Smart card function module and carrier tape

Abstract

The utility model relates to an intelligent card function module and a carrier tape. The intelligent card function module comprises a chip and a printed circuit board for bearing the chip. The printed circuit board comprises a contact surface and a packaging surface, the contact surface is provided with contacts conforming to the ISO7816 protocol, and the packaging surface is provided with a chip bearing area, a plurality of first connecting areas and a plurality of second connecting areas. The chip comprises a first functional chip and a second functional chip, the first functional chip and the second functional chip are both located in the chip bearing area, and the first functional chip and the second functional chip are connected with each other through the second connecting area, so that circuit connection of the first functional chip and the second functional chip is achieved. The first function chip and the second function chip are electrically connected with the contacts through the first connection areas. According to the invention, the second connection area is arranged on the packaging surface, and the chips with different functions are electrically connected through the second connection area, so that the functions and performance required by the function module of the intelligent card are realized under the condition that the volume of each independent chip is not increased and the processing capability of each independent chip is not improved.

Description

Technical Field

[0001] This application relates to the field of smart card manufacturing technology, and in particular to a smart card functional module and carrier tape. Background Technology

[0002] A smart card is a general term for a plastic card (usually the size of a credit card) that has a microchip embedded in it (i.e., a smart card module). A smart card module mainly consists of a chip and a PCB carrier tape. The chip is soldered onto the PCB carrier tape, and the multiple functional pads of the chip correspond one-to-one with the multiple functional pads of the PCB carrier tape for electrical conduction. Standard smart cards include three modes: contact, contactless, and dual-interface.

[0003] As market demand continues to increase, the functions and performance requirements of chips used in contact smart cards are becoming more numerous and demanding, leading to larger chip sizes and higher requirements for the manufacturing processes of certain components. The increased chip size makes chip packaging more difficult, and the advancements in manufacturing processes further increase the chip development cycle and overall packaging costs. Summary of the Invention

[0004] To solve the above technical problems, this application provides a smart card functional module, including a chip and a printed circuit board carrying the chip. The printed circuit board includes a contact surface and a cover surface. The contact surface is provided with contacts conforming to the ISO7816 protocol. The cover surface is provided with a chip carrying area, a first connection area and a second connection area.

[0005] The chip includes a first functional chip and a second functional chip, both of which are located within the chip carrier area. The first functional chip and the second functional chip are interconnected via the second connection area to achieve a circuit connection between them. The first functional chip and the second functional chip are electrically connected to the contacts via the first connection area.

[0006] In one embodiment, the printed circuit board further includes a conductive layer and a substrate layer stacked sequentially, wherein the side of the conductive layer away from the substrate layer is the contact surface, and the side of the substrate layer away from the conductive layer is the cover surface.

[0007] The conductive layer is further provided with contact pads, which are electrically connected to the contacts. The substrate layer is provided with pad holes, and the first connection area is connected to the contact pads through the pad holes.

[0008] In one embodiment, a plurality of copper-clad connecting lines are provided in the second connection area, and the copper-clad connecting lines are bonded to the substrate layer.

[0009] In one embodiment, the first functional chip has a plurality of first pins, and the second functional chip has a plurality of second pins; wherein...

[0010] At least one first pin is electrically connected to one end of the copper-clad interconnect, and at least one second pin is electrically connected to the other end of the copper-clad interconnect, so as to realize the electrical connection between the first functional chip and the second functional chip.

[0011] A portion of the first pin is electrically connected to the contact via the first connection area and the pad hole, and a portion of the second pin is electrically connected to the contact via the first connection area and the pad hole.

[0012] In one embodiment, the number of the first pins and the number of the second pins are the same, or the number of the first pins and the number of the second pins are different.

[0013] In one embodiment, if a plurality of the first connecting regions form a first ring on the package cover; and the second connecting regions form a second ring on the package cover.

[0014] The centers of the first ring and the second ring coincide with the center point of the chip carrier area, and the diameter of the first ring is greater than the diameter of the second ring, and the diameter of the second ring is greater than the length of the chip carrier area.

[0015] In one embodiment, the number of the second connection regions is the same as the number of the first connection regions;

[0016] Both the copper-clad connecting wires and the solder pad holes are configured to have 5 holes; or

[0017] Both the copper-clad connecting wires and the solder pad holes are configured to have 6 holes; or

[0018] Both the copper-clad connector and the pad holes are configured to have 8 holes.

[0019] In one embodiment, the first functional chip and the second functional chip are connected to the contact using any one of wire bonding, chip bonding, automatic bonding, or flip-chip bonding packaging.

[0020] This application also provides a carrier tape including smart card function modules as mentioned in any of the above embodiments, wherein every two smart card function modules are arranged at intervals along the width direction of the carrier tape to form a module group, and several module groups are arranged at intervals along the length of the carrier tape.

[0021] In one embodiment, the plurality of said module groups are an integral structure and adopt a reel-and-roll structure, wherein,

[0022] The carrier tape has several toothed holes on its two sides, and the toothed holes are arranged at intervals along the length of the carrier tape.

[0023] The technical solutions provided by the embodiments of this application may include the following beneficial effects:

[0024] As described in the above embodiments, the smart card functional module of this application includes a chip and a printed circuit board carrying the chip. The printed circuit board includes a contact surface and a cover surface. The contact surface is provided with contacts conforming to the ISO7816 protocol. The cover surface is provided with a chip carrying area, several first connection areas, and a second connection area. The chip includes a first functional chip and a second functional chip. Both the first functional chip and the second functional chip are located within the chip carrying area, and the first functional chip and the second functional chip are interconnected through the second connection area to achieve a circuit connection between them. The first functional chip and the second functional chip are electrically connected to the contacts respectively through the first connection area. By providing a second connection area on the cover surface and using the second connection area to electrically connect different functional chips, this application achieves the functions and performance required by the smart card functional module without increasing the size of each individual chip or improving the manufacturing process capability of each individual chip.

[0025] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this application. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 This is a schematic diagram of the structure of a printed circuit board packaging cover provided in one embodiment of this application from a single viewpoint.

[0028] Figure 2 This is a schematic diagram of the structure of a printed circuit board contact surface from one viewpoint, provided in one embodiment of this application.

[0029] Figure 3 This is a cross-sectional structural diagram from one perspective provided in one embodiment of this application.

[0030] Figure 4 This is a partial structural diagram of the printed circuit board packaging cover provided in one embodiment of this application from a certain perspective.

[0031] Figure label:

[0032] 100, Contact surface; 200, Packaging cover; 201, Chip carrier area; 202, First connection area; 203, Second connection area.

[0033] 1. Conductive layer; 2. Substrate layer; 20. Pad hole; 21. Copper-clad connecting wire; 22. Perforated hole; 3. First functional chip; 30. First pin; 4. Second functional chip; 40. Second pin; 5. Metal wire. Detailed Implementation

[0034] As mentioned in the background section, with the increasing market demand, contact smart card chips need to have more and more functions and higher and higher performance. However, to meet the needs of the newly added functions or performance of the chips, product development is required based on the existing chip manufacturing capabilities. This requires increasing the area of ​​the new functional areas or improving the overall chip manufacturing capabilities to achieve new functions in a smaller area.

[0035] However, adding new functional areas to a chip increases its overall size. Since the size of a conventional carrier tape is fixed, this increase in chip size leads to a larger encapsulation, increasing packaging technology difficulty and costs. Furthermore, if other functional modules can meet new customer demands without requiring improvements in chip manufacturing processes, increasing overall chip manufacturing capabilities to reduce overall chip size can result in increased or wasted R&D costs and time.

[0036] Based on this, this application provides a smart card function module, which is configured with a structure for circuit encapsulating chips with different functions. This enables the addition of functions and the improvement of performance of the smart card function module while keeping the chip size and manufacturing process capabilities unchanged.

[0037] Specifically, refer to Figures 1-4 The smart card functional module includes a chip and a printed circuit board that carries the chip. The printed circuit board includes a contact surface 100 and a cover surface 200. The contact surface 100 is provided with contacts conforming to the ISO7816 protocol, and the cover surface 200 is provided with a chip carrying area 201, a first connection area 202, and a second connection area 203.

[0038] The chip includes a first functional chip 3 and a second functional chip 4. Both the first functional chip 3 and the second functional chip 4 are located within the chip carrier area 201, and the first functional chip 3 and the second functional chip 4 are interconnected through the second connection area 203 to realize their circuit connection. The first functional chip 3 and the second functional chip 4 are electrically connected to the contacts respectively through the first connection area 202.

[0039] It is important to note that the ISO 7816 protocol is an internationally standardized communication protocol for contact smart cards, primarily used for reading and writing contact smart cards. For example, PSAM, SAM, and mobile phone SIM cards all conform to this standard. This protocol was jointly developed by the International Organization for Standardization (ISO) and the International Electrotechnical Commission (IEC), covering various aspects such as the physical characteristics, electrical interface, transmission protocol, and command structure of smart cards. Contact smart cards typically have six or eight contacts. These contacts specifically include C1, C2, C3, C4, C5, C6, C7, and C8. Specifically, C1 (VCC) is the power input contact, used to provide power to the smart card; C2 (RST) is the reset signal input contact, used for resetting the smart card; C3 (CLK) is the clock signal input contact, providing a clock signal to the smart card; C4 is a reserved contact, its specific purpose is currently undefined; C5 (GND) is the ground contact, used for grounding the circuit; C6 (VPP) is the programming voltage contact, used for programming the smart card; C7 (I / O) is the serial input / output data contact, used for data transmission between the smart card and the reader; C8 is also a reserved contact, its specific purpose is currently undefined. These contacts together ensure communication and power supply between the smart card and the reader. The ISO 7816 standard specifies the electrical characteristics and operating procedures of these contacts in detail to ensure the compatibility and reliability of the smart card.

[0040] This application provides a second connection area 203 on the packaging cover 200 for sealing chips with different process capabilities and functions. That is, the first functional chip 3 and the second functional chip 4 are electrically connected by the second connection area 203. This not only effectively increases the functionality and performance of the smart card functional module, but also greatly reduces the difficulty and cost of packaging technology.

[0041] In one embodiment, the first functional chip 3 is configured as a chip composed of other functional modules that meet customer needs and are manufactured using a common chip manufacturing process, and the second functional chip 4 is configured as a chip that meets the customer's needs for a large-capacity FLASH (Flash Memory) functional module and is manufactured using a better chip manufacturing process. During the mounting process with the packaging cover 200, the first functional chip 3 and the second functional chip 4 are electrically connected via the second connection area 203, so that the smart card functional module can add a large-capacity FLASH function without changing the size and manufacturing process of the chip, by packaging the first functional chip 3 and the second functional chip 4 together.

[0042] In some embodiments, this application does not limit the number of other functional sub-chips mounted within the chip carrier area 201. The distinction between the first functional chip 3 and the second functional chip 4 in this application is merely to express the connection relationship between different chips. When several functional chips are disposed on the package cover 200, each functional chip can be interconnected through the second connection area 203.

[0043] In some implementations, reference continues. Figure 3 The printed circuit board also includes a conductive layer 1 and a substrate layer 2 stacked sequentially. The side of the conductive layer 1 away from the substrate layer 2 is a contact surface 100, and the side of the substrate layer 2 away from the conductive layer 1 is a cover surface 200. The conductive layer 1 is also provided with contact pads (not shown in the figure), which are electrically connected to contacts (not shown in the figure). The substrate layer 2 has pad holes 20, and the first connection area 202 is connected to the contact pads through the pad holes 20.

[0044] It should be understood that the first connection area 202 and the contact pad in this embodiment can also be understood as the areas at both ends of the pad hole 20. That is, the first connection area 202 and the contact pad both represent a region, and the corresponding area of ​​the pad hole 20 on the conductive layer 1 can be understood as the contact pad, and the corresponding area of ​​the pad hole 20 on the cover 200 can be understood as the first connection area 202.

[0045] Specifically, the material of the substrate layer 2 can be FR-4 (epoxy fiberglass), CEM series, RCC (resin-coated copper), or other high-performance insulating materials. The conductive layer 1 can be understood as a copper foil with a carrier tape pattern that is pressed or bonded to the side of the substrate layer 2 away from the chip.

[0046] In some embodiments, the substrate layer 2 not only achieves the connection between the cover 200 and the contact surface 100, i.e. the connection between the chip and the contact, by providing pad holes 20, but the substrate layer 2 can also provide insulation between the base surface and the cover 200.

[0047] In some implementations, reference continues. Figure 1 A copper-clad connecting line 21 is provided in the second connection area 203, and the copper-clad connecting line 21 is bonded to the substrate layer 2.

[0048] Continue to refer to Figure 3 The printed circuit board includes a conductive layer 1, a substrate layer 2, and copper-clad interconnects 21 stacked sequentially. The copper-clad interconnects 21 can be understood as copper foil that is pressed or bonded to the side of the substrate layer 2 near the chip and has circuit paths etched on it.

[0049] In this application, several functional chips (first functional chip 3 and second functional chip 4) located in the chip carrier area 201 are soldered to copper-clad interconnects 21, and the connection between the functional chips is realized through the copper-clad interconnects 21, thereby increasing the functionality of the smart card module and improving its performance.

[0050] In some implementations, refer to Figure 4 The first functional chip 3 is provided with a plurality of first pins 30, and the second functional chip 4 is provided with a plurality of second pins 40. At least one first pin 30 is electrically connected to one end of the copper-clad interconnect 21, and at least one second pin 40 is electrically connected to the other end of the copper-clad interconnect 21, so as to realize the electrical connection between the first functional chip 3 and the second functional chip 4. Some first pins 30 are electrically connected to contacts via the first connection area 202 and the pad hole 20, and some second pins 40 are electrically connected to contacts via the first connection area 202 and the pad hole 20.

[0051] In some embodiments, the connection between the first functional chip 3 and the second functional chip 4 and the printed circuit board can be achieved by any one of wire bonding, chip bonding, automatic bonding, or flip-chip bonding. Preferably, the connection between the first functional chip 3 and the second functional chip 4 and the printed circuit board is achieved by wire bonding.

[0052] Specifically, continue to refer to Figure 4 In the packaging of the smart card module, the first pin 30 and the second pin 40 are connected to the contact and the copper-clad connecting line 21 respectively by means of metal wire 50 (gold wire), the first pin 30 is connected to the contact pad, and the second pin 40 is connected to the contact pad by means of metal wire.

[0053] In some embodiments, the number of first pins 30 and the number of second pins 40 are the same. Preferably, both the first pins 30 and the second pins 40 are provided with 6.

[0054] In some embodiments, the number of first pins 30 and the number of second pins 40 are different. Preferably, there are 6 first pins 30 and 2 second pins 40. One first pin 30 is connected to the first end of the copper-clad interconnect 21, and the remaining five first pins 30 are each connected to a first connection area 202, i.e., electrically connected to the contact pads on the conductive layer 1 through the pad holes 20. One second pin 40 is connected to the second end of the copper-clad interconnect 21 opposite to the first end, and the other second pin 40 is connected to the first connection area 202 that is not connected to the first pins 30.

[0055] In some embodiments, referring to FIG1, a plurality of solder holes are spaced apart on the cover 200, and the center point of each solder pad hole 20 is connected to form a first virtual circle. Copper interconnects 21 are spaced apart on the cover 200, and the center point of each copper interconnect 21 is connected to form a second virtual circle.

[0056] The center of the first virtual circle, the center of the second virtual circle, and the center point of the chip carrier area 201 coincide, and the diameter of the first virtual circle is greater than the diameter of the second virtual circle, and the diameter of the second virtual circle is greater than the length of the chip carrier area 201.

[0057] Alternatively, it can be understood that the copper-clad interconnect 21 surrounds the first functional chip 3 and the second functional chip 4, and the pad hole 20 surrounds the copper-clad interconnect 21 in turn. This forms a circular region that expands outward from the center point of the chip carrier area 201.

[0058] In some embodiments, the number of copper-clad interconnects 21 is the same as the number of pad holes 20. Preferably, there are 5 copper-clad interconnects 21 and 5 pad holes 20. Preferably, there are 6 copper-clad interconnects 21 and 6 pad holes 20. Preferably, there are 8 copper-clad interconnects 21 and 8 first connection areas 202.

[0059] Reference Figure 1 and Figure 4 The number of copper-clad interconnects 21 and pad holes 20 is set to 6 each. The first functional chip 3 and the second functional chip 4 are located in the middle of the area enclosed by the copper-clad interconnects 21, and the first functional chip 3, the second functional chip 4 and the copper-clad interconnects 21 are located in the middle of the circular area enclosed by the first connection area 202.

[0060] In some implementations, after the chip is installed, it is sealed with encapsulating adhesive to increase the physical robustness of the device. Furthermore, a first connection area 202 can be provided externally to connect to devices outside the module. This is a standard feature in the art and will not be described in detail here.

[0061] This application also provides a carrier tape including smart card function modules as mentioned in any of the above embodiments. Every two smart card function modules are arranged at intervals along the width direction of the carrier tape to form a module group, and several module groups are arranged at intervals along the length of the carrier tape.

[0062] In some embodiments, the modules are integrated into a single unit and employ a reel-type tape winding structure. A plurality of toothed holes 22 are provided on the edges of both sides of the carrier tape, and the toothed holes 22 are spaced apart along the length of the carrier tape.

[0063] It is important to note that because the module assembly is a single integrated structure, the conductive layer 1, substrate layer 2, and copper-clad connecting lines 21 in each module are also integrated during the carrier tape formation process. Therefore, the perforations 22 can be formed directly on the substrate layer 2, just like the pad holes 20.

Claims

1. A smart card functional module, comprising a chip and a printed circuit board carrying the chip, characterized in that, include: The printed circuit board includes a contact surface and a cover. The contact surface is provided with contacts conforming to the ISO7816 protocol, and the cover is provided with a chip carrier area, a first connection area, and a second connection area. The chip includes a first functional chip and a second functional chip, both of which are located within the chip carrier area. The first functional chip and the second functional chip are interconnected via the second connection area to achieve a circuit connection between them. The first functional chip and the second functional chip are electrically connected to the contacts via the first connection area.

2. The smart card functional module according to claim 1, characterized in that, The printed circuit board further includes a conductive layer and a substrate layer stacked sequentially, wherein the side of the conductive layer away from the substrate layer is the contact surface, and the side of the substrate layer away from the conductive layer is the cover surface. The conductive layer is further provided with contact pads, which are electrically connected to the contacts. The substrate layer is provided with pad holes, and the first connection area is connected to the contact pads through the pad holes.

3. The smart card functional module according to claim 2, characterized in that, The second connection area is provided with a plurality of copper-clad connecting lines, which are bonded to the substrate layer.

4. The smart card functional module according to claim 3, characterized in that, The first functional chip has a plurality of first pins, and the second functional chip has a plurality of second pins; wherein, At least one first pin is electrically connected to one end of the copper-clad interconnect, and at least one second pin is electrically connected to the other end of the copper-clad interconnect, so as to realize the electrical connection between the first functional chip and the second functional chip. A portion of the first pin is electrically connected to the contact via the first connection area and the pad hole, and a portion of the second pin is electrically connected to the contact via the first connection area and the pad hole.

5. The smart card functional module according to claim 4, characterized in that, The number of the first pin is the same as the number of the second pin, or The number of the first pin is different from the number of the second pin.

6. The smart card functional module according to claim 3, characterized in that, A plurality of the first connecting regions form a first ring on the package cover; the second connecting regions form a second ring on the package cover. The centers of the first ring and the second ring coincide with the center point of the chip carrier area, and the diameter of the first ring is greater than the diameter of the second ring, and the diameter of the second ring is greater than the length of the chip carrier area.

7. The smart card functional module according to claim 6, characterized in that, The number of pad holes is the same as the number of copper-clad interconnects; Both the copper-clad connecting wires and the solder pad holes are configured to have 5 holes; or Both the copper-clad connecting wires and the solder pad holes are configured to have 6 holes; or Both the copper-clad connector and the pad holes are configured to have 8 holes.

8. The smart card functional module according to claim 1, characterized in that, The first functional chip and the second functional chip are connected to the contact using any one of the following methods: wire bonding, chip mounting, automatic bonding, or flip-chip bonding.

9. A carrier tape, characterized in that, Includes the smart card function module as described in any one of claims 1-8, wherein every two smart card function modules are arranged at intervals along the width direction of the carrier tape to form a module group, and several module groups are arranged at intervals along the length of the carrier tape.

10. The carrier tape according to claim 9, characterized in that, Several of the aforementioned module groups form an integrated structure and employ a reel-and-reel structure, wherein, The carrier tape has several toothed holes on its two sides, and the toothed holes are arranged at intervals along the length of the carrier tape.

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