinder is 0.5mm to 1.5mm smaller than the inner diameter of the circular hole, so that the first cylinder can effectively support the circuit board 3 and prevent the base 21 from undergoing normal displacement when subjected to a large force.
[0048] In one embodiment, the height of the second cylinder is less than the depth of the circular hole, and the difference between the depth of the circular hole and the height of the second cylinder is 0.1 mm to 0.2 mm (e.g., 0.15 mm).
[0049] In this embodiment, the height of the second cylinder is slightly less than the depth of the circular hole, so that the top of the second cylinder will not protrude from the circular hole. A first thermally conductive layer 231 is bonded to the top of the second cylinder, and the first thermally conductive layer 231 is located in the circular hole, thereby ensuring the stability of the contact between the WiFi chip 4 and the top surface of the circuit board 3.
[0050] In one embodiment, such as Figure 1 and Figure 4 As shown, there are two WiFi chips 4, namely a WiFi baseband chip 41 and a WiFi radio frequency chip 42.
[0051] The circuit board 3 is provided with two through holes 31 spaced apart; the heat sink 2 includes two first bosses 22 and two second bosses 23.
[0052] The second protrusion 23 is attached to the WiFi baseband chip 41, and the other second protrusion 23 is attached to the WiFi radio frequency chip 42.
[0053] The WiFi baseband chip 41 has a second protrusion 23 and a first protrusion 22 on its bottom, and the WiFi radio frequency chip 42 also has a second protrusion 23 and a first protrusion 22 on its bottom. The WiFi baseband chip 41 and the WiFi radio frequency chip 42 share a heat sink 2 and a heatsink 1 for heat dissipation. In this embodiment, the WiFi chip structure is simple, has low manufacturing cost, and provides fast heat dissipation.
[0054] In one embodiment, such as Figure 1 As shown, the WiFi chip structure also includes a CPU chip 5 and an optical communication device 6, both of which are electrically connected to the circuit board 3; the optical communication device 6 includes, but is not limited to, BOSA, Combo, optical modules, etc.
[0055] Another embodiment of this utility model also provides an FTTR device, including the WiFi chip structure described above.
[0056] The above-described embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model, and should all be included within the protection scope of this utility model.
Claims
1. A WiFi chip structure, characterized in that, The device includes a heat sink, a heat dissipation block, a circuit board, and a WiFi chip. The circuit board has at least two through holes spaced apart. The heat dissipation block includes a base, at least two first protrusions, and at least two second protrusions. All the first protrusions are spaced apart on the base. The second protrusions are located at the end of the first protrusions away from the heat dissipation block. The first protrusions and the second protrusions are arranged in a one-to-one correspondence. The second protrusion is inserted into the through hole in a one-to-one correspondence, and the second protrusion is attached to the WiFi chip. The side of the circuit board away from the WiFi chip abuts against the end of the first protrusion away from the base. The side of the base away from the first protrusion is attached to the heat sink, and there is a gap between the base and the circuit board.
2. The WiFi chip structure according to claim 1, characterized in that, The circuit board has a first conductive heat dissipation layer on the side facing the WiFi chip; the first conductive heat dissipation layer is arranged around the through hole and abuts against the WiFi chip; the WiFi chip is electrically connected to the ground terminal of the circuit board through the first conductive heat dissipation layer.
3. The WiFi chip structure according to claim 2, characterized in that, The circuit board has a second conductive heat dissipation layer on the side facing the base; the second conductive heat dissipation layer is arranged around the through hole and abuts against the first boss; the heat sink is electrically connected to the ground terminal of the circuit board through the second conductive heat dissipation layer.
4. The WiFi chip structure according to claim 1, characterized in that, The second protrusion has a first thermally conductive layer at the end away from the first protrusion, and the second protrusion is attached to the WiFi chip through the first thermally conductive layer.
5. The WiFi chip structure according to claim 1, characterized in that, The base is provided with a second heat-conducting layer at the end away from the first protrusion, and the base is attached to the heat sink through the second heat-conducting layer.
6. The WiFi chip structure according to claim 1, characterized in that, The first boss is a first cylinder, the second boss is a second cylinder, and the diameter of the first cylinder is larger than the diameter of the second cylinder; the through hole is a circular hole adapted to the second cylinder.
7. The WiFi chip structure according to claim 6, characterized in that, The difference between the diameter of the first cylinder and the inner diameter of the circular hole is 0.5 mm to 1.5 mm.
8. The WiFi chip structure according to claim 6, characterized in that, The height of the second cylinder is less than the depth of the circular hole, and the difference between the depth of the circular hole and the height of the second cylinder is 0.1mm to 0.2mm.
9. The WiFi chip structure according to claim 1, characterized in that, The WiFi chip is provided in two parts, namely a WiFi baseband chip and a WiFi radio frequency chip; The circuit board has two through holes spaced apart; the heat sink includes two first bosses and two second bosses. The second protrusion is attached to the WiFi baseband chip, and the other second protrusion is attached to the WiFi radio frequency chip.
10. An FTTR device, characterized in that, Includes the WiFi chip structure as described in any one of claims 1 to 9.