Communication type PCB for monitoring deviation of mechanical blind hole
By designing alignment coupons on the PCB board to monitor mechanical blind hole misalignment and using X-ray inspection, the problem of untimely detection of mechanical blind hole misalignment was solved, the scrap rate of defective boards was reduced, and the inspection efficiency and accuracy of the drilling process were improved.
Patent Information
- Application Number
- CN202422877851.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-25
- Publication Date
- 2025-10-31
- Estimated Expiration
- 2034-11-25
AI Technical Summary
Existing technology cannot detect the misalignment of mechanical through holes and mechanical blind holes in a timely manner, resulting in a scrap rate of up to 0.50% for defective boards.
Design a communication PCB board for monitoring mechanical blind via misalignment. By designing an alignment coupon for monitoring mechanical blind via misalignment at each of the four corners of the PCB board, the misalignment problem is detected during the first test drilling and process sampling using X-ray inspection. A combination of L1-Ln and Ln+1-Lm layer mechanical blind via unit structures and insulating material layers is adopted to ensure that the mechanical blind vias are not connected and are isolated by mechanical through-holes.
It effectively reduced the scrap rate of defective boards from 0.50% to 0.10%, and improved the inspection efficiency and accuracy of the drilling process.
Smart Images
Figure CN223503101U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of PCB board technology, and in particular relates to a communication PCB board for monitoring mechanical blind hole misalignment. Background Technology
[0002] The existing coupon can only monitor the misalignment of mechanical through-holes relative to the inner layer pattern; the existing coupon can only determine the misalignment of mechanical through-holes relative to the inner layer pattern, but cannot determine the misalignment of mechanical through-holes with other mechanical blind holes. If the misalignment of mechanical through-holes and mechanical blind holes occurs during the drilling process and cannot be detected in time, it will cause the defective board to flow to the next process and cannot be salvaged. Therefore, the scrap rate caused by the problem is as high as 0.50%. Utility Model Content
[0003] To overcome the problems existing in related technologies, the present invention discloses a communication PCB board for monitoring mechanical blind hole misalignment.
[0004] The technical solution is as follows: A communication PCB board for monitoring mechanical blind hole misalignment, comprising:
[0005] The structure consists of L1-Ln layers of mechanical blind hole units, multiple layers of insulating material, and Ln+1-Lm layers of mechanical blind hole units arranged from top to bottom.
[0006] The aforementioned multilayer insulating material layer isolates the L1-Ln layer mechanical blind hole unit structure from the Ln+1-Lm layer mechanical blind hole unit structure;
[0007] The L1-Ln layer mechanical blind via unit structure includes n layers of sub-copper layers after electroplating of copper plates;
[0008] And L1-Ln layers of mechanical blind vias are present on the sub-copper layer after the n-layer copper plating is electroplated;
[0009] The Ln+1-Lm layer mechanical blind via unit structure includes a sub-copper layer after electroplating of m-(n+1) layer copper plating and Ln+1-Lm layer mechanical blind vias penetrating the sub-copper layer after electroplating of m-(n+1) layer copper plating.
[0010] Furthermore, the mechanical blind holes in the L1-Ln layer are not connected to the mechanical blind holes in the Ln+1-Lm layer.
[0011] Mechanical through holes are drilled on one side of the mechanical blind holes in layers L1-Ln and Ln+1-Lm. The mechanical through holes are neither tangent to nor intersect with the mechanical blind holes in layers L1-Ln and Ln+1-Lm.
[0012] The L1-Ln layer mechanical blind vias include:
[0013] Drill the first hole in the middle of the sub-copper layer, and drill the four second holes at the four corners of the sub-copper layer.
[0014] The diameter of the first hole is 0.90 mm; the diameter of the second hole is 0.50 mm.
[0015] The distance between the edge of the first hole and the edge of the second hole is 0.075 mm.
[0016] Mechanical through holes are drilled between each adjacent second hole;
[0017] The distance between the mechanical through hole and the edges of the first hole and the second hole is 0.075 mm.
[0018] The Ln+1-Lm layer mechanical blind vias include:
[0019] Drill the first hole in the middle of the sub-copper layer, and drill the four second holes at the four corners of the sub-copper layer.
[0020] The diameter of the first hole is 0.90 mm; the diameter of the second hole is 0.50 mm;
[0021] The distance between the edge of the first hole and the edge of the second hole is 0.075 mm.
[0022] Mechanical through holes were drilled between adjacent holes II;
[0023] The distance between the mechanical through hole and the edges of the first hole, the second hole, and the second hole is 0.075 mm.
[0024] An insulating material layer is adhered between adjacent copper sub-layers.
[0025] Combining all the above technical solutions, the beneficial effects of this utility model are as follows: problems can be detected in a timely manner during the trial drilling of the first piece and in-process sampling inspection. Once a problem is detected, the drilling coefficient can be adjusted immediately, effectively preventing defective boards from being scrapped in subsequent processes. This utility model can reduce such scrap from 0.50% to 0.10%. This utility model is applicable to mechanically blind via boards with N+N designs on PCBs. Attached Figure Description
[0026] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure;
[0027] Figure 1 This is a schematic diagram of a communication PCB board for monitoring mechanical blind hole misalignment provided in an embodiment of this utility model;
[0028] Figure 2 This is a mechanical buried hole diagram of the L1-Ln layers provided in this embodiment of the utility model;
[0029] Figure 3 This is a mechanical buried hole diagram of the L(n+1)-Lm layer provided in this embodiment of the utility model;
[0030] Figure 4 This is a schematic diagram of drilling mechanical through holes and mechanical blind holes in layers L1-Ln provided in this embodiment of the utility model;
[0031] Figure 5 This is a schematic diagram of drilling mechanical through holes and mechanical blind holes in the L(n+1)-Lm layer provided in this embodiment of the utility model;
[0032] In the figure: 1. Mechanical blind via unit structure of L1-Ln layer; 2. Insulating material layer; 3. Mechanical blind via unit structure of Ln+1-Lm layer; 4. Sub-copper layer; 5. Mechanical blind via of L1-Ln layer; 6. Mechanical blind via of Ln+1-Lm layer; 7. Mechanical through hole; 8. First hole; 9. Second hole; 10. Hole I; 11. Hole II. Detailed Implementation
[0033] To make the above-mentioned objectives, features, and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a full understanding of this utility model. However, this utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this utility model. Therefore, this utility model is not limited to the specific embodiments disclosed below.
[0034] Example 1: The communication PCB board for monitoring mechanical blind hole misalignment provided in this embodiment of the present invention adopts a positioning coupon for monitoring mechanical blind hole misalignment at each of the four corners of the PCB board. This coupon is checked by X-ray during the first drilling test and process sampling inspection.
[0035] like Figure 1 As shown, the communication PCB board for monitoring mechanical blind hole misalignment provided in this embodiment of the utility model includes:
[0036] The mechanical blind hole unit structure 1 with L1-Ln layers arranged from top to bottom, the multi-layer insulating material layer 2, and the mechanical blind hole unit structure 3 with Ln+1-Lm layers;
[0037] The L1-Ln layer mechanical blind via unit structure 1 includes n layers of copper sub-copper layers 4 after electroplating of copper plates;
[0038] An insulating material layer 2 is adhered between adjacent sub-copper layers 4;
[0039] The sub-copper layer 4 of the n-layer copper plating after electroplating has L1-Ln mechanical blind holes 5.
[0040] The multilayer insulating material layer 2 includes at least two insulating material layers 2, which isolate the L1-Ln layer mechanical blind hole unit structure 1 from the Ln+1-Lm layer mechanical blind hole unit structure 3.
[0041] The Ln+1-Lm layer mechanical blind via unit structure 3 includes an m-(n+1) layer of copper sub-copper layer 4 after electroplating of copper plate;
[0042] An insulating material layer 2 is adhered between adjacent sub-copper layers 4;
[0043] The copper sub-copper layer 4 of the m-(n+1) layer copper plating after electroplating has Ln+1-Lm layer mechanical blind holes 6.
[0044] Mechanical through holes 7 are drilled on one side of the mechanical blind holes 5 in the L1-Ln layer and the mechanical blind holes 6 in the Ln+1-Lm layer, which are neither tangent to nor intersect with the mechanical blind holes 5 in the L1-Ln layer and the mechanical blind holes 6 in the Ln+1-Lm layer.
[0045] For example, such as Figure 2 As shown, the mechanical blind via 5 in the L1-Ln layer includes:
[0046] Drill the first hole 8 in the middle of the sub-copper layer 4, and drill the four second holes 9 at the four corners of the sub-copper layer 4;
[0047] The first hole 8 has a diameter of 0.90 mm; the second hole 9 has a diameter of 0.50 mm.
[0048] The distance between the edge of the first hole 8 and the edge of the second hole 9 is 0.075 mm.
[0049] For example, such as Figure 3 As shown, the mechanical blind via 6 in the Ln+1-Lm layer includes:
[0050] Drill the first hole 10 in the middle of the sub-copper layer 4, and drill the four second holes 11 at the four corners of the sub-copper layer 4;
[0051] The diameter of hole I 10 is 0.90 mm; the diameter of hole II 11 is 0.50 mm.
[0052] The distance between the edge of the first hole 10 and the edge of the second hole 11 is 0.075 mm.
[0053] like Figure 4 As shown, mechanical through holes 7 are drilled between adjacent second holes 9;
[0054] The distance between the mechanical through hole 7 and the first hole 8 and the second hole 9 is 0.075 mm.
[0055] like Figure 5 As shown, mechanical through holes 7 are drilled between adjacent holes II 11;
[0056] The distance between the mechanical through hole 7 and the first hole 10, the second hole 11, and the second hole 9 is 0.075 mm.
[0057] Design principles.
[0058] The communication PCB board for monitoring mechanical blind hole misalignment provided in this embodiment of the utility model adopts a alignment coupon for monitoring mechanical blind hole misalignment at each of the four corners of the PCB board. This coupon is checked by X-ray during the first test drilling and process sampling inspection.
[0059] The N+N mechanical blind hole drilling process includes:
[0060] The first step involves drilling holes in the L1-Ln layers, applying copper plating, filling the holes with resin, grinding the board with resin, and completing the inner layer pattern of the L1-Ln layers.
[0061] The second step involves drilling holes in the Ln+1-Lm layer, applying copper plating, filling holes with resin, grinding the board with resin, and completing the inner layer pattern of the Ln+1-Lm layer.
[0062] The third step involves laminating the inner layer patterns of L1-Ln and Ln+1-Lm layers together, followed by drilling (mechanical through holes) to obtain a communication PCB board with N+N mechanical blind holes for monitoring the misalignment of the mechanical blind holes.
[0063] For example, the L1-Ln and L(n+1)-Lm drilling alignment coupon design: the diameter of the middle hole is designed to be 0.90mm, the diameter of the four surrounding small holes is designed to be 0.50mm, and the distance from the edge of the 0.50mm small hole to the edge of the 0.90mm large hole is 0.075mm.
[0064] Among them, mechanical buried holes in L1-Ln layers, such as Figure 2 As shown;
[0065] L(n+1)-Lm layer mechanical buried holes such as Figure 3 As shown;
[0066] Another example is the effect after mechanically drilling a through hole:
[0067] like Figure 4 Schematic diagram of drilling mechanical through holes and mechanical blind holes in L1-Ln layers;
[0068] When the mechanical through hole 7 is tangent to or intersects with the mechanical blind hole 5 in the L1-Ln layer, it indicates that there is a misalignment problem between the mechanical through hole 7 and the mechanical blind hole 5 in the L1-Ln layer. At this time, the drilling coefficient of the mechanical through hole needs to be adjusted immediately.
[0069] like Figure 5Schematic diagram of drilling mechanical through holes and mechanical blind holes in L(n+1)-Lm layers;
[0070] When the mechanical through hole 7 is tangent to or intersects with the mechanical blind hole in the L(n+1)-Lm layer, it indicates that there is a misalignment problem between the mechanical through hole and the mechanical blind hole 6 in the L(n+1)-Lm layer. In this case, the drilling coefficient of the mechanical through hole needs to be adjusted immediately.
[0071] In the above embodiments, the descriptions of each embodiment have different focuses. For parts that are not described in detail or recorded in a certain embodiment, please refer to the relevant descriptions of other embodiments.
[0072] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any modifications, equivalent substitutions and improvements made by those skilled in the art within the scope of the technology disclosed in the present utility model, within the spirit and principles of the present utility model, should be included within the protection scope of the present utility model.
Claims
1. A communication PCB board for monitoring mechanical blind hole misalignment, characterized in that, The PCB board includes: The mechanical blind hole unit structure arranged from top to bottom consists of L1-Ln layer mechanical blind hole unit structure (1), multi-layer insulating material layer (2), and Ln+1-Lm layer mechanical blind hole unit structure (3). The multilayer insulating material layer (2) isolates the L1-Ln layer mechanical blind hole unit structure (1) from the Ln+1-Lm layer mechanical blind hole unit structure (3); The L1-Ln layer mechanical blind hole unit structure (1) includes n layers of copper sub-copper layers after electroplating (4); The sub-copper layer (4) of the n-layer copper plating after electroplating has L1-Ln layers of mechanical blind holes (5); The Ln+1-Lm layer mechanical blind via unit structure (3) includes a sub-copper layer (4) after electroplating of the m-(n+1) layer copper plate; the sub-copper layer (4) after electroplating of the m-(n+1) layer copper plate has an Ln+1-Lm layer mechanical blind via (6) through it.
2. The communication PCB board for monitoring mechanical blind hole misalignment according to claim 1, characterized in that, The mechanical blind holes (5) in the L1-Ln layer are not connected to the mechanical blind holes (6) in the Ln+1-Lm layer.
3. The communication PCB board for monitoring mechanical blind hole misalignment according to claim 1, characterized in that, Mechanical through holes (7) are drilled on one side of the mechanical blind holes (5) in the L1-Ln layer and the mechanical blind holes (6) in the Ln+1-Lm layer. The mechanical through holes (7) are not tangent to or intersect with the mechanical blind holes (5) in the L1-Ln layer and the mechanical blind holes (6) in the Ln+1-Lm layer.
4. The communication PCB board for monitoring mechanical blind hole misalignment according to claim 1, characterized in that, The L1-Ln layer mechanical blind holes (5) include: Drill the first hole (8) in the middle of the sub-copper layer (4) and drill the four second holes (9) at the four corners of the sub-copper layer (4).
5. The communication PCB board for monitoring mechanical blind hole misalignment according to claim 4, characterized in that, The first hole (8) has a diameter of 0.90 mm; the second hole (9) has a diameter of 0.50 mm; The distance between the edge of the first hole (8) and the edge of the second hole (9) is 0.075 mm.
6. The communication PCB board for monitoring mechanical blind hole misalignment according to claim 5, characterized in that, Mechanical through holes (7) are drilled between adjacent second holes (9); The distance between the mechanical through hole (7) and the first hole (8) and the second hole (9) is 0.075 mm.
7. The communication PCB board for monitoring mechanical blind hole misalignment according to claim 1, characterized in that, The Ln+1-Lm layer mechanical blind hole (6) includes: Drill the first hole (10) in the middle of the sub-copper layer (4) and drill the four second holes (11) at the four corners of the sub-copper layer (4).
8. The communication PCB board for monitoring mechanical blind hole misalignment according to claim 7, characterized in that, The diameter of the first hole (10) is 0.90 mm; the diameter of the second hole (11) is 0.50 mm; The distance between the edge of the first hole (10) and the edge of the second hole (11) is 0.075 mm.
9. The communication PCB board for monitoring mechanical blind hole misalignment according to claim 8, characterized in that, Mechanical through holes (7) are drilled between adjacent holes II (11); The distance between the mechanical through hole (7) and the first hole (10), the second hole (11), and the second hole (9) is 0.075 mm.
10. The communication PCB board for monitoring mechanical blind hole misalignment according to claim 1, characterized in that, An insulating material layer (2) is adhered between adjacent sub-copper layers (4).